CN219248401U

CN219248401U - Combined radiator structure

Info

Publication number: CN219248401U
Application number: CN202223022333.3U
Authority: CN
Inventors: 林源憶; 张富贵
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2022-11-11
Filing date: 2022-11-11
Publication date: 2023-06-23
Anticipated expiration: 2032-11-11

Abstract

The utility model relates to a combined radiator structure, which comprises a carrier, at least one heat source is contacted with the carrier, at least one high-temperature area is formed at the position where the carrier is contacted with the heat source, and a non-high-temperature area is formed at the position where the carrier is not contacted with or far from the heat source, wherein the non-high-temperature area and the high-temperature area are respectively provided with a first fin group with a mounting height and a second fin group with a mounting height higher than the first fin group, the second fin group is provided with a first part, the first part is higher than the mounting height of the first fin group, the top end of the first part is outwards extended and extended to form a second part which covers the first fin but is not contacted with the first fin group, and a spacing flow passage is defined between the first fin group and the second part of the second fin group, so that the high-temperature area of the carrier can obtain larger and more heat dissipation area by virtue of the upper space of the high-temperature area, and heat dissipation area is further rapid.

Description

Combined radiator structure

Technical Field

The utility model relates to the field of radiators, in particular to a combined radiator structure for improving the heat transfer area of a high-temperature area of a carrier.

Background

Generally, a heat sink is a heat sink component that contacts a surface of a heat generating component and then increases a heat dissipation area after heat conduction, and heat exchange is generated after a plurality of heat dissipation fins contact air, so that heat is diffused outwards in a heat radiation manner to achieve heat dissipation.

The existing radiator is divided into a radiator with aluminum extruded fins or buckling fins or heat pipe fins or upper and lower stacked fins, when one radiator contacts a heat source, the radiator directly contacts the heat source surface (such as a central processing unit or a graphic processing chip) by a local area of the bottom surface, for example, a radiator with 10 cm x 10 cm contacts a heat source with 3 cm x3 cm, the radiator only contacts the heat source surface by a contact area with 3 cm x3 cm, and the rest area of the radiator is far away from and not contacted with the heat source. The heat of the heat source is mainly transferred and radiated outwards through a contact area of 3 cm x3 cm of the radiator, so that the temperature of the contact area is higher than that of other areas to form a high-temperature area, and the heat of the radiator which is not contacted with or far from the other areas of the heat source is transferred and reduced along with the increase of the heat diffusion distance to form a non-high-temperature area. However, the heat transfer area of the contact area of the radiator is insufficient and only a small amount of bearable heat quantity can be transferred due to the fact that the contact area of the radiator is only 3 cm x3 cm, so that the heat dissipation effect is poor; however, the heat source can generate a large amount of heat rapidly when in operation, and the large amount of heat cannot be transferred out and is continuously accumulated in the high temperature area, so that the heat accumulation and heat accumulation problems are generated in the high temperature area.

Therefore, how to solve the problem of insufficient heat transfer area in the high temperature region and to help the high temperature region to dissipate heat rapidly, i.e. how to research and improve the heat accumulation in the high temperature region is needed by the inventor and the related manufacturers in the industry.

Disclosure of Invention

In order to solve the above problems, the present utility model is directed to a combined radiator structure, which can make the high temperature area of the radiator obtain larger and more heat dissipation area by the upper space of the high temperature area so as to rapidly dissipate heat, thereby solving the high Wen Ouju heat and accumulated heat problems.

In order to achieve the above object, the present utility model provides a combined heat sink structure, comprising:

the carrier is contacted with at least one heat source, at least one high temperature area is formed at the position contacted with the at least one heat source, a non-high temperature area is formed at the position which is not contacted with or far from the heat source, a first fin group with a erection height and a second fin group higher than the erection height of the first fin group are respectively arranged at the non-high temperature area and the high temperature area, each second fin group comprises a plurality of second fins, a first part of each second fin is provided with a bottom end and a top end, the bottom end is combined with or integrally formed on the high temperature area of the carrier, the top end is higher than the erection height of the first fin group and extends outwards for a second part, and the second part covers and does not contact with the first fin group, so that a separation flow channel is defined between the first fin group and the second part of the second fin group, and the second part of the second fin group extends outwards from the top end higher than the erection height of the first fin group is formed, so that the high temperature area of the carrier can obtain more heat dissipation area above the carrier by the high temperature area.

The combined radiator structure comprises: the first fin group comprises a plurality of first fins, each first fin is provided with a lower end and an upper end, the lower ends are combined or integrally formed on a non-high temperature area of the carrier, the upper ends are positioned above the first fins, and the erection height is defined between the lower ends and the upper ends.

The combined radiator structure comprises: the second portion of each second fin of the second set of fins is a horizontal or diagonal outwardly extending extension.

The combined radiator structure comprises: comprises a plurality of high temperature areas and a plurality of second fin groups, wherein each high temperature area is provided with a second fin group, and the heights of the second fin groups are the same or different.

The combined radiator structure comprises: the second parts of the first fin group and the second fin group are respectively provided with a first air flow and a second air flow which pass through, and the flow rates of the first air flow and the second air flow are the same or different.

