CN210093812U - Heat radiation module - Google Patents
Heat radiation module Download PDFInfo
- Publication number
- CN210093812U CN210093812U CN201920382147.XU CN201920382147U CN210093812U CN 210093812 U CN210093812 U CN 210093812U CN 201920382147 U CN201920382147 U CN 201920382147U CN 210093812 U CN210093812 U CN 210093812U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- radiating fin
- radiating
- substrate
- fin group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to the technical field of radiators, in particular to a radiating module, which comprises a substrate, a radiating tube group and a radiating fin group; the substrate is provided with a plurality of heat dissipation channels, and the inner walls of the heat dissipation channels are provided with a heat dissipation structure; one end of each heat dissipation pipe set is fixedly connected to the corresponding heat dissipation channel, and the other end of each heat dissipation pipe set extends out of the substrate; the radiating fin group sets up the cover and establishes on the other end that the base plate was kept away from to the radiating fin group, the utility model discloses a radiator structure obtains optimizing, has advantages such as easy dismounting, radiating efficiency are showing and improve.
Description
Technical Field
The utility model relates to a radiator technical field, concretely relates to heat dissipation module.
Background
The heat dissipation module may be coupled to the integrated circuit while in contact with the electronic devices typically included in the integrated circuit package to improve heat dissipation efficiency.
However, with the continuous improvement of integrated circuits, the performance of electronic devices is continuously improved, the power consumption of electronic devices is increasingly large, the surface heat flux density of electronic devices is rapidly increased, high requirements are also provided for cooling methods of electronic devices, generally people increase the heat dissipation efficiency by increasing the heat dissipation area, but the volume of a heat dissipation module is limited by the electronic devices, so that the external structure of the heat dissipation module is relatively single, and the installation and use efficiency of the heat dissipation module is affected.
Therefore, it is necessary to provide a technical means to solve the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's defect, provide heat dissipation module to there is the heat dissipation module volume among the solution prior art to be restricted by electron device, make heat dissipation module external construction comparatively single, thereby influence the problem of heat dissipation module's installation availability factor.
The utility model is realized in such a way that the heat radiation module comprises a substrate, a heat radiation pipe group and a heat radiation fin group;
the substrate is provided with a plurality of heat dissipation channels, and the inner walls of the heat dissipation channels are provided with a heat dissipation structure;
one end of each heat dissipation pipe set is fixedly connected to one corresponding heat dissipation channel, and the other end of each heat dissipation pipe set extends out of the substrate;
the radiating fin group is sleeved on the other end of the radiating pipe group extending out of the substrate.
Preferably, the heat dissipation fin group comprises a plurality of heat dissipation fins, and each heat dissipation fin is provided with a plurality of mounting holes; the radiating pipe group penetrates through the plurality of mounting holes and is fixedly connected to the radiating fin group.
Preferably, the plurality of mounting holes are provided with fixing rings protruding from the heat dissipation fins, and the fixing rings are sleeved on the surfaces of the heat dissipation tube sets so as to fixedly connect the heat dissipation tube sets to the heat dissipation fin sets.
Preferably, the heat dissipation structure is a plurality of grooves which are arranged along the heat dissipation channel and are distributed circumferentially.
Preferably, each of the set of heat dissipating fins is perpendicular to the set of heat dissipating pipes.
Preferably, each of the heat dissipation fins in the heat dissipation fin group is rectangular in cross-sectional area.
Preferably, the substrate is vertically provided with a positioning hole
The utility model discloses a heat dissipation module's technological effect does:
in the heat dissipation module of the present invention, the heat dissipation fin group is formed by a plurality of heat dissipation fins at equal intervals on one end of the heat dissipation fin group, and an air duct is formed between two adjacent heat dissipation fins, thereby improving the heat dissipation efficiency; moreover, the inner wall of the heat dissipation channel is provided with a heat dissipation structure which is a plurality of grooves distributed circumferentially along the heat dissipation channel, so that the heat dissipation capability of the device is enhanced, and the heat conduction speed of the heat dissipation pipe can be increased. The utility model discloses an optimized heat dissipation module structure, the setting of many places heat dissipation mechanism has strengthened the radiating effect of radiator, and reasonable size design has also effectively strengthened the application scope of radiator simultaneously.
Drawings
FIG. 1: the embodiment of the utility model relates to an overall structure schematic diagram of a heat radiation module;
FIG. 2: the embodiment of the utility model provides a partial structure schematic diagram of heat dissipation module that relates.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "fixedly attached" to another element, it can be fixedly attached by welding, bolting, gluing, or the like.
