CN210220788U - Loop heat pipe radiator - Google Patents
Loop heat pipe radiator Download PDFInfo
- Publication number
- CN210220788U CN210220788U CN201920755545.1U CN201920755545U CN210220788U CN 210220788 U CN210220788 U CN 210220788U CN 201920755545 U CN201920755545 U CN 201920755545U CN 210220788 U CN210220788 U CN 210220788U
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- loop
- loop heat
- pipe radiator
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005494 condensation Effects 0.000 claims description 10
- 238000009833 condensation Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a loop heat pipe radiator. The utility model discloses a be the condenser pipe of loop closure form, the front end of condenser pipe is provided with several radiating fin, all be provided with the evaporimeter from top to bottom in the rear end of condenser pipe, the condenser pipe afterbody is provided with the interface. The utility model discloses rational in infrastructure, simple, the operation is convenient, uses through the cooperation that adopts closed condenser pipe of loop and evaporimeter to improve the heat conduction homogeneity of steam, make components and parts during operation can noiselessness, pollution-free, improve holistic reliability.
Description
Technical Field
The utility model relates to a heat dissipation technical field, concretely relates to loop heat pipe radiator.
Background
At present, a common radiator of a heat radiating device of a high-power electric semiconductor device adopts an air cooling mode, and the air cooling mode comprises a self-cooling mode and a forced air cooling mode. The self-cooling radiator mainly takes away heat through natural flow of air; the forced air cooling type radiator needs to be provided with a fan to cool the equipment, but the method has high noise and is easy to absorb dust, so that the overall reliability is reduced.
The heat pipe radiator well solves the heat radiation problem of the high-power electric semiconductor device. The heat pipe is an excellent heat conductor, and the heat pipe radiator of the power device produced in China is limited by a plurality of factors to cause uneven heat conduction, so that the heat radiation effect is not obvious.
The above problems are problems that the art needs to solve.
Disclosure of Invention
The to-be-solved technical problem of the utility model is to provide a loop heat pipe radiator, use through the cooperation that adopts annular condenser pipe and a plurality of evaporimeter to can improve the radiating effect of heat pipe radiator of changing roads.
In order to solve the technical problem, the utility model provides a scheme is: the utility model provides a loop heat pipe radiator, is including being the condenser pipe of loop closure form, the front end of condenser pipe is provided with several radiating fin, all be provided with the evaporimeter from top to bottom in the rear end of condenser pipe, the condenser pipe afterbody is provided with the interface.
As a further improvement of the above technical solution:
and a plurality of branch pipes are arranged in the middle of the rear end of the condensing pipe at intervals.
And a baffle is arranged on one side of the radiating fin.
And a sliding groove connected with the condensation pipe is arranged in the middle of the evaporator.
The radiating fins are made of materials with small thermal resistance.
The two ends of the condensation pipe are both arranged to be arc-shaped structures.
The utility model has the advantages that:
the utility model discloses rational in infrastructure, simple, the operation is convenient, uses through the cooperation that adopts closed condenser pipe of loop and evaporimeter to improve the heat conduction homogeneity of steam, make components and parts during operation can noiselessness, pollution-free, improve holistic reliability.
Bypass pipe, can improve the circulation of steam for the heat exchange of steam makes loop heat pipe radiator can dispel the heat high-efficiently, improves holistic reliability.
Radiating fin adopt the material that the thermal resistance is little to make to can improve radiating effect, protect components and parts to move high-efficiently.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
The reference numbers in the figures illustrate: 1. condenser pipe, 2, radiating fin, 3, baffle, 4, evaporimeter, 5, bypass pipe, 6, interface.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Referring to fig. 1, an embodiment of the present invention, including the condenser tube 1 that is the closed loop, the front end of the condenser tube 1 is provided with several heat dissipation fins 2, the rear end of the condenser tube 1 is provided with an evaporator 4 from top to bottom, and the tail of the condenser tube 1 is provided with an interface 6.
As shown in fig. 1, a plurality of branch pipes 5 are arranged at intervals in the middle of the rear end of the condensation pipe 1.
As shown in fig. 1, a baffle 3 is provided on the side of the heat radiating fin 2.
As shown in fig. 1, a chute connected to the condensation duct 1 is provided in the middle of the evaporator 4.
As shown in fig. 1, the heat dissipating fins 2 are made of a material having low thermal resistance.
As shown in fig. 1, both ends of the condensation pipe 1 are arranged in an arc structure.
In actual operation, the loop heat pipe radiator is assembled first. A plurality of radiating fins 4 are welded at the front end of the condensing tube 1, meanwhile, the baffle 3 is welded behind the radiating fins 4, and finally, the evaporator 4 is installed at the rear end of the condensing tube 1. The assembly of the loop heat pipe radiator is completed.
In practical use, the loop heat pipe radiator is mounted on a semiconductor device. The loop heat pipe radiator starts to work, hot gas generated by the semiconductor device is introduced into the loop heat pipe radiator, the hot gas is converted into steam through the work of the evaporator 4, and the steam is cooled through the radiating fins 4, so that the temperature of the semiconductor device can be reduced. The utility model discloses fully improve the heat conduction homogeneity of steam, improved loop heat pipe radiator's radiating effect widely.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (6)
1. The loop heat pipe radiator is characterized by comprising a condensation pipe (1) in a loop closed shape, wherein a plurality of radiating fins (2) are arranged at the front end of the condensation pipe (1), evaporators (4) are arranged at the upper part and the lower part of the rear end of the condensation pipe (1), and an interface (6) is arranged at the tail part of the condensation pipe (1).
2. The loop heat pipe radiator of claim 1, wherein a plurality of branch pipes (5) are arranged at intervals in the middle of the rear end of the condensation pipe (1).
3. A loop heat pipe radiator as claimed in claim 1, wherein a baffle (3) is provided on one side of the heat dissipating fins (2).
4. A loop heat pipe radiator according to claim 1, wherein a chute connected to the condenser pipe (1) is provided in the middle of the evaporator (4).
5. The loop heat pipe radiator of claim 1, wherein said heat dissipating fins (2) are made of a material having low thermal resistance.
6. A loop heat pipe radiator according to claim 1 wherein both ends of the condenser tube (1) are arranged in an arc configuration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920755545.1U CN210220788U (en) | 2019-05-24 | 2019-05-24 | Loop heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920755545.1U CN210220788U (en) | 2019-05-24 | 2019-05-24 | Loop heat pipe radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210220788U true CN210220788U (en) | 2020-03-31 |
Family
ID=69927476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920755545.1U Expired - Fee Related CN210220788U (en) | 2019-05-24 | 2019-05-24 | Loop heat pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210220788U (en) |
-
2019
- 2019-05-24 CN CN201920755545.1U patent/CN210220788U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200331 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |