CN210340247U

CN210340247U - Transfer device in degumming machine for silicon wafer production

Info

Publication number: CN210340247U
Application number: CN201921307823.3U
Authority: CN
Inventors: 刘君; 余江湖; 郑松
Original assignee: Anhui Jingtian New Energy Technology Co Ltd
Current assignee: Anhui Jingtian New Energy Technology Co Ltd
Priority date: 2019-08-13
Filing date: 2019-08-13
Publication date: 2020-04-17
Anticipated expiration: 2029-08-13

Abstract

The utility model discloses a silicon chip production is with adversion device of degumming machine, which comprises a fixing plate and i, the slide rail that the inboard fixedly connected with longitudinal symmetry of fixed plate and another fixed plate set up, sliding connection has the pulley that the equidistance distributes between slide rail and another slide rail, swing joint has the connecting plate between pulley and another pulley, the connecting block that the inboard fixedly connected with symmetry of connecting plate set up, the inboard fixedly connected with bottom plate of connecting block and another connecting block, swing joint has a motor in the fixed plate, bottom plate upper end fixedly connected with bilateral symmetry's support, it is connected with the axis of rotation to rotate between support and another support, the first sprocket that the axis of rotation outside fixedly connected with symmetry set up. This transfer device in degumming machine for silicon chip production reduces the frictional resistance when removing, drives and puts the adjustment that the thing board carries out position from top to bottom, is convenient for remove to another process department with the silicon chip on putting the thing board, further prescribes a limit to put the direction of thing board, improves stability.

Description

Transfer device in degumming machine for silicon wafer production

Technical Field

The utility model relates to a transfer device technical field specifically is a silicon chip production is with interior transfer device of degumming machine.

Background

The silicon chip is a crystal with a basically complete lattice structure, has different properties in different directions and is a good semiconductor material, and the chip made of the silicon chip is a famous "Shen calculator" and has remarkable operational capability.

With the wide application of silicon wafers in the fields of aerospace, national defense, industrial automation and the like, the production process of the silicon wafers is continuously improved, in order to ensure the normal use of the silicon wafers, the silicon wafers need to be subjected to degumming operation in a degumming machine in multiple processes, so that a transfer device in the degumming machine is indispensable, but the existing transfer device has the defects of low motion stability, inconvenient operation and large jitter of the silicon wafers in the device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a silicon chip production is with anticreep machine adversion device to it is low to propose the motion stationarity in solving above-mentioned background art, and the operation is inconvenient, and the silicon chip shakes the great problem of mobility in the device.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a silicon chip production is with debonding machine adversion device, includes the fixed plate, the slide rail that fixed plate and the inboard fixedly connected with longitudinal symmetry of another fixed plate set up, sliding connection has the pulley that the equidistance distributes between slide rail and another slide rail, swing joint has the connecting plate between pulley and another pulley, the connecting block that the inboard fixedly connected with symmetry of connecting plate set up, the inboard fixedly connected with bottom plate of connecting block and another connecting block, swing joint has a motor in the fixed plate, bottom plate upper end fixedly connected with bilateral symmetry's support, it is connected with the axis of rotation to rotate between support and another support, the first sprocket that the axis of rotation outside fixedly connected with symmetry set up.

Preferably, the lower end of the bottom plate is fixedly connected with a second motor, the second motor and the outer side of the right end of the rotating shaft are fixedly connected with a second chain wheel, and a second chain is meshed and connected between the second chain wheel and the other second chain wheel.

Preferably, the bottom plate and the inboard recess that all sets up of another bottom plate, the meshing of first sprocket outside is connected with first chain, first chain lower extreme passes recess fixedly connected with and puts the thing board, and first chain and recess one-to-one.

Preferably, a sliding groove is formed in the lower end of the fixing plate, a sliding block is connected in the sliding groove in a sliding mode, and a first motor is fixedly connected to the upper end of the sliding block.

Preferably, a gear is fixedly connected to the outer side of the motor shaft of the first motor, racks are fixedly connected to the upper ends of the inner sides of the fixed plate and the other fixed plate, and the racks and the gear are in meshed connection.

