CN210274697U

CN210274697U - Packaging structure of PCB board

Info

Publication number: CN210274697U
Application number: CN201920450331.3U
Authority: CN
Inventors: 王琼; 王继红
Original assignee: Xian Yep Telecommunication Technology Co Ltd
Current assignee: Xian Yep Telecommunication Technology Co Ltd
Priority date: 2019-04-03
Filing date: 2019-04-03
Publication date: 2020-04-07
Anticipated expiration: 2029-04-03

Abstract

The embodiment of the utility model provides a relate to electronic equipment technical field, disclose a packaging structure of PCB board. The utility model discloses in, the packaging structure of PCB board includes: the PCB body and the setting are in the conducting layer of PCB body upper surface, PCB body includes first PIN foot and second PIN foot, the conducting layer is including connecting first PIN foot with the connecting portion of second PIN foot, be provided with on the PCB body and be used for keeping apart connecting portion with the isolated part of PCB body, connecting portion with the isolated part is in at least partial the overlapping of orthographic projection on PCB body upper surface. The utility model provides a packaging structure of PCB board can reduce packaging structure's of PCB board material cost and manufacturing cost.

Description

Packaging structure of PCB board

Technical Field

The embodiment of the utility model provides a relate to electronic equipment technical field, in particular to packaging structure of PCB board.

Background

A PCB, i.e., a printed circuit board, is widely used in electronic devices due to its testability, high reliability, standardization, and the like. And in the debugging stage of the PCB, the 0 ohm resistance plays an important role. In the design process of the PCB, the connection of a signal path or a power supply path between two bonding pads is realized by adopting a 0 ohm resistor, so that the position is reserved, and the verification and debugging of the signal path or the power supply path on the PCB are favorably realized.

The inventor finds that at least the following problems exist in the prior art: the use of 0 ohm resistors in large quantities in the PCB board has high material and production costs. Therefore, there is a need to provide a new packaging structure of PCB to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a packaging structure of PCB board can reduce packaging structure's of PCB board material cost and manufacturing cost.

In order to solve the above technical problem, an embodiment of the present invention provides a packaging structure of a PCB board, including: the PCB body and the setting are in the conducting layer of PCB body upper surface, PCB body includes first PIN foot and second PIN foot, the conducting layer is including connecting first PIN foot with the connecting portion of second PIN foot, be provided with on the PCB body and be used for keeping apart connecting portion with the isolated part of PCB body, connecting portion with the isolated part is in at least partial the overlapping of orthographic projection on PCB body upper surface.

Compared with the prior art, the embodiment of the utility model, through connecting part with first PIN foot and second PIN foot direct connection, connecting part is as a virtual 0 ohm resistance, in the debugging stage of PCB board, can cut off connecting part if need replace other component, weld other component, when batch production, the influence of modification encapsulation to production file is only few connecting part, and do not need to carry out component replacement the connecting part remain can, owing to need not to weld 0 ohm resistance, the cost is saved, material cost and processing cost problem that prior art adopted 0 ohm resistance as PCB board debugging instrument can produce are solved; simultaneously, owing to be provided with on the PCB body and be used for keeping apart connecting portion with the isolation part of PCB body, connecting portion with the isolation part is in orthographic projection on this body upper surface of PCB partially overlaps at least, when cutting connecting portion, the cutting position can do connecting portion with the isolation part is in the part that orthographic projection on this body upper surface of PCB overlaps, because the connecting portion of this part with be provided with the isolation part between the PCB body to reduced will the signal that the connecting portion excessively violently damaged the PCB body when cutting off caused short circuit or the risk of breaking circuit, and then improved the reliability of PCB board.

In addition, the connecting part is a bonding pad with one end connected with the first PIN foot and the other end connected with the second PIN foot. So set up, only need make a pad can with first PIN foot with the second PIN foot is connected, simple structure has the cost advantage.

In addition, the pad includes first and second end portions respectively connecting the first PIN leg and the second PIN leg, and an intermediate portion connecting the first and second end portions, the intermediate portion having a width smaller than the first and second end portions. Due to the arrangement, when the bonding pad is cut, only the middle part with smaller width needs to be cut, so that the bonding pad is convenient to cut.

In addition, the width of the pad gradually increases from the middle portion toward the first end portion and the second end portion.

In addition, the connection portion includes a first pad connected to the first PIN, a second pad connected to the second PIN, and a printed wire connecting the first pad and the second pad.

In addition, the number of the printed wires is multiple, and the printed wires are arranged in parallel. So set up, guarantee the reliability that first PIN foot and second PIN foot are connected.

In addition, the upper surface of the PCB body is recessed towards the direction far away from the conducting layer to form the isolating part. So set up, the space has been reserved between the upper surface of isolation portion with connecting portion and PCB board body to can reduce will the signal that the too violent damage PCB board body of exerting oneself when connecting portion cut off causes the risk of short circuit or open circuit.

In addition, the upper surface of PCB board body is towards keeping away from the sunken portion of the sunken formation of direction of conducting layer, the isolation part set up in the sunken portion and with PCB board body non-communicative connection. So set up, when cutting off connecting portion, the edge of a knife only can contact the isolation part and can not cut the PCB board body to can reduce will when cutting off connecting portion exert oneself too violently the signal that damages the PCB board body causes the risk of short circuit or open circuit.

In addition, the buffer layer is made of metal.

In addition, the buffer layer comprises a plurality of metal layers, and the metal layers are all at least partially overlapped with the orthographic projection of the isolation part on the upper surface of the PCB body. The multilayer metal layer is more difficult to cut through, so that the risk of short circuit or open circuit caused by signals which damage the PCB body by too much force when the connecting part is cut off is further reduced.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

Fig. 1 is a plan view provided by a first embodiment of the present invention;

fig. 2 is a cross-sectional view provided by a first embodiment of the present invention;

FIG. 3 is a cross-sectional view of yet another alternative embodiment of the present invention;

fig. 4 is a plan view of a second embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will explain in detail each embodiment of the present invention with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.

The first embodiment of the present invention relates to a packaging structure 100 of a PCB, as shown in fig. 1 and 2, including: PCB board body 11 and setting are in the conducting layer of PCB board body 11 upper surface, PCB board body 11 includes first PIN foot and second PIN foot, the conducting layer is including connecting first PIN foot with the connecting portion 12 of second PIN foot, be provided with on the PCB board body 11 and be used for keeping apart connecting portion 12 with PCB board body 11's isolation 13, connecting portion 12 with isolation 13 is in orthographic projection on PCB board body 11 upper surface is at least partly overlapped.

Compared with the prior art, the embodiment of the utility model, through connecting portion 12 with first PIN foot and second PIN foot lug connection, first PIN foot and second PIN foot are used for connecting the component of PCB board, connecting portion 12 is as a virtual 0 ohm resistance, in the debugging stage (hardware debugging) of PCB board, if need replace other components available burin with connecting portion 12 cuts off, weld other components (resistance, exclusion, common mode inductance etc.), when batch production, the influence of modification encapsulation to production file is only few connecting portion 12, and do not need to carry out component replacement connecting portion 12 remain can, owing to need not to weld 0 ohm resistance, practiced thrift the cost, solved prior art and adopted 0 ohm resistance as the material cost and the processing cost problem that PCB board debugging instrument can produce; simultaneously, because be provided with on the PCB board body 11 and be used for keeping apart connecting portion 12 with the isolation 13 of PCB board body 11, connecting portion 12 with isolation 13 is in orthographic projection on the PCB board body 11 upper surface is at least partly overlapped, when cutting connecting portion 12, the cutting position can do connecting portion 12 with isolation 13 is in the part that orthographic projection on the PCB board body 11 upper surface overlapped, because the connecting portion 12 of this part with be provided with isolation 13 between the PCB board body 11, thereby reduced with the signal that connecting portion 12 took hard to damage PCB board body 11 when cutting off causes the risk of short circuit or open circuit, and then improved the reliability of PCB board.

In this embodiment, connecting portion 12 is connected for one end first PIN foot, the other end are connected the pad of second PIN foot, so set up, only need make a pad can with first PIN foot with the second PIN foot is connected, simple structure has the cost advantage.

Optionally, the pad includes a first end portion 121 and a second end portion 122 respectively connected to the first PIN leg and the second PIN leg, and an intermediate portion 123 connecting the first end portion 121 and the second end portion 122, a width of the intermediate portion 123 is smaller than that of the first end portion 121 and that of the second end portion 122, so that the intermediate portion 123 with a smaller width only needs to be cut off during cutting of the pad, and since the cutting width is smaller, the cutting of the pad is facilitated. Further, the width of the pad gradually increases from the middle portion 123 toward the first end portion 121 and the second end portion 122.

It is worth mentioning that the upper surface of the PCB body 11 is a recessed portion 14 recessed in a direction away from the conductive layer, and the isolation portion 13 is disposed in the recessed portion 14 and is in non-communication connection with the PCB body 11, so that when the connecting portion 12 is cut off by a nicking tool, the knife edge only contacts the isolation portion 13 and does not cut the PCB body 11, thereby reducing the risk of short circuit or open circuit caused by a signal that excessively violently damages the PCB body 11 when the connecting portion 12 is cut off. Further, the isolation portion 13 may be made of metal, for example, a copper sheet non-communicatively connected to the PCB body 11 is used as the isolation portion 13.

The isolation portion 13 may be a single layer of metal or a plurality of layers of metals. For example, when the routing space is large, more layers of protection may be designed according to the stacked routing, that is, the isolation portion 13 includes multiple metal layers, and the multiple metal layers at least partially overlap with an orthographic projection of the isolation portion 13 on the upper surface of the PCB body 11. The risk of short-circuiting or breaking due to signals that would damage the PCB body 11 by too much force when the connection 12 is cut off is further reduced, since the multi-layer metal layer is more difficult to cut through.

It can be understood that, as shown in fig. 3, in another possible embodiment of the present invention, the upper surface of the PCB body 11 faces away from the direction of the conductive layer is formed by recessing the isolation portion 13, i.e., the lower clearance of the connecting portion 12 is formed by the isolation portion 13, so as to set the isolation portion 13 to reserve a space between the connecting portion 12 and the upper surface of the PCB body 11, when the connecting portion 12 is cut off by the graver, the knife edge will not directly contact the PCB body 11, thereby reducing the risk of short circuit or open circuit caused by the signal that excessively hurts the PCB body 11 when the connecting portion 12 is cut off.

The second embodiment of the present invention relates to a package structure 200 of a PCB board. The second embodiment is substantially the same as the first embodiment, and mainly differs therefrom in that: in the first embodiment, the connection portion 12 is a pad having one end connected to the first PIN and the other end connected to the second PIN. In the second embodiment of the present invention, as shown in fig. 4, the connection portion 12 includes a first pad 124 connected to the first PIN, a second pad 125 connected to the second PIN, and a printed wire 126 connecting the first pad 124 and the second pad 125. In addition, those skilled in the art can understand that the technical effects of the present embodiment are similar to those of the first embodiment, and are not described herein again.

In this embodiment, the first pad 124 and the second pad 125 are both circular or square with the same size, the printed wire 126 is a straight line, and the width of the printed wire 126 is smaller than the width of the first pad 124 and the second pad 125, so that the printed wire 126 is cut more easily because the width of the printed wire 126 is narrower. The printed wire 126 is a copper foil, and can realize stable and reliable connection between the first pad 124 and the second pad 125, thereby realizing continuous conduction of signal paths, and the first pad 124 and the second pad 125 are configured as package pads of a chip component or package pads of a through component.

Optionally, the number of the printed wires 126 is multiple, and the multiple printed wires 126 are arranged in parallel, so that the connection reliability of the first PIN and the second PIN is ensured. Of course, the number of the printed wires 126 may be only one.

It will be understood by those skilled in the art that the foregoing embodiments are specific examples of the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in its practical application.

Claims

1. A PCB board packaging structure is characterized by comprising: the PCB body and the setting are in the conducting layer of PCB body upper surface, PCB body includes first PIN foot and second PIN foot, the conducting layer is including connecting first PIN foot with the connecting portion of second PIN foot, be provided with on the PCB body and be used for keeping apart connecting portion with the isolated part of PCB body, connecting portion with the isolated part is in at least partial the overlapping of orthographic projection on PCB body upper surface.

2. The PCB board packaging structure of claim 1, wherein the connecting portion is a pad having one end connected to the first PIN and the other end connected to the second PIN.

3. The PCB of claim 2, wherein the pad includes first and second end portions respectively connecting the first and second PIN legs, and a middle portion connecting the first and second end portions, the middle portion having a width smaller than the first and second end portions.

4. The PCB board packaging structure of claim 3, wherein the width of the pad gradually increases from the middle portion towards the first end portion and the second end portion.

5. The package structure of the PCB board according to claim 1, wherein the connection part includes a first pad connected to the first PIN, a second pad connected to the second PIN, and a printed wire connecting the first pad and the second pad.

6. The PCB board packaging structure of claim 5, wherein the number of the printed wires is plural, and the plural printed wires are arranged in parallel with each other.

7. The PCB board packaging structure of claim 1, wherein the upper surface of the PCB board body is recessed towards the direction away from the conductive layer to form the isolation portion.

8. The PCB board packaging structure of claim 1, wherein the upper surface of the PCB board body is recessed towards a direction away from the conductive layer to form a recess, and the isolation portion is disposed in the recess and is in non-communicative connection with the PCB board body.

9. The PCB packaging structure of claim 8, wherein the isolation portion is made of metal.

10. The PCB board packaging structure of claim 9, wherein the isolation portion comprises a plurality of metal layers, and each of the plurality of metal layers at least partially overlaps with an orthographic projection of the connection portion on the upper surface of the PCB board body.