CN210199677U

CN210199677U - Intelligence vending machine mainboard CPU heat radiation structure

Info

Publication number: CN210199677U
Application number: CN201921340188.9U
Authority: CN
Inventors: Shixin Wang; 王诗信; Congying Chen; 陈聪颍; Zhiming Zhu; 朱志铭
Original assignee: Quanzhou Intelligent Purchase Vending Machine Co Ltd
Current assignee: Quanzhou Intelligent Purchase Vending Machine Co Ltd
Priority date: 2019-08-19
Filing date: 2019-08-19
Publication date: 2020-03-27
Anticipated expiration: 2029-08-19

Abstract

The utility model discloses an intelligence vending machine mainboard CPU heat radiation structure, including the diaphragm, the inside processing of diaphragm has the through-hole, mainboard CPU's top is equipped with fixed subassembly, the top of graphite alkene board is laminated with the bottom of heat conduction silicone grease mutually, the top of diaphragm is equipped with forced air cooling subassembly, the below of copper sheet is equipped with radiator unit. This intelligence vending machine mainboard CPU heat radiation structure, through fixed subassembly, the cooperation of diaphragm and square slab, make and closely laminate between mainboard CPU and the graphite alkene board, and then guarantee radiating efficiency, through heat conduction silicone grease, the graphite alkene board, the cooperation of copper sheet and fin, make the speed of heat conduction faster, the area increases, and then make the heat distribute fast and dilute, cooperation through air-cooled subassembly and radiator unit, make the ice pad can absorb the heat in the copper sheet fast, the fan can carry out the forced air cooling to fin and mainboard CPU fast through rotating, and then improve the radiating efficiency, shorten the radiating time, prolonged service life.

Description

Intelligence vending machine mainboard CPU heat radiation structure

Technical Field

The utility model relates to an intelligence vending machine mainboard CPU heat radiation structure technical field specifically is an intelligence vending machine mainboard CPU heat radiation structure.

Background

CPU is also called central processing unit, central processing unit is a super large scale integrated circuit, it is the operation core and the control core of a computer, its function is mainly to explain computer instruction and handle the data in the computer software, and apply to various intelligent device in a large number, intelligence vending machine mainboard CPU heat radiation structure among the prior art, can't make between mainboard CPU and the graphite alkene board closely laminate, and then can't guarantee radiating efficiency, it can't make the speed of heat conduction faster, the area increase, and then make the heat can't be given off and diluted fast, can't absorb the heat in the copper sheet fast simultaneously, and can't carry out the forced air cooling to fin and mainboard CPU, and then reduce radiating efficiency, increase the radiating time, greatly shorten the life of the device, lead to easily that mainboard CPU is burnt out.

Disclosure of Invention

An object of the utility model is to provide an intelligence vending machine mainboard CPU heat radiation structure, with the intelligence vending machine mainboard CPU heat radiation structure among the prior art of proposing in solving above-mentioned background art, can't make and closely laminate between mainboard CPU and the graphite alkene board, and then can't guarantee radiating efficiency, it can't make the speed of heat conduction faster, the area increases, and then make the heat can't be given off and dilute fast, can not absorb the heat in the copper sheet fast simultaneously, and can't carry out the forced air cooling to fin and mainboard CPU, and then reduce the radiating efficiency, increase radiating time, shorten the device's life greatly, lead to the problem that mainboard CPU is burnt out easily.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an intelligence vending machine mainboard CPU heat radiation structure, includes the diaphragm, the inside processing of diaphragm has the through-hole, the inner wall rigid coupling of through-hole has two square boards, two the top of square board is equipped with mainboard CPU, mainboard CPU's outer wall scribbles heat conduction silicone grease, the bottom left and right sides of heat conduction silicone grease respectively with the top inboard looks joint of two square boards, mainboard CPU's top is equipped with fixed subassembly, the top of diaphragm is equipped with two fin, two the inside and outside both sides of fin respectively with the top looks joint of square board and diaphragm, two the copper sheet rigid coupling is passed through together in the bottom of fin, the top rigid coupling of copper sheet has the graphite alkene board, the top of graphite alkene board is laminated with the bottom of heat conduction silicone grease, the top of diaphragm is equipped with the forced air cooling subassembly, the below of copper sheet is equipped with radiator unit.

Preferably, the fins are symmetrically distributed about the axis of the through-hole.

Preferably, fixed subassembly includes sleeve, montant, round pin axle, apron, draw-in groove and spring, telescopic bottom is in the same place with the top rigid coupling of square slab, telescopic inner wall clearance fit has the montant, the bottom of montant links to each other with telescopic inner wall bottom through the spring is fixed, is located left the top of montant is passed through the round pin axle and is rotated with the apron and link to each other, the bottom of apron is laminated mutually with the top of heat conduction silicone grease, the right-hand member of apron passes through the draw-in groove and is connected mutually with the montant that is located the right side.

Preferably, the air cooling assembly comprises a support plate, a round rod, a clamping plate and a fan, the bottom of the support plate is fixedly connected with the top of the transverse plate, the top of the support plate located on the left side is rotatably connected with the clamping plate through the round rod, the bottom of the clamping plate is fixedly connected with the fan, and the right end of the clamping plate is attached to the top of the support plate located on the right side.

Preferably, the radiating assembly comprises a long plate, a rotating shaft, an ice pad and a bolt, the left end of the long plate is connected with the lower portion of the left end of the inner wall of the through hole through the rotating shaft in a rotating mode, the ice pad is in clearance fit with the top of the long plate, the top of the ice pad is attached to the bottom of the copper sheet, the inner wall of the long plate is in clearance fit with the inner wall of the through hole, the bolt is connected with the right end of the long plate in a clamping mode, and the bolt is connected with the bottom of the transverse plate in a threaded mode.

Preferably, the ice pad coincides with the axis of the graphene plate.

Compared with the prior art, the beneficial effects of the utility model are that: this intelligence vending machine mainboard CPU heat radiation structure, through fixed subassembly, the cooperation of diaphragm and square slab, make and closely laminate between mainboard CPU and the graphite alkene board, and then guarantee radiating efficiency, through heat conduction silicone grease, graphite alkene board, the cooperation of copper sheet and fin, make the speed of heat conduction faster, the area increases, and then make the heat distribute fast and dilute, cooperation through air-cooled subassembly and radiator unit, make the ice pad can absorb the heat in the copper sheet fast, the fan can carry out the forced air cooling to fin and mainboard CPU fast through rotating, and then improve the radiating efficiency, shorten the radiating time, prolong the device's life greatly, avoid being burnt out the risk because of mainboard CPU.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a left side view of the structure of fig. 1.

Fig. 3 is a schematic structural diagram of the sleeve, the vertical rod and the main board CPU in fig. 1.

Fig. 4 is a schematic structural diagram of the graphene sheet, the long sheet and the ice pad in fig. 1.

In the figure: 1. the heat dissipation module comprises a transverse plate, 2, a through hole, 3, a square plate, 4, a main board CPU, 5, heat conduction silicone grease, 6, a heat dissipation sheet, 7, a fixing component, 701, a sleeve, 702, a vertical rod, 703, a pin shaft, 704, a cover plate, 705, a clamping groove, 706, a spring, 8, an air cooling component, 801, a support plate, 802, a round rod, 803, a clamping plate, 804, a fan, 9, a heat dissipation component, 901, a long plate, 902, a rotating shaft, 903, an ice pad, 904, a bolt, 10, a copper sheet, 11 and a graphene plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a CPU heat dissipation structure of a main board of an intelligent vending machine comprises a transverse board 1, a through hole 2 is processed inside the transverse board 1, two square boards 3 are fixedly connected to the inner wall of the through hole 2, the two square boards 3 are symmetrically distributed about the axis of the through hole 2, a main board CPU4 is arranged on the top of each square board 3, heat conducting silicone grease 5 is coated on the outer wall of a main board CPU4, the heat conducting silicone grease 5 has high heat conductivity, the left side and the right side of the bottom of the heat conducting silicone grease 5 are respectively clamped with the inner sides of the tops of the two square boards 3, a fixing component 7 is arranged above the main board CPU4, two heat dissipation fins 6 are arranged on the top of the transverse board 1, the heat dissipation fins 6 are made of aluminum alloy, the heat dissipation fins 6 are symmetrically distributed about the axis of the through hole 2, the heat dissipation fins 6 are more even to a support board CPU4, the inner side and the outer side of each, the top rigid coupling of copper sheet 10 has graphite alkene board 11, and graphite alkene board 11 has stronger heat conductivity for in mainboard CPU 4's heat can conduct to copper sheet 10 fast, the top of graphite alkene board 11 and the bottom laminating of heat conduction silicone grease 5, the top of diaphragm 1 is equipped with air-cooled subassembly 8, and the below of copper sheet 11 is equipped with radiator unit 9.

The fixed component 7 comprises a sleeve 701, a vertical rod 702, a pin shaft 703, a cover plate 704, a clamping groove 705 and a spring 706, the bottom of the sleeve 701 is fixedly connected with the top of the square plate 3, the inner wall of the sleeve 701 is in clearance fit with the vertical rod 702, the sleeve 701 plays a role in guiding the vertical rod 702, the bottom of the vertical rod 702 is fixedly connected with the bottom of the inner wall of the sleeve 701 through the spring 706, the spring 706 gives a downward pulling force to the vertical rod 702, the top of the vertical rod 702 positioned on the left side is rotationally connected with the cover plate 704 through the pin shaft 703, the pin shaft 703 enables the cover plate 704 to be rotated when stressed, the bottom of the cover plate 704 is attached to the top of the heat-conducting silicone grease 5, the right end of the cover plate 704 is connected with the.

The air cooling assembly 8 comprises a support plate 801, a round rod 802, a clamping plate 803 and a fan 804, the bottom of the support plate 801 is fixedly connected with the top of the transverse plate 1, the top of the support plate 801 positioned on the left side is rotatably connected with the clamping plate 803 through the round rod 802, the round rod 802 enables the clamping plate 803 to rotate when stressed, the bottom of the clamping plate 803 is fixedly connected with the fan 804, the fan 804 is used for blowing air to a main board CPU, and the right end of the clamping plate 803 is attached to the top of the support plate 801 positioned on the right side.

Radiating component 9 includes long board 901, pivot 902, ice pad 903 and bolt 904, the left end of long board 901 rotates with the inner wall left end below of through-hole 2 through pivot 902 and links to each other, pivot 902 makes long board 901 rotatable when atress, the top clearance fit of long board 901 has ice pad 903, ice pad 903 has extremely strong heat absorption performance, can cool down copper sheet 10 fast, the top of ice pad 903 is laminated with the bottom of copper sheet 10, ice pad 903 coincides mutually with graphite alkene board 11's axis, make ice pad 903 can absorb graphite alkene board 11 to the conductive heat of copper sheet 10 fast, the inner wall of long board 901 and the inner wall clearance fit of through-hole 2, long board 901 joint has bolt 904, bolt 904 plays limiting displacement to long board 901, bolt 904 links to each other with the bottom screw thread of diaphragm 1.