The combined radiator structure comprises: the spacing distance of the plurality of first fins is the same as or different from the spacing distance of the plurality of second fins.

The combined radiator structure comprises: the first fin group forms at least one hollowed-out part at a position avoiding the at least one high-temperature area, and the second fin group is positioned at the hollowed-out part.

The second fin group is provided with the second part which extends outwards from the top end of the first part higher than the erection height of the first fin group, so that the high temperature area of the carrier can obtain larger and more heat dissipation area by the upper space of the high temperature area.

Drawings

FIG. 1 is an exploded view of the present utility model;

FIG. 2 is a schematic diagram of the combination of the present utility model;

FIG. 3 is a combined front view of the present utility model;

fig. 4A-4C are schematic views of a plurality of second fin sets according to the present utility model.

Reference numerals illustrate: a carrier 11; a non-high temperature zone 1111; a high temperature zone 1112; a first fin group 13; a first fin 131; a lower end 132; an upper end 133; a hollowed-out portion 135; erecting a height h; a heat source 14; a second fin group 15; a second fin 151; a first portion 152; a bottom end 1521; a top end 1522; a second portion 153; a spacing runner 16; a first gas flow F1; and a second air flow F2.

Detailed Description

The above objects of the present utility model, as well as the structural and functional characteristics thereof, will be described in terms of the preferred embodiments of the present utility model as illustrated in the accompanying drawings.

First, the carrier 11 in the present utility model is a heat conductive plate body such as a flat heat pipe, a temperature equalizing plate, a copper or copper alloy plate, a titanium or titanium alloy plate, or a metal composite plate.

Please refer to fig. 1, which is an exploded view of the present utility model; FIG. 2 is a schematic diagram of the combination of the present utility model; fig. 3 is a combined front view of the present utility model. As shown in these drawings, the combined heat sink structure of the present utility model comprises: a partial surface of a carrier 11 is in direct contact with at least one heat source 14 and forms a high temperature zone 1112, and a non-high temperature zone 1111 is defined around the high temperature zone 1112 in areas not in contact with or remote from the heat source 14. The non-high temperature zone 1111 is adjacent to the high temperature zone 1112, and because the high temperature zone 1112 is in contact with the heat source 14 and the non-high temperature zone 1111 is remote or not in contact with the heat source 14, the temperature of the high temperature zone 1112 is higher than the temperature of the non-high temperature zone 1111. The non-high temperature region 1111 and the high temperature region 1112 are respectively provided with a first fin set 13 having an installation height h and a second fin set 15 higher than the installation height h of the first fin set 13.

The first fin set 13 transfers heat from the non-high temperature region 1111 to the outside for heat exchange, and is composed of a plurality of first fins 131 arranged at intervals. The first fins 131 of the first fin set 13 each have a lower end 132 and an upper end 133, wherein the lower end 132 is combined or integrally formed on the non-high temperature region 1111 of the carrier 11, the upper end 133 is located above the fins, and the mounting height h is defined between the lower end 132 and the upper end 133.

The second fin group 15 is disposed in the high temperature region 1112 and is composed of a plurality of second fins 151 arranged at intervals. Each of the second fins 151 of the second fin set 15 has a first portion 152, and the first portion 152 has a bottom end 1521 and a top end 1522. The bottom end 1521 of the first portion 152 is bonded or integrally formed to the high temperature region 1112 of the carrier 11. The top 1522 of the first portion 152 is higher than the mounting height h of the first fin set 13 and extends outwardly (horizontally or diagonally) with a second portion 153. The second portion 153 is located above the first fin set 13 and covers but does not contact the first fin set 13 such that a spacer channel 16 is defined between the first fin set 13 and the second portion 153 of the second fin set 15.

In the present embodiment, the second portion 153 extends along at least one horizontal direction X, and two sides of the second portion 153 extend towards two opposite horizontal directions X (i.e. the left and right directions of the carrier 11 in the drawing), so that the first portion 152 and the second portion 153 together form a T-shaped body standing in the high temperature region 1112 of the carrier 11. But is not limited thereto, and in other alternative embodiments the second portion 153 may extend in at least one oblique direction.

In this embodiment, the second fin set 15 forms the second portion 153 extending from the top end 1522 of the first portion 152 higher than the mounting height h of the first fin set 13, so that the high temperature area 1112 can obtain a larger and more heat dissipation area by the space above the second portion, thereby improving the heat dissipation capacity and heat dissipation speed of the high temperature area 1112.

Referring back to fig. 1, the first fin set 13 forms a hollow portion 135 at a position avoiding (bypassing) the high temperature region 1112, so that the second fin set 15 is distributed in the hollow portion 135 and disposed in the high temperature region 1112, so that the present utility model forms a compact combined heat sink structure without ineffective space.

Optionally, one side of the second portion 153 of the first fin set 13 and the second fin set 15 is respectively abutted with a fan (not shown), and the two fans attract a first air flow F1 and a second air flow F2 to respectively pass through the second portion 153 of the first fin set 13 and the second fin set 15 (as shown in fig. 3). The flow rates or velocities of the first air flow F1 and the second air flow F2 are the same or different. In a preferred embodiment, the second air flow F2 has a greater flow rate or velocity than the first air flow F1 to help the second fin set 15 located in the high temperature region 1112 dissipate heat, and also to make the heat conduction velocity of the second fin set 15 higher than that of the first fin set 13. Furthermore, a portion of the second air flow F2 may take away heat from the first fin set 13 through the separation channel 16.

The first fin set 13 and the second fin set 15 may be integrally formed with the carrier 11 or may be combined as separate components. For example, the drawing shows that the first fins 131 of the first fin set 13 and the second fins 151 of the second fin set 15 are fastening fins, and are then combined with each other in the non-high temperature region 1111 and the high temperature region 1112 of the carrier 11 by a connecting structure (such as welding or gluing). In an alternative embodiment, the first fins 131 of the first fin set 13 and the second fins 151 of the second fin set 15 are selected as non-fastening fins, and are respectively combined in the non-high temperature region 1111 and the high temperature region 1112 by a connecting structure (such as welding, gluing, plugging, etc.); or the first fin set 13 and the second fin set 15 are integrally formed (such as injection molding or 3D printing) with the carrier 11, for example, the first fins 131 and the second fins 151 respectively protrude upward from the non-high temperature region 1111 and the high temperature region 1112 of the carrier 11.

The spacing distance between the first fins 131 and the spacing distance between the second fins 151 may be the same or different, and a small spacing distance means a large spacing density. In a preferred embodiment, the spacing distance of the second fins 151 is smaller than the spacing distance of the first fins 131, i.e., the spacing density of the second fins 151 is greater than the spacing density of the first fins 131. So that the second fin set 15 provides more heat dissipation area with more second fins 151 to help the high temperature region 1112 with higher temperature dissipate heat, and the heat conduction of the second fin set 15 is higher than that of the first fin set 13

Please refer to fig. 4A-4C, which are schematic diagrams of the second fin sets of the present utility model. Although the carrier 11 is disclosed as defining a non-high temperature region 1111 and a high temperature region 1112 (shown in fig. 1), it is not limited thereto. As shown in fig. 4A, the carrier 11 defines two high temperature regions 1112 where two heat sources 14 are contacted, in addition to defining the non-high temperature region 1111 as described above for the first fin set 13. The first fin set 13 avoids the two high temperature regions 1112 to form two hollowed-out portions 135 corresponding to the high temperature regions 1112. Two second fin groups 15 are respectively disposed on the two high temperature regions 1112, and second portions 153 of the two second fin groups 15 are respectively extended toward two opposite horizontal directions X of the carrier 11. In these figures, the horizontal portion 153 of one second fin group 15 extends in a direction toward the left of the carrier 11, and the horizontal portion 153 of the other second fin group 15 extends in a direction toward the right of the carrier 11. Thus, the first portion 152 and the second portion 153 of the two second fin sets 15 of the present embodiment together form, for example, an L-shape. In other variations, the heights of the two second fin groups 15 may be selected to be the same (as shown in fig. 4B) or different (as shown in fig. 4C) depending on the installation environment.

The above description is illustrative of the utility model and is not to be construed as limiting, and it will be understood by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the utility model as defined in the appended claims.

Claims

1. A modular heat sink structure comprising:

the carrier is contacted with at least one heat source, at least one high-temperature area is formed at the position which is contacted with the at least one heat source, a non-high-temperature area is formed at the position which is not contacted with or far from the heat source, a first fin group with a erection height and a second fin group higher than the erection height of the first fin group are respectively arranged at the non-high-temperature area and the high-temperature area, each second fin group comprises a plurality of second fins, each second fin is provided with a first part with a bottom end and a top end, the bottom end is combined with or integrally formed on the high-temperature area of the carrier, the top end is higher than the erection height of the first fin group and extends outwards for a second part, and the second part covers and does not contact with the first fin group, so that a spacing flow channel is defined between the first fin group and the second part of the second fin group, and the second part of the second fin group extends outwards from the top end higher than the erection height of the first fin group is formed.

2. The combination heat sink structure of claim 1, wherein: the first fin group comprises a plurality of first fins, each first fin is provided with a lower end and an upper end, the lower ends are combined or integrally formed on a non-high temperature area of the carrier, the upper ends are positioned above the first fins, and the erection height is defined between the lower ends and the upper ends.

3. The combination heat sink structure of claim 1, wherein: the second portion of each second fin of the second set of fins is a horizontal or diagonal outwardly extending extension.

4. The combination heat sink structure of claim 1, wherein: comprises a plurality of high temperature areas and a plurality of second fin groups, wherein each high temperature area is provided with a second fin group, and the heights of the second fin groups are the same or different.

5. The combination heat sink structure of claim 2, wherein: the spacing distance of the plurality of first fins is the same as or different from the spacing distance of the plurality of second fins.

6. The combination heat sink structure of claim 1, wherein: the first fin group forms at least one hollowed-out part at a position avoiding the at least one high-temperature area, and the second fin group is positioned at the hollowed-out part.