CN210272279U - System for LGA packaging and LGA packaging structure - Google Patents
System for LGA packaging and LGA packaging structure Download PDFInfo
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- CN210272279U CN210272279U CN201921572902.7U CN201921572902U CN210272279U CN 210272279 U CN210272279 U CN 210272279U CN 201921572902 U CN201921572902 U CN 201921572902U CN 210272279 U CN210272279 U CN 210272279U
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Abstract
The utility model discloses a system and LGA packaging structure for LGA encapsulation, this system for LGA encapsulation includes: the glue dispenser is used for enabling a user to dispense the adhesive at a target position marked on the printed circuit board; the absorption tool is used for a user to absorb the wafer to be packaged so as to place the wafer to be packaged at a target position with adhesive; the drying oven is used for baking the printed circuit board adhered with the wafer to be packaged by a user so as to solidify the wafer to be packaged on the printed circuit board; and the manual wire bonder is used for bonding a connecting wire on the circuit board solidified with the wafer to be packaged by a user so as to enable the wafer to be packaged and the printed circuit board to be in circuit connection. The utility model provides a current LGA encapsulation need change the technical problem of packaging system self structure because of engineering sample changes.
Description
Technical Field
The utility model relates to a wafer packaging's technical field, more specifically relates to a system and LGA packaging structure for LGA encapsulation.
Background
LGA is called Land Grid Array (Land Grid Array) package, the wafer adopting LGA package is connected to PCB substrate (printed circuit board), and the PCB substrate replaces the former needle-like pins through metal contacts, so that the smaller package space is used to accommodate more output and input pins, and the integration level is higher; the pin circuit is short, the circuit impedance is reduced, and the electrical property is improved; meanwhile, large-scale mounting of the rear end is conveniently achieved through a tin paste printing mode, and mounting efficiency is improved.
The existing LGA packaging is all automatic equipment operation, the equipment investment is large, if the automatic packaging production line of the LGA switches models, long time is needed for equipment adjustment, especially for packaging a small amount of engineering samples, most of the time is spent on adjusting the equipment, the great productivity is lost, and packaging factories are generally rejected. However, as product updating iterations are accelerated, verification of wafers, designs, schemes, etc. is more and more frequent, the demand for packaging a small number of engineering samples is increasing, and frequent switching of LGA automated packaging lines is an unblocked trend.
Therefore, the disadvantages of the conventional LGA automated packaging production line that changes due to changes in engineering samples are more prominent, and there is an increasingly prominent contradiction between the conventional LGA automated packaging production line and the current product updating situation.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems existing in the prior art, the utility model provides a system and LGA packaging structure for LGA encapsulation can make the system for LGA encapsulation need not to change self structure because of the engineering sample changes, has realized LGA packaging structure's quick encapsulation.
According to a first aspect of the present invention, there is provided a system for LGA packaging, comprising:
the glue dispenser is used for enabling a user to dispense the adhesive at a target position marked on the printed circuit board;
the absorption tool is used for a user to absorb the wafer to be packaged so as to place the wafer to be packaged at the target position with the adhesive;
the drying oven is used for baking the printed circuit board adhered with the wafer to be packaged by a user so as to enable the wafer to be packaged to be solidified on the printed circuit board;
and the manual wire bonder is used for bonding a connecting wire on the circuit board solidified with the wafer to be packaged by a user so as to enable the wafer to be packaged to be in circuit connection with the printed circuit board.
Optionally, the dispenser is further configured to allow a user to apply a coating adhesive on the wafer to be packaged after the circuit connection;
the oven is also used for baking the coating glue coated on the wafer to be packaged by a user so as to enable the wafer to be packaged to be solidified between the coating glue and the printed circuit board.
Optionally, the adhesive is a glue, the system further comprising a freezer for refrigerating the glue prior to use.
Optionally, the system further comprises: the microscope is used for a user to check the wafer to be packaged, the printed circuit board and the connecting wires in the process of LGA packaging.
Optionally, the dispenser is further configured to allow a user to dispense package paste on the printed circuit board after the circuit connection; the system further comprises: and the heating table is used for heating the packaging adhesive placed with the packaging shell by a user so as to solidify the packaging shell on the printed circuit board and wrap the wafer to be packaged after circuit connection.
Optionally, the encapsulation adhesive is solder paste or glue.
Optionally, the system still includes visual purifying box, the point gum machine the frock is absorb the oven manual wire bonder the fridge the microscope with the warm table dress is in the purifying box, so that the user is in the purifying box right treat that the encapsulation wafer carries out the LGA encapsulation.
