CN210328162U

CN210328162U - Split circuit board

Info

Publication number: CN210328162U
Application number: CN201920834024.5U
Authority: CN
Inventors: 王健康; 吴俊�
Original assignee: Kunshan Hongyuntong Multilayer Circuit Board Co ltd
Current assignee: Kunshan Hongyuntong Multilayer Circuit Board Co ltd
Priority date: 2019-06-04
Filing date: 2019-06-04
Publication date: 2020-04-14
Anticipated expiration: 2029-06-04

Abstract

The utility model provides a close amalgamation circuit board, including the first to the N base plate that stacks gradually the setting, wherein, the area of the N base plate is more than or equal to the area of N +1 base plate, and the regional printing of the N base plate has at least one the same or different N layer PCB circuit, and the regional printing that does not overlap with N +1 base plate on the N base plate has at least one the same or different N layer PCB circuit, and wherein, N and N are positive integer, and 1 is not more than or equal to N < N. The utility model discloses can improve material utilization ratio, practice thrift manufacturing cost to reduce the material number, guarantee the production simplification, improve production efficiency.

Description

Split circuit board

Technical Field

The utility model relates to a circuit board technical field, concretely relates to close amalgamation circuit board.

Background

At present, aiming at the production orders of various PCBs (Printed Circuit boards) in small batch, the corresponding production material numbers are more, and most of the material numbers need to be made into first pieces, so that the production efficiency is low, and the same PCB finished products with small quantity are cut out by a large plate, so that a large amount of residues exist, and the production materials are wasted.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem in the above-mentioned technique at least to a certain extent, for this reason, the utility model provides a close amalgamation circuit board can improve material utilization ratio, practices thrift manufacturing cost to reduce the material number, guarantee the production simplification, improve production rate.

In order to achieve the above object, the utility model provides a following technical scheme: a splicing circuit board comprises first to N substrates which are sequentially stacked, wherein the area of the N substrate is larger than or equal to that of the N +1 substrate, at least one same or different N layers of PCB circuits are printed in the area of the N substrate, at least one same or different N layers of PCB circuits are printed in the area, which is not overlapped with the N +1 substrate, of the N substrate, wherein N and N are positive integers, and N is larger than or equal to 1 and is smaller than or equal to N.

According to the utility model provides a close amalgamation circuit board, through by lower supreme range upon range of multilayer base plate that sets gradually, the area of lower one deck base plate is greater than or equal to the area of upper strata base plate in two base plates of adjacent layer, the regional PCB circuit of printing the corresponding number of piles with the upper strata base plate overlap on every layer of base plate, therefore, can close a plurality of the same or different PCB circuits and amalgamate and print on a big board, and can be with different layer PCB, the individual layer promptly, bilayer and multilayer PCB close and amalgamate and print on a big board, thereby can improve material utilization rate, and save manufacturing cost, and reduce the material number, guarantee the production simplification, improve production rate.

In addition, according to the utility model discloses the amalgamation circuit board that above-mentioned embodiment provided can also have following additional technical characterstic:

further, there is a gap between adjacent PCB circuits.

Further, the spliced circuit board is provided with a master material number, and each PCB circuit is provided with a respective slave material number.

Further, the substrates of adjacent layers are pressed together by using prepregs.

Furthermore, each substrate is square, and one corner of each square substrate coincides with one corner of the other square substrate.

Drawings

Fig. 1 is a top view of a composite circuit board according to an embodiment of the present invention;

fig. 2 is a front view of a composite circuit board according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1, the utility model discloses close amalgamation circuit board of embodiment is including the first to nth base plate that stacks gradually the setting. The area of the nth substrate is larger than or equal to that of the (N + 1) th substrate, at least one same or different N-layer PCB circuit is printed in the area of the nth substrate, at least one same or different N-layer PCB circuit is printed in the area, which is not overlapped with the (N + 1) th substrate, of the nth substrate, wherein N and N are positive integers, and N is larger than or equal to 1 and is smaller than N.

As shown in fig. 2, the first to nth substrates are stacked from bottom to top to form a stacked structure of a first to nth layers.

