CN210345720U

CN210345720U - Clean factory building

Info

Publication number: CN210345720U
Application number: CN201921169667.9U
Authority: CN
Inventors: 秦学礼; 张群; 肖红梅; 阎冬; 李鹏
Original assignee: SY Technology Engineering and Construction Co Ltd
Current assignee: SY Technology Engineering and Construction Co Ltd
Priority date: 2019-07-23
Filing date: 2019-07-23
Publication date: 2020-04-17
Anticipated expiration: 2029-07-23

Abstract

The utility model relates to the technical field of flat panel display manufacturing, and discloses a clean workshop which comprises a workshop body, wherein an upper technical interlayer, a lower technical interlayer and a clean production layer are arranged in the workshop body, and an overhead waffle slab and a clean room arranged on the waffle slab are arranged in the clean production layer; a material storage rack group is arranged in the material storage and transmission area, and partition boards are respectively arranged on two sides of the material storage rack group; the material storage rack group comprises two rows of material storage racks, a return air channel is formed by a gap between each row of material storage racks and the adjacent partition plate, and the return air channel is communicated with the lower technical interlayer; the side wall of each row of material storage racks is provided with a plurality of fan filter units for sucking airflow in the return air channel and sending the airflow into the corresponding material storage racks.

Description

Clean factory building

Technical Field

The utility model relates to a flat panel display manufacturing technical field especially relates to a clean factory building.

Background

At present, the mainstream products of the electronic industry are semiconductor chips and flat panel display devices, and due to the precision machining requirements of the production process, the production environment thereof needs strict cleanliness levels, so the processing production of the semiconductor chips and the flat panel display devices needs to be carried out in a clean room, the cleanliness levels in the clean room send clean air into the room through a fan filter unit arranged on a suspended ceiling, and suspended particles in the room are discharged from a return air inlet to be maintained. Traditional clean factory building is as shown in fig. 1, including factory building body 1, be equipped with technical interlayer 5 in the factory building body 1, technical interlayer 6 down and be located technical interlayer 5 and the clean production zone between the technical interlayer 6 down, be equipped with built on stilts wafer board 3 that sets up and set up clean room 2 on wafer board 3 in the clean production zone, clean room 2 is including being located raised floor 201 on wafer board 3, furred ceiling 202 and with raised floor 201 and furred ceiling 202 complex wallboard, clean room 2 both sides are equipped with the technique intermediate lamella 7 that is used for communicateing lower technical interlayer 5 and upper technical interlayer 6, and be equipped with the dry cooling coil 9 that is used for cooling cycle air between lower technical interlayer 6 and every technique intermediate lamella 7.

The clean room 2 has three spaces for ensuring air cleanliness, which are a material storage area 211, a material transmission area 212 and a process production area 22, wherein the material storage area 211 is provided with a material storage rack 10 for storing materials such as glass substrates and chips to be processed, and the material transmission area 212 is internally provided with an automatic handling device; the process production area 22 typically houses process production equipment and is also the active area for the operator. Since the glass substrates, chips, etc. to be processed in the material storage 211 and material transfer 212 regions are in direct contact with ambient air, the air cleanliness levels in this space are typically much more stringent than the air cleanliness levels in the process production zone 22.

A plurality of fan filter units 8 are arranged on the ceiling 202 of the process production area 22, and in order to ensure a strict cleanliness class of the material storage and transportation area 21, the fan filter units 8 are generally fully distributed on the ceiling 202 of the material transportation area 212, and the fan filter units 8 are arranged on the side surface of the material storage rack 10 in a high density manner. The air circulation path of the whole clean room cleaning air conditioning system is shown by an arrow in fig. 1, wherein air in the process production area 22 is sucked by the fan filter units 8 arranged on the side surfaces of the material storage racks 10, so that the fan filter units with the same air volume as that of the fan filter units arranged on the side surfaces of the material storage racks 10 need to be additionally arranged on the suspended ceiling 202 of the process production area 22, the number of the fan filter units 8 required to be arranged on the suspended ceiling 202 of the process production area 22 is greatly increased, and similarly, the energy consumption is correspondingly increased.

