CN208400717U - A kind of damp-proof PCB thin film capacitor - Google Patents
A kind of damp-proof PCB thin film capacitor Download PDFInfo
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- CN208400717U CN208400717U CN201821170198.8U CN201821170198U CN208400717U CN 208400717 U CN208400717 U CN 208400717U CN 201821170198 U CN201821170198 U CN 201821170198U CN 208400717 U CN208400717 U CN 208400717U
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- capacitor
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- copper wire
- plastics shell
- capacitor core
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Abstract
The utility model discloses a kind of damp-proof PCB thin film capacitors, including capacitor body, potting compound high-performance epoxy resin, engineering plastics shell, capacitor core, the first copper wire, the second copper wire, the inside of capacitor body is equipped with capacitor core, the side of capacitor core is equipped at least one or more copper wire, the other side of capacitor core is equipped with the copper wire at least also having one or more, the outside of capacitor body is equipped with engineering plastics shell, and potting compound high-performance epoxy resin is equipped between engineering plastics shell and capacitor core.The capacitor body and engineering plastics shell of the capacitor assemble, and encapsulating high-performance epoxy resin, make the favorable sealing property of product.Overcome the problems, such as that product is easy dampness, and ensures that product service life reaches 100,000 hours or more.High performance engineering plastics shell, high density, low water absorption, noninflammability；Improve the service life of distributed photovoltaic inverter；Production is easy to operate, product qualification rate is high, high production efficiency.
Description
Technical field:
The utility model relates to capacitor area, specially a kind of damp-proof PCB thin film capacitor.
Background technique:
Existing market common design structure are as follows: common metal winding film is as capacitor core, outside common PBT plastic
Shell, ordinary epoxy resin are packaged.When for high temperature and humidity occasion, since moisture protection is poor, moisture enters in capacitance core body,
Metallization coating oxidation is caused to seriously affect the service life of photovoltaic DC-to-AC converter so that capacitance decline, loss be made to increase.Tool
The shortcomings that body, is divided into following two points:
1: moisture protection is poor, and moisture is easily accessible in capacitance core body；
2: metalized film does not have humidity resistance, and coat of metal disappearance easy to oxidize after dampness causes element premature failure.
Utility model content:
The purpose of this utility model is in view of the drawbacks of the prior art, to provide a kind of damp-proof PCB thin film capacitor, with
Solve the problems, such as that above-mentioned background technique proposes.
To achieve the above object, the utility model provides the following technical solutions: a kind of damp-proof PCB thin film capacitor,
Including capacitor body, potting compound high-performance epoxy resin, engineering plastics shell, capacitor core, the first copper wire, the second copper wire,
The inside of the capacitor body is equipped with the capacitor core, and the side of the capacitor core is equipped with first copper wire, described
The other side of capacitor core is equipped with second copper wire, and the outside of the capacitor body is equipped with the engineering plastics shell, institute
It states and is equipped with the potting compound high-performance epoxy resin between engineering plastics shell and the capacitor core.
As a kind of optimal technical scheme of the utility model, the first copper wire of institute and second copper wire with the capacitor
Fuse is connected.
As a kind of optimal technical scheme of the utility model, the capacitor core passes through on the engineering plastics shell
Positioning bar is fixed on the middle position of the engineering plastics interior of shell.
As a kind of optimal technical scheme of the utility model, the capacitor core, first copper wire and described second
Copper wire passes through the potting compound high-performance epoxy resin heating baking-curing and is fixedly linked with the engineering plastics shell.
As a kind of optimal technical scheme of the utility model, the engineering plastics shell uses polyphenylene sulfide engineering plastics
It is made.
This practical beneficial effect is: the capacitor body and engineering plastics shell of the capacitor assemble, and the high property of encapsulating
Energy epoxy resin, makes the favorable sealing property of product.Overcome the problems, such as that product is easy dampness, and ensures that product service life reaches
100000 hours or more.High performance engineering plastics shell, high density, low water absorption, noninflammability；Improve distributed photovoltaic inverter
Service life；Production is easy to operate, product qualification rate is high, high production efficiency.
Detailed description of the invention:
Fig. 1 is this practical structural schematic diagram；
Fig. 2 is this practical side view；
In figure: 1, capacitor body, 2, potting compound high-performance epoxy resin, 3, engineering plastics shell, 4, capacitor core, 5,
First copper wire, the 6, second copper wire.
Specific embodiment:
The preferred embodiment of the utility model is described in detail with reference to the accompanying drawing, so that the advantages of the utility model
It can be easier to be understood by those skilled in the art with feature, to make apparent specific boundary to the protection scope of the utility model
It is fixed.
