CN210253325U - Liquid bubble cleaning device for carrier tank of grinding head of semiconductor equipment - Google Patents

Liquid bubble cleaning device for carrier tank of grinding head of semiconductor equipment Download PDF

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Publication number
CN210253325U
CN210253325U CN201921223449.9U CN201921223449U CN210253325U CN 210253325 U CN210253325 U CN 210253325U CN 201921223449 U CN201921223449 U CN 201921223449U CN 210253325 U CN210253325 U CN 210253325U
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China
Prior art keywords
overflow
plate
cleaning
holes
tank body
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Application number
CN201921223449.9U
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Chinese (zh)
Inventor
陈智慧
贺贤汉
李泓波
张正伟
朱光宇
王松朋
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Fulede Technology Development Dalian Co ltd
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Fulede Technology Development Dalian Co ltd
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Priority to CN201921223449.9U priority Critical patent/CN210253325U/en
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Abstract

The utility model discloses a semiconductor equipment grinding head load body groove liquid bubble belt cleaning device, include: the device comprises an upper tank body and a lower tank body which are communicated, wherein one side surface of the upper tank body is an inclined surface, and a baffle and an upper pulling plate are arranged on the inclined surface; the lower tank body is internally provided with a cleaning device and an overflow device, the cleaning device comprises an air outlet pipe, a cleaning plate and supporting plates, the cleaning plate is provided with a plurality of rows of cleaning holes, the bottom surface of the cleaning plate is distributed with a plurality of supporting plates, the supporting plates are provided with through holes, a plurality of air outlet pipes are positioned in the corresponding through holes, and the bottom surface of each air outlet pipe is provided with a plurality of air outlet holes; the overflow device comprises an overflow side plate and an overflow bottom plate, the bottom of the overflow side plate is connected with the overflow bottom plate, and an overflow port is formed in the overflow side plate; one end of the water inlet pipe is connected to the lower trough body. The device can remove large particles on parts, and has the advantages of good removal effect, greatly reduced cleaning time, convenient use and greatly improved field production efficiency.

Description

Liquid bubble cleaning device for carrier tank of grinding head of semiconductor equipment
Technical Field
The utility model relates to a belt cleaning device, a semiconductor equipment grinding head load body groove liquid bubble belt cleaning device specifically says so.
Background
In the existing repair and regeneration process of a polishing head of a semiconductor chemical machine, particles which are difficult to remove exist on a carrier of the polishing head, so that the particles of a part are removed by treating the carrier with ultrasonic waves. Since ultrasonic waves can only remove fine particles on the surface of a part and are difficult to remove relatively large particles, the carrier of the polishing head needs to be manually wiped once with isopropyl alcohol, and after wiping, the carrier needs to be rinsed for a while with water. Because the grinding head is complicated in structure and made of polyethylene, the grinding head is difficult to wipe firstly, the product is damaged by negligence, in addition, the wiping time is long, the effect is poor, time and labor are wasted, and the production efficiency of the site is greatly reduced.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects in the prior art, the application provides a liquid bubble cleaning device for a carrier tank of a grinding head of a semiconductor device, which replaces manual wiping to remove large-scale particles on the surface.
In order to achieve the purpose, the technical scheme of the application is as follows: a bubble cleaning device for carrier liquid of a polishing head of a semiconductor device comprises: the device comprises an upper tank body and a lower tank body which are communicated, wherein one side surface of the upper tank body is an inclined surface, and a baffle and an upper pulling plate are arranged on the inclined surface; the cleaning equipment comprises an air outlet pipe, a cleaning plate and a supporting plate, wherein a plurality of rows of cleaning holes are formed in the cleaning plate, a plurality of supporting plates are distributed on the bottom surface of the cleaning plate, through holes are formed in the supporting plate, the air outlet pipes are positioned in the corresponding through holes, and a plurality of air outlet holes are formed in the bottom surface of each air outlet pipe; the overflow device comprises an overflow side plate and an overflow bottom plate, the bottom of the overflow side plate is connected with the overflow bottom plate, and an overflow port is formed in the overflow side plate; the overflow side plates are positioned at two sides of the cleaning equipment, and the plurality of supporting plates are positioned on the overflow bottom plate; one end of the water inlet pipe is connected to the lower trough body.
Further, a gap between the overflow side plate and the lower trough body side plate is an overflow channel, and a gap between the overflow bottom plate and the lower trough body bottom plate is a drainage channel.
Furthermore, a plurality of hydrophobic plates are arranged below the overflow bottom plate, and a plurality of drain holes are formed in each hydrophobic plate.
Furthermore, one end of each of the plurality of air outlet pipes is connected with a communicating pipe, the communicating pipe is connected with the air source device through an air inlet pipe, and the air inlet pipe is provided with an adjusting valve a.
Furthermore, the bottom plate of the lower groove body is connected with a drain pipe a, the overflow bottom plate is connected with a drain pipe b, the drain pipe b is provided with a regulating valve b, and the bottom of the drain pipe a is connected to the drain pipe b.
Furthermore, the water inlet pipe is provided with an adjusting valve c.
Furthermore, the upper pulling plate is in sliding connection with the two side plates of the upper groove body, the upper pulling plate is provided with a lifting handle, and a visual window is arranged above the lifting handle.
Furthermore, an exhaust hood is arranged at the top of the upper tank body, the exhaust hood is connected with the two serially-connected washing towers through air pipes, and the two serially-connected washing towers are connected with an exhaust fan.
As a further step, the top of the upper tank body is provided with a lighting lamp which is connected with a lighting switch fixed on the outer wall of the upper tank body.
As a further step, handles are arranged on both sides of the upper surface of the cleaning plate.
The utility model discloses owing to adopt above technical scheme, can gain following technological effect: compared with the prior art, the cleaning device has the advantages that manual wiping is not needed, the grinding head loading body is only needed to be placed in the groove, large particles on the part are removed through the water circulating back and forth, the effect is good, the cleaning time is greatly reduced, the use is convenient, and the field production efficiency is greatly improved.
Drawings
FIG. 1 is a front view of the present application;
FIG. 2 is a side view of the present application;
FIG. 3 is a schematic structural diagram of the present application;
FIG. 4 is a sectional view of the structure of a part of the lower tank body;
FIG. 5 is a cross-sectional view of the present application;
FIG. 6 is an enlarged view of a portion of the structure in section;
FIG. 7 is a view showing the construction of a cleaning apparatus;
FIG. 8 is a bottom view of the cleaning apparatus;
FIG. 9 is a schematic view of a cleaning apparatus;
the sequence numbers in the figures illustrate: 1. exhaust hood, 2, baffle, 3, upward arm-tie, 4, lower cell body, 5, governing valve b, 6, drain pipe b, 7, drain pipe a, 8, carry and draw handle, 9, lighting switch, 10, visual window, 11, overflow curb plate, 12, overflow mouth, 13, overflow channel, 14, drainage channel, 15, overflow bottom plate, 16, governing valve c, 17, inlet tube, 18, wash the board, 19, the wash port, 20, the backup pad, 21, the board that dredges, 22, the outlet duct, 23, communicating pipe, 24, the venthole, 25, wash the hole, 26, the intake pipe, 27, the handle.
Detailed Description
The invention will be described in further detail with reference to the following figures and specific embodiments: the present application is further described by taking this as an example.
Example 1
As shown in fig. 1-9, the present embodiment provides a device for cleaning bubbles in carrier liquid of a polishing head of a semiconductor device, comprising: the device comprises an upper tank body and a lower tank body which are communicated, wherein one side surface of the upper tank body is an inclined surface, and a baffle and an upper pulling plate are arranged on the inclined surface; the lower tank body is internally provided with a cleaning device and an overflow device, the cleaning device comprises an air outlet pipe, a cleaning plate and supporting plates, the cleaning plate is provided with a plurality of rows of cleaning holes, the bottom surface of the cleaning plate is distributed with a plurality of supporting plates, the supporting plates are provided with a plurality of through holes, and each row of through holes in each supporting plate are on a horizontal line; a plurality of air outlet pipes are positioned in the corresponding through holes, and the bottom surface of each air outlet pipe is provided with a plurality of air outlet holes; the overflow device comprises an overflow side plate and an overflow bottom plate, the bottom of the overflow side plate is connected with the overflow bottom plate, and an overflow port is formed in the overflow side plate; the overflow side plates are positioned at two sides of the cleaning equipment, and the plurality of supporting plates are positioned on the overflow bottom plate; one end of the water inlet pipe is connected to the lower trough body. A gap between the overflow side plate and the lower trough body side plate is an overflow channel, a gap between the overflow bottom plate and the lower trough body bottom plate is a drainage channel, a plurality of drainage plates are arranged below the overflow bottom plate, and each drainage plate is provided with a plurality of drainage holes; a plurality of drain plates are positioned in the drain channel; one ends of the plurality of air outlet pipes are connected with a communicating pipe, the communicating pipe is connected with an air source device through an air inlet pipe, and an adjusting valve a is arranged on the air inlet pipe; the cleaning plate is provided with a groove for the air inlet pipe to pass through.
The upper pulling plate is opened, and the mechanical grinding head carrier is placed on the cleaning plate in the lower tank body. The water inlet pipe is connected with a tap water pipe, the regulating valve c is opened, water is injected into the lower groove body, after the water in the lower groove body is fully filled to the height of the overflow port, redundant water flows out of the overflow port, flows through the overflow channel and the drainage channel, is finally drained through the drainage pipe a, and the regulating valve c is closed; the air source device is opened and communicated with an air source, and an adjusting valve a capable of adjusting air quantity is arranged on the air inlet pipe; starting an illuminating switch, preparing a water source and an air source at the moment, closing the upper pull plate, and observing the cleaning state of the part through the visual window; and the effect of removing part particles can be achieved more effectively by adjusting the air source adjusting valve a. The exhaust device at the top of the upper tank body is opened, so that the peculiar smell gas in the tank can effectively flow away. The tank body is made of stainless steel, so that the size is stable and the tank body is not easy to deform; the cleaning equipment is made of polypropylene, and the material has good processability, excellent weather resistance and excellent acid and alkali resistance.
The above, only for the utility model discloses create the concrete implementation way of preferred, nevertheless the utility model discloses the protection scope of creation is not limited to this, and any person skilled in this technical field is in the utility model discloses create the technical scope of disclosure, according to the utility model discloses the technical scheme of creation and utility model design equivalence replacement or change all should be covered in the protection scope of creation of the utility model.

Claims (10)

1. A bubble cleaning device for carrier liquid of a grinding head of a semiconductor device is characterized by comprising: the device comprises an upper tank body and a lower tank body which are communicated, wherein one side surface of the upper tank body is an inclined surface, and a baffle and an upper pulling plate are arranged on the inclined surface; the cleaning equipment comprises an air outlet pipe, a cleaning plate and a supporting plate, wherein a plurality of rows of cleaning holes are formed in the cleaning plate, a plurality of supporting plates are distributed on the bottom surface of the cleaning plate, through holes are formed in the supporting plate, the air outlet pipes are positioned in the corresponding through holes, and a plurality of air outlet holes are formed in the bottom surface of each air outlet pipe; the overflow device comprises an overflow side plate and an overflow bottom plate, the bottom of the overflow side plate is connected with the overflow bottom plate, and an overflow port is formed in the overflow side plate; the overflow side plates are positioned at two sides of the cleaning equipment, and the plurality of supporting plates are positioned on the overflow bottom plate; one end of the water inlet pipe is connected to the lower trough body.
2. The apparatus of claim 1, wherein the gap between the overflow side plate and the lower tank side plate is an overflow channel, and the gap between the overflow bottom plate and the lower tank bottom plate is a drain channel.
3. The apparatus of claim 1, wherein a plurality of drain plates are disposed under the overflow plate, each drain plate having a plurality of drain holes.
4. The apparatus of claim 1, wherein each of said plurality of outlet tubes is connected to a communication tube, said communication tube is connected to a gas source device through an inlet tube, and said inlet tube is provided with a control valve a.
5. The semiconductor device polishing head carrier tank liquid bubble cleaning device according to claim 1, wherein the lower tank body bottom plate is connected with a drain pipe a, the overflow bottom plate is connected with a drain pipe b, a regulating valve b is arranged on the drain pipe b, and the bottom of the drain pipe a is connected to the drain pipe b.
6. The apparatus of claim 1, wherein the inlet tube is provided with a control valve c.
7. The apparatus as claimed in claim 1, wherein the upper plate is slidably connected to two side plates of the upper tank, the upper plate has a handle, and a window is disposed above the handle.
8. The device for cleaning bubbles in liquid in a carrier tank of a polishing head of a semiconductor device as claimed in claim 1, wherein an exhaust hood is disposed at the top of the upper tank body, the exhaust hood is connected to the two serially connected washing towers through an air pipe, and the serially connected washing towers are connected to an air exhaust fan.
9. The apparatus for cleaning bubbles in carrier tank liquid of polishing head of semiconductor device as claimed in claim 1, wherein a lighting lamp is provided at the top of the upper tank, and the lighting lamp is connected to a lighting switch fixed on the outer wall of the upper tank.
10. The apparatus of claim 1, wherein handles are provided on both sides of the upper surface of the cleaning plate.
CN201921223449.9U 2019-07-31 2019-07-31 Liquid bubble cleaning device for carrier tank of grinding head of semiconductor equipment Active CN210253325U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921223449.9U CN210253325U (en) 2019-07-31 2019-07-31 Liquid bubble cleaning device for carrier tank of grinding head of semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921223449.9U CN210253325U (en) 2019-07-31 2019-07-31 Liquid bubble cleaning device for carrier tank of grinding head of semiconductor equipment

Publications (1)

Publication Number Publication Date
CN210253325U true CN210253325U (en) 2020-04-07

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ID=70015396

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921223449.9U Active CN210253325U (en) 2019-07-31 2019-07-31 Liquid bubble cleaning device for carrier tank of grinding head of semiconductor equipment

Country Status (1)

Country Link
CN (1) CN210253325U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112718691A (en) * 2020-12-07 2021-04-30 富乐德科技发展(大连)有限公司 Automatic cleaning device for silicon component in cavity of semiconductor equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112718691A (en) * 2020-12-07 2021-04-30 富乐德科技发展(大连)有限公司 Automatic cleaning device for silicon component in cavity of semiconductor equipment

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