In addition, the cleanliness levels of the material storage area 211 and the material conveying area 212 are strictly required, the air supply quantity required to ensure the cleanliness levels is large, but the heat productivity of the equipment in the area is small, so that only a very small portion of the air flow passing through this area needs to be cooled, but according to the conventional construction of the clean room 2 shown in fig. 1, the fan filter units 8 installed at the top of the material transfer area 212 and the fan filter units 8 installed on the side walls of the material storage racks 10 draw air flows processed by the dry cooling coil 9, meanwhile, after the gas flows flowing out of the process production area 22 and the material conveying area 212 enter the lower technical interlayer 6, all the dry cooling coils 9 are processed, so that the number of the dry cooling coils 9 is increased greatly, and a plurality of projects are caused under the condition that the dry cooling coils 9 cannot be arranged in a specified space; furthermore, the air flows from the process production area 22 and the material transfer area 212 all pass through the technical tunnel 7 and the upper technical interlayer 5, so that the space required by the technical tunnel 7 and the upper technical interlayer 5 is increased, and the construction cost is increased.

SUMMERY OF THE UTILITY MODEL

The utility model provides a clean factory building optimizes through the air circulation route to toilet's clean air conditioning system, has reduced the volume of supplying air and the quantity of dry cooling coil and fan filter unit in technology production area, has compressed the shared space of technology intermediate layer and has gone up the technique lane, has reduced energy consumption and construction cost.

The embodiment of the utility model provides a clean factory building, this clean factory building includes the factory building body, be equipped with upper technical interlayer, lower technical interlayer and lie in the upper technical interlayer with the clean production zone between the lower technical interlayer in the factory building body, be equipped with the waffle slab that sets up in the air and set up the toilet on the waffle slab in the clean production zone, the toilet includes the furred ceiling on upper portion and with the wallboard of furred ceiling complex, the both sides of toilet are equipped with the technical intermediate channel that is used for intercommunication lower technical interlayer with the upper technical interlayer, and be equipped with the dry cooling coil who is used for cooling cycle air between lower technical interlayer and each technical intermediate channel; wherein,

a material storage and transmission area and a process production area are arranged in the clean room, and a plurality of fan filter units are respectively arranged in the material storage and transmission area and the suspended ceiling of the process production area;

a material storage rack group is arranged in the material storage and transmission area, and partition boards are respectively arranged on two sides of the material storage rack group;

the material storage rack group comprises two rows of material storage racks, a return air channel is formed in a gap between each row of material storage racks and the adjacent partition plate, and the return air channel is communicated with the lower technical interlayer; and a plurality of fan filter units are arranged on the side wall of each row of material storage racks and used for sucking the airflow in the return air channel and sending the airflow into the corresponding material storage racks.

In the above embodiment, the partition board is arranged on one side of each row of material storage racks, which is far away from the other row of material storage racks, the return air channel is formed between the material storage racks and the partition board, and the return air channel is communicated with the lower technical interlayer, so that most of air flow flowing out of the material storage and transmission area can directly enter the return air channel, the air flow in the return air channel is sucked by the fan filter unit arranged on the side wall of the material storage racks, and is sent out after pressure filtration and returns to the material storage and transmission area again, and the in-situ circulation is realized.

When specifically setting up, be located be equipped with a plurality of ventilation holes on the furred ceiling at return air double-layered top, go up the intraformational air current of technique intermediate layer and pass through a plurality of ventilation holes get into in the return air double-layered. Because the air current in the upper technology interlayer is the low-temperature air current after the temperature reduction treatment of the dry cooling coil, after a part of the low-temperature air current in the upper technology interlayer enters the return air channel through the vent holes, the low-temperature air current is sucked by the fan filter unit arranged on the side wall of the material storage rack, and is sent into the material storage area after being filtered and pressurized, so that the temperature of the material storage area can be reduced.

Optionally, a louver air opening is arranged on each ventilation hole.

Or an air volume regulating valve for regulating the area of the opening hole to control the air intake is arranged on each vent hole. The open area of the vent hole can be adjusted through the air volume adjusting valve, so that the flow of low-temperature air flow entering the air return channel from the upper technical interlayer is adjusted, and the temperature of a material storage area is adjusted.

Optionally, the air quantity control device further comprises a driving device for driving the air quantity control valve to act, and a temperature sensor arranged in the return air channel, wherein the driving device is used for driving the air quantity control valve to act according to the temperature detected by the temperature sensor.

Optionally, the drive device comprises a drive motor.

In order to reduce the temperature of the material storage area, besides the ventilation holes are formed to enable the return air channel to be communicated with the upper technical interlayer and introduce low-temperature airflow in the upper technical interlayer, a plurality of fan filter units can be arranged on a suspended ceiling at the top of the return air channel, and the airflow in the upper technical interlayer enters the return air channel after being processed by the fan filter units. Therefore, the flow of the low-temperature airflow entering the return air channel can be accurately controlled by controlling the arrangement number of the fan filter units and adjusting the rotating speed of the fan.

