CN210039484U

CN210039484U - Built-in IC nixie tube packaging device

Info

Publication number: CN210039484U
Application number: CN201920780748.6U
Authority: CN
Inventors: 陆壮树; 张洪亮
Original assignee: Shenzhen Bright Au Optronics Co
Current assignee: Shenzhen Bright Au Optronics Co
Priority date: 2019-05-28
Filing date: 2019-05-28
Publication date: 2020-02-07
Anticipated expiration: 2029-05-28

Abstract

The utility model discloses a built-in IC charactron encapsulates device, including aluminum alloy casing and built-in IC charactron body, aluminum alloy casing's inboard is provided with spacing spring, and the top of spacing spring is connected with the clamp splice, the upper surface of clamp splice is connected with the spacing groove, the equal adhesion in both ends is connected with heat dissipation mechanism around the built-in IC charactron body, and the built-in IC charactron body is located the inboard of clamp splice, the inside pin that is provided with in bottom of built-in IC charactron body, and the below of built-in IC charactron body installs the bottom, the inboard surface mounting of bottom has protection machanism, and the equal adhesion in both ends inboard surface is connected with the glue film about the bottom. Compared with the existing common IC nixie tube packaging device, the built-in IC nixie tube packaging device can transfer heat generated inside the device to the outside, maintain the relative stability of the temperature inside the device, and also can fix the inside of the device at multiple positions, so that the built-in IC nixie tube inside the device can be kept stable.

Description

Built-in IC nixie tube packaging device

Technical Field

The utility model relates to a IC charactron encapsulates device technical field, specifically is a built-in IC charactron encapsulates device.

Background

The IC nixie tube is an electronic component combined based on the light-emitting diode, and the IC nixie tube packaging device is a semiconductor component which can package and protect the IC nixie tube so as to be convenient for the use of the IC nixie tube.

The heat that current IC charactron encapsulates the device in the use, can not be with the inside production of this device is transferred to the external world, leads to this device when using, the phenomenon that the high temperature appears easily to shorten the inside IC charactron's of this device life, can not be fine satisfies people's user demand, to above-mentioned condition, carries out technical innovation on current IC charactron encapsulation device basis.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a built-in IC charactron encapsulates device to propose general encapsulation device in solving above-mentioned background art in the use, can not lead to this device when using, the phenomenon of high temperature appears easily with the heat transfer of the inside production of this device, thereby shortened the life of the inside IC charactron of this device, the user demand problem of satisfying people that can not be fine.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a built-in IC charactron encapsulates device, includes aluminum alloy casing and built-in IC charactron body, aluminum alloy casing's inboard is provided with spacing spring, and the top of spacing spring is connected with the clamp splice, the upper surface of clamp splice is connected with the spacing groove, the equal adhesion in both ends is connected with heat dissipation mechanism around the built-in IC charactron body, and built-in IC charactron body is located the inboard of clamp splice, the inside pin that is provided with in bottom of built-in IC charactron body, and the bottom is installed to the below of built-in IC charactron body, the inboard surface mounting of bottom has protection mechanism, and the equal adhesion in both ends inboard surface is connected with the glue film about the bottom.

Preferably, the heat dissipation mechanism includes fixing screw, thermovent and heat dissipation silica gel, and the inside fixing screw that is provided with in both ends edge about heat dissipation silica gel, the thermovent is located inside both ends around the aluminum alloy housing.

Preferably, constitute penetrating structure between thermovent and the heat dissipation silica gel, and the thermovent sets up to "V" style of calligraphy structure of falling to the surface of heat dissipation silica gel is laminated with the inside surface edge of thermovent mutually.

Preferably, the protection mechanism comprises a limiting block, a jack and a rubber block, the jack is arranged inside the limiting block, and the rubber block is fixed inside the jack.

Preferably, the upper surface of the limiting block is attached to the bottom end surface of the clamping block, the limiting block is matched with the pins through the insertion holes and the rubber blocks to form an integrated structure, and the insertion holes penetrate through the limiting block and the bottom cover respectively.

Preferably, the upper surface structure of the clamping block is matched with the inner surface structure of the limiting groove, and the clamping block and the limiting groove form a sliding structure through the mutual matching of the limiting springs.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model can radiate the heat generated in the working process inside the device by arranging the fixing screw, the heat dissipation port and the heat dissipation silica gel, so as to maintain the relative stability of the internal temperature of the device, thereby being convenient for the built-in IC digital tube body inside the device to use, and the structure arrangement of the heat dissipation port can increase the contact area between the heat dissipation silica gel and the outside air, thereby being beneficial to the heat dissipation;

2. the utility model can protect the pin inside the device through the arrangement of the limiting block, the jack and the rubber block, prevent the pin from breaking or bending at the edge of the jack, and also avoid the pin from directly contacting with the jack to cause abrasion to the pin, thereby influencing the normal work of the device;

3. the utility model discloses a setting of stopper, clamp splice, jack and rubber block also can be fixed the clamp splice through the stopper simultaneously for the clamp splice is carrying out the in-process of centre gripping to built-in IC digital pipe body and is keeping stable, avoids it to appear removing or rocking, influences the stability and the use of built-in IC digital pipe body.

Drawings

FIG. 1 is a schematic view of the internal structure of the aluminum alloy shell of the present invention;

FIG. 2 is a schematic view of a front view half-section structure of the present invention;

fig. 3 is a schematic view of the bottom view of the present invention.

In the figure: 1. an aluminum alloy housing; 2. a limiting spring; 3. a clamping block; 4. an IC nixie tube body is arranged in the shell; 5. A pin; 6. a heat dissipation mechanism; 601. fixing the screw rod; 602. a heat dissipation port; 603. radiating silica gel; 7. a glue layer; 8. a bottom cover; 9. a limiting groove; 10. a protection mechanism; 1001. a limiting block; 1002. a jack; 1003. A rubber block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a built-in IC nixie tube packaging device comprises an aluminum alloy shell 1 and a built-in IC nixie tube body 4, wherein a limiting spring 2 is arranged on the inner side of the aluminum alloy shell 1, the top end of the limiting spring 2 is connected with a clamping block 3, the upper surface of the clamping block 3 is connected with a limiting groove 9, the upper surface structure of the clamping block 3 is matched with the inner surface structure of the limiting groove 9, and the clamping block 3 and the limiting groove 9 form a sliding structure through mutual matching of the limiting springs 2, so that built-in IC nixie tube bodies 4 with different sizes in the device can be clamped and fixed, the convenience of the device in the use process is improved, and meanwhile, the clamping block 3 can be limited, so that the device can be balanced and moved in the clamping process, the shaking or the inclination of the device is prevented, and the stability of clamping and fixing of the built-in IC nixi;

the front end and the rear end of the built-in IC nixie tube body 4 are both connected with a heat dissipation mechanism 6 in an adhesion manner, the built-in IC nixie tube body 4 is positioned at the inner side of the clamping block 3, the heat dissipation mechanism 6 comprises a fixing screw 601, a heat dissipation port 602 and heat dissipation silica gel 603, the fixing screw 601 is arranged at the inner part of the left end edge and the right end edge of the heat dissipation silica gel 603, the heat dissipation port 602 is positioned at the inner part of the front end and the rear end of the aluminum alloy shell 1, a through structure is formed between the heat dissipation port 602 and the heat dissipation silica gel 603, the heat dissipation port 602 is arranged in an inverted V-shaped structure, the outer surface of the heat dissipation silica gel 603 is attached to the inner side surface edge of the heat dissipation port 602, heat generated in the internal working process of the device can be dissipated, the relative stability of the internal temperature of the device is maintained, the, thereby facilitating the heat dissipation;

the pin 5 is arranged in the bottom end of the built-in IC nixie tube body 4, the bottom cover 8 is arranged below the built-in IC nixie tube body 4, the protection mechanism 10 is arranged on the inner side surface of the bottom cover 8, the inner side surfaces of the left end and the right end of the bottom cover 8 are connected with the glue layers 7 in an adhesion mode, the protection mechanism 10 comprises a limiting block 1001, a jack 1002 and a rubber block 1003, the jack 1002 is arranged in the limiting block 1001, the rubber block 1003 is fixed in the jack 1002, the upper surface of the limiting block 1001 is attached to the bottom end surface of the clamping block 3, the limiting block and the pin 5 form an integrated structure through mutual matching between the jack 1002 and the rubber block 1003, the jack 1002 penetrates through the limiting block 1001 and the bottom cover 8 respectively, the pin 5 in the device can be protected, the phenomenon that the pin 5 is broken or bent at the edge of the jack 1002 can be prevented, and lead to the fact wearing and tearing to pin 5 to influence its normal work, also can fix clamp splice 3 through stopper 1001 simultaneously, make clamp splice 3 carry out the in-process of centre gripping to built-in IC charactron body 4 and keep stable, avoid it to appear removing or rocking, influence the stability and the use of built-in IC charactron body 4.

The working principle is as follows: when the built-in IC nixie tube packaging device is used, firstly, one end of a built-in IC nixie tube body 4 is placed in a clamping block 3 on one side, then the clamping block 3 connected with the built-in IC nixie tube body 4 is pressed through the built-in IC nixie tube body 4 to enable the clamping block 3 to pass through the structural arrangement between the clamping block and an upper surface limiting groove 9, balanced movement is carried out on the inner side of the limiting groove 9, further, a limiting spring 2 on the outer side of the clamping block 3 is compressed, then the other end of the built-in IC nixie tube body 4 is placed in a clamping block 3 on the other side, so that the limiting spring 2 on the outer side of the clamping block 3 rebounds to clamp and fix the built-in IC nixie tube body 4, then, jacks 1002 on the surface of a limiting block 1001 connected with a bottom cover 8 correspond to pins 5 on the surface of the built-in IC nixie tube, thereby making them integral;

and the limiting block 1001 on the inner side surface of the bottom cover 8 presses the bottom end of the clamping block 3 upwards to fix the clamping block 3 through the mutual matching between the limiting block and the limiting groove 9 on the upper surface of the clamping block 3, so as to maintain the stability of the clamping block 3 in the using process, avoid the phenomenon of shaking left and right to influence the clamping and fixing of the built-in IC digital tube body 4 and further influence the use of the device, in the using process of the device, the heat dissipation silica gel 603 on the outer surfaces of the front end and the back end of the built-in IC nixie tube body 4 is connected with the built-in IC nixie tube body 4 through adhesion, so that the heat on the surface of the built-in IC nixie tube body 4 is transmitted to the heat dissipation silica gel 603, and then the heat dissipation silica gel 603 transmits the heat to the outside through the heat dissipation opening 602 on the surface of the aluminum alloy shell 1, therefore, the effect of radiating the interior of the device is achieved, and the working principle of the built-in IC nixie tube packaging device is the working principle.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a built-in IC charactron encapsulates device, includes aluminum alloy casing (1) and built-in IC charactron body (4), its characterized in that: the aluminum alloy housing's (1) inboard is provided with spacing spring (2), and the top of spacing spring (2) is connected with clamp splice (3), the upper surface of clamp splice (3) is connected with spacing groove (9), the equal adhesion in both ends is connected with heat dissipation mechanism (6) around built-in IC charactron body (4), and built-in IC charactron body (4) are located the inboard of clamp splice (3), the inside pin (5) that is provided with in bottom of built-in IC charactron body (4), and bottom (8) are installed to the below of built-in IC charactron body (4), the inboard surface mounting of bottom (8) has protection machanism (10), and bottom (8) about both ends inboard surface adhesion all is connected with glue film (7).

2. The IC-embedded nixie tube package device according to claim 1, wherein: the heat dissipation mechanism (6) comprises a fixing screw rod (601), a heat dissipation opening (602) and heat dissipation silica gel (603), the fixing screw rod (601) is arranged inside the edges of the left end and the right end of the heat dissipation silica gel (603), and the heat dissipation opening (602) is arranged inside the front end and the rear end of the aluminum alloy shell (1).

3. The IC-embedded nixie tube package device according to claim 2, wherein: constitute penetrating structure between thermovent (602) and heat dissipation silica gel (603), and thermovent (602) sets up to "V" style of calligraphy structure of falling to the surface of heat dissipation silica gel (603) is laminated mutually with the inside surface edge of thermovent (602).

4. The IC-embedded nixie tube package device according to claim 1, wherein: the protection mechanism (10) comprises a limiting block (1001), a jack (1002) and a rubber block (1003), the jack (1002) is arranged inside the limiting block (1001), and the rubber block (1003) is fixed inside the jack (1002).

5. The IC-embedded nixie tube package device according to claim 4, wherein: the upper surface of stopper (1001) is laminated with the bottom surface of clamp splice (3) mutually, and stopper (1001) through jack (1002) and rubber block (1003) between mutually support and constitute the integral structure between pin (5) to jack (1002) run through respectively in the inside of stopper (1001), bottom (8).

6. The IC-embedded nixie tube package device according to claim 1, wherein: the upper surface structure of the clamping block (3) is matched with the inner surface structure of the limiting groove (9), and the clamping block (3) is matched with the limiting groove (9) through the limiting springs (2) to form a sliding structure.