The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of damp-proof PCB thin film capacitor, including
Capacitor body 1, potting compound high-performance epoxy resin 2, engineering plastics shell 3, capacitor core 4, the first copper wire 5, the second copper wire
6, the inside of capacitor body 1 is equipped with capacitor core 4, and the side of capacitor core 4 is equipped with the first copper wire 5, capacitor core 4 it is another
Side is equipped with the second copper wire 6, and the outside of capacitor body 1 is equipped with engineering plastics shell 3, engineering plastics shell 3 and capacitor core 4 it
Between be equipped with potting compound high-performance epoxy resin 2.
Further, the first copper wire 5 of institute and the second copper wire 6 are connected with capacitor core 4.
Further, capacitor core 4 is fixed on inside engineering plastics shell 3 by the positioning bar on engineering plastics shell 3
Middle position.
Further, capacitor core 4, the first copper wire 5 and the second copper wire 6 are added by potting compound high-performance epoxy resin 2
Warm baking-curing is fixedly linked with engineering plastics shell 3.
Further, engineering plastics shell 3 is made of polyphenylene sulfide engineering plastics.
Working principle: a kind of damp-proof PCB thin film capacitor, including capacitor body 1, potting compound high-performance asphalt mixtures modified by epoxy resin
Rouge 2, engineering plastics shell 3, capacitor core 4, the first copper wire 5, the second copper wire 6, extremely by the good installation of capacitor core 4 of welding processing
After engineering plastics shell 3, production is completed in heating cure after pouring into potting compound high-performance epoxy resin 2.Capacitor is paid attention to when assembly
The positioning bar of fuse 4 and engineering plastics shell 3 cooperates, it is ensured that fuse is placed in the middle, and when encapsulation pays attention to the encapsulating amount of potting compound；According to work
Skill requires to carry out heating baking-curing；This product pass through to the special designing of metallized film coating damp-proof treatment, plastic shell,
Select high-performance epoxy resin encapsulating, it is ensured that the whole moisture resistance of product.By common metal thin film coating before, improves and be
By special damp-proof treatment, plastic shell is high temperature resistant, extremely low water absorption rate, noninflammability by common enclosure improvement before, is filled out
Charge selects special high-performance epoxy resin, and the innovation for technical matters effectively ensures the stabilization of photovoltaic inversion device
Operation, longer life expectancy, and this product preferably guarantee the consistency of product quality in production, and improve production efficiency.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.
Claims (5)
1. a kind of damp-proof PCB thin film capacitor, including capacitor body (1), potting compound high-performance epoxy resin (2), work
Engineering plastics shell (3), capacitor core (4), the first copper wire (5), the second copper wire (6), it is characterised in that: the capacitor body
(1) inside is equipped with the capacitor core (4), and the side of the capacitor core (4) is equipped with first copper wire (5), the electricity
The other side for holding fuse (4) is equipped with second copper wire (6), and the outside of the capacitor body (1) is equipped with the engineering plastics
Shell (3) is equipped with the potting compound high-performance epoxy resin between the engineering plastics shell (3) and the capacitor core (4)
(2)。
2. a kind of damp-proof PCB thin film capacitor according to claim 1, it is characterised in that: institute the first copper wire (5) and
Second copper wire (6) is connected with the capacitor core (4).
3. a kind of damp-proof PCB thin film capacitor according to claim 1, it is characterised in that: the capacitor core (4)
The internal middle position of the engineering plastics shell (3) is fixed on by the positioning bar on the engineering plastics shell (3).
4. a kind of damp-proof PCB thin film capacitor according to claim 1, it is characterised in that: the capacitor core
(4), first copper wire (5) and second copper wire (6) pass through the potting compound high-performance epoxy resin (2) heating baking
Solidification is fixedly linked with the engineering plastics shell (3).
5. a kind of damp-proof PCB thin film capacitor according to claim 1, it is characterised in that: outside the engineering plastics
Shell (3) is made of polyphenylene sulfide special engineering plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821170198.8U CN208400717U (en) | 2018-07-24 | 2018-07-24 | A kind of damp-proof PCB thin film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821170198.8U CN208400717U (en) | 2018-07-24 | 2018-07-24 | A kind of damp-proof PCB thin film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208400717U true CN208400717U (en) | 2019-01-18 |
Family
ID=65128555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821170198.8U Active CN208400717U (en) | 2018-07-24 | 2018-07-24 | A kind of damp-proof PCB thin film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208400717U (en) |
-
2018
- 2018-07-24 CN CN201821170198.8U patent/CN208400717U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Film capacitor for moisture -proof PCB Effective date of registration: 20200429 Granted publication date: 20190118 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd Pledgor: FOSHAN SHUNDE FUTIAN ELECTRICAL Co.,Ltd. Registration number: Y2020440000103 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |