CN210200675U - Automatic tear golden device - Google Patents
Automatic tear golden device Download PDFInfo
- Publication number
- CN210200675U CN210200675U CN201921269895.3U CN201921269895U CN210200675U CN 210200675 U CN210200675 U CN 210200675U CN 201921269895 U CN201921269895 U CN 201921269895U CN 210200675 U CN210200675 U CN 210200675U
- Authority
- CN
- China
- Prior art keywords
- vacuum sucker
- track
- wafer
- tearing
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 104
- 239000010931 gold Substances 0.000 claims abstract description 104
- 229910052737 gold Inorganic materials 0.000 claims abstract description 104
- 239000003292 glue Substances 0.000 claims description 25
- 238000012546 transfer Methods 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 claims description 6
- 238000004064 recycling Methods 0.000 claims description 6
- 239000002699 waste material Substances 0.000 abstract description 7
- 238000004134 energy conservation Methods 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 3
- 239000002313 adhesive film Substances 0.000 description 40
- 238000011084 recovery Methods 0.000 description 9
- 238000005096 rolling process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 241000252254 Catostomidae Species 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses an automatic tear golden device, it includes that the wafer tears golden module, organism, the wafer tear golden module set up in the organism. When the vacuum tearing device is used, the upper vacuum sucker device track and the lower vacuum sucker device track are arranged on two sides right above the vacuum tearing gold carrying platform, and the lower vacuum sucker device track is located on one side of the upper vacuum sucker device track. The upper vacuum sucker moves along the upper vacuum sucker track, and the lower vacuum sucker moves along the lower vacuum sucker track. When the device is used, the upper vacuum sucker rail and the lower vacuum sucker rail are driven to drive the first upper vacuum sucker, the second upper vacuum sucker and the lower vacuum sucker to complete gold tearing operation. After the device is adopted, the speed of the vacuum sucker is set, so that the gold tearing strength is adjusted. Thereby reducing the generation of waste materials and achieving the purposes of energy conservation and consumption reduction; the automation degree of gold tearing is improved, and the aims of improving the working efficiency and reducing the time and labor cost are fulfilled.
Description
Technical Field
The utility model relates to a wafer processing equipment field especially relates to an automatic tear golden device.
Background
In prior art, the process of peeling off metal from the wafer is still accomplished through the manual work, because manual gold tearing has the inefficiency, and tears the inhomogeneous problem of gold dynamics, receives the influence of factors such as the restriction of operating personnel horizontally, wafer characteristics at the in-process of manual gold tearing simultaneously, very easily takes place the wafer and receives the circumstances such as pollution, damage, and manual gold tearing still has drawbacks such as material recovery efficiency low. Therefore, how to change the existing gold tearing process is to reduce the time cost spent during the gold tearing operation, and further improve the gold tearing efficiency in unit time, which is the direction of current gold tearing equipment research.
SUMMERY OF THE UTILITY MODEL
Therefore, an automatic gold tearing device is needed to be provided, the problems that gold tearing efficiency is low, force is not uniform, and material recovery efficiency is low are solved manually.
In order to achieve the above object, the inventor provides an automatic gold tearing device, which is characterized by comprising a wafer gold tearing module and a machine body, wherein the wafer gold tearing module is arranged in the machine body;
the wafer gold tearing module comprises a lower vacuum sucker, an upper vacuum sucker track, a lower vacuum sucker track and a vacuum gold tearing platform deck; the vacuum sucker device comprises a lower vacuum sucker device track, wherein the lower vacuum sucker device track is arranged on one side below the vacuum gold tearing platform deck, the lower vacuum sucker device track comprises a vertical track part, the upper vacuum sucker device track is arranged on two sides right above the vacuum gold tearing platform deck, the upper vacuum sucker device moves on the upper vacuum sucker device track at the position, the lower vacuum sucker device moves on the lower vacuum sucker device track at the position, the upper vacuum sucker device track comprises an upper sub-track and a lower sub-track, and the lower sub-track is parallel to the vacuum gold tearing platform deck plane.
