CN210295930U - High-temperature-resistant conductive film - Google Patents
High-temperature-resistant conductive film Download PDFInfo
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- CN210295930U CN210295930U CN201921355783.XU CN201921355783U CN210295930U CN 210295930 U CN210295930 U CN 210295930U CN 201921355783 U CN201921355783 U CN 201921355783U CN 210295930 U CN210295930 U CN 210295930U
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Abstract
The utility model discloses a high temperature resistant conductive film, including the heat-resistant film, first metallic coating, second metallic coating and third metallic coating have set gradually on the heat-resistant die, first metallic coating evenly covers on the heat-resistant film through the vacuum plating technology, second metallic coating and third metallic coating through electroplating or chemical plating in proper order with first cladding material in close combination, the high temperature resistant conductive film product testing 30M ~ 3G frequency shielding efficiency of this structure is 80 ~ 90dB, and the high temperature resistant conductive film cladding material face level resistance of this structure<0.05Ω/inch2Excellent welding performance and high-temperature resistance of the structureThe electric film can be used for wrapping foam, and the finished product has excellent electric conduction and compression performance, can be welded and resists high temperature.
Description
Technical Field
The utility model relates to a film structure of inside use of electronic product, in particular to high temperature resistant conductive film.
Background
With the rapid development of the electronic industry, the demand for conductive materials is also increasing, and these demands include ultra-thinning of materials, good conductivity, high chemical stability, good shielding effectiveness, and the like, and there is no conductive material which has outstanding dielectric properties, mechanical properties, radiation resistance, wear resistance, and the like when used at high temperature besides the above properties in the market at present.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide a high temperature resistant conductive film, it has chemical stability height, and electric conductivity, characteristics that shielding effectiveness is good.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a high temperature resistant conductive film, includes the heat-resistant film, first metallic coating, second metallic coating and third metallic coating have set gradually on the heat-resistant mould, first metallic coating evenly covers on the heat-resistant film through the vacuum plating technology, second metallic coating and third metallic coating closely combine with first coating through electroplating or chemical plating in proper order.
Further, the method comprises the following steps: the first metal plating layer is gold, silver, copper or nickel.
Further, the method comprises the following steps: the second metal plating layer is gold, silver, copper or nickel.
Further, the method comprises the following steps: the third metal plating layer is silver or tin.
Further, the method comprises the following steps: the thickness of first metallic coating is only 0.05um ~ 0.1um, and the thickness of second metallic coating is 1 ~ 5um, and the thickness of third metallic coating is 1 ~ 5 um.
Further, the method comprises the following steps: the thickness of the high-temperature-resistant conductive film is 15-60 um.
Further, the method comprises the following steps: the heat-resistant film is polyimide.
The utility model has the advantages that:
1. polyimide has excellent temperature resistance: can be used in the environment of-269-280 ℃ for a long time; excellent mechanical properties: tensile strength >100 MPa; meanwhile, the composite material still has outstanding dielectric property, mechanical property, radiation resistance, wear resistance and the like when used at high temperature.
2. The 30M-3G frequency shielding effectiveness of the high-temperature resistant conductive film finished product of the structure is 80-90 dB.
3. The high-temperature resistant conductive film of the structureHorizontal resistance of film coating surface<0.05Ω/inch2The welding performance is excellent.
4. The high-temperature-resistant conductive film with the structure can be used for wrapping foam, and a finished product has excellent conductivity and compression performance, can be welded and is high-temperature-resistant.
Drawings
Fig. 1 is a schematic structural diagram of a high temperature resistant conductive film.
Labeled as: the coating comprises a heat-resistant film 1, a first metal plating layer 2, a second metal plating layer 3 and a third metal plating layer 4.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the following detailed description.
The high-temperature-resistant conductive film as shown in fig. 1 comprises a heat-resistant film 1, wherein a first metal plating layer 2, a second metal plating layer 3 and a third metal plating layer 4 are sequentially arranged on the heat-resistant film, the first metal plating layer 2 is uniformly coated on the heat-resistant film through a vacuum plating process, the vacuum plating has the characteristics of thinner plating layer and low pollution, the second metal plating layer 3 and the third metal plating layer 4 are sequentially and tightly combined with the first plating layer through electroplating or chemical plating, the heat-resistant film 1 is polyimide, the thickness of the polyimide can be 0.01-0.050 mm, and the polyimide has excellent temperature resistance: can be used in the environment of-269-280 ℃ for a long time; simultaneously has excellent mechanical properties: tensile strength >100 MPa; meanwhile, the coating still has outstanding dielectric property, mechanical property, radiation resistance, wear resistance and the like when used at high temperature;
during specific preparation, the thickness of each coating can be controlled as required, and the specific thickness of each layer is as follows: the thickness of the first metal coating 2 is only 0.05 um-0.1 um, the thickness of the second metal coating 3 is 1-5 um, and the thickness of the third metal coating 4 is 1-5 um, so that the whole thickness of the finished product is 15-60 um, the finished product can be used independently, and the wrapped foam after the coating can be used together inside the electronic product.
On the basis, the first metal plating layer 2 is gold, silver, copper or nickel, the second metal plating layer 3 is gold, silver, copper or nickel, and the third metal plating layer 4 is silver or tin.
The above structure was tested to have the following characteristics:
1. the 30M-3G frequency shielding effectiveness of the high-temperature resistant conductive film finished product of the structure is 80-90 dB.
2. The horizontal resistance of the coating surface of the high-temperature resistant conductive film of the structure<0.05Ω/inch2The welding performance is excellent.
3. The high-temperature-resistant conductive film with the structure can be used for wrapping foam, and a finished product has excellent conductivity and compression performance, can be welded and is high-temperature-resistant.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. A high temperature resistant conductive film, characterized in that: including heat-resistant film (1), first metal coating (2), second metal coating (3) and third metal coating (4) have set gradually on the heat-resistant film, first metal coating (2) evenly cover on the heat-resistant film through the vacuum plating technology, second metal coating (3) and third metal coating (4) through electroplating or chemical plating in proper order with first cladding material in close combination.
2. A high temperature resistant conductive film according to claim 1, wherein: the first metal plating layer (2) is gold, silver, copper or nickel.
3. A high temperature resistant conductive film according to claim 1, wherein: the second metal plating layer (3) is gold, silver, copper or nickel.
4. A high temperature resistant conductive film according to claim 1, wherein: the third metal plating layer (4) is silver or tin.
5. A high temperature resistant conductive film according to claim 1, wherein: the thickness of first metal coating (2) is only 0.05um ~ 0.1mm, and the thickness of second metal coating (3) is 1 ~ 5um, and the thickness of third metal coating (4) is 1 ~ 5 um.
6. A high temperature resistant conductive film according to claim 1, wherein: the thickness of the high-temperature-resistant conductive film is 15-60 um.
7. A high temperature resistant conductive film according to claim 1, wherein: the heat-resistant film (1) is polyimide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921355783.XU CN210295930U (en) | 2019-08-20 | 2019-08-20 | High-temperature-resistant conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921355783.XU CN210295930U (en) | 2019-08-20 | 2019-08-20 | High-temperature-resistant conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210295930U true CN210295930U (en) | 2020-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201921355783.XU Active CN210295930U (en) | 2019-08-20 | 2019-08-20 | High-temperature-resistant conductive film |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111873562A (en) * | 2020-07-01 | 2020-11-03 | 苏州华捷电子有限公司 | High-temperature-resistant high-resilience electromagnetic shielding conductive foam and preparation process thereof |
| WO2021208541A1 (en) * | 2020-04-13 | 2021-10-21 | 深圳市海瀚新能源技术有限公司 | Conductive film and preparation method therefor |
| CN114075654A (en) * | 2020-08-22 | 2022-02-22 | 昆山鑫美源电子科技有限公司 | Preparation method of conductive film, current collection and transmission material and energy storage device |
| WO2022041447A1 (en) * | 2020-08-22 | 2022-03-03 | 昆山鑫美源电子科技有限公司 | Conductive thin film, method for manufacturing conductive thin film, current collecting and transmitting material, and energy storage apparatus |
-
2019
- 2019-08-20 CN CN201921355783.XU patent/CN210295930U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021208541A1 (en) * | 2020-04-13 | 2021-10-21 | 深圳市海瀚新能源技术有限公司 | Conductive film and preparation method therefor |
| EP4138098A4 (en) * | 2020-04-13 | 2024-05-22 | Shenzhen Hairun New Energy Tech Co Ltd | Conductive film and preparation method therefor |
| CN111873562A (en) * | 2020-07-01 | 2020-11-03 | 苏州华捷电子有限公司 | High-temperature-resistant high-resilience electromagnetic shielding conductive foam and preparation process thereof |
| CN114075654A (en) * | 2020-08-22 | 2022-02-22 | 昆山鑫美源电子科技有限公司 | Preparation method of conductive film, current collection and transmission material and energy storage device |
| WO2022041445A1 (en) * | 2020-08-22 | 2022-03-03 | 昆山鑫美源电子科技有限公司 | Method for preparing conductive film, current collection and transmission material, and energy storage apparatus |
| WO2022041447A1 (en) * | 2020-08-22 | 2022-03-03 | 昆山鑫美源电子科技有限公司 | Conductive thin film, method for manufacturing conductive thin film, current collecting and transmitting material, and energy storage apparatus |
| CN114075654B (en) * | 2020-08-22 | 2023-03-17 | 昆山鑫美源电子科技有限公司 | Preparation method of conductive film, current collection and transmission material and energy storage device |
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