Referring to fig. 1 and fig. 2, in order to provide an embodiment of the present invention, the heat dissipation module in this embodiment is used for dissipating heat of an electronic device, the heat dissipation module in this embodiment includes a substrate 20, a heat dissipation tube group 30 and a heat dissipation fin group 10, and each component of the heat dissipation module is further described below:
a plurality of heat dissipation channels 23 are arranged on the substrate 20, and a heat dissipation structure is arranged on the inner wall of each heat dissipation channel 23;
one end of the heat dissipation tube set 30 is respectively and fixedly connected to the corresponding heat dissipation channel 23, and the other end of the heat dissipation tube set 30 extends out of the substrate 20 and is sleeved with the heat dissipation fin set 10, as follows:
the substrate 20 includes a lower substrate 22 and an upper substrate 21 mounted on top of the lower substrate 22; the bottom of the upper substrate 21 is provided with a plurality of first radiating grooves; the top of the lower substrate 22 is provided with a plurality of second heat dissipation grooves corresponding to the first heat dissipation grooves; the first heat dissipation groove and the second heat dissipation groove enclose a first heat dissipation channel 23101; the third heat sink is disposed between the two adjacent first heat sinks along the top of the upper substrate 21, and one end of the heat dissipation pipe set 30 is fixed to the first heat dissipation channel 23 and the second heat dissipation channel 23, so that the number of heat conduction pipes is increased by the multi-layer heat dissipation pipes, and the heat conduction efficiency is improved well under the condition of size limitation of the electronic device.
The radiating fin group 10 is sleeved on the other end of the radiating fin group 30 extending out of the substrate 20; accordingly, a certain distance exists between the heat dissipation fins and the substrate 20, so that the number of the required heat dissipation fins can be adjusted and assembled at will according to the size of the heat dissipation module and the actual situation.
Referring to fig. 1, as another embodiment of the present invention, a plurality of mounting holes 11 are formed on each of the heat dissipating fins in the heat dissipating fin set 10, and the heat dissipating tube set 30 passes through the plurality of mounting holes 11 and is fixedly connected to the heat dissipating fin set 10.
Referring to fig. 1, in order to improve the stability of the heat dissipation module, as another embodiment of the present invention, a fixing ring 12 protruding from the heat dissipation fins is disposed on the plurality of mounting holes 11, and the fixing ring 12 is disposed on the surface of the heat dissipation tube assembly 30 to fixedly connect the heat dissipation tube assembly 30 to the heat dissipation fin assembly 10.
Referring to fig. 1, in order to optimize the structure of the substrate 20, increase the heat dissipation area and improve the heat dissipation efficiency, as another embodiment of the present invention, the heat dissipation structure is a plurality of grooves 201 disposed along the heat dissipation channel 23 and distributed circumferentially.
Referring to fig. 1, in order to optimize the structure of the substrate 20, increase the heat dissipation area and improve the heat dissipation efficiency, as another embodiment of the present invention, each of the heat dissipation fins in the heat dissipation fin group 10 is perpendicular to the heat dissipation tube group 30, preferably, the heat dissipation fins are rectangular in cross-sectional area.
Referring to fig. 1, as another embodiment of the present invention, a positioning hole is vertically formed on a substrate 20.
To sum up, the utility model discloses an evenly install cooling fin group 10 in the one end of cooling tube group 30 to there is certain distance between cooling fin group 10 and the base plate 20, can make up to the electron device of different power, reasonable increase and/or reduce cooling fin and/or heat pipe, moreover, the base plate adopts aluminium as the material in this embodiment, and the surface of this base plate through sandblast anodic oxidation, has advantages such as corrosion resistance height, durable, the utility model discloses a radiator structure obtains optimizing, easy dismounting, radiating efficiency are showing and are improving.
The above is merely a preferred embodiment of the present invention, and the structure is not limited to the above-mentioned shapes, and any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (7)
1. The heat dissipation module is characterized in that: the radiating fin group comprises a substrate, a radiating pipe group and a radiating fin group;
the substrate is provided with a plurality of heat dissipation channels, and the inner walls of the heat dissipation channels are provided with a heat dissipation structure;
one end of each heat dissipation pipe set is fixedly connected in the corresponding heat dissipation channel, and the other end of each heat dissipation pipe set extends out of the substrate;
the radiating fin group is sleeved on the other end of the radiating pipe group extending out of the substrate.
2. The heat dissipation module of claim 1, wherein the set of heat dissipation fins includes a plurality of heat dissipation fins, each of the heat dissipation fins having a plurality of mounting holes; the radiating pipe group penetrates through the plurality of mounting holes and is fixedly connected to the radiating fin group.
3. The heat dissipation module of claim 2, wherein: the plurality of mounting holes are provided with fixing rings protruding out of the heat dissipation fins; the fixing ring is sleeved on the surface of the radiating pipe group so as to fixedly connect the radiating pipe group to the radiating fin group.
4. The heat dissipation module of claim 1, 2 or 3, wherein: the heat dissipation structure is a plurality of grooves which are arranged along the heat dissipation channel and are distributed circumferentially.
5. The heat dissipation module of claim 4, wherein: each radiating fin in the radiating fin group is perpendicular to the radiating fin group.
6. The heat dissipation module of claim 5, wherein: each radiating fin in the radiating fin group is rectangular in cross-sectional area.
7. The heat dissipation module of claim 5, wherein: the base plate is vertically provided with a positioning hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920382147.XU CN210093812U (en) | 2019-03-25 | 2019-03-25 | Heat radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920382147.XU CN210093812U (en) | 2019-03-25 | 2019-03-25 | Heat radiation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210093812U true CN210093812U (en) | 2020-02-18 |
Family
ID=69472432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920382147.XU Expired - Fee Related CN210093812U (en) | 2019-03-25 | 2019-03-25 | Heat radiation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210093812U (en) |
-
2019
- 2019-03-25 CN CN201920382147.XU patent/CN210093812U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200218 Termination date: 20210325 |