CN212157854U

CN212157854U - Liquid heating, radiating and refrigerating device

Info

Publication number: CN212157854U
Application number: CN202020831748.7U
Authority: CN
Inventors: 赵子龙
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-05-19
Filing date: 2020-05-19
Publication date: 2020-12-15
Anticipated expiration: 2030-05-19

Abstract

The utility model discloses a liquid heating heat dissipation refrigerating plant. This liquid heating heat dissipation refrigerating plant includes: the heating pipe, the heat pipe, sensor tubulose metal waterproof case, the organism inferior valve, the heat pipe installation piece, the fin, the fan, the organism mesochite, the organism upper cover, the function upper key, the circuit board, the semiconductor refrigeration piece, the function lower key, the function button, a weighing sensor and a temperature sensor, sealed plug, the heating pipe support, room temperature detection sensor, this liquid heating heat dissipation refrigerating plant simple structure, high durability and convenient use, the problem that liquid needs the heating in the container has effectively been solved, the slow problem of high temperature liquid natural heat dissipation in the container and the refrigerated problem of liquid needs in the container, the time has effectively been saved, and the work efficiency is improved.

Description

Liquid heating, radiating and refrigerating device

Technical Field

The utility model relates to a household electrical appliances technical field, concretely relates to liquid heating heat dissipation refrigerating plant.

Background

The cooling of hot water, oil and other high temperature liquid in the existing family is usually the natural heat dissipation cooling, and the cooling mode has the problem of long waiting time, and when people urgently need to use the cooling mode, the cooling mode cannot be used for cooling in time, and the final cooling temperature is uncontrollable. Moreover, cooling in air can only be to room temperature, and cannot be to a lower temperature. If the liquid needs to be cooled to a lower temperature, the liquid needs to be placed in refrigeration equipment such as a refrigerator, the operation is complex, the liquid needs to be stored in a separate position, and the problems of container dumping, liquid spilling, uncontrollable cooling temperature and the like are easily caused. The existing household heating adopts a kettle or a frying pan and the like, the heating temperature cannot be controlled, and the liquid cannot be heated to the expected temperature.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome above-mentioned not enough, provide a liquid heating heat dissipation refrigerating plant, through the refrigeration to the liquid heating heat dissipation, make liquid reach the temperature that needs, make things convenient for people's use, to the refrigerated function of the quick increase heating heat dissipation of the container of no heating heat dissipation refrigeration function, and the commonality is strong, makes things convenient for people's life.

The utility model provides a liquid heating heat dissipation refrigerating plant, include: the device comprises a heating pipe, a heat conduction pipe, a sensor tubular metal waterproof shell, a machine body lower shell, a heat pipe installation block, a machine body middle shell, a machine body upper cover and a heating pipe bracket; the machine body lower shell and the machine body upper cover are respectively arranged at the bottom and the top of the machine body middle shell, and the heat pipe mounting block is arranged on the machine body lower shell;

the heat pipe mounting block is provided with a temperature sensor assembly mounting hole, a heat pipe mounting hole and a heating pipe mounting hole, the heating pipe support is connected in the heating pipe mounting hole and extends below the lower shell of the machine body, the heating pipe is annular and is connected to the bottom of the heating pipe support, the heat pipe is arranged in the heat pipe mounting hole and extends downwards to the upper part of the heating pipe, and the tubular metal waterproof shell of the sensor is arranged in the temperature sensor assembly mounting hole and extends downwards to the upper part of the heating pipe;

a temperature sensor and a sealing rubber plug are arranged in the tubular metal waterproof shell of the sensor, the sealing rubber plug is arranged above the temperature sensor, and the temperature sensor is contacted with the inner wall of the tubular metal waterproof shell of the sensor;

a semiconductor refrigeration piece is arranged above the heat pipe mounting block, a radiating fin is arranged on the lower shell of the machine body, and the semiconductor refrigeration piece is clamped between the radiating fin and the heat pipe mounting block;

a fan is arranged in the machine body middle shell, a fan vent is arranged in the center of the interior of the machine body middle shell, the fan is opposite to the fan vent, an air inlet is arranged below the outer wall of the machine body middle shell, an air outlet is arranged above the outer wall of the machine body middle shell, and the fan is positioned between the air inlet and the air outlet; the improved multifunctional temperature sensor is characterized in that a circuit board is arranged at the bottom of the upper cover of the machine body, a function upper key, a function lower key and a function key are arranged on the upper surface of the upper cover of the machine body, the temperature sensor and the fan are connected to the circuit board through leads respectively, and a room temperature detection sensor is further arranged on the circuit board.

Optionally, the heat pipe mounting block is mounted on the lower shell of the machine body through a heat pipe mounting block mounting screw.

Optionally, the heat sink is mounted on the lower case of the machine body through a heat sink screw.

Optionally, the fan is mounted on the middle housing of the machine body through a cooling fan mounting screw.

Optionally, the circuit board is mounted on the upper cover of the machine body through a circuit board mounting screw.

Optionally, the upper cover of the machine body is mounted on the middle shell of the machine body through an upper cover mounting screw.

Optionally, the machine body lower shell is mounted on the machine body middle shell through a machine body lower shell mounting screw.

Optionally, the upper cover of the machine body is provided with a power line mounting hole, and the power line is connected with the circuit board through the power line mounting hole.

The utility model discloses following beneficial effect has: the utility model provides a pair of liquid heating heat dissipation refrigerating plant, this liquid heating heat dissipation refrigerating plant simple structure, convenient to use has effectively solved the problem that liquid need heat in the container, the slow problem of high temperature liquid natural heat dissipation in the container and the refrigerated problem of liquid need in the container, has effectively saved the time, has improved work efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a perspective view of a liquid heating, heat dissipating and refrigerating apparatus provided by the present invention.

Fig. 2 is a main body diagram of a liquid heating, heat dissipating and refrigerating apparatus provided by the present invention.

Fig. 3 is a top view of the liquid heating, heat dissipating and refrigerating apparatus provided by the present invention.

Fig. 4 is a bottom view of the liquid heating, heat dissipating and refrigerating apparatus provided by the present invention.

Fig. 5 is a side view of the liquid heating, heat dissipating and refrigerating apparatus provided by the present invention.

Fig. 6 is a sectional view in the direction a-a of fig. 5.

Fig. 7 is a partially enlarged view of fig. 6 in the region C.

FIG. 8 is a schematic view of a heat pipe mounting block.

Fig. 9 is a top view of the lower housing of the machine body.

Fig. 10 is a sectional view in the direction B-B of fig. 9.

Fig. 11 is a front view of the housing of the machine body.

Fig. 12 is a top view of the housing of the machine body.

Illustration of the drawings: 1-heating a tube; 2-a heat conducting pipe; 3-sensor tubular metal waterproof casing; 4-lower casing of machine body; 5-a heat pipe mounting block; 6-a heat sink; 7-a fan; 8-body middle shell; 9-upper cover of machine body; 10-a display screen; 11-a functional upper key; 12-a circuit board; 13-semiconductor refrigerating sheet; 14-function down key; 15-function key; 16-a temperature sensor; 17-sealing the rubber plug; 18-a heating tube holder; 19-temperature sensor assembly mounting holes; 20-heat pipe mounting holes; 21-heating pipe mounting holes; 22-mounting screws for heat pipe mounting blocks; 23-heat sink screws; 24-radiator fan mounting screws; 25-circuit board mounting screws; 26-mounting screws on the upper cover; 27-lower shell mounting screws; 28-power line mounting holes; 29-air inlet; 30-air outlet; 31-a fan vent; 32-room temperature detection sensor.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments. It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Exemplary embodiments according to the present application will now be described in more detail with reference to the accompanying drawings. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to only the embodiments set forth herein. It is to be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art, in the drawings, the thicknesses of layers and regions are exaggerated for clarity, and the same devices are denoted by the same reference numerals, and thus the description thereof will be omitted.

Referring to fig. 1 to 12, an embodiment of the present invention provides a liquid heating, heat dissipating and refrigerating apparatus, including: the device comprises a heating pipe 1, a heat conduction pipe 2, a sensor tubular metal waterproof shell 3, a machine body lower shell 4, a heat pipe installation block 5, a machine body middle shell 8, a machine body upper cover 9 and a heating pipe support 18; organism inferior valve 4 and organism upper cover 9 set up respectively in the bottom and the top of organism mesochite 8, and organism upper cover 9 is installed on organism mesochite 8 through upper cover mounting screw 26, and organism inferior valve 4 is installed on organism mesochite 8 through organism inferior valve mounting screw 27. The heat pipe mounting block 5 is arranged on the lower machine body shell 4, and the heat pipe mounting block 5 is mounted on the lower machine body shell 4 through a heat pipe mounting block mounting screw 22.

Be provided with temperature sensor subassembly mounting hole 19, heat pipe mounting hole 20 and heating pipe mounting hole 21 on heat pipe installation piece 5, heating pipe support 18 connects in heating pipe mounting hole 21 and extends to organism inferior valve 4 below, heating pipe 1 is the annular and connects in heating pipe support 18 bottom, heat pipe 2 sets up in heat pipe mounting hole 20 and downwardly extending to heating pipe 1 top, heat pipe 2 is inseparable with the contact of heat pipe mounting hole 20, heat conduction that can be good.

The tubular metal waterproof shell 3 of the sensor is arranged in the mounting hole 19 of the temperature sensor assembly and extends downwards to the upper part of the heating pipe 1, the tubular metal waterproof shell 3 of the sensor is tightly contacted with the inside of the mounting hole 19 of the temperature sensor assembly, the sealing is good, and the water vapor entering the tubular metal waterproof shell is prevented from damaging the temperature sensor 16.

Be provided with temperature sensor 16 and sealed plug 17 in the waterproof shell of sensor tubulose metal 3, sealed plug 17 sets up in temperature sensor 16 top, and temperature sensor 16 and the 3 inner walls in close contact with of the waterproof shell of sensor tubulose metal realize good heat conduction, make temperature detect more accurate.

The semiconductor refrigerating sheet 13 is arranged above the heat pipe mounting block 5, the radiating sheet 6 is arranged on the lower machine body shell 4, and the radiating sheet 6 is mounted on the lower machine body shell 4 through a radiating sheet screw 23. The semiconductor refrigeration piece 13 is clamped between the radiating fin 6 and the heat pipe mounting block 5, so that the heat pipe mounting block 5, the semiconductor refrigeration piece 13 and the radiating fin 6 are tightly attached, and heat conduction is good.

The fan 7 is arranged in the machine body middle shell 8, the fan 7 is arranged in the machine body middle shell 8 through the cooling fan mounting screw 24, the fan vent 31 is arranged in the center of the interior of the machine body middle shell 8, and the fan 7 is opposite to the fan vent 31 in position, so that good ventilation is guaranteed. An air inlet 29 is formed below the outer wall of the machine body middle shell 8, an air outlet 30 is formed above the outer wall of the machine body middle shell 8, and the fan 7 is located between the air inlet 29 and the air outlet 30; the bottom of the upper cover 9 is provided with a circuit board 12, and the circuit board 12 is mounted on the upper cover 9 through a circuit board mounting screw 25. The upper surface of the upper cover 9 is provided with a function upper key 11, a function lower key 14 and a function key 15, the temperature sensor 16 and the fan 7 are respectively connected to the circuit board 12 through wires, and the circuit board 12 is also provided with a room temperature detection sensor 32. The body upper cover 9 is provided with a power line mounting hole 28, and the power line is connected with the circuit board 12 through the power line mounting hole 28. The temperature sensor 16 and the room temperature detecting sensor 32 may be of the type DS18B 20. The upper cover 9 of the body can also be provided with a display screen 10 for displaying the temperature values detected by the room temperature detection sensor 32 and the temperature sensor 16. The specific circuit structure of function upper key 11, function lower key 14, function button 15 and circuit board 12 and the principle of carrying out relevant control according to the temperature all can realize according to prior art, the utility model discloses an innovation part lies in liquid heating heat dissipation refrigerating plant's structure.

The utility model discloses liquid heating heat dissipation refrigerating plant's theory of operation as follows:

during the use, can put into the container that is equipped with liquid heating heat dissipation refrigerating plant and work as, guarantee that liquid upper surface submergence heating pipe 1, and with heat pipe 2 contact to the realization is to liquid heating, heat dissipation cooling, refrigeration. The device provides a plurality of working modes: first, heating mode. And II, a heat dissipation and cooling mode. And thirdly, a refrigeration mode. And fourthly, a heat preservation mode and a combined mode of the first three working modes and the fourth working mode, namely heat preservation after heating to a specified temperature, heat preservation after heat dissipation and cooling to the specified temperature, and heat preservation after cooling to the specified temperature. After power-on, the operating mode of the device is set by means of the function keys 15.

When the device is selected to be in heating mode: the working mode is set through the function key 15, the temperature to be heated is set through the function key 11 and the function key 14, then the function key 15 is pressed again, the device starts to heat, the heating is realized by electrifying the heating pipe 1 to heat the liquid, the temperature sensor 16 detects the temperature of the liquid continuously, and when the liquid is heated to the set temperature, the heating is stopped.

When the equipment is selected to be in a heat dissipation and cooling mode: setting a working mode through a function key 15, setting a temperature to be cooled through a function up key 11 and a function down key 14, pressing the function key 15 again to start cooling, and starting a fan 7; the heat pipe 2 transmits the heat in the liquid to the heat pipe installation block 5 through the heat pipe 2, the heat is transmitted to the radiating fin 6 through the semiconductor refrigerating fin 13, the fan 7 introduces the air from the air inlet 29 through the fan vent 31 on the body middle shell 8 and blows the air to the radiating fin 6, the cold air takes away the heat on the radiating fin 6, the air which completes the heat exchange is discharged out of the body from the air outlet 30 on the body middle shell 8, thereby the temperature of the liquid in the container is continuously reduced, the temperature sensor 16 continuously detects the temperature of the liquid, when the liquid is cooled to a set temperature by heat dissipation, the equipment stops working.

When the apparatus is selected to cooling mode: setting a working mode through a function key 15, setting the temperature to be cooled through a function up key 11 and a function down key 14, pressing the function key 15 again, starting the equipment to cool, and starting a fan 7 at the moment; the semiconductor refrigerating sheet 13 is electrified and started; the heat pipe 2 transfers the heat in the liquid to the heat pipe installation block 5 through the heat pipe 2, the heat is transferred to the