In this embodiment, when the motherboard CPU heat dissipation structure of the smart vending machine is used, the fan 804 is connected to an external power supply, so that the fan 804 rotates, and when the motherboard CPU4 works to generate heat, the heat of the motherboard CPU4 is quickly conducted into the graphene board 11 by the limitation of the cover plate 704 and the resilience of the spring 706, so that the motherboard CPU4 is tightly attached to the graphene board 11, the heat of the motherboard CPU4 is quickly conducted into the graphene board 11 by the action of the heat conductive silicone grease 5, the heat is conducted into the copper sheet 10 by the graphene board 11, the heat is quickly absorbed by the ice pad 903 by attaching the ice pad 903 to the copper sheet 10, so that the heat in the copper sheet 10 is quickly reduced, the copper sheet 10 is fixedly connected to the heat dissipation fins 6 by the copper sheet 10, the heat is conducted into the heat dissipation fins 6, the heat is quickly dissipated and diluted by the action of the heat dissipation fins 6, and the fan 804 rotates, can carry out the forced air cooling to fin 6 and mainboard CPU4 fast, and then through multiple cooling and to thermal dilution, improve the radiating efficiency, extend the device's life.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an intelligence vending machine mainboard CPU heat radiation structure, includes diaphragm (1), its characterized in that: the heat-conducting heat-radiating structure is characterized in that a through hole (2) is machined in the transverse plate (1), two square plates (3) are fixedly connected to the inner wall of the through hole (2), a main board CPU (4) is arranged at the top of each square plate (3), heat-conducting silicone grease (5) is coated on the outer wall of each main board CPU (4), the left side and the right side of the bottom of each heat-conducting silicone grease (5) are respectively clamped with the inner sides of the tops of the two square plates (3), a fixing component (7) is arranged above the main board CPU (4), two heat-radiating fins (6) are arranged at the top of the transverse plate (1), the inner side and the outer side of each heat-radiating fin (6) are respectively clamped with the tops of the square plates (3) and the transverse plate (1), the bottoms of the two heat-radiating fins (6) are fixedly connected together through a copper sheet (10), a graphene sheet (11) is fixedly connected to the top of the copper sheet (10), and the, the top of the transverse plate (1) is provided with an air cooling assembly (8), and a heat dissipation assembly (9) is arranged below the copper sheet (10).

2. The intelligent vending machine mainboard CPU heat dissipation structure of claim 1, characterized in that: the radiating fins (6) are distributed symmetrically with respect to the axis of the through hole (2).

3. The intelligent vending machine mainboard CPU heat dissipation structure of claim 1, characterized in that: fixed subassembly (7) include sleeve (701), montant (702), round pin axle (703), apron (704), draw-in groove (705) and spring (706), the bottom of sleeve (701) is in the same place with the top rigid coupling of square slab (3), the inner wall clearance fit of sleeve (701) has montant (702), the bottom of montant (702) and the inner wall bottom of sleeve (701) are passed through spring (706) and are fixed continuous, are located the left the top of montant (702) is passed through round pin axle (703) and is rotated with apron (704) and link to each other, the bottom of apron (704) is laminated with the top of heat conduction silicone grease (5) mutually, the right-hand member of apron (704) passes through draw-in groove (705) and is located montant (702) looks joint on right side.

4. The intelligent vending machine mainboard CPU heat dissipation structure of claim 1, characterized in that: the air cooling assembly (8) comprises a support plate (801), a round rod (802), a clamping plate (803) and a fan (804), the bottom of the support plate (801) is fixedly connected with the top of the transverse plate (1), the top of the support plate (801) positioned on the left side is rotatably connected with the clamping plate (803) through the round rod (802), the bottom of the clamping plate (803) is fixedly connected with the fan (804), and the right end of the clamping plate (803) is attached to the top of the support plate (801) positioned on the right side.

5. The intelligent vending machine mainboard CPU heat dissipation structure of claim 1, characterized in that: the heat dissipation assembly (9) comprises a long plate (901), a rotating shaft (902), an ice pad (903) and a bolt (904), wherein the left end of the long plate (901) is rotatably connected with the lower portion of the left end of the inner wall of the through hole (2) through the rotating shaft (902), the ice pad (903) is in clearance fit with the top of the long plate (901), the top of the ice pad (903) is attached to the bottom of the copper sheet (10), the inner wall of the long plate (901) is in clearance fit with the inner wall of the through hole (2), the bolt (904) is clamped at the right end of the long plate (901), and the bolt (904) is connected with the bottom of the transverse plate (1) in a threaded mode.

6. The intelligent vending machine mainboard CPU heat dissipation structure of claim 5, characterized in that: the ice pad (903) coincides with the axis of the graphene plate (11).