The utility model discloses an embodiment, if the number of piles of a batch PCB circuit that needs the printing covers 1 to N, then can make the area of base plate in the above-mentioned laminated structure decrease progressively from bottom to top successive layer, and then can be in the shared region of the superiors base plate, and the region that does not overlap with adjacent last layer base plate on other each layer base plate prints at least one the same or different PCB circuit, and the number of piles of PCB circuit depends on the regional base plate number of piles of printing.

If the number of layers of a batch of PCB circuits to be printed does not completely cover 1 to N, for example, i layers of PCB circuits are not included, i is more than or equal to 1 and less than N, the areas of the ith substrate and the (i + 1) th substrate in the laminated structure are equal and completely overlapped, and the areas of other substrates are gradually decreased from bottom to top.

If the number of layers of a batch of PCB circuits to be printed is equal and N layers of PCB circuits are adopted, the areas of the substrates in the laminated structure are the same, and the first substrate to the Nth substrate are completely overlapped.

In one embodiment of the present invention, as shown in fig. 1, each substrate is square, and one corner of each square substrate coincides with one corner of the other square substrate. Through making an angle of all square base plates coincide mutually, can be convenient for concentrate on the overlapping region of all square base plates together, also can guarantee simultaneously that the region outside overlapping concentrates on together, from this, not only do benefit to the range upon range of design and the preparation of N base plates, still more do benefit to and close more PCB circuit and piece together on a circuit board, can reduce the area of closing the regional area of vacancy on the piece together circuit board, improve the utilization ratio that closes the piece together circuit board.

In an embodiment of the present invention, the substrates of adjacent layers are pressed together by using prepregs. The method comprises the steps of placing a prepreg with low fluidity between two substrates of adjacent layers, ensuring that one corner of the two substrates of the adjacent layers is completely matched, placing the prepreg in high temperature and high pressure for pressing, ensuring that the prepreg is controlled and cannot flow out of a pressing position, and forming the combined circuit board provided by the embodiment of the utility model.

In an embodiment of the present invention, the printed circuit board assembly has a mother board number, and each PCB circuit has a respective daughter board number. For example, in actual production, need print five different types of PCB circuit, then corresponding have five son material numbers, after setting up these five PCB circuits that need print in a amalgamation circuit board through amalgamation technique, can set up a masterbatch number corresponding to amalgamation circuit board, can become a masterbatch number with five son material numbers from this, reducible material number to can improve production efficiency, guarantee the production simplification.

In one embodiment of the present invention, there is a gap between adjacent PCB circuits. After the PCB circuit printing on the splicing circuit board is finished, a required PCB finished product can be cut through the gap between the adjacent PCB circuits.

In an embodiment of the present invention, N is 2, i.e. the second substrate 2 can be disposed on the first substrate 1 by the above-mentioned pressing method to obtain the combined circuit board shown in fig. 3, wherein the area of the second substrate 2 is smaller than the area of the first substrate 1. The overlapping area, i.e. the double-layer portion, is printed with 4 double-layer PCB circuits a, and the area of the first substrate 1 that is not overlapped with the second substrate 2, i.e. the single-layer portion, can be used for printing 5 single-layer PCB circuits b, 6 single-layer PCB circuits c, 2 single-layer PCB circuits d, and 4 single-layer PCB circuits e.

In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A spliced circuit board is characterized by comprising first to N substrates which are sequentially stacked, wherein the area of the N substrate is larger than or equal to that of the N +1 substrate, at least one same or different N-layer PCB circuit is printed in the area of the N substrate, at least one same or different N-layer PCB circuit is printed in the area, which is not overlapped with the N +1 substrate, of the N substrate, wherein N and N are positive integers, and N is larger than or equal to 1 and is smaller than or equal to N.

2. The puzzle circuit board of claim 1, wherein adjacent PCB circuits have a gap therebetween.

3. The tiled circuit board of claim 1, wherein the tiled circuit board has one master stock number and each PCB circuit has a respective slave stock number.

4. The tiled circuit board of claim 1, wherein the substrates of adjacent layers are pressed together using a prepreg.

5. The puzzle circuit board of claim 1, wherein each of the base plates is square, and wherein one corner of each of the square base plates coincides with one corner of the other square base plate.