CN210328177U - Automatic processing equipment for PI film copper-clad plate - Google Patents
Automatic processing equipment for PI film copper-clad plate Download PDFInfo
- Publication number
- CN210328177U CN210328177U CN201921023869.2U CN201921023869U CN210328177U CN 210328177 U CN210328177 U CN 210328177U CN 201921023869 U CN201921023869 U CN 201921023869U CN 210328177 U CN210328177 U CN 210328177U
- Authority
- CN
- China
- Prior art keywords
- water tank
- film
- corrosion
- liquid
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Abstract
The utility model discloses an automatic processing device of PI film copper-clad plate, which comprises a frame, an XZ shaft moving platform, a PI film copper-clad plate clamp, a corrosion water tank, a film-removing water tank, a cleaning water tank, a drying device and an air pump which are jointly installed on the frame, wherein the PI film copper-clad plate clamp is installed on the XZ shaft moving platform and is used for driving the PI film copper-clad plate clamp to move along the X shaft and the Z shaft; the device comprises a corrosion water tank, a film removing liquid, a cleaning water tank, a drying device and a control device, wherein the corrosion water tank is internally provided with a corrosion liquid, the film removing liquid is arranged in the film removing water tank, the bottom of the cleaning water tank is hollowed, two spray pipes are arranged in the cleaning water tank, and the drying device comprises two dryers; the air pump is connected with the air bubble stone through an air pipe, and the air bubble stone is arranged in the corrosive liquid of the corrosive water tank and is used for blowing air into the corrosive liquid to form air bubbles. The utility model discloses to the corrosion of PI membrane copper plate, the striping, wash, dry four processes realize programme-controlled automation, possible unmanned on duty, work efficiency is high moreover, can realize handling in batches greatly.
Description
Technical Field
The utility model discloses industrial automation processing field, more specifically relates to a PI membrane covers automatic processing equipment of copper.
Background
The traditional frequency selection surface is generally carved on an FR4 copper clad plate, and the FR4 copper clad plate is generally 0.1-0.8mm thick, has higher hardness and is not easy to fold.
The PI film coated copper plate is formed by coating copper foil on a PI film (polyimide film) serving as a flexible substrate, the thickness of the PI film commonly used at present is 0.025mm, and the PI film coated copper plate is particularly suitable for being used as a substrate of a flexible printed circuit board and insulating materials of various high-temperature resistant motors and electrical appliances.
The photosensitive dry film is pasted on the surface of the PI film copper-clad plate, and after exposure, development, etching and stripping, the corresponding pattern with the frequency selection surface can be manufactured on the flexible substrate of the PI film.
At present, in the manufacturing process of the frequency selective surface, after the required pattern of the frequency selective surface is printed out and exposed and developed, the procedures of etching, removing a film and the like are required, and the procedures of etching, removing a film and the like are basically manual operation at present, so the efficiency is low, and the large-scale processing cannot be realized.
SUMMERY OF THE UTILITY MODEL
To the above defect of prior art or improve the demand, the utility model provides a PI membrane covers automatic processing equipment of copper, it can accomplish full automated processing to PI membrane etching, deciduate, washing, four process flow of drying, and efficiency and treatment quality are high, can realize handling in batches.
In order to achieve the above object, according to one aspect of the present invention, there is provided an automatic processing apparatus for PI film-coated copper plates, comprising a frame, and an XZ axis moving platform, a PI film-coated copper plate jig, a corrosion water tank, a stripping water tank, a cleaning water tank, a drying device and an air pump, which are mounted on the frame, wherein,
the PI film copper-clad plate clamp is mounted on the XZ-axis moving platform and used for driving the PI film copper-clad plate clamp to move along an X axis and a Z axis, wherein the X axis extends along the left-right direction and the Z axis extends along the up-down direction;
the corrosion water tank, the film removing water tank, the cleaning water tank and the drying device are sequentially arranged along the X axis, corrosion liquid is arranged in the corrosion water tank, film removing liquid is arranged in the film removing water tank, the bottom of the cleaning water tank is hollow, two spray pipes are arranged in the cleaning water tank and are arranged along the X axis, each spray pipe is arranged on one inner side wall of the cleaning water tank, the drying device comprises two drying machines, the two drying machines are arranged along the X axis, and drying openings of the two drying machines are arranged oppositely;
the air pump is connected with the air bubble stone through an air pipe, and the air bubble stone is arranged in the corrosive liquid of the corrosive water tank and is used for blowing air into the corrosive liquid to form air bubbles.
Preferably, the washing device further comprises a waste liquid tank, the water outlets of the corrosion water tank and the membrane removing water tank are respectively connected with the waste liquid tank through a liquid discharge pipeline, and the waste liquid tank is located below the washing water tank and used for collecting liquid flowing out of the hollow part of the washing water tank.
Preferably, a pH sensor, a temperature sensor and a water level sensor are arranged in the corrosion water tank.
Preferably, a heating rod is arranged in the corrosion water tank, and the heating rod is connected with a relay positioned outside the corrosion water tank.
Preferably, a PH sensor, a temperature sensor and a water level sensor are arranged in the film removing water tank.
Preferably, a heating rod is arranged in the film removing water tank and connected with a relay positioned outside the film removing water tank.
Preferably, the air pump is connected with a relay, and a flow regulating valve is arranged on the air inlet pipeline.
Preferably, the liquid inlet pipeline and the liquid discharge pipeline of the corrosion water tank are respectively provided with an electromagnetic valve.
Preferably, the liquid inlet pipeline and the liquid discharge pipeline of the membrane removing water tank are respectively provided with an electromagnetic valve.
Preferably, each spray pipe is respectively connected with a water inlet pipe, and an electromagnetic valve and a flow regulating valve are arranged on the water inlet pipe.
Generally, through the utility model discloses above technical scheme who conceives compares with prior art, can gain following beneficial effect:
1) the utility model discloses a XZ axle moving platform can drive the removal and reciprocate about the PI membrane copper that covers, can corrode in proper order, the processing of four processes of striping, washing, stoving, degree of automation is high, can accomplish unmanned on duty, and work efficiency is high moreover, can realize handling in batches greatly.
2) The waste liquid generated in the whole treatment process can be collected and treated collectively, so that the influence on environmental damage can be effectively reduced;
3) the utility model discloses a temperature, water level, pH value in corrosion water tank, the striping basin all can carry out real time monitoring.
Drawings
FIG. 1 is a schematic structural view of the PI film coated copper plate of the present invention during processing;
fig. 2 is a schematic view of the present invention after a part of the sheet material is removed from the frame.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Furthermore, the technical features mentioned in the embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
As shown in fig. 1 and 2, an automatic processing device for a PI film-coated copper plate comprises a frame 1, and an XZ axis moving platform 2, a PI film-coated copper plate clamp 3, a corrosion water tank 4, a film removing water tank 5, a cleaning water tank 6, a drying device 7 and an air pump which are jointly installed on the frame 1, wherein a framework of the frame 1 is preferably built by 3030 sectional materials, and a plate with the thickness of 2mm in an outer frame installed on the framework is embedded in the framework.