According to a second aspect of the present invention, there is provided an LGA package structure, including:
a printed circuit board marked with a target position;
after being sucked by the sucking tool, the wafer to be packaged is adhered to the target position through an adhesive and is cured on the printed circuit board through baking the adhesive by an oven, and the adhesive is dispensed on the target position through a dispenser by a user;
and the connecting wire is bonded between the wafer to be packaged and the printed circuit board through a manual wire bonder so as to perform circuit connection on the wafer to be packaged and the printed circuit board.
Optionally, the LGA package structure further includes:
coating glue, namely coating the glue on the wafer to be packaged after circuit connection, and baking the wafer to be packaged by an oven to enable the wafer to be packaged to be solidified between the coating glue and the printed circuit board;
and the packaging shell is solidified on the printed circuit board through packaging glue so as to wrap the wafer to be packaged after the wafer is in circuit connection with the printed circuit board.
Compare in the automatic encapsulation of the great LGA of current equipment input line of producing, the utility model provides a system for LGA encapsulation has following beneficial effect:
(1) the whole LGA packaging can be realized only by a small amount of equipment investment, the investment cost is low, and the requirement on the area of a field is small;
(2) the method does not need one procedure corresponding to different equipment like an LGA automatic packaging production line, and a user only needs to master a dispenser and a manual wire bonder, so that the requirement on personnel is low;
(3) the application range is wide, and the packaging of various LGA packaging structures can be met;
(4) the packaging preparation is simple, the packaging can be carried out after the material preparation of the packaging structure is finished, the packaging speed is high, and the engineering sample verification progress is accelerated;
(5) the packaging mode is flexible, and cross validation of various engineering schemes can be realized.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 shows a block diagram of a system structure for LGA packaging according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating a wafer to be packaged according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of another embodiment of a wafer to be packaged;
fig. 4 is a schematic diagram illustrating an LGA package according to a second embodiment of the present invention.
Detailed Description
The invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by like reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. Moreover, certain well-known elements may not be shown in the figures.
Numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of the devices are described below in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 is a block diagram of a system for LGA packaging according to an embodiment of the present invention. Referring to FIG. 1, a system for an LGA package includes: a dispenser 1, a suction tool 2, a baking oven 3 and a manual wire bonder 4, wherein,
the glue dispenser 1 is used for enabling a user to spot an adhesive on a target position marked on the printed circuit board;
the absorption tool 2 is used for a user to absorb the wafer to be packaged so as to place the wafer to be packaged at a target position with adhesive;
the drying oven 3 is used for baking the printed circuit board adhered with the wafer to be packaged by a user so as to solidify the wafer to be packaged on the printed circuit board;
and the manual wire bonder 4 is used for bonding connecting wires on the circuit board solidified with the wafer to be packaged by a user so as to enable the wafer to be packaged and the printed circuit board to be in circuit connection.
It should be noted that the target position is a position where a wafer to be packaged is preset on the printed circuit board, and the printed circuit board may mark the target position in a scribing manner.
Specifically, the inner diameter of the dispensing head of the dispenser 1 may be processed as required, and under a normal condition, the inner diameter is generally 0.2 mm. The suction tool 2 may be shaped like, but not limited to, tweezers.
The embodiment of the utility model provides a system for LGA encapsulation, the packaging method is nimble, can accomplish multiple LGA packaging structure fast under user's operation, and application scope does not receive factors such as waiting to encapsulate wafer quantity, encapsulation position and prescribe a limit to need not to change self structure because of the engineering sample changes, solved current LGA encapsulation and need change the technical problem of packaging system self structure because of the engineering sample changes, realized LGA packaging structure's quick encapsulation.
The dispenser 1 may also be used for a user to apply a coating adhesive (i.e., coating adhesive) on a wafer to be packaged after circuit connection; and, the oven 3 can also be used for baking the coating glue coated on the wafer to be packaged by the user, so that the wafer to be packaged is cured between the coating glue and the printed circuit board, thereby enabling the LGA packaging structure to have higher packaging reliability.
Referring to fig. 1, in an alternative embodiment, where the adhesive is glue, the system for LGA packaging may further include: and the refrigerating box 5 is used for refrigerating glue before use so as to ensure the adhesion of the glue to the wafer to be packaged. In particular, the principles of the cooler may be referenced to the fresh food compartment of the refrigerator.
In an alternative embodiment, the system for LGA packaging further includes a microscope 6, and the microscope 6 is used for a user to inspect the wafer to be packaged, the printed circuit board and the connecting wires during LGA packaging to ensure that the package is qualified.
In an optional embodiment, the dispenser 1 is further configured to allow a user to dispense package glue on the printed circuit board after the circuit connection, and the system for LGA packaging further includes a heating table 7, where the heating table 7 is configured to allow the user to heat the package glue on which the package casing is placed, so as to cure the package casing on the printed circuit board to wrap the wafer to be packaged after the circuit connection. Specifically, the package shell may be made of a metal material or plastic-encapsulated epoxy resin; the packaging adhesive is solder paste or glue; the heating table can be a platform with a larger area, so that the packaging adhesive under the packaging shell can be heated at the same time, and the packaging reliability is improved.
Referring to fig. 2, assuming that the wafer 30 to be packaged and the wafer 50 to be packaged are to be mounted on the printed circuit board 10, a user performing LGA packaging using the above-described system for LGA packaging may perform the following operation processes:
(1) and (3) mounting: firstly, the printed circuit board 10 is placed on a machine table of a dispenser to be dispensed with the glue 20 and the glue 60, and then the absorption tool is used for clamping the wafer 30 to be packaged and placing the wafer on the glue 20, and clamping the wafer 50 to be packaged and placing the wafer on the glue 60.
It should be noted that the way of dispensing the glue may be determined according to the structure of the wafer to be packaged, for example, if the wafer to be packaged is a common ASIC circuit having no cavity at the bottom similar to the wafer 30 to be packaged, the dispensing operation may be performed with the center of the target position for placing the wafer to be packaged as the center of the circle; if the wafer to be packaged is similar to the wafer 50 to be packaged and the bottom is a cavity structure, the cavity structure can be opened for square or circular scribing operation.
It should be understood that in the case of a poly-wafer package, the above-described mounting process may be repeated.
(2) Curing and bonding the connecting wire: checking the wafer 30 to be packaged and the glue 20, and the wafer 50 to be packaged and the glue 60 under a microscope, and if the chip mounting is qualified, placing the printed circuit board 10 in an oven for baking; then, after the wafer 30 to be packaged and the wafer 50 to be packaged are solidified on the printed circuit board 10, the connecting wires 40 are bonded on a manual wire bonder, and the condition of the bonding wires is checked under a microscope to ensure that the bonding wires are correct and firm.
Further, referring to fig. 3, a dispensing adhesive 70 is dispensed on the wafer 30 to be packaged by a dispenser to cure the wafer 30 to be packaged again.
(3) Further, referring to fig. 3, the glue tube of the dispenser may be replaced by a needle tube filled with solder paste or glue, so as to scribe the solder paste or glue 80 on the outer edge of the printed circuit board 10 using the needle tube, and then the metal package 90 is placed on the solder paste or glue 80 and the metal package 90 is soldered to the printed circuit board 10 by a heating stage, or the metal package 90 is cured to the printed circuit board 10 by an oven.
The system for LGA packaging needs to perform the above operation process of LGA packaging in a clean room, and in an optional embodiment, the system for LGA packaging further comprises a visual purifying box, and a dispenser, a suction tool, an oven, a manual wire bonder, a refrigerator, a microscope and a heating table are integrally arranged in the purifying box so as to allow a user to perform LGA packaging on a wafer to be packaged in the purifying box.
The system for LGA packaging can meet the requirements of various LGA packaging structures containing shells in the aspects of similar sensors, such as pressure sensor LGA packaging, silicon microphone sensor LGA packaging, temperature and humidity sensor LGA packaging and the like.
To the above-mentioned system for LGA encapsulation, the embodiment two of the utility model provides a low-cost LGA packaging structure is still provided, include: a printed circuit board marked with a target position; after being sucked by the sucking tool, the wafer to be packaged is adhered to a target position through an adhesive and is cured on the printed circuit board through baking the adhesive by the oven, and the adhesive is dispensed on the target position through a dispenser by a user; and the connecting wire is bonded between the wafer to be packaged and the printed circuit board through a manual wire bonder so as to perform circuit connection on the wafer to be packaged and the printed circuit board.
The LGA package structure may further include: coating glue, namely coating the glue on the wafer to be packaged after circuit connection and baking the wafer to be packaged by an oven so as to solidify the wafer to be packaged between the coating glue and the printed circuit board; and the packaging shell is solidified on the printed circuit board through packaging glue so as to wrap the wafer to be packaged after the wafer is in circuit connection with the printed circuit board, so that the packaging reliability is improved.
Further, if the number of the wafers to be packaged is multiple and each wafer to be packaged corresponds to one target position, referring to fig. 4, the multiple target positions are arranged on the printed circuit board in an array arrangement manner, that is, the multiple wafers 100 to be packaged are also packaged on the printed circuit board in an array arrangement manner, so that multiple product packaging samples distributed in an array manner are manufactured, and finished product cutting is conveniently performed in a manual manner. And after the cutting is finished, normal finished product testing operation can be carried out.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. The present invention is limited only by the claims and their full scope and equivalents.
Claims (10)
1. A system for LGA packaging, comprising:
the glue dispenser is used for enabling a user to dispense the adhesive at a target position marked on the printed circuit board;
the absorption tool is used for a user to absorb the wafer to be packaged so as to place the wafer to be packaged at the target position with the adhesive;
the drying oven is used for baking the printed circuit board adhered with the wafer to be packaged by a user so as to enable the wafer to be packaged to be solidified on the printed circuit board;
and the manual wire bonder is used for bonding a connecting wire on the circuit board solidified with the wafer to be packaged by a user so as to enable the wafer to be packaged to be in circuit connection with the printed circuit board.
2. The system of claim 1,
the dispenser is also used for coating the coating glue on the wafer to be packaged after the circuit connection by a user;
the oven is also used for baking the coating glue coated on the wafer to be packaged by a user so as to enable the wafer to be packaged to be solidified between the coating glue and the printed circuit board.
3. The system of claim 2, wherein the adhesive is a glue, the system further comprising a cooler for cooling the glue prior to use.
4. The system of claim 3, further comprising: the microscope is used for a user to check the wafer to be packaged, the printed circuit board and the connecting wires in the process of LGA packaging.
5. The system of claim 4,
the glue dispenser is also used for enabling a user to dispense packaging glue on the printed circuit board after the circuit connection;
the system further comprises: and the heating table is used for heating the packaging adhesive placed with the packaging shell by a user so as to solidify the packaging shell on the printed circuit board and wrap the wafer to be packaged after circuit connection.
6. The system of claim 5, wherein the encapsulation glue is solder paste or glue.
7. The system of claim 5, further comprising a visual purge bin, wherein the dispenser, the suction tool, the oven, the manual wire bonder, the refrigerator, the microscope and the heating stage are integrated in the purge bin for a user to LGA package the wafer to be packaged in the purge bin.
8. An LGA package structure, comprising:
a printed circuit board marked with a target position;
after being sucked by the sucking tool, the wafer to be packaged is adhered to the target position through an adhesive and is cured on the printed circuit board through baking the adhesive by an oven, and the adhesive is dispensed on the target position through a dispenser by a user;
and the connecting wire is bonded between the wafer to be packaged and the printed circuit board through a manual wire bonder so as to perform circuit connection on the wafer to be packaged and the printed circuit board.
9. The LGA package structure of claim 8, further comprising:
coating glue, namely coating the glue on the wafer to be packaged after circuit connection, and baking the wafer to be packaged by an oven to enable the wafer to be packaged to be solidified between the coating glue and the printed circuit board;
and the packaging shell is solidified on the printed circuit board through packaging glue so as to wrap the wafer to be packaged after the wafer is in circuit connection with the printed circuit board.
10. The LGA package structure of claim 8, wherein the number of the wafers to be packaged is plural, each wafer to be packaged corresponds to one of the target locations, and the target locations are arranged on the printed circuit board in an array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921572902.7U CN210272279U (en) | 2019-09-20 | 2019-09-20 | System for LGA packaging and LGA packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921572902.7U CN210272279U (en) | 2019-09-20 | 2019-09-20 | System for LGA packaging and LGA packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN210272279U true CN210272279U (en) | 2020-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921572902.7U Active CN210272279U (en) | 2019-09-20 | 2019-09-20 | System for LGA packaging and LGA packaging structure |
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| CN (1) | CN210272279U (en) |
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- 2019-09-20 CN CN201921572902.7U patent/CN210272279U/en active Active
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Address after: 214000 floor 5, building C, swan tower, Wuxi Software Park, No. 111, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi Weigan Semiconductor Co.,Ltd. Address before: 214000 floor 5, building C, swan tower, Wuxi Software Park, No. 111, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee before: Wuxi Weil Semiconductor Co.,Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20220921 Address after: Room 501, 5th Floor, Building C, Cygnus Building, Wuxi Software Park, No. 111, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Senxin Technology Co.,Ltd. Address before: 214000 5th floor, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee before: Wuxi Weigan Semiconductor Co.,Ltd. |