CN208400719U - A kind of PCB thin film capacitor - Google Patents
A kind of PCB thin film capacitor Download PDFInfo
- Publication number
- CN208400719U CN208400719U CN201821170199.2U CN201821170199U CN208400719U CN 208400719 U CN208400719 U CN 208400719U CN 201821170199 U CN201821170199 U CN 201821170199U CN 208400719 U CN208400719 U CN 208400719U
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- China
- Prior art keywords
- plastic shell
- capacitor core
- epoxy resin
- locating slot
- lead
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Abstract
The utility model discloses a kind of PCB thin film capacitors, including plastic shell, capacitor core, lead, encapsulated epoxy resin and quick locating slot, the inside of the plastic shell is equipped with the capacitor core, the inside of the plastic shell is equipped with the quick locating slot, the two sides of the capacitor core are equipped with the lead, and the encapsulated epoxy resin is equipped between the capacitor core and the plastic shell.By carrying out reasonable structure design to plastic shell, increase quick locating slot, bottom shape is changed to arc-shaped, the quick location and installation of capacitor core energy of soldered exit ensures that exit is placed in the middle in plastic shell, it carries out asphalt mixtures modified by epoxy resin again to be potted, monnolithic case is more attractive；Simplify production technology, be substantially reduced fraction defective, and saves cost；Appearance is more beautiful, improves the competitiveness of product in market, has quickly positioning installation placed in the middle, produces simple and effective, qualification rate is high.
Description
Technical field:
The utility model relates to capacitor area, specially a kind of PCB thin film capacitor.
Background technique:
Existing market common design structure are as follows: metallized film winding is used as capacitor core, simple square plastic shell, ring
Oxygen resin is packaged.When this production, since capacitor core and shell fit clearance are larger, the exit of capacitor core with
Shell is not placed in the middle, it is necessary to which by exit correcting process, production efficiency is lower, bad rate is higher, and appearance is unsightly.It is specific to lack
Point shows as two o'clock:
1: the positioning of capacitor exit difficulty is placed in the middle, and production efficiency is low, bad rate is higher；
2: appearance is unsightly.
Utility model content:
The purpose of this utility model is in view of the drawbacks of the prior art, to provide a kind of PCB thin film capacitor, on solving
State the problem of background technique proposes.
To achieve the above object, the utility model provides the following technical solutions: a kind of PCB thin film capacitor, including modeling
The inside of glue shell, capacitor core, lead, encapsulated epoxy resin and quick locating slot, the plastic shell is equipped with the capacitor
The inside of fuse, the plastic shell is equipped with the quick locating slot, and the two sides of the capacitor core are equipped with the lead, institute
It states and is equipped with the encapsulated epoxy resin between capacitor core and the plastic shell.
As a kind of optimal technical scheme of the utility model, the capacitor core is fixed on by the quick locating slot
The middle part of the plastic shell, the lead are connected by welding with the capacitor core.
As a kind of optimal technical scheme of the utility model, the capacitor core and the lead pass through the encapsulating
Epoxy resin is heating and curing to be connected with the plastic shell.
This practical beneficial effect is: by carrying out reasonable structure design to plastic shell, increase quick locating slot, general
Bottom shape is changed to arc-shaped, and the capacitor core of soldered exit can quickly location and installation be in plastic shell, and really
It is placed in the middle to protect exit, then carries out asphalt mixtures modified by epoxy resin and is potted, monnolithic case is more attractive；Simplify production technology, be substantially reduced fraction defective,
And save cost；Appearance is more beautiful, improves the competitiveness of product in market, has quickly positioning installation placed in the middle, production is easy
Efficiently, qualification rate is high.
Detailed description of the invention:
Fig. 1 is this practical structural schematic diagram；
Fig. 2 is this practical one of partial structural diagram；
Fig. 3 is the two of this practical partial structural diagram；
In figure: 1, plastic shell, 2, capacitor core, 3, lead, 4, encapsulated epoxy resin, 5, quick locating slot.
