CN210018788U - Refrigerating and heating device - Google Patents

Abstract

The utility model relates to a small-size semiconductor refrigerating and heating device. It includes casing, semiconductor refrigeration component, radiator fan, circuit control device, heat-conducting plate, the casing includes upper cover, lower cover and establishes the netted guard ring between upper cover and lower cover, fretwork in the middle of the radiator, semiconductor refrigeration component establish in radiator fretwork department, and radiator fan establishes in the radiator below, and the lower cover is equipped with the louvre, the heat-conducting plate is established on the upper cover surface, is equipped with supplementary electric heating pipe around the heat-conducting plate bottom surface. The utility model has the advantages of simple and reasonable design, through circuit control device control semiconductor change between refrigeration and heating, when needs higher temperature, can start the auxiliary heating, this device heat dissipation is good, and the appearance transform is many, and power is low, durable.

Description

Refrigerating and heating device

Technical Field

The utility model relates to a small-size semiconductor refrigerating and heating device.

Background

Small containers such as juice cups, tea cups, wine cups and the like need to be kept at a certain temperature sometimes, and need to be kept at a temperature lower than normal temperature or higher than normal temperature, so that the small household appliances do not have the function at present.

Disclosure of Invention

Therefore, an object of the present invention is to provide a small refrigerating and heating apparatus capable of refrigerating or heating.

The purpose of the utility model is realized like this.

A refrigeration heating device comprises a shell, a semiconductor refrigeration element, a radiator, a heat radiation fan, a circuit control device and a heat conduction plate, and is characterized in that: the casing includes upper cover, lower cover and establishes the netted guard ring between upper cover and lower cover, fretwork in the middle of the radiator, semiconductor refrigeration component establish in radiator fretwork department, and radiator fan establishes in the radiator below, and the lower cover is equipped with the louvre, the heat-conducting plate is established on the upper cover surface, is equipped with supplementary electric heating pipe around the heat-conducting plate bottom surface.

The technical scheme can be further perfected as follows.

And a heat insulation plate is arranged between the radiator and the auxiliary electric heating pipe, and a through hole is formed in the middle of the heat insulation plate, so that the semiconductor refrigeration element upwards penetrates through the through hole to contact the heat conduction plate.

The utility model has the advantages of simple and reasonable design, through circuit control device control semiconductor change between refrigeration and heating, when needs higher temperature, can start the auxiliary heating, this device heat dissipation is good, and the appearance transform is many, and power is low, durable.

Drawings

FIG. 1 is an outline view of the embodiment.

FIG. 2 is a schematic structural diagram of the embodiment.

Fig. 3 is an exploded view of the embodiment.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings and examples.

The embodiment is combined with the accompanying drawings, and a refrigeration and heating device comprises a shell 1, a semiconductor refrigeration element 2, a radiator 3, a radiating fan 4, a circuit control device 5 and a heat conduction plate 6, wherein the shell 1 comprises an upper cover 10, a lower cover 11 and a net-shaped protective ring 12 arranged between the upper cover and the lower cover, the middle of the radiator 3 is hollowed out, the semiconductor refrigeration element 2 is arranged at the hollowed part of the radiator, the radiating fan 4 is arranged below the radiator 3, the lower cover 11 is provided with a radiating hole 13, the heat conduction plate 6 is arranged on the surface of the upper cover 10, and an auxiliary electric heating pipe 7 is arranged around the bottom surface of the heat conduction plate 6. A heat insulation plate 8 is arranged between the radiator 3 and the auxiliary electric heating pipe 7, and a through hole 9 is arranged in the middle of the heat insulation plate 8, so that the semiconductor refrigerating element 2 upwards passes through the through hole 9 and contacts the heat conduction plate 6. The circuit control device 5 controls the semiconductor cooling element to switch between cooling and heating, which belongs to the prior art, and the embodiment will not be described in detail.

Claims (2)

1. A refrigeration heating device comprises a shell, a semiconductor refrigeration element, a radiator, a heat radiation fan, a circuit control device and a heat conduction plate, and is characterized in that: the casing includes upper cover, lower cover and establishes the netted guard ring between upper cover and lower cover, fretwork in the middle of the radiator, semiconductor refrigeration component establish in radiator fretwork department, and radiator fan establishes in the radiator below, and the lower cover is equipped with the louvre, the heat-conducting plate is established on the upper cover surface, is equipped with supplementary electric heating pipe around the heat-conducting plate bottom surface.

2. The refrigerating and heating apparatus according to claim 1, wherein: and a heat insulation plate is arranged between the radiator and the auxiliary electric heating pipe, and a through hole is formed in the middle of the heat insulation plate, so that the semiconductor refrigeration element upwards penetrates through the through hole to contact the heat conduction plate.

Images