CN210328114U - Multilayer circuit board - Google Patents
Multilayer circuit board Download PDFInfo
- Publication number
- CN210328114U CN210328114U CN201920881477.3U CN201920881477U CN210328114U CN 210328114 U CN210328114 U CN 210328114U CN 201920881477 U CN201920881477 U CN 201920881477U CN 210328114 U CN210328114 U CN 210328114U
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- Prior art keywords
- circuit board
- heat dissipation
- layer
- main body
- hole
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- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model provides a multilayer circuit board, which comprises a circuit board main body, an inner layer circuit board, a circuit board frame, a threaded hole, an aluminum alloy plating layer, a copper plating layer, a pin hole, a pin post, an insulating layer, a heat dissipation hole and a waterproof breathable film, wherein the circuit board main body is fixed on the lower end face of the circuit board frame, the threaded hole is arranged on the upper end face of the circuit board frame, the inner layer circuit board is assembled in the circuit board main body, the aluminum alloy plating layer is arranged on the lower end face of the aluminum alloy plating layer, the pin hole is arranged in the circuit board main body, the pin post is arranged in the pin hole, the insulating layer is coated on the lower end face of the inner layer circuit board, the heat dissipation hole is arranged on the surface of the insulating layer, the waterproof breathable film, the usability is good.
Description
Technical Field
The utility model relates to a multilayer circuit board belongs to circuit board technical field.
Background
The double-sided board is a medium layer in the middle, and the two sides are wiring layers. The multilayer board is a multilayer wiring layer, and a dielectric layer is arranged between every two layers and can be made very thin. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface and the remaining one is incorporated in an insulating board. The electrical connections between them are usually made through plated-through holes in the cross-section of the circuit board.
Among the prior art, current multilayer circuit board is because the heat dissipation is not good when using, and the life-span of multilayer heating panel descends, when the operation is used, produces a large amount of heats in the circuit board, and the heat is difficult to dispel and each circuit board heat dissipation inhomogeneous degree is high, leads to its multilayer circuit board work fault rate height, influences equipment operation, and the problem that above-mentioned appearance is solved to the urgent need for a multilayer circuit board now.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a multilayer circuit board to solve the problem that proposes in the above-mentioned background art, the utility model discloses rational in infrastructure, the composite mounting of being convenient for, the radiating effect is good, and the usability is good.
In order to achieve the above purpose, the present invention is realized by the following technical solution: a multilayer circuit board comprises a circuit board main body, an inner layer circuit board, a heat dissipation mechanism, a circuit board frame and a threaded hole, the circuit board main body is fixed on the lower end face of the circuit board frame, the upper end face of the circuit board frame is provided with a threaded hole, the inner layer circuit board is assembled in the circuit board main body, the heat dissipation mechanism is arranged in the circuit board main body, the heat dissipation mechanism comprises an aluminum alloy plating layer, a copper plating layer, pin holes, pins, an insulating layer, heat dissipation holes and a waterproof and breathable film, the lower end face of the circuit board main body is provided with an aluminum alloy coating, the lower end face of the aluminum alloy coating is provided with a copper coating, the circuit board main body is internally provided with a pin hole, a pin post is arranged in the pin hole, the lower end surface of the inner layer circuit board is coated with an insulating layer, the insulating layer surface has seted up the louvre, the inside upside bonding of louvre has waterproof ventilated membrane.
Furthermore, a flame-retardant PC film is bonded at the joint of the copper plating layer and the inner-layer circuit board.
Further, the inner diameter of the pin hole is matched with the specification of the pin column.
Furthermore, the insulating layer is made of resin.
Further, the specification of the waterproof breathable film is matched with the inner diameter of the heat dissipation hole.
Furthermore, the radiating holes and the waterproof breathable film form a radiating assembly, and the radiating assembly is provided with a plurality of groups, and the specifications of the plurality of groups of radiating assemblies are the same.
The utility model has the advantages that: the utility model discloses a multilayer circuit board, because of the utility model discloses added aluminum alloy cladding material, copper plating layer, pinhole, round pin post, insulating layer, louvre and waterproof ventilated membrane, this design can be cooled down to the inlayer circuit board, has solved the not good problem of original multilayer circuit board result of use, has improved the utility model discloses a radiating efficiency.
Because of copper cladding material bonds with inlayer circuit board junction has fire-retardant PC film, this design prevents through using fire-retardant PC film that the circuit board main part burns out because of the heat dissipation is not good, be the resin because of the insulating layer material, this design prevents to appear short circuit phenomenon between the inlayer circuit board and damages the circuit board main part through using the insulating layer, because of waterproof ventilated membrane specification and louvre internal diameter phase-match, this design prevents inside water entering inlayer circuit board and carry out better heat dissipation through using waterproof ventilated membrane, the louvre constitutes radiator unit with waterproof ventilated membrane, and radiator unit is provided with the multiunit, multiunit radiator unit specification is the same, this design is through using radiator unit better evenly radiating to inlayer circuit board, the utility model discloses rational in infrastructure, the aggregate erection of being convenient for, the radiating effect is.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural view of a multilayer circuit board of the present invention;
fig. 2 is a top view of a multilayer circuit board according to the present invention;
fig. 3 is a schematic structural view of a heat dissipation mechanism in a multilayer circuit board according to the present invention;
FIG. 4 is an enlarged view of A in a multilayer circuit board according to the present invention;
in the figure: 1-a circuit board main body, 2-an inner layer circuit board, 3-a heat dissipation mechanism, 4-a circuit board frame, 5-a threaded hole, 31-an aluminum alloy plating layer, 32-a copper plating layer, 33-a pin hole, 34-a pin column, 35-an insulating layer, 36-a heat dissipation hole, 37-a waterproof breathable film and 321-a flame-retardant PC film.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a multilayer circuit board, includes circuit board main part 1, inlayer circuit board 2, heat dissipation mechanism 3, circuit board grillage 4 and screw hole 5, and terminal surface is fixed with circuit board main part 1 under the circuit board grillage 4, and screw hole 5 is seted up to circuit board grillage 4 up end, and 1 internal assembly of circuit board main part has inlayer circuit board 2, and 1 inside heat dissipation mechanism 3 that is provided with of circuit board main part.
Copper plating 32 bonds with inlayer circuit board 2 junction has fire-retardant PC film 371, this design prevents circuit board main part 1 because of the poor burning out of heat dissipation through using fire-retardant PC film 371, pinhole 33 internal diameter and round pin 34 specification phase-match, the rationality of this design has been improved, insulating layer 35 material is the resin, this design prevents to appear short circuit phenomenon between the inlayer circuit board 2 through using insulating layer 35 and damages circuit board main part 1, waterproof ventilated membrane 37 specification and 36 internal diameter phase-matches of louvre, this design prevents that water from getting into inside the inlayer circuit board 2 and carrying out better heat dissipation through using waterproof ventilated membrane 37, louvre 36 constitutes radiator unit with waterproof ventilated membrane 37, and radiator unit is provided with the multiunit, multiunit radiator unit specification is the same, this design is through using better carrying out even heat dissipation to inlayer circuit board 2 of radiator unit.
As an embodiment of the present invention: when circuit board main part 1 is inside when producing a large amount of heats, the heat is partly inside through fire-retardant PC film 371 entering copper coating 32, then transmit the outside air by circuit board frame 4 through aluminum alloy coating 31, copper coating 32 and aluminum alloy coating 31 can accelerate thermal transmission, partly heat is in the outside air through round pin post 34 transmission, partly heat flows in waterproof ventilated membrane 37 inside at last from the inside atmosphere that flows in of louvre 36 by insulating layer 35 in addition, the purpose of carrying out quick homodisperse to the heat of circuit board main part 1 inside has been played, thereby make circuit board main part 1's life more permanent, improved the utility model discloses a radiating efficiency.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a multilayer circuit board, includes circuit board main part, inlayer circuit board, heat dissipation mechanism, circuit board frame and screw hole, its characterized in that: a circuit board main body is fixed on the lower end face of the circuit board frame, a threaded hole is formed in the upper end face of the circuit board frame, an inner-layer circuit board is assembled in the circuit board main body, and a heat dissipation mechanism is arranged in the circuit board main body;
the heat dissipation mechanism comprises an aluminum alloy plating layer, a copper plating layer, a pin hole, a pin post, an insulating layer, a heat dissipation hole and a waterproof breathable film, wherein the aluminum alloy plating layer is arranged on the lower end face of the circuit board main body, the copper plating layer is arranged on the lower end face of the aluminum alloy plating layer, the pin hole is formed in the circuit board main body, the pin post is placed in the pin hole, the insulating layer is coated on the lower end face of the inner-layer circuit board, the heat dissipation hole is formed in the surface of the insulating layer.
2. The multilayer wiring board of claim 1, wherein: and a flame-retardant PC film is bonded at the joint of the copper plating layer and the inner layer circuit board.
3. The multilayer wiring board of claim 1, wherein: the inner diameter of the pin hole is matched with the specification of the pin column.
4. The multilayer wiring board of claim 1, wherein: the insulating layer is made of resin.
5. The multilayer wiring board of claim 1, wherein: the specification of the waterproof breathable film is matched with the inner diameter of the heat dissipation hole.
6. The multilayer wiring board of claim 1, wherein: the radiating holes and the waterproof breathable film form radiating assemblies, and the radiating assemblies are provided with a plurality of groups, and the specifications of the plurality of groups of radiating assemblies are the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920881477.3U CN210328114U (en) | 2019-06-12 | 2019-06-12 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920881477.3U CN210328114U (en) | 2019-06-12 | 2019-06-12 | Multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210328114U true CN210328114U (en) | 2020-04-14 |
Family
ID=70143320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920881477.3U Expired - Fee Related CN210328114U (en) | 2019-06-12 | 2019-06-12 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210328114U (en) |
-
2019
- 2019-06-12 CN CN201920881477.3U patent/CN210328114U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200414 Termination date: 20210612 |