Optionally, a temperature sensor is arranged in the return air channel.

Drawings

FIG. 1 is a schematic view illustrating a clean room according to the prior art;

FIG. 2 is a schematic structural view of a clean room according to an embodiment of the present invention;

FIG. 3 is a schematic structural view of another clean room according to an embodiment of the present invention;

fig. 4 is a schematic structural view of another clean room according to an embodiment of the present invention.

Reference numerals:

1-factory building noumenon

2-clean room

201-elevated floor

202-ceiling 2021-vents

21-Material storage and transport zone

211-material storage area 212-material transfer area

22-technical production area 23-return air channel

3-waffle slab 4-partition board

5-upper technical interlayer 6-lower technical interlayer

7-technical channel 8-fan filter unit

9-dry cooling coil pipe 10-material storage rack

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The embodiment of the utility model provides a clean factory building through set up the partition plate in the toilet and between partition plate and material storage frame form with the return air double-layered way of technical interlayer intercommunication down to purify air conditioning system's air circulation route to the toilet and optimized, reduced the air supply volume in technology production area and the quantity of dry cooling coil and fan filter unit, compressed the shared space of technical interlayer and last technical interlayer, reduced energy consumption and construction cost.

The clean workshop comprises a workshop body, wherein an upper technical interlayer, a lower technical interlayer and a clean production layer positioned between the upper technical interlayer and the lower technical interlayer are arranged in the workshop body, a waffle slab arranged in an overhead manner and a clean room arranged on the waffle slab are arranged in the clean production layer, the clean room comprises a suspended ceiling at the upper part and a wallboard matched with the suspended ceiling, technical interlayers for communicating the lower technical interlayer with the upper technical interlayer are arranged at two sides of the clean room, and a dry cooling coil for cooling circulating air is arranged between the lower technical interlayer and each technical interlayer; wherein,

a material storage and transmission area and a process production area are arranged in the clean room, and a plurality of fan filter units are respectively arranged on suspended ceilings of the material storage and transmission area and the process production area;

the material storage rack group comprises two rows of material storage racks, a return air channel is formed by a gap between each row of material storage racks and the adjacent partition plate, and the return air channel is communicated with the lower technical interlayer; the side wall of each row of material storage racks is provided with a plurality of fan filter units for sucking airflow in the return air channel and sending the airflow into the corresponding material storage racks.

In the embodiment, the partition boards are arranged on one side of each row of material storage racks, which is away from the other row of material storage racks, the top of each partition board is connected with the suspended ceiling, the bottom of each partition board is connected with the waffle board, the material storage racks and the adjacent partition boards form the return air channel, and the return air channel is communicated with the lower technical interlayer, so that after airflow flowing out of the material storage and transmission area enters the lower technical interlayer, most of the airflow can enter the return air channel through the holes in the waffle board due to the reasons of path, pressure balance and the like, and is sucked by the fan filter unit arranged on the material storage racks, filtered and pressurized and then returns to the material storage and transmission area again, and in-situ circulation is realized; because this part of air current that circulates on spot no longer passes through dry cooling coil, technical intermediate lane and last technical intermediate layer, so, the quantity of dry cooling coil can significantly reduce, and, the occupied space of technical intermediate lane and last technical intermediate layer also can compress, the cost of clean room construction has been reduced, simultaneously, because the fan filter unit that sets up on the material storage rack lateral wall no longer inhales air from the technology production district, thereby reduced the air supply volume and the fan filter unit quantity in technology production district, reduced energy consumption and construction cost.

For a clearer understanding of the structure and the principle of the clean room provided by the embodiments of the present invention, a detailed description will be given with reference to the accompanying drawings.

As shown in fig. 2, the clean factory building comprises a factory building body 1, wherein an upper technical interlayer 5, a lower technical interlayer 6 and a clean production layer between the upper technical interlayer 5 and the lower technical interlayer 6 are arranged in the factory building body 1, a waffle slab 3 arranged in an overhead manner and a clean room 2 arranged on the waffle slab 3 are arranged in the clean production layer, technical interlayers 7 used for communicating the lower technical interlayer 6 with the upper technical interlayer 5 are further arranged on two sides of the clean room 2, and a dry cooling coil 9 used for cooling circulating air is arranged between the lower technical interlayer 6 and each technical interlayer 7.

The waffle slab 3 is a concrete slab with holes uniformly formed and has the functions of supporting and ventilating; the clean room 2 comprises a ceiling 202 at the upper part and a wallboard matched with the ceiling 202, a material storage and transmission area 21 and a process production area 22 are arranged in the clean room 2, and the ceilings of the material storage and transmission area 21 and the process production area 22 are respectively provided with a plurality of fan filter units 8; a material storage rack group is arranged in the material storage and transmission area 21, partition boards 4 are respectively arranged on two sides of the material storage rack group, the top of each partition board 4 is connected with the suspended ceiling 202, and the bottom of each partition board 4 is connected with the waffle board 3; the material storage rack group comprises two rows of material storage racks 10, a return air channel 23 is formed in a gap between each row of material storage racks 10 and the adjacent partition plate 4, and each return air channel 23 is communicated with the lower technical interlayer 6; specifically, the return air channel 23 is communicated with the lower technical interlayer 6 through a hole formed in the waffle slab 3.

In the material storage and transmission area 21, the material storage racks 10 are used for storing materials such as glass substrates and chips to be processed, the area where the material storage racks 10 are arranged is a material storage area 211, a material transmission area 212 is formed in the area between two rows of the material storage racks 10, and an automatic handling device is arranged in the material transmission area 212; in the material storage area 211, a plurality of fan filter units 8 are arranged on the side wall of each row of material storage racks 10 for sucking the airflow in the return air channel 23 and sending the airflow into the corresponding material storage racks 10, that is, the fan filter units 8 can suck the airflow entering the return air channel 23 and send the airflow out of the material storage racks 10 after filtering and pressurizing treatment, that is, send the airflow out of the material storage area 211, so as to dilute the concentration of suspended particles in the material storage area 211 and maintain the cleanliness level requirement of the material storage area 211; in the material conveying area 212, the fan filter unit 8 arranged at the top in a high density mode sucks the airflow in the upper technical interlayer 5, and the airflow is filtered and pressurized and then sent out of the material conveying area 212, so that the suspended particle concentration of the material conveying area 212 is diluted, and the cleanliness grade requirement of the material conveying area 212 is maintained.

In addition, in the material storage area 211, the wafer plate 3 is provided with the raised floor 201, the surface of the raised floor 201 is relatively flat, and the material storage rack 10 is convenient to place, and similarly, the raised floor 201 can be arranged on the wafer plate 3 in the process production area 22, and the raised floor 201 is provided with a hole, so that the process production area 22 is communicated with the lower technical interlayer 6, and devices such as pipelines can be arranged in a gap between the raised floor 201 and the wafer plate 3. The bottom of the return air channel 23 may be provided with a raised floor 201 with holes, or may not be provided with the raised floor 201.

As shown by the arrows in fig. 2, after the air flow flowing out from the material storage and transmission area 21 enters the lower technical interlayer 6, a small part of the air flow flows to both sides, the temperature is reduced after passing through the dry cooling coil 9, and the air flow enters the upper technical interlayer 5 through the technical interlayer 7, most of the air flow can enter the return air interlayer 23 through the holes in the wafer plate 3 and the raised floor 201, is sucked by the fan filter unit 8 arranged on the material storage rack 10, is filtered and pressurized and then is sent into the material storage area 211 to maintain the high cleanliness grade requirement of the material storage area 211, and the air flow passes through the material storage area 211, enters the material transmission area 212 and enters the lower technical interlayer 6 through the holes in the wafer plate 3, so that the in-situ circulation is realized. Because this part of air current that circulates in situ no longer passes through dry cooling coil pipe 9, technical intermediate channel 7 and last technical intermediate layer 5, so, the quantity of dry cooling coil pipe 9 can significantly reduce, and, the space that technical intermediate channel 7 and last technical intermediate layer 5 occupy also can compress, the cost of clean room 2 construction has been reduced, simultaneously, because return air intermediate channel 23 provides the amount of wind for setting up fan filter unit 8 on the lateral wall of material storage frame 10, the top of technology production district 22 need not additionally arrange fan filter unit 8 with the same amount of wind of fan filter unit 8 of material storage frame 10 side installation again, thereby the amount of wind and the fan filter unit quantity of technology production district 22 have been reduced, energy consumption and construction cost are reduced.

As shown in fig. 3, in order to ensure the requirement of the material storage area on the temperature, a plurality of ventilation holes 2021 are provided on the ceiling 202 at the top of the return air channel 23, the air flow in the upper technical interlayer 5 enters the return air channel 23 through the ventilation holes 2021, is sucked by the fan filter unit 8 arranged on the side wall of the material storage rack 10, is filtered and pressurized and then is sent to the material storage area 211, because the air flow is cooled by the dry cooling coil 9, the temperature is low, and when the low-temperature air flow passes through the material storage rack 10, the heating load in the space is eliminated, and the suspended particles are taken away, thereby ensuring the temperature requirement of the material storage area 211 and maintaining the cleanliness level in the material storage area 211. Each ventilation hole 2021 may be provided with a louver opening or an air volume adjusting valve (not shown) for adjusting the opening area, and the opening area of the ventilation hole may be adjusted by the air volume adjusting valve, so as to adjust the flow rate of the low-temperature air flow entering the return air channel 23 from the upper technical interlayer 5, and further adjust the temperature of the material storage region 211. Furthermore, a driving device used for driving the air volume adjusting valve to act can be further arranged, a temperature sensor is arranged in the return air channel, and the driving device is specifically used for driving the air volume adjusting valve to act according to the temperature detected by the temperature sensor so as to adjust the size of the area of the opening hole. Specifically, the driving device comprises a driving motor.

Or, as shown in fig. 4, a plurality of fan filter units 8 may be further disposed on the ceiling 202 at the top of the return air channel 23, the low-temperature air flow in the upper technical interlayer 5 enters the return air channel 23 through the fan filter units 8, that is, a part of the low-temperature air flow in the upper technical interlayer 5 is sucked by the fan filter units 8, and then is sent into the return air channel 23 after being filtered and pressurized, and in the return air channel 23, the part of the low-temperature air flow is sucked by the fan filter units 8 disposed on the side walls of the material storage rack 10 again, and then is sent into the material storage area 211 after being filtered and pressurized, and when the low-temperature air flow passes through the material storage area 211, the heating load in the space is eliminated, and suspended particles are taken away, thereby ensuring the temperature requirement of the material storage area 211 and maintaining the cleanliness level in the material storage area. Furthermore, a temperature sensor is arranged in the return air channel 23, and the quantity of the fan filter units 8 and the rotating speed of the fan which are put into use are adjusted according to the temperature detected by the temperature sensor, so that the air quantity entering the return air channel 23 from the upper technical interlayer 5 is accurately controlled, and the temperature of the material storage area 211 can be accurately controlled.

In a specific embodiment, the clean room is structured as shown in fig. 4, in the room body, the clean room 2 includes a material storage and transportation area 21 and process production areas 22 located at two sides of the material storage and transportation area 21, and the suspended ceilings of the material storage and transportation area 21 and the process production areas 22 are respectively provided with a plurality of fan filter units 8;

two rows of material storage racks 10 are arranged in the material storage and transmission area 21, and a partition plate 4 is arranged between each row of material storage racks 10 and the adjacent process production area 22; a return air channel 23 is formed in a gap between each row of material storage racks 10 and the adjacent partition plate 4, and each return air channel 23 is communicated with the lower technical interlayer 6 through a hole in the waffle slab 3; the side wall of each row of material storage racks 10 is provided with a plurality of fan filter units 8 for sucking the airflow in the return air channel 23 and sending the airflow into the corresponding material storage racks 10, and the ceiling 202 at the top of the return air channel 23 is provided with a plurality of fan filter units 8.

The air circulation path in the clean workshop is as follows:

in the upper technical interlayer 5, a part of air flow enters the technical production area 22 through the fan filter unit 8 arranged at the top of the technical production area 22, a part of air flow enters the material transmission area 212 through the fan filter unit 8 arranged at the top of the material transmission area 212, and a part of air flow enters the return air channel 23 through the fan filter unit 8 arranged at the top of the return air channel 23 and enters the material storage area 211 through the fan filter unit 8 arranged at the side of the material storage rack 10;

in the material storage and transmission area 21, the fan filter unit 8 arranged at the top of the material transmission area 212 sucks air from the upper technical interlayer 5, and sends the air into the material transmission area 212 after filtering and pressurizing to maintain the requirement of high cleanliness grade of the material transmission area 212, and the air flow passes through the material transmission area 212 and then enters the lower technical interlayer 6 from the holes on the wafer plate 3; the air in the return air channel 23 is sucked by the fan filter unit 8 arranged on the side of the material storage rack 10, the air is filtered and pressurized by the fan filter unit 8 and then is sent into the material storage area 211 to maintain the high cleanliness grade requirement of the material storage area 211, and then enters the lower technical interlayer 6 through the material transmission area 212, wherein part of the air flow in the return air channel 23 comes from the upper technical interlayer 5, and part comes from the lower technical interlayer 6, and the low-temperature air flow in the upper technical interlayer 5 is beneficial to eliminating the heating load of the material storage area 211;

in the process production area 22, a fan filter unit 8 arranged at the top sucks air in the upper technical interlayer 5, the air is filtered and pressurized and then is sent into the process production area 22 to maintain the cleanliness requirement of the process production area 22, the air flow passes through the process production area 22 and then enters the lower technical interlayer 6, wherein one part of the air flow is reduced in temperature after passing through a dry cooling coil pipe 9 and enters the upper technical interlayer 5 through a technical interlayer 7, and the other part of the air flow enters return air interlayers 23 positioned at two sides of the material storage and transmission area 21 through holes in the wafer plate 3; as the fan filter unit 8 with the same air quantity as the fan filter unit 8 arranged on the side surface of the material storage rack 10 does not need to be additionally arranged at the top of the process production area 22, the air quantity of the process production area 22 and the number of the fan filter units are reduced, and the energy consumption and the construction cost are reduced.

In the lower technical interlayer 6, a part of air flow enters the return air channel 23, and a part of air flow enters the technical interlayer 7 through the dry cooling coil pipe 9 and reaches the upper technical interlayer 5. Because the air current that gets into in the return air double-layered 23 no longer passes through dry cooling coil 9, so the quantity of dry cooling coil 9 can significantly reduce, has reduced a investment, simultaneously, also can reduce the air side resistance of dry cooling coil 9, makes the operation energy consumption of fan filter unit reduce, has also prolonged high-efficient (or super high-efficient) air cleaner's life. Furthermore, since this part of the air flow no longer passes through the technical tunnel 7 and the upper technical sandwich 5, the space of the technical tunnel 7 and the upper technical sandwich 5 can be compressed, and the investment in the construction of the clean room is reduced.

As can be seen from the above description, in the embodiment of the present invention, the partition board is disposed in the clean room, and the return air channel communicated with the lower technical interlayer is formed between the partition board and the material storage rack, so as to optimize the air circulation path in the clean room, reduce the air supply volume of the process production area and the number of the dry cooling coil and the fan filter unit, reduce the space occupied by the upper technical interlayer and the lower technical interlayer, and reduce the energy consumption and the construction cost; furthermore, a ventilation hole with an air volume adjusting valve or a fan filter unit can be arranged on the ceiling at the top of the return air channel, so that low-temperature air flow in the upper technical interlayer can enter the return air channel to adjust the temperature of the material storage area.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A clean workshop comprises a workshop body, wherein an upper technical interlayer, a lower technical interlayer and a clean production layer positioned between the upper technical interlayer and the lower technical interlayer are arranged in the workshop body, a waffle slab arranged in an overhead manner and a clean room arranged on the waffle slab are arranged in the clean production layer, the clean room comprises a suspended ceiling on the upper part and a wallboard matched with the suspended ceiling, technical interlayers for communicating the lower technical interlayer with the upper technical interlayer are arranged on two sides of the clean room, and a dry cooling coil for cooling circulating air is arranged between the lower technical interlayer and each technical interlayer; it is characterized in that the preparation method is characterized in that,

a material storage and transmission area and a process production area are arranged in the clean room, and a plurality of fan filter units are respectively arranged in the material storage and transmission area and the suspended ceiling of the process production area; wherein,

2. The clean factory building of claim 1, wherein a plurality of ventilation holes are formed in the ceiling at the top of said return air duct, and the air flow in said upper technical interlayer enters said return air duct through said plurality of ventilation holes.

3. The clean factory building of claim 2, wherein each vent hole is provided with a louver opening.

4. The clean factory building of claim 2, wherein each of said ventilating holes is provided with an air volume adjusting valve for adjusting the area of the opening to control the air intake.

5. The clean factory building of claim 4, further comprising a driving device for driving the air volume adjusting valve to act, and a temperature sensor arranged in the return air channel, wherein the driving device is used for driving the air volume adjusting valve to act according to the temperature detected by the temperature sensor.

6. The clean room as claimed in claim 5, wherein the driving means comprises a driving motor.

7. The clean factory building of claim 1, wherein a plurality of fan filter units are arranged on the ceiling at the top of the return air channel, and the air flow in the upper technical interlayer enters the return air channel after being processed by the fan filter units.

8. The clean factory building of claim 7, wherein a temperature sensor is arranged in said return air duct.