Preferably, the upper vacuum sucker comprises a first upper vacuum sucker and a second upper vacuum sucker, the track of the upper vacuum sucker is an annular track, the track of the lower vacuum sucker is a T-shaped track, the horizontal track part of the T-shaped track is parallel to the plane of the vacuum gold tearing carrier, and the vertical track part of the T-shaped track is arranged at one end, far away from the vacuum gold tearing carrier, of the horizontal track.
Preferably, one side of the lower vacuum sucker is provided with a cutting knife track, and a rotatable glue film cutting knife is arranged in the cutting knife track.
Preferably, the device further comprises an anti-static glue film rubber roller arm, wherein the anti-static glue film rubber roller arm is arranged on one side of the vacuum gold tearing carrying platform.
Preferably, the device also comprises a feeding and discharging module and a conveying module;
the feeding and discharging module and the conveying module are arranged in the machine body;
the feeding and discharging module is located on one side of the wafer gold tearing module, and the conveying module is arranged on the other side of the wafer gold tearing module.
Preferably, the transfer module further comprises a combination arm and a boat placing carrying platform, the combination arm comprises a wafer transfer arm, the wafer transfer arm is located at one side of the combination arm, and the boat placing carrying platform is arranged at one side of the combination arm.
Preferably, the conveying module further comprises a scrap recycling vehicle, and the scrap recycling vehicle is located on one side below the wafer gold tearing module.
Preferably, the machine body comprises an upper machine cover, a visible glass window, a first maintenance side plate, a movable machine door and a second maintenance side plate, and the top of the machine body is provided with a wafer carrying platform hole, a combined arm hole and a wafer boat carrying platform hole; the visible glass window, the wafer carrying platform hole, the combination arm hole and the wafer boat carrying platform hole respectively correspond to the positions of the feeding module, the blanking module, the vacuum gold tearing carrying platform, the combination arm and the wafer boat placing carrying platform.
Preferably, the device further comprises a controller, an anti-static glue film rubber roller arm and a glue film cutter, wherein the anti-static glue film rubber roller arm is arranged on one side of the vacuum gold tearing platform deck, the glue film cutter is rotatably arranged on a cutter rail on one side of the lower vacuum sucker, the controller is connected with the wafer gold tearing module, and the controller is used for executing the following steps:
driving the upper vacuum sucker track and the lower vacuum sucker track to enable the upper vacuum sucker and the lower vacuum sucker to be in the original point state;
driving an upper vacuum sucker and a lower vacuum sucker to vacuumize, and sucking an upper layer and a lower layer of the adhesive film;
driving the lower vacuum sucker track to drive the lower vacuum sucker to move downwards along the vertical track part of the lower vacuum sucker track so as to separate the adhesive film, driving the upper vacuum sucker track to drive the upper vacuum sucker to move towards the vacuum gold tearing platform to one end of the lower sub-track far away from the original point so that the adhesive film covers the wafer;
driving an anti-static glue film rubber roller arm to horizontally roll the glue film on the upper surface of the wafer;
driving the lower vacuum sucker to close the vacuum, and driving the lower vacuum sucker track to drive the lower vacuum sucker to return to the original point; driving a lower vacuum sucker track to drive the lower vacuum sucker to move to a position close to the wafer carrying platform, driving the film cutting knife to rotate so as to enable the film cutting knife to stand up, driving the cutting knife track to move, and driving the film cutting knife to horizontally cut off the film;
driving the upper vacuum sucker track to drive the upper vacuum sucker to move upwards from the rightmost end of the lower sub-track, driving the adhesive film to be torn from the surface of the wafer, and carrying out gold tearing operation;
the upper vacuum sucker track is driven to drive the upper vacuum sucker to move to the recovery receiving area, vacuum is closed, and the upper layer of the adhesive film falls into the recovery receiving area.
