CN210200558U - Enhancement mode resistance-capacitance step-down X2 condenser - Google Patents
Enhancement mode resistance-capacitance step-down X2 condenser Download PDFInfo
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- CN210200558U CN210200558U CN201920906888.3U CN201920906888U CN210200558U CN 210200558 U CN210200558 U CN 210200558U CN 201920906888 U CN201920906888 U CN 201920906888U CN 210200558 U CN210200558 U CN 210200558U
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Abstract
The utility model discloses an enhanced resistance-capacitance step-down X2 capacitor, which comprises an inner packaging layer arranged inside a packaging outer mould shell; the inner packaging layer wraps the capacitor core body; the two sides of the capacitor core body and the inner packaging layer are led out through steel wire leads, and a contact protection module is arranged at the ohmic contact position of a terminal pin; a metal coating layer and a thin film dielectric layer are arranged in the capacitor core; the utility model relates to an enhancement mode resistance-capacitance step-down X2 condenser improves its self resistance-capacitance step-down ability through the metallized film shaping encapsulation of multilayering, and has good thermal volatility and safety contact nature, its reasonable in design, and simple structure simple process easily operates, has improved long service life, is fit for extensively promoting.
Description
Technical Field
The utility model relates to a capacitor, in particular to an enhanced resistance-capacitance step-down X2 capacitor; belongs to the field of electronic appliances.
Background
The working principle of capacitance voltage reduction is that capacitance reactance generated by a capacitor under a certain alternating current signal frequency is used for limiting the maximum working current, the voltage reduction is more practical to limit the load current, the voltage of a voltage stabilizing element load does not change along with the load size, a common CBB or a resistance-capacitance voltage reduction circuit made by a capacitor with insufficient voltage redundancy has a safety problem, and an enhanced resistance-capacitance voltage reduction X2 is undoubtedly contradictory to a capacitor with more and more miniaturized volume mass in the current market.
Disclosure of Invention
Technical problem to be solved
In order to solve the above problem, the utility model provides an enhancement mode resistance-capacitance step-down X2 condenser.
(II) technical scheme
The enhanced resistance-capacitance step-down X2 capacitor of the utility model comprises an inner packaging layer arranged inside a packaging outer mould shell; the inner packaging layer wraps the capacitor core body; the two sides of the capacitor core body and the inner packaging layer are led out through steel wire leads, and a contact protection module is arranged at the ohmic contact position of a terminal pin; and a metal coating layer and a film dielectric layer are arranged in the capacitor core.
Furthermore, the metal coating layer is a zinc-aluminum composite metal coating, the film medium layer is a polypropylene film, the surface area of the metal coating layer is smaller than that of the film medium layer, the metal coating layer is attached to the surface of the film medium layer through evaporation, and the metal coating layer and the film medium layer are formed through winding and pressure casting.
Furthermore, a heat dissipation heat sink film layer is arranged between the capacitor core body and the inner packaging layer.
Furthermore, the steel wire lead is wrapped by a copper-tin coating film, is packaged by epoxy resin adhesive, and is provided with a conductive adhesive strip between the steel wire lead and the contact protection module.
Furthermore, the inner packaging layer and the contact protection module are both epoxy resin viscose glue, and the outer packaging mould shell is made of non-conductive materials.
(III) advantageous effects
Compared with the prior art, the utility model, it has following beneficial effect: the utility model discloses an enhancement mode resistance-capacitance step-down X2 condenser improves its self resistance-capacitance step-down ability through the metallized film shaping encapsulation of multilayering, and has good thermal volatility and safety contact nature, its reasonable in design, and simple structure simple process easily operates, has improved long service life, is fit for extensively promoting.
Drawings
Fig. 1 is a schematic view of the whole capacitor structure of the present invention.
Fig. 2 is a schematic diagram of the internal structure of the capacitor core according to the present invention.
1-packaging an outer mould shell; 2-inner packaging layer; 3-a capacitor core; 301-metal coating layer; 302-heat sink film layer for heat dissipation; 303-thin film dielectric layer; 4-steel wire lead; 5-conductive adhesive strips; 6-contact protection module.