The PI film copper-clad plate clamp 3 is mounted on the XZ-axis moving platform 2 and used for driving the PI film copper-clad plate clamp 3 to move along an X axis and a Z axis, and referring to FIG. 1, the X axis extends along the left-right direction and the Z axis extends along the up-down direction; the XZ-axis moving platform 2 is a commonly used two-axis moving platform and comprises an X-axis driving motor, an X-axis transmission mechanism, an X-axis guide rail (parallel to the X axis), a connecting frame, a Z-axis driving motor, a Z-axis transmission mechanism and a Z-axis guide rail (parallel to the Z axis), wherein as a preferable mode, the connecting frame can be directly arranged on the X-axis guide rail and is connected with the X-axis transmission mechanism, the X-axis driving motor drives the connecting frame to move longitudinally (leftwards and rightwards) along the X-axis guide rail through the X-axis transmission mechanism, the Z-axis driving motor is arranged on the connecting frame, the Z-axis driving motor drives the PI film-coated copper plate clamp 3 to move longitudinally (upwards and downwards) along the Z-axis guide rail through the Z-axis transmission mechanism, the PI film-coated copper plate clamp 3 clamps the PI film-coated copper plate 10, and the PI; preferably, the connecting frame comprises a supporting frame and a Y-axis guide rail which are connected together, the Y-axis guide rail is connected with the X-axis transmission mechanism, the Z-axis driving motor is installed on the supporting frame, the Y-axis guide rail is parallel to the Y-axis, and the X-axis, the Y-axis and the Z-axis jointly form a Cartesian coordinate system. Preferably, the automatic processing equipment further comprises a waste liquid tank 8, the water outlets of the corrosion water tank 4 and the membrane removing water tank 5 are respectively connected with the waste liquid tank 8 through a liquid discharge pipeline, the waste liquid tank 8 is located below the cleaning water tank 6 and used for collecting liquid flowing out of the hollow part of the cleaning water tank 6, and waste liquid can be directly discharged into the waste liquid tank 8 for centralized processing.
The etching water tank 4, the film removing water tank 5, the cleaning water tank 6 and the drying device 7 are sequentially arranged along the X axis, etching liquid is arranged in the etching water tank 4, the XZ axis moving platform 2 can drive the PI film copper-clad plate 10 to move to the upper side of the etching water tank 4 along the left and right directions, then the PI film copper-clad plate 10 is driven to move downwards to enter the etching water tank 4 for etching treatment, film removing liquid is arranged in the film removing water tank 5, the XZ axis moving platform 2 can drive the PI film copper-clad plate 10 to move to the upper side of the film removing water tank 5 along the left and right directions, then the PI film copper-clad plate 10 is driven to move downwards to enter the film removing water tank 5 for film removing treatment, the bottom of the cleaning water tank 6 is hollowed, two spray pipes 9 are arranged in the cleaning water tank 6 and arranged along the X axis, each spray pipe 9 can be parallel to the Y axis and can also be arranged obliquely relative to the horizontal plane, each spray pipe 9 is respectively arranged on one inner side wall of the cleaning water tank 6, the XZ-axis moving platform 2 can drive the PI film copper-clad plate 10 to move above the cleaning water tank 6 along the left and right directions, then drive the PI film copper-clad plate 10 to move downwards to enter the cleaning water tank 6 for cleaning treatment, high-pressure water generated by the spray pipes 9 on the two sides of the inner wall of the cleaning tank is utilized to impact the surface of the PI film copper-clad plate 10 to realize cleaning, and the cleaned wastewater can flow out through the hollowed holes at the bottom of the cleaning water tank 6 and flow into the waste liquid tank 8; the drying device 7 comprises two dryers, the two dryers are arranged along an X axis, drying openings of the dryers are arranged oppositely, an XZ axis moving platform 2 can drive a PI film copper-clad plate 10 to move above the drying device 7 along the left and right directions, then the PI film copper-clad plate 10 is driven to move downwards to enter between the two dryers, and then the two dryers can simultaneously dry the left side and the right side of the PI film copper-clad plate 10.
The air pump is connected with the air bubble stone through an air pipe, and the air bubble stone is arranged in the corrosive liquid of the corrosive water tank 4 and is used for blowing air into the corrosive liquid to form air bubbles, so that the corrosion speed is accelerated.
Further, this PI membrane covers copper anchor clamps 3 includes a vertical board and installs a plurality of clips on the vertical board, and the clip can reset through torsion spring, through the edge of these clips centre gripping PI membrane covers copper 10, can fix PI membrane covers copper 10 on PI membrane covers copper anchor clamps 3. In addition, the vertical plate can be processed with a larger through hole in the middle part along the left and right directions, so that two dryers can be convenient to simultaneously dry the left and right side surfaces of the PI film coated copper plate 10.
Further, be provided with PH sensor, temperature sensor and level sensor in the corruption basin 4, also be provided with PH sensor, temperature sensor and level sensor in the water tank 5 that strips to can gather each item parameter of the liquid in corruption basin 4 and the water tank 5 that strips, after corresponding process is accomplished, there is audible and visual warning suggestion occasionally PH, temperature, water level are unusual.
Further, be provided with the heating rod in the corrosion water tank 4, reach the purpose of heating corrosive liquid, can accelerate corrosion rate, this heating rod is connected with the relay that is located this corrosion water tank 4 outside simultaneously, can control the work of the heating rod in the corrosion water tank 4 through the relay, control safe and reliable.
Further, be provided with the heating rod in the water tank 5 that strips, reach the purpose of heating the stripping liquid, can accelerate the striping speed, this heating rod is connected with the relay that is located this water tank 5 outside that strips simultaneously, can control the work of the heating rod in the water tank 5 that strips through the relay, control safe and reliable.
Furthermore, the air pump is connected with a relay, the control is safe and reliable, and the air inlet pipeline is provided with a flow regulating valve so as to control the air inflow and the amount of bubbles generated in the corrosive liquid.
Further, be provided with the solenoid valve on the inlet channel of corruption basin 4 and the flowing back pipeline respectively, be provided with the solenoid valve on the inlet channel of striping basin 5 and the flowing back pipeline respectively to can control feed liquor and flowing back through electronic mode.
Furthermore, each spray pipe 9 is respectively connected with a water inlet pipe, and an electromagnetic valve and a flow regulating valve are arranged on the water inlet pipe to control the water pressure entering the spray pipes 9.
The utility model discloses an XZ axle moving platform 2 is automatic to take PI membrane copper plate 10 to corrode basin 4, corrode respectively in the water tank 5 that strips and the washing basin 6, the striping and wash, then take drying device 7 department to dry again, corrode, the striping, wash and dry time all can control (processing time has enough to remove PI membrane copper plate 10 through XZ axle moving platform 2 again after again), degree of automation and treatment effeciency are high, can realize handling in batches.
It will be understood by those skilled in the art that the foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An automatic processing device of PI film copper plate, which is characterized by comprising a frame, an XZ axis moving platform, a PI film copper plate clamp, a corrosion water tank, a film removing water tank, a cleaning water tank, a drying device and an air pump which are arranged on the frame together, wherein,
the PI film copper-clad plate clamp is mounted on the XZ-axis moving platform and used for driving the PI film copper-clad plate clamp to move along an X axis and a Z axis, wherein the X axis extends along the left-right direction and the Z axis extends along the up-down direction;
the corrosion water tank, the film removing water tank, the cleaning water tank and the drying device are sequentially arranged along the X axis, corrosion liquid is arranged in the corrosion water tank, film removing liquid is arranged in the film removing water tank, the bottom of the cleaning water tank is hollow, two spray pipes are arranged in the cleaning water tank and are arranged along the X axis, each spray pipe is arranged on one inner side wall of the cleaning water tank, the drying device comprises two drying machines, the two drying machines are arranged along the X axis, and drying openings of the two drying machines are arranged oppositely;
the air pump is connected with the air bubble stone through an air pipe, and the air bubble stone is arranged in the corrosive liquid of the corrosive water tank and is used for blowing air into the corrosive liquid to form air bubbles.
2. The automatic processing equipment for the PI film copper-clad plate according to claim 1, further comprising a waste liquid tank, wherein the water outlets of the corrosion water tank and the stripping water tank are respectively connected with the waste liquid tank through a liquid discharge pipeline, and the waste liquid tank is positioned below the cleaning water tank and used for collecting liquid flowing out of the hollow part of the cleaning water tank.
3. The automatic processing equipment for the PI film coated copper plate as claimed in claim 1, wherein a PH sensor, a temperature sensor and a water level sensor are arranged in the corrosion water tank.
4. The automatic processing equipment for the PI film coated copper plate as claimed in claim 1, wherein a heating rod is arranged in the corrosion water tank, and the heating rod is connected with a relay positioned outside the corrosion water tank.
5. The automatic processing equipment for the PI film coated copper plate as claimed in claim 1, wherein a PH sensor, a temperature sensor and a water level sensor are arranged in the de-coating water tank.
6. The automatic processing equipment for the PI film coated copper plate as claimed in claim 1, wherein a heating rod is arranged in the film removing water tank, and the heating rod is connected with a relay positioned outside the film removing water tank.
7. The automatic processing equipment for the PI film copper plates as claimed in claim 1, wherein the air pump is connected with a relay, and a flow regulating valve is arranged on the air inlet pipeline.
8. The automatic processing equipment for the PI film coated copper plate as claimed in claim 1, wherein the liquid inlet pipeline and the liquid outlet pipeline of the corrosion water tank are respectively provided with an electromagnetic valve.
9. The automatic processing equipment for the PI film coated copper plate as claimed in claim 1, wherein the liquid inlet pipeline and the liquid outlet pipeline of the de-coating water tank are respectively provided with an electromagnetic valve.
10. The automatic processing equipment for the PI film coated copper plate as claimed in claim 1, wherein each spraying pipe is connected with a water inlet pipe, and the water inlet pipe is provided with an electromagnetic valve and a flow regulating valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921023869.2U CN210328177U (en) | 2019-07-03 | 2019-07-03 | Automatic processing equipment for PI film copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921023869.2U CN210328177U (en) | 2019-07-03 | 2019-07-03 | Automatic processing equipment for PI film copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210328177U true CN210328177U (en) | 2020-04-14 |
Family
ID=70148211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921023869.2U Active CN210328177U (en) | 2019-07-03 | 2019-07-03 | Automatic processing equipment for PI film copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210328177U (en) |
-
2019
- 2019-07-03 CN CN201921023869.2U patent/CN210328177U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101966524A (en) | Automatic cleaning method and device for aluminium alloy composite boards | |
| CN105880208A (en) | Stepping groove type ultrasonic cleaning machine | |
| CN208261348U (en) | Spray-cleaning Machine | |
| US4371422A (en) | Continuous processing of printed circuit boards | |
| CN110586555A (en) | Rotary cleaning machine for compressor parts | |
| CN104941949A (en) | Full-automatic one-armed manipulator ultrasonic cleaner and cleaning technology thereof | |
| CN108289379A (en) | PCB internal layers development etching and automatic optics inspection connecting line equipment and bus connection method | |
| CN210328177U (en) | Automatic processing equipment for PI film copper-clad plate | |
| CN210805718U (en) | Cleaning system | |
| CN105855235A (en) | High-efficiency energy-saving cleaning device | |
| CN110318042B (en) | Horizontal nickel-gold production line and nickel-gold melting method | |
| CN213327850U (en) | Acid pickling device for circuit board | |
| CN212669804U (en) | Hot-dip galvanizing pickling treatment device | |
| CN103834948B (en) | A kind of double fluted trench etch machine | |
| CN109462946A (en) | A kind of PCB welding resistance returns washing method | |
| CN206104885U (en) | Nonmetal filter equipment of full -automatic powder metallurgy | |
| CN202129232U (en) | Atomization stain removing device for electroplating workpiece | |
| RU72157U1 (en) | DEVICE FOR CLEANING ROLLING BEARINGS | |
| CN112289716A (en) | Silicon chip processing is with removing phosphorus silicon glass acid dip pickle | |
| CN207589287U (en) | A kind of full-automatic PCB Sheetmaking systems based on Internet of Things | |
| CN212463667U (en) | Vertical transmission equipment | |
| CN215463080U (en) | Acid mist purification treatment system | |
| CN111321445A (en) | Automobile wheel hub electrophoresis apparatus | |
| CN212893958U (en) | Reaction device for electroplating spraying wastewater | |
| KR100573359B1 (en) | Continuous Automatic Facilities for Electrochemical Indirect Etching of Aluminium Plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |