CN210268336U - Heat exchanger chip and heat exchanger - Google Patents
Heat exchanger chip and heat exchanger Download PDFInfo
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- CN210268336U CN210268336U CN201920746979.5U CN201920746979U CN210268336U CN 210268336 U CN210268336 U CN 210268336U CN 201920746979 U CN201920746979 U CN 201920746979U CN 210268336 U CN210268336 U CN 210268336U
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- heat exchanger
- chip
- welding
- chip body
- solder
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Abstract
The utility model discloses a heat exchanger chip and a heat exchanger, wherein the heat exchanger chip comprises a chip body and a storage part, the storage part is formed at the edge of the chip body and is used for storing welding flux before the chip body is welded; the heat exchanger comprises the heat exchanger chips, and an accommodating groove is formed between the storage piece of each heat exchanger chip and the chip body of the adjacent heat exchanger chip to store solder. This heat exchanger is through brushing the soldering paste once when the preparation, and the solder paste is stored in the holding tank, holds the welding seam that gets into two adjacent chips through the capillary action in the soldering paste of holding in the holding tank during welding, realizes the welding of two adjacent chips to accomplish the welding of heat exchanger main part, the preparation is efficient, is fit for batch production.
Description
Technical Field
The utility model relates to a heat exchange equipment technical field, in particular to heat exchanger chip and heat exchanger.
Background
The heat exchanger is a device for transferring part of heat of hot fluid to cold fluid, and is also called as a heat exchanger. The oil cooler is one of heat exchangers, is mainly used for cooling lubricating oil or fuel oil of engines of vehicles, engineering machinery, ships and the like, the hot side of a product is the lubricating oil or the fuel oil, and the cold side of the product can be cooling water or air. In the running process of the vehicle, lubricating oil in each large lubricating system depends on power of an oil pump, passes through a hot side channel of the oil cooler and transfers heat to a cold side of the oil cooler, and cooling water or cold air takes away the heat through the cold side channel of the oil cooler, so that heat exchange between cold fluid and hot fluid is realized, and the lubricating oil is ensured to be at a proper working temperature.
The existing box type oil cooler main body comprises a first chip, an oil side fin, a second chip and a water side fin, wherein the number of the first chip, the oil side fin, the second chip and the water side fin is multiple, the first chip, the oil side fin, the second chip and the water side fin are sequentially overlapped and welded to form a cooling unit, and a medium is used for carrying out heat exchange.
The first chip and the second chip of current box formula oil cooler main part adopt turn-ups structure, the oil cooler main part scribbles the soldering paste to the turn-ups of each layer of chip earlier before the welding, later pile up the chip of scribbling the soldering paste again and braze and keep apart oil side fin and water side fin, can know from this, the oil cooler that adopts this kind of chip architecture need the one deck to connect one deck ground to brush the chip when the preparation, and is comparatively consuming time, and preparation procedure inefficiency is unfavorable for batch production.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a when heat exchanger chip, this heat exchanger chip are applied to the heat exchanger, can improve the welding efficiency of chip in the manufacture process of heat exchanger.
Another object of the utility model is to provide a heat exchanger, this heat exchanger include the heat exchanger chip, the storage of heat exchanger chip with adjacent form the holding tank between the chip body of heat exchanger chip, the holding tank stores the solder before the heat exchanger welding, this heat exchanger once only applies paint the cream with a brush when the preparation, the preparation is efficient.
The utility model discloses a realize through following technical scheme:
the utility model provides a chip in a first aspect, which comprises a chip body and a storage part;
the storage part is formed at the edge of the chip body and used for storing the solder before chip welding.
As described above for the chip, the storage member is flat.
As mentioned above, the chip body comprises a substrate and a first flange at the edge of the substrate.
As with the chip described above, the storage member includes a second flange at the edge of the first flange.
As for the chip, the clamp between the plane of the first flanging and the plane of the second flanging is 20-40 degrees.
The utility model discloses the third aspect provides a heat exchanger, this heat exchanger include a plurality of as above heat exchanger chip, every heat exchanger chip's storage piece and adjacent form the holding tank between heat exchanger chip's the chip body to store the solder.
As above heat exchanger, two adjacent heat exchanger chips's the outside of the chip body of upper heat exchanger chip welds in the inboard of the chip body of lower heat exchanger chip, and forms the holding tank between the inboard of the storage of lower heat exchanger chip and the outside of the chip body of upper heat exchanger chip.
The utility model discloses a heat exchanger chip includes the chip body and stores the piece, stores the piece shaping at the edge of chip body, is used for storing the solder before chip body welding. Because the heat exchanger chip is provided with the storage part for storing the welding flux, when the welding flux is coated before the welding of the heat exchanger chip, the welding flux is coated at one time, and the welding flux is stored on the storage part, so that the problem of low manufacturing efficiency caused by coating the welding flux for many times in the prior art is solved, and the assembly efficiency of the heat exchanger is improved.
The utility model discloses a heat exchanger is including a plurality of heat exchanger chips that the stack set up, and the heat exchanger chip includes the chip body and stores the piece, stores the piece shaping at the edge of chip body, is used for storing the solder before chip body welding. When the heat exchanger is assembled, an accommodating groove is formed between the storage piece of each heat exchanger chip and the chip body of the adjacent heat exchanger chip, and the accommodating groove is used for storing solder; when the heat exchanger is assembled, a plurality of heat exchanger chips are firstly laminated, and then one side surface of the heat exchanger body, which is provided with the storage part, is coated with soldering paste at one time; because the accommodating groove on the side surface of the heat exchanger has the function of storing the soldering paste and the solder, the soldering paste and the solder do not need to be coated between the outer side of the upper chip body and the inner side of the lower chip body (namely between the overlapped parts of the two chips in contact) in the adjacent chips every time, and the sufficient soldering paste and the solder can be ensured to be contained in the accommodating groove only by coating the storage part once; in specific operation process, hold the welding seam that the soldering paste in the holding tank passes through two adjacent chips of capillary action entering, for the welding seam welding of two adjacent chips in the welding stove provides the structural basis, above-mentioned heat exchanger equipment, production efficiency have showing the improvement, more are fit for batch production.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat exchanger chip provided in an embodiment of the present invention;
fig. 2 is a schematic partial structural diagram of a heat exchanger chip according to an embodiment of the present invention;
fig. 3 is a schematic partial structural diagram of a heat exchanger according to an embodiment of the present invention;
fig. 4 is an enlarged schematic structural diagram of a partial structure of a heat exchanger according to an embodiment of the present invention.
Description of reference numerals:
1-heat exchanger chip;
2-a heat exchanger;
11-a chip body;
12-a storage member;
13-accommodating grooves;
111-a substrate;
112-first flanging.
Detailed Description
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In the description of the present invention, it is to be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
The following is directed to the heat exchanger chip and the heat exchanger provided by the present invention in detail with reference to the specific embodiments.
The first embodiment is as follows:
fig. 1 is a schematic structural diagram of a heat exchanger chip provided in an embodiment of the present invention, and fig. 2 is a schematic partial structural diagram of a heat exchanger chip provided in an embodiment of the present invention, please refer to fig. 1 and 2, this embodiment provides a heat exchanger chip 1, the heat exchanger chip 1 includes a chip body 11 and a storage part 12, the storage part 12 is formed at an edge of the chip body 11, and is used for storing solder before the chip body 11 is welded;
in this embodiment, the chip 1 includes a chip body 11 and a storage component 12, where the chip body 11 is used to isolate heat exchange fins in a heat exchanger to form a heat exchange channel, the storage component 12 is used to store solder before the chip body is soldered, and the solder is soldered to an adjacent chip body 11 during chip soldering. In this embodiment, the material of the chip body and the storage member is not particularly limited, and a stainless steel material is preferred.
In this embodiment, the storage member 12 is a flat plate, in other embodiments, the storage member may be an arc or other shapes, and the specific structure of the storage member is not particularly limited in this embodiment.
Further, in the present embodiment, the chip body 11 includes a base 111 and a first flange 112 located at an edge of the base 111, and a second flange facing an outer side of the base is located at an outer edge of the first flange 112, and the second flange forms the storage member 12. Wherein the included angle between the first flange 112 and the base plate 111 is greater than 90 degrees. Furthermore, the plane of the storage member 12 is 20-40 degrees from the plane of the first flange 112. When this chip is applied to the heat exchanger, adjacent two the first turn-ups of the upper chip of chip and the first turn-ups laminating of lower floor's chip form the holding tank between the second turn-ups of lower floor's chip and the first turn-ups of upper chip, and in this embodiment, store the piece 12 place the plane with the planar clamp in first turn-ups 112 place is 20-40 degrees, once only apply paint with a brush the soldering paste when the heat exchanger preparation, can guarantee that the soldering paste is stored in the holding tank and can guarantee that the soldering paste can flow out from the holding tank under high temperature, improved the preparation efficiency of heat exchanger.
The embodiment of the utility model provides a heat exchanger chip, including chip body and storage piece, the shaping of storage piece is in the edge of chip body is used for storing the solder before chip body welding. When this chip is applied to the heat exchanger, adjacent two the first turn-ups of the upper chip of chip and the first turn-ups laminating of lower floor's chip form the holding tank between the second turn-ups of lower floor's chip and the first turn-ups of upper chip, once only apply paint the cream solder with a brush when the heat exchanger preparation, improved the preparation efficiency of heat exchanger.
Example two:
the embodiment provides a method for manufacturing a heat exchanger chip, wherein the heat exchanger chip is the heat exchanger chip described in the first embodiment, and in the manufacturing method, the chip body and the storage part are integrally formed through a mold.
Specifically, in this embodiment, the substrate of the chip body includes a bottom plate, a first flange and a second flange, wherein the second flange forms a storage member, and the length of the second flange is 1.5mm to 2.5 mm.
The heat exchanger chip of the embodiment is simple in structure, can be formed through a die in one step, is simple in structure in the manufacturing method, and is suitable for batch production.
Example three:
fig. 3 is a schematic view of a partial structure of a heat exchanger provided by an embodiment of the present invention, and fig. 4 is a schematic view of an enlarged structure of a partial structure of a heat exchanger provided by an embodiment of the present invention. Referring to fig. 1 to 4, in the present embodiment, a heat exchanger 2 is provided, where the heat exchanger 2 includes a plurality of heat exchanger chips 1 according to the embodiment, and a receiving groove 13 is formed between a storage element 12 of each heat exchanger chip 1 and a chip body 11 of an adjacent heat exchanger chip to store solder.
The outer side of the chip body 11 of the upper heat exchanger chip of the two adjacent heat exchanger chips is welded on the inner side of the chip body 11 of the lower heat exchanger chip, and the accommodating groove 13 is formed between the inner side of the storage piece 12 of the lower heat exchanger chip and the outer side of the chip body 11 of the upper heat exchanger chip.
This embodiment piles up the completion back at heat exchanger chip and heat transfer fin, the inboard of the first turn-ups 112 of lower floor's chip and the first turn-ups 112's of upper chip outside butt, form holding tank 13 between the inboard of the storage 12 of lower floor's chip and the first turn-ups 112's of upper chip outside, only need once only apply paint the soldering paste with a brush in the side when the welding, can store the soldering paste in holding tank 13, hold the overlapping portion that the soldering paste in the holding tank got into two adjacent chip contacts through capillary action during the welding, can realize the welding of two adjacent chips.
The heat exchanger of the present embodiment is described by taking an oil cooler as an example, and a heat exchanger main body in the present embodiment includes a plurality of cooling units connected in a stacked manner; each cooling unit consists of a first chip, an oil side fin, a second chip and a water side fin; in any one of the cooling unit structures, the first chip, the oil-side fin, the second chip, and the water-side fin are sequentially welded in an overlapping manner.
In this embodiment, two adjacent heat exchanger chips and heat exchange fins form a heat exchange flow channel, wherein the length of the first flanging 112 is greater than the sum of twice the height of the heat exchange flow channel and twice the thickness of the chip. In this embodiment, the length of the first turned-over edge 112 is greater than the oil duct height, the water duct height and the thickness of the two layers of chips, and the contact length between the outer side of the first turned-over edge of the upper layer chip and the inner side of the first turned-over edge of the lower layer chip is large, so that the overall reliability of the oil cooler can be further ensured.
The heat exchanger of this embodiment is including a plurality of heat exchanger chips that the stack set up, the heat exchanger chip includes chip body and storage piece, the edge at the chip body of storage piece shaping, be used for storing the solder before chip body welding, when the heat exchanger equipment, form the holding tank between the chip body of the storage piece of every heat exchanger chip and adjacent heat exchanger chip, the holding tank is used for storing the solder, when the heat exchanger equipment, can once only apply paint the solder paste with a brush on heat exchanger main part surface after accomplishing heat exchanger chip lamination, hold the overlap portion that the solder paste that holds in the holding tank got into two adjacent chip contacts through capillary action during the welding, realize the welding of two adjacent chips, the heat exchanger equipment, high production efficiency, and is suitable for batch production.
Example four:
the embodiment provides a method for manufacturing a heat exchanger, where the heat exchanger is the heat exchanger described in the third embodiment, and the method for manufacturing the heat exchanger includes the following steps:
s101, assembling a plurality of heat exchanger chips to form a heat exchanger main body;
specifically, the heat exchanger chips and the heat exchange fins are assembled, wherein the heat exchange fins are isolated by the heat exchange chips, and the two adjacent heat exchange chips and the heat exchange fins positioned between the two adjacent heat exchange chips form a heat exchange flow channel. The outer side of the chip body of the upper heat exchanger chip of the two adjacent heat exchanger chips is in contact with the inner side of the chip body of the lower heat exchanger chip, and a containing groove is formed between the inner side of the storage piece of the lower heat exchanger chip and the outer side of the chip body of the upper heat exchanger chip.
S102, coating solder on one side, provided with the storage part, of the heat exchanger main body so that the solder enters the accommodating groove;
specifically, the side of the heat exchanger body is coated with soldering paste, so that the accommodating groove is filled with the soldering paste.
S103, placing the heat exchanger body into a welding furnace for welding.
Specifically, the heat exchanger main body is placed in a welding furnace for vacuum brazing.
Further wherein the applying solder comprises: and coating the solder from top to bottom from the topmost heat exchanger chip so that the solder is stored in each accommodating groove.
The manufacturing method of the heat exchanger comprises the steps of assembling a plurality of heat exchanger chips to form a heat exchanger main body; coating solder on one side of the heat exchanger main body, which is provided with the storage part, so that the solder enters the accommodating groove; and (4) putting the heat exchanger main body into a welding furnace for welding. According to the heat exchanger manufacturing method, before the heat exchanger main body is welded, the solder paste is brushed once, the solder paste is stored in the accommodating groove, the solder paste accommodated in the accommodating groove during welding enters the overlapping portion of two adjacent chips through the capillary action, the two adjacent chips are welded, and therefore the heat exchanger main body is welded, manufacturing efficiency is high, and the heat exchanger manufacturing method is suitable for batch production.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (7)
1. A heat exchanger chip, characterized in that: comprises a chip body and a storage piece,
the storage part is formed at the edge of the chip body and used for storing the solder before the chip body is welded.
2. The heat exchanger chip of claim 1, wherein: the storage member is flat.
3. The heat exchanger chip of claim 1, wherein:
the chip body comprises a substrate and a first flanging positioned at the edge of the substrate.
4. The heat exchanger chip of claim 3, wherein:
the storage member includes a second flange at an edge of the first flange.
5. The heat exchanger chip of claim 4, wherein:
the clamp between the plane of the first flanging and the plane of the second flanging is 20-40 degrees.
6. A heat exchanger, characterized by: comprising a plurality of heat exchanger chips according to any one of claims 1 to 5, the reservoir of each heat exchanger chip forming a receiving groove between the chip body of an adjacent heat exchanger chip for storing solder.
7. The heat exchanger of claim 6, wherein:
the outer side of the chip body of the upper heat exchanger chip of the heat exchanger chip is welded on the inner side of the chip body of the lower heat exchanger chip, and an accommodating groove is formed between the inner side of the storage piece of the lower heat exchanger chip and the outer side of the chip body of the upper heat exchanger chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920746979.5U CN210268336U (en) | 2019-05-22 | 2019-05-22 | Heat exchanger chip and heat exchanger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920746979.5U CN210268336U (en) | 2019-05-22 | 2019-05-22 | Heat exchanger chip and heat exchanger |
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| CN210268336U true CN210268336U (en) | 2020-04-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110044201A (en) * | 2019-05-22 | 2019-07-23 | 赤壁银轮工业换热器有限公司 | Heat exchanger chip and preparation method thereof, heat exchanger and preparation method thereof |
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2019
- 2019-05-22 CN CN201920746979.5U patent/CN210268336U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110044201A (en) * | 2019-05-22 | 2019-07-23 | 赤壁银轮工业换热器有限公司 | Heat exchanger chip and preparation method thereof, heat exchanger and preparation method thereof |
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