Detailed Description
An enhanced resistance-capacitance step-down X2 capacitor as shown in the attached drawings comprises an inner packaging layer 2 arranged inside a packaging outer mould shell 1; the inner packaging layer 2 wraps the capacitor core body 3; the two sides of the capacitor core body 3 and the inner packaging layer 2 are led out through steel wire leads 4, and contact protection modules 6 are arranged at ohmic contact positions of terminal pins; the capacitor core body 3 is internally provided with a metal coating layer 301 and a film dielectric layer 303.
The metal coating layer 301 is a zinc-aluminum composite metal coating, the film medium layer 303 is a polypropylene film, the surface area of the metal coating layer 301 is smaller than that of the film medium layer 303, the metal coating layer is attached to the surface of the film medium layer 303 through evaporation, and the metal coating layer and the film medium layer are formed through winding pressure casting; a heat dissipation heat sink film layer 302 is arranged between the capacitor core body 3 and the inner packaging layer 2; the outside of the steel wire lead 4 is wrapped by a copper-tin coating film and packaged by epoxy resin adhesive, and a conductive adhesive strip 5 is arranged between the steel wire lead and the contact protection module 6; the inner packaging layer 2 and the contact protection module 6 are both epoxy resin viscose glue, and the packaging outer mould shell 1 is made of non-conductive materials.
The utility model discloses an enhancement mode resistance-capacitance step-down X2 condenser improves its self resistance-capacitance step-down ability through the metallized film shaping encapsulation of multilayering, and has good thermal volatility and safety contact nature, its reasonable in design, and simple structure simple process easily operates, has improved long service life, is fit for extensively promoting.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the spirit and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made by the technical solution of the present invention by those skilled in the art should fall into the protection scope of the present invention, and the technical contents claimed by the present invention have been fully recorded in the claims.
Claims (5)
1. An enhancement mode resistance-capacitance step-down X2 capacitor, characterized in that: comprises an inner packaging layer (2) arranged in a packaging outer mould shell (1); the inner packaging layer (2) wraps the capacitor core body (3); the two sides of the capacitor core body (3) and the inner packaging layer (2) are led out through steel wire leads (4), and contact protection modules (6) are arranged at ohmic contact positions of terminal pins; the capacitor core body (3) is internally provided with a metal coating layer (301) and a thin film dielectric layer (303).
2. The enhanced resistor-capacitor buck X2 capacitor of claim 1, wherein: the metal coating layer (301) is a zinc-aluminum composite metal coating, the film medium layer (303) is a polypropylene film, the surface area of the metal coating layer (301) is smaller than that of the film medium layer (303), the metal coating layer is attached to the surface of the film medium layer (303) through evaporation, and the metal coating layer and the film medium layer are formed through winding pressure casting.
3. The enhanced resistor-capacitor buck X2 capacitor of claim 1, wherein: a heat dissipation heat sink film layer (302) is arranged between the capacitor core body (3) and the inner packaging layer (2).
4. The enhanced resistor-capacitor buck X2 capacitor of claim 1, wherein: the steel wire lead (4) is wrapped by a copper-tin coating film, is packaged by epoxy resin adhesive, and is provided with a conductive adhesive strip (5) between the steel wire lead and the contact protection module (6).
5. The enhanced resistor-capacitor buck X2 capacitor of claim 1, wherein: the inner packaging layer (2) and the contact protection module (6) are both epoxy resin viscose glue, and the packaging outer mould shell (1) is made of non-conductive materials.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920906888.3U CN210200558U (en) | 2019-06-17 | 2019-06-17 | Enhancement mode resistance-capacitance step-down X2 condenser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920906888.3U CN210200558U (en) | 2019-06-17 | 2019-06-17 | Enhancement mode resistance-capacitance step-down X2 condenser |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210200558U true CN210200558U (en) | 2020-03-27 |
Family
ID=69870842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920906888.3U Expired - Fee Related CN210200558U (en) | 2019-06-17 | 2019-06-17 | Enhancement mode resistance-capacitance step-down X2 condenser |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN210200558U (en) |
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2019
- 2019-06-17 CN CN201920906888.3U patent/CN210200558U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200327 Termination date: 20210617 |
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CF01 | Termination of patent right due to non-payment of annual fee |