Specific embodiment:
The preferred embodiment of the utility model is described in detail with reference to the accompanying drawing, so that the advantages of the utility model
It can be easier to be understood by those skilled in the art with feature, to make apparent specific boundary to the protection scope of the utility model
It is fixed.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of PCB thin film capacitor, including outside plastic cement
Shell 1, capacitor core 2, lead 3, encapsulated epoxy resin 4 and quick locating slot 5, the inside of plastic shell 1 are equipped with capacitor core 2,
The inside of plastic shell 1 is equipped with quick locating slot 5, and the two sides of capacitor core 2 are equipped with lead 3, capacitor core 2 and plastic shell
Encapsulated epoxy resin 4 is equipped between 1.
Further, capacitor core 2 is fixed on the middle part of plastic shell 1, lead 3 and capacitance core by quick locating slot 5
Son 2 is connected by welding.
Further, capacitor core 2 and lead 3 are heating and curing by encapsulated epoxy resin 4 is connected with plastic shell 1.
Working principle: a kind of PCB thin film capacitor, including plastic shell 1, capacitor core 2, lead 3, encapsulating asphalt mixtures modified by epoxy resin
Rouge 4 and quick locating slot 5, lead 3 and capacitor core 2 are welded as a whole, then quickly positioning is installed between two parties by capacitor core 2
In plastic shell 1, production is completed in heating cure after encapsulated epoxy resin 4；Capacitor core 2 and plastic shell 1 are paid attention to when assembly
Be centered about cooperation, it is ensured that the lead 3 of capacitor core 2 is placed in the middle；The encapsulating amount of potting compound is paid attention to when encapsulation；According to the technological requirements
Carry out heating baking-curing.This product, which is passed through, is welded as a whole exit and capacitor core, then capacitor core is quickly positioned
It is installed in plastic shell between two parties, epoxy resin carries out high temperature encapsulating, it is ensured that the whole moisture resistance of product.By common side before
Shape plastic shell, improves and designs for circular arc bottom, and inside is equipped with quick locating slot, the quick positioning core of energy, for the wound of technology
Newly, simplify production technology, improve production efficiency, hence it is evident that improve qualification rate, more cost-effective, performance is stablized, and appearance is more beautiful.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.
Claims (3)
1. a kind of PCB thin film capacitor, including plastic shell (1), capacitor core (2), lead (3), encapsulated epoxy resin (4)
With quick locating slot (5), it is characterised in that: the inside of the plastic shell (1) is equipped with the capacitor core (2), the plastic cement
The inside of shell (1) is equipped with the quick locating slot (5), and the two sides of the capacitor core (2) are equipped with the lead (3), institute
It states and is equipped with the encapsulated epoxy resin (4) between capacitor core (2) and the plastic shell (1).
2. a kind of PCB thin film capacitor according to claim 1, it is characterised in that: the capacitor core (2) passes through institute
The middle part that quick locating slot (5) is fixed on the plastic shell (1) is stated, the lead (3) and the capacitor core (2) pass through weldering
It connects connected.
3. a kind of PCB thin film capacitor according to claim 1, it is characterised in that: the capacitor core (2) and described
Lead (3) is heating and curing by the encapsulated epoxy resin (4) to be connected with the plastic shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821170199.2U CN208400719U (en) | 2018-07-24 | 2018-07-24 | A kind of PCB thin film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821170199.2U CN208400719U (en) | 2018-07-24 | 2018-07-24 | A kind of PCB thin film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208400719U true CN208400719U (en) | 2019-01-18 |
Family
ID=65128872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821170199.2U Active CN208400719U (en) | 2018-07-24 | 2018-07-24 | A kind of PCB thin film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208400719U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110581031A (en) * | 2019-09-06 | 2019-12-17 | 天津合众汇能科技有限公司 | Secondary sealing glue-pouring type single capacitor and production method thereof |
-
2018
- 2018-07-24 CN CN201821170199.2U patent/CN208400719U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110581031A (en) * | 2019-09-06 | 2019-12-17 | 天津合众汇能科技有限公司 | Secondary sealing glue-pouring type single capacitor and production method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Film capacitor for PCB Effective date of registration: 20200429 Granted publication date: 20190118 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd Pledgor: FOSHAN SHUNDE FUTIAN ELECTRICAL Co.,Ltd. Registration number: Y2020440000103 |