Be different from prior art, above-mentioned technical scheme can place the wafer and tear golden microscope carrier in the vacuum when using, and the vacuum tears golden microscope carrier evacuation and catches the wafer, and vacuum chuck ware track, lower vacuum chuck ware track drive vacuum chuck ware and lower vacuum chuck ware to the original point on the drive. The upper and lower vacuum suction cups are driven to vacuumize and suck the upper and lower layers of the adhesive film. The lower vacuum sucker track is driven to drive the lower vacuum sucker to move downwards so as to separate the glue film, and the upper vacuum sucker track is driven to drive the upper vacuum sucker to move to the position above the wafer to cover the wafer. And finally, driving the upper vacuum sucker track to drive the upper vacuum sucker to move along the upper vacuum sucker track, wherein the upper vacuum sucker can drive the adhesive film to be torn from the surface of the wafer, so that the gold tearing operation of the wafer is realized. Thus the utility model discloses can realize mechanized tearing gold, reach the purpose that improves work efficiency, reduce time and human cost. Then the movement speed of the upper vacuum sucker can be controlled by controlling the track of the upper vacuum sucker to control the gold tearing force, thereby reducing the generation of waste materials and achieving the purposes of energy conservation and consumption reduction.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 shows the separation principle of the adhesive film;
FIG. 3 is a basic configuration diagram of a lower vacuum chuck;
FIG. 4 is a diagram showing a wafer, a film, and a vacuum chuck;
FIG. 5 is a flowchart of the gold tearing operation;
FIG. 6 is a view of the position of the vacuum chuck on the track.
Description of reference numerals:
1. upper machine cover
2. Visual glass window
3. Wafer stage hole
4. Combined arm hole
5. Wafer boat stage hole
6. First maintenance side plate
7. Movable machine door
8. Second access side plate
9. Anti-static adhesive film
10. Lower vacuum sucker, 101, cutter rail, 102, film cutter
11. Upper vacuum sucker, 111, first upper vacuum sucker, 112, second upper vacuum sucker
12. Upper vacuum sucker track
13. Lower vacuum chuck device track
14. Vacuum gold tearing platform deck
15. Combined arm
16. Anti-static rubber film rubber roller arm
17. Wafer transfer arm
18. Wafer boat placing platform
19. Waste recovery vehicle
20. Wafer
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1-6, in the present embodiment, the wafer gold tearing module includes a lower vacuum chuck 10, an upper vacuum chuck 11, an upper vacuum chuck rail 12, a lower vacuum chuck rail 13, and a vacuum gold tearing stage 14. The lower vacuum sucker 10 and the lower vacuum sucker track 13 are arranged on one side of the lower portion of the vacuum gold tearing carrying table 14, the upper vacuum sucker track 12 and the lower vacuum sucker track are arranged on two sides of the position right above the vacuum gold tearing carrying table 14, the lower vacuum sucker track 13 is located on one side of the upper vacuum sucker track 12, the upper vacuum sucker track 12 comprises an upper sub-track and a lower sub-track, and the lower sub-track is parallel to the plane of the vacuum gold tearing carrying table 14. When the gold tearing operation is performed, the wafer 20 is placed on the vacuum gold tearing carrying platform 14, and the wafer 20 is firmly adsorbed on the carrying platform by utilizing the vacuumizing principle to prevent the wafer from moving. Then the upper vacuum sucker and the lower vacuum sucker are driven to suck the upper layer and the lower layer of the adhesive film by utilizing vacuumizing, and then the lower vacuum sucker track is driven to drive the lower vacuum sucker to move downwards so that the adhesive film is separated. The upper vacuum chuck rail 12 is driven to move the first upper vacuum chuck 111 to cover the wafer 20 above the wafer 20. Finally, the upper vacuum chuck rail 12 is driven to drive the first upper vacuum chuck 111 to move along the upper vacuum chuck rail, so as to separate the adhesive film from the wafer 20 and carry away the metal on the wafer 20. After the device is adopted, mechanized gold tearing can be realized, and the gold tearing force can be effectively controlled, so that the generation of waste materials is reduced, the purposes of energy conservation and consumption reduction are achieved, the automatic gold tearing degree is improved, and the purposes of improving the working efficiency and reducing the time and labor cost are achieved.
The circular track of the embodiment can be opened, so that when gold tearing is carried out each time, all tracks need to wait for all suckers to drive all suckers to return to the original point after the gold tearing is finished, and then gold tearing operation is carried out next time. Alternatively, referring to fig. 6, in the present embodiment, in order to facilitate the circulation of the upper vacuum chuck rail, the upper vacuum chuck includes a first upper vacuum chuck 111 and a second upper vacuum chuck 112. The upper vacuum sucker track 12 is an annular track, the lower vacuum sucker track 13 is a T-shaped track, the horizontal track part of the T-shaped track is parallel to the vacuum gold tearing carrying platform 14 plane, and meanwhile the vertical track part of the T-shaped track is arranged at one end, far away from the vacuum gold tearing carrying platform 14, of the horizontal track. The circular track provides a working path for the first upper vacuum chuck 111 and the second upper vacuum chuck 112 to be positioned on without interference. The first upper vacuum chuck 111 drives the adhesive film to move to above the wafer 20, and the lower vacuum chuck 10 moves downward along the vertical portion of the T-shaped track to separate the upper and lower adhesive films. Then the lower vacuum chuck is closed to return to the original point, and the vacuum chuck and the second upper vacuum chuck 112 move to the position of the wafer 20 to cut the adhesive film, so that the adhesive film can be cut off, and the upper and lower vacuum chucks suck the adhesive film to wait for the next gold tearing operation. Then, the first upper vacuum chuck 111 drives the adhesive film to move to the upper side of the wafer 20, so that the adhesive film is separated from the wafer, and the gold tearing operation is completed. After the first upper vacuum chuck 111 completes the gold tearing command, the second upper vacuum chuck 112 can perform the next gold tearing operation. Therefore, the gold tearing efficiency is greatly improved.
Specifically, the working principle in the present embodiment is as follows: when the gold tearing device executes a gold tearing instruction, the wafer 20 is placed on the vacuum gold tearing carrier 14. Then the upper vacuum sucker rail 12 and the lower vacuum sucker rail 13 enable the first and the second upper vacuum suckers and the lower vacuum sucker 10 to reach the starting point state, and then the anti-static adhesive film 9 is arranged in the upper vacuum sucker and the lower vacuum sucker. The adhesive film is separated up and down by using vacuum and rail movement, specifically, the lower sub-rail is driven to drive the first upper vacuum chuck 111 to move right to the end far away from the original point, as shown in fig. 6, the rightmost end of the lower sub-rail drives the lower chuck rail to drive the lower vacuum chuck 10 to move down along the vertical rail part, so that the antistatic adhesive film 9 is separated and covers the wafer 20. In order to realize the metal bonding of the adhesive film and the surface of the wafer, the adhesive film can be rolled. The vacuum sucker 10 is driven to close vacuum, the vacuum sucker 10 is driven to return to the initial point by the vacuum sucker track 13, the vacuum sucker 112 and the second upper vacuum sucker waiting at the original point are moved together to the position close to the wafer loading platform, then the adhesive film is cut off, the vacuum sucker track 12 and the lower vacuum sucker track 13 are driven to return to the original point by the vacuum sucker and the second upper vacuum sucker 112 after the adhesive film is cut off, and the next gold tearing operation is facilitated. The upper vacuum sucker rail 12 is driven to drive the first upper vacuum sucker 111 to move upwards from the rightmost end of the lower rail, and gold tearing operation is carried out.
Referring to fig. 3, in the present embodiment, a cutter rail 101 is disposed at one side of the lower vacuum chuck 10, and a rotatable film cutter 102 is disposed in the cutter rail 101. When cutting the antistatic adhesive film 9, as shown in the right side view of fig. 3, a rotatable adhesive film cutter 102 is erected in the adhesive film direction, and as shown in the left side view of fig. 3, the adhesive film cutter 102 is moved along a cutter rail 101 to cut the antistatic adhesive film 9, and then the adhesive film cutter 102 is stored. By adopting the device, the mechanical cutting of cutting off the adhesive film can be realized.
In the embodiment, in order to realize mechanized adhesive film rolling, the device further comprises an anti-static adhesive film rubber roller arm 16, and the anti-static adhesive film rubber roller arm 16 is arranged on one side of the vacuum gold tearing carrying platform 14. The anti-static glue film glue roller arm 16 uniformly covers the anti-static glue film on the upper surface of the wafer 20 through rolling and other action modes, so that the condition that the glue film does not adsorb the wafer is avoided.
Referring to fig. 1, in this embodiment, the device further includes a loading and unloading module and a transmitting module, the loading and unloading module and the transmitting module are disposed in the machine body, the loading and unloading module is located at one side of the wafer gold tearing module, and the transmitting module is disposed at the other side of the wafer gold tearing module, so that the functions of automatically feeding and taking out a finished product are achieved. Go up the feeding and taking out that the raw materials can be accomplished to the setting of unloading module and conveying module efficient, the degree of automation of tearing the gold device of the improvement of very big degree has compared in artifical pay-off, the saving time cost of very big degree improves and tears gold efficiency.
Referring to fig. 1, in the present embodiment, the transfer module further includes a combination arm and a boat-placing stage. The assembly arm 15 comprises a wafer transfer arm 17, the wafer transfer arm 17 is located at one side of the assembly arm 15, and the boat placing stage 18 is arranged at one side of the assembly arm 15. In the present embodiment, before the gold tearing operation is performed, the wafer 20 is picked up from the boat placement stage 18 by the wafer transfer arm 17 in the transfer module, and then placed on the vacuum gold tearing stage 14 by the rotation and horizontal movement of the combination arm 15. In the process of transferring the wafer 20, it is preferable that the vacuum gold tearing carrying platform 14, the combination arm 15 and the boat placing carrying platform 18 are arranged on the same straight line, and the anti-static glue film rubber covered roller arm 16 and the wafer transferring arm 17 are also arranged on the same straight line. The anti-static glue film rubber roller arm 16 performs rolling operation on the other side while the wafer conveying arm 17 picks up the wafer 20, so that the material conveying efficiency and the rolling operation efficiency are greatly improved, and the process scheduling of the combined arm 15 can be met to the maximum extent.
Of course, the vacuum gold-tearing carrying platform 14, the combination arm 15 and the boat-placing carrying platform 18 in the embodiment may also be placed at a certain angle, and meanwhile, the anti-static glue film rubber roller arm 16 and the wafer conveying arm 17 in the combination arm 15 may also be bent at a certain angle, and may also complete the rolling and material conveying instructions. When the wafer transfer arm 17 picks up the wafer 20, the anti-static glue film roller at the other end is positioned at one side for waiting. After the wafer transfer arm 17 puts the wafer 20 into the vacuum gold-stripping carrying platform, the anti-static glue film rubber roller arm 16 moves to the upper side of the wafer 20 to perform the rolling operation.
Referring to fig. 1, in the present embodiment, the conveying module further includes a waste recycling cart. The scrap recycling cart 19 is located on one side below the wafer gold tearing module. The waste recovery vehicle 19 is located below the gold tearing module and receives the recoverable waste falling from the top, so that the problem of low material recovery efficiency is solved.
Referring to fig. 1, in the present embodiment, the machine body includes an upper machine cover 1, a visible glass window 2, a first access side plate 6, a movable machine door 7, and a second access side plate 8, and a wafer stage hole 3, a combined arm hole 4, and a wafer boat stage hole 5 are formed in the top of the machine body. The state of the anti-static adhesive film can be detected through the visual glass window 2, and the wafer carrying platform hole 3, the combined arm hole 4 and the wafer boat carrying platform hole 5 respectively correspond to the vacuum gold tearing carrying platform 14, the combined arm 15 and the wafer boat placing carrying platform 18 in position. The device for protecting the interior of the machine body is used for preventing foreign matters from falling into each device so as to ensure the precision of the interior device. Meanwhile, the operator is prevented from being accidentally injured when the internal gold tearing device runs. The arrangement of the combined arm hole 4 facilitates the extension of the combined arm 15. Meanwhile, the arrangement of the wafer stage holes 3 and the wafer boat stage holes 5 greatly facilitates the execution of the instruction of taking and placing the wafer 20 by the combination arm 15. The first overhaul side plate 6, the movable machine door 7 and the second overhaul side plate 8 which are positioned on the periphery of the machine body can be checked by maintenance personnel when the gold tearing device needs to be maintained or is maintained conveniently.
Referring to fig. 5 and 6, in the embodiment, during the gold stripping operation, the wafer 20 is placed on the vacuum gold stripping stage 14 by the transfer module, the vacuum gold stripping stage 14 vacuumizes the wafer, and the anti-static glue film 9 is loaded into the upper and lower vacuum chucks. The upper and lower vacuum chuck rails are then driven by the controller to bring the first upper vacuum chuck 111 and the lower vacuum chuck 10 to the original position. Referring to fig. 2, the lower vacuum chuck rail is driven to drive the lower vacuum chuck to move downward so as to separate the adhesive film. The lower upper vacuum chuck rail 12 is driven to drive the first upper vacuum chuck device 111 to move rightwards to one end far away from the original point, and the lower vacuum chuck device 10 is driven by the driving rail to move downwards along the vertical rail part of the lower vacuum chuck rail 13, so that the anti-static glue film 9 covers the wafer 20. The anti-static glue film roller arm 16 is driven to perform fan-shaped horizontal rolling on the anti-static glue film on the upper surface of the wafer 20. Vacuum chuck ware 10 closes the vacuum under the drive, and the glued membrane lower floor drops from vacuum chuck ware down, and the vertical length of lower track is less, and its junction of glued membrane after will satisfying to tear is in the vacuum and tears near the gold microscope carrier to can adsorb the glued membrane that has upper and lower floor after vacuum chuck ware moves to the position that is close the vacuum and tears the gold microscope carrier down. The lower vacuum chuck rail 13 is then driven to bring the lower vacuum chuck 10 back to the origin, while the upper vacuum chuck rail 12 is driven to bring the second upper vacuum chuck 112 back to the origin via the rails. Referring to fig. 3, the upper vacuum sucker rail 12 and the lower vacuum sucker rail 13 are driven to drive the second upper vacuum sucker 112 and the lower vacuum sucker 10 to move together to a position close to the vacuum metal tearing platform, the film cutter 102 is driven to rotate so as to erect the film cutter 102, the cutter rail 101 is driven to move, the cutter is driven to horizontally cut the film, and after the film is cut, the upper vacuum sucker rail 12 and the lower vacuum sucker rail 13 are driven to drive the lower vacuum sucker 10 and the second upper vacuum sucker 112 to return to the original point. Finally, the vacuum chuck 11 will drive the adhesive film to tear from the surface of the wafer, thereby realizing the gold tearing operation for the wafer. The upper vacuum sucker rail 12 is driven to drive the first upper vacuum sucker 111 to move to the recovery receiving area through the upper sub-rail, the vacuum is closed, and the upper layer of the adhesive film falls into the recovery receiving area. And if the gold needs to be torn for multiple times, repeating the steps. If the gold tearing is finished, the arm is sucked to take the wafer 20 away and place the wafer in the wafer boat, so that the automatic gold tearing operation can be completed.
It should be noted that, although the above embodiments have been described herein, the scope of the present invention is not limited thereby. Therefore, based on the innovative concept of the present invention, the changes and modifications of the embodiments described herein, or the equivalent structure or equivalent process changes made by the contents of the specification and the drawings of the present invention, directly or indirectly apply the above technical solutions to other related technical fields, all included in the scope of the present invention.
Claims (8)
1. An automatic gold tearing device is characterized by comprising a wafer gold tearing module and a machine body, wherein the wafer gold tearing module is arranged in the machine body;
the wafer gold tearing module comprises a lower vacuum sucker, an upper vacuum sucker track, a lower vacuum sucker track and a vacuum gold tearing platform deck; the vacuum sucker device comprises a lower vacuum sucker device track, wherein the lower vacuum sucker device track is arranged on one side below the vacuum gold tearing platform deck, the lower vacuum sucker device track comprises a vertical track part, the upper vacuum sucker device track is arranged on two sides right above the vacuum gold tearing platform deck, the upper vacuum sucker device moves on the upper vacuum sucker device track at the position, the lower vacuum sucker device moves on the lower vacuum sucker device track at the position, the upper vacuum sucker device track comprises an upper sub-track and a lower sub-track, and the lower sub-track is parallel to the vacuum gold tearing platform deck plane.
2. The automatic gold tearing device of claim 1, wherein the upper vacuum sucker comprises a first upper vacuum sucker and a second upper vacuum sucker, the upper vacuum sucker rail is an annular rail, the lower vacuum sucker rail is a T-shaped rail, a horizontal rail portion of the T-shaped rail is parallel to a plane of the vacuum gold tearing carrier, and a vertical rail portion of the T-shaped rail is arranged at one end of the horizontal rail, which is far away from the vacuum gold tearing carrier.
3. The automatic metal tearing device according to claim 1, wherein a cutter rail is arranged on one side of the lower vacuum sucker, and a rotatable film cutter is arranged in the cutter rail.
4. The automatic gold tearing device according to claim 1, further comprising an anti-static glue film rubber roller arm, wherein the anti-static glue film rubber roller arm is arranged on one side of the vacuum gold tearing carrier.
5. The automatic gold tearing device according to claim 1, further comprising a feeding and discharging module and a conveying module;
the feeding and discharging module and the conveying module are arranged in the machine body;
the feeding and discharging module is located on one side of the wafer gold tearing module, and the conveying module is arranged on the other side of the wafer gold tearing module.
6. The automatic gold tearing device according to claim 5, wherein the transfer module further comprises a combination arm and a boat placement stage, the combination arm comprises a wafer transfer arm, the wafer transfer arm is located at one side of the combination arm, and the boat placement stage is arranged at one side of the combination arm.
7. The automatic metal stripping device as claimed in claim 5, wherein the conveying module further comprises a scrap recycling cart, and the scrap recycling cart is located on one side below the wafer metal stripping module.
8. The automatic gold tearing device according to claim 6, wherein the machine body comprises an upper machine cover, a visible glass window, a first maintenance side plate, a movable machine door and a second maintenance side plate, and a wafer carrying platform hole, a combined arm hole and a wafer boat carrying platform hole are formed in the top of the machine body; the visible glass window, the wafer carrying platform hole, the combination arm hole and the wafer boat carrying platform hole respectively correspond to the positions of the feeding module, the blanking module, the vacuum gold tearing carrying platform, the combination arm and the wafer boat placing carrying platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921269895.3U CN210200675U (en) | 2019-08-07 | 2019-08-07 | Automatic tear golden device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921269895.3U CN210200675U (en) | 2019-08-07 | 2019-08-07 | Automatic tear golden device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210200675U true CN210200675U (en) | 2020-03-27 |
Family
ID=69865839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921269895.3U Withdrawn - After Issue CN210200675U (en) | 2019-08-07 | 2019-08-07 | Automatic tear golden device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210200675U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504194A (en) * | 2019-08-07 | 2019-11-26 | 福建省福联集成电路有限公司 | One kind being torn golden clothes automatically and set |
-
2019
- 2019-08-07 CN CN201921269895.3U patent/CN210200675U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504194A (en) * | 2019-08-07 | 2019-11-26 | 福建省福联集成电路有限公司 | One kind being torn golden clothes automatically and set |
| CN110504194B (en) * | 2019-08-07 | 2024-05-28 | 福建省福联集成电路有限公司 | Automatic tear golden device |
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