Compared with the prior art, the beneficial effects of the utility model are that: this conveying device in degumming machine for silicon chip production, cooperation through gear and rack is used, it removes to drive the pulley left and right sides direction, the motor lower extreme passes through sliding block and the sliding tray sliding connection in the fixed plate, frictional resistance when reducing the removal, improve the smoothness nature of removal, slide rail sliding connection on pulley and the fixed plate simultaneously, the direction of injecing the pulley, further improve the stationarity of motion, at first sprocket, first chain, the second sprocket, under the interact of second chain and second motor, the adjustment of position about the thing board carries out is put in the drive, be convenient for will put the silicon chip on the thing board and remove to another process department, and set up the recess corresponding with first chain on the bottom plate, further inject the direction of putting the thing board, and stability is improved.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic front view of the present invention;

FIG. 3 is a schematic side view of the present invention;

fig. 4 is a schematic top view of the present invention;

FIG. 5 is a front view of the bottom plate and the object placing plate of the present invention;

fig. 6 is a schematic sectional view of the present invention.

In the figure: 1. a fixing plate; 2. a slide rail; 3. a pulley; 4. a connecting plate; 5. connecting blocks; 6. a base plate; 7. a first motor; 8. a support; 9. a rotating shaft; 10. a first sprocket; 11. a second motor; 12. a second sprocket; 13. a second chain; 14. a groove; 15. a first chain; 16. a storage plate; 17. a sliding groove; 18. a slider; 19. a gear; 20. a rack.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: an inner transfer device of a degumming machine for silicon wafer production comprises a fixed plate 1, a slide rail 2, a pulley 3, a connecting plate 4, a connecting block 5, a bottom plate 6, a first motor 7, a bracket 8, a rotating shaft 9, a first chain wheel 10, a second motor 11, a second chain wheel 12, a second chain 13, a groove 14, a first chain 15, a placing plate 16, a slide groove 17, a slide block 18, a gear 19 and a rack 20, wherein the inner sides of the fixed plate 1 and the other fixed plate 1 are fixedly connected with the slide rail 2 which is symmetrically arranged up and down, the slide rail 2 and the other slide rail 2 are slidably connected with the pulley 3 which is equidistantly distributed, the pulley 3 and the other pulley 3 are movably connected with the connecting plate 4, the inner sides of the connecting plate 4 are fixedly connected with the connecting blocks 5 which are symmetrically arranged, the inner sides of the connecting block 5 and the other connecting block 5 are fixedly connected with the bottom plate 6, the first, a rotating shaft 9 is rotatably connected between the bracket 8 and the other bracket 8, and first chain wheels 10 which are symmetrically arranged are fixedly connected to the outer side of the rotating shaft 9;

further, the lower end of the bottom plate 6 is fixedly connected with a second motor 11, the second motor 11 and the outer side of the right end of the rotating shaft 9 are both fixedly connected with a second chain wheel 12, a second chain 13 is meshed and connected between the second chain wheel 12 and the other second chain wheel 12, and the rotating shaft 9 is driven to rotate through the matching use of the second chain 13 and the second chain wheel 12;

furthermore, the inner sides of the bottom plate 6 and the other bottom plate 6 are respectively provided with a groove 14 which are symmetrically arranged, the outer side of the first chain wheel 10 is engaged and connected with a first chain 15, the lower end of the first chain 15 penetrates through the groove 14 to be fixedly connected with an object placing plate 16, the first chain 15 and the groove 14 are in one-to-one correspondence, and the object placing plate 16 is driven to move up and down by the matching use of the first chain wheel 10 and the first chain 15, so that the silicon wafers on the object placing plate 16 can be conveniently transferred;

furthermore, a sliding groove 17 is formed in the lower end of the fixing plate 1, a sliding block 18 is connected in the sliding groove 17 in a sliding manner, the upper end of the sliding block 18 is fixedly connected with the first motor 7, and the resistance of the first motor 7 during movement is reduced by matching the sliding groove 17 with the sliding block 18;

further, a gear 19 is fixedly connected to the outer side of the motor shaft of the first motor 7, racks 20 are fixedly connected to the upper ends of the inner sides of the fixed plate 1 and the other fixed plate 1, the racks 20 and the gear 19 are meshed to be connected, and the pulleys 3 are driven to move left and right through the matching use of the racks 20 and the gear 19, so that the object placing plate 16 is driven to move left and right.

The working principle is as follows: firstly, fixing plates 1 are respectively fixed on the inner wall of a degumming machine, then, silicon wafers to be treated are placed on a placing plate 16, a first motor 7 is opened to rotate forwards, a gear 19 on the first motor 7 rotates, the gear 19 is used by matching with a rack 20, the gear 19 moves leftwards on the rack 20, a sliding block 18 at the lower end of the first motor 7 synchronously moves leftwards in a sliding groove 17, at the moment, the first motor 7 drives a pulley 3 to move leftwards between sliding rails 2, then, the first motor 7 is closed, a second motor 11 is opened to rotate backwards, the second motor 11 drives a second chain wheel 12 to rotate, the second chain wheel 12 drives a second chain 13 to rotate, the second chain 13 drives another second chain wheel 12 to rotate, and a rotating shaft 9 at the inner side of the second chain wheel 12 rotates. The first chain wheel 10 on the outer side of the rotating shaft 9 synchronously rotates to drive the first chain 15 to move downwards in the groove 14 to drive the object placing plate 16 to move downwards, then the second motor 11 is closed, the first degumming procedure operation is carried out on the silicon wafer on the object placing plate 16, then the previous step is operated in the reverse direction, the object placing plate 16 is lifted upwards, the first motor 7 is opened again to rotate forwards, the operation is stopped above the other procedure, the second motor 11 is opened to rotate backwards, the object placing plate 16 is put down again, and the above operations are repeated until all procedures in the degumming machine are completed.

It should be finally noted that the above only serves to illustrate the technical solution of the present invention, and not to limit the scope of the present invention, and that simple modifications or equivalent replacements performed by those skilled in the art to the technical solution of the present invention do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. The utility model provides a silicon chip production is with transfer device in degumming machine, includes the fixed plate, its characterized in that: the utility model discloses a chain wheel, including fixed plate and another fixed plate, the inboard fixedly connected with longitudinal symmetry of fixed plate and another fixed plate sets up, sliding connection has the pulley that the equidistance distributes between slide rail and another slide rail, swing joint has the connecting plate between pulley and another pulley, the connecting block that the inboard fixedly connected with symmetry of connecting plate set up, the inboard fixedly connected with bottom plate of connecting block and another connecting block, swing joint has first motor in the fixed plate, the support of bottom plate upper end fixedly connected with lateral symmetry, the rotation is connected with the axis of rotation between support and another support, the first sprocket that the axis of rotation outside fixedly connected with symmetry set up.

2. The internal transfer device of the degumming machine for silicon wafer production according to claim 1, characterized in that: the bottom plate lower extreme fixedly connected with second motor, the equal fixedly connected with second sprocket in second motor and the axis of rotation right-hand member outside, the meshing is connected with the second chain between second sprocket and another second sprocket.

3. The internal transfer device of the degumming machine for silicon wafer production according to claim 1, characterized in that: the bottom plate and another bottom plate inboard all set up the recess that the symmetry set up, the meshing is connected with first chain in the first sprocket outside, first chain lower extreme passes recess fixedly connected with and puts the thing board, and first chain and recess one-to-one.

4. The internal transfer device of the degumming machine for silicon wafer production according to claim 1, characterized in that: the sliding tray has been seted up to the lower extreme in the fixed plate, sliding tray sliding connection has the sliding block, sliding block upper end fixedly connected with first motor.

5. The internal transfer device of the degumming machine for silicon wafer production according to claim 1, characterized in that: the outer side of the motor shaft of the first motor is fixedly connected with a gear, the upper ends of the inner sides of the fixed plate and the other fixed plate are fixedly connected with racks, and the racks and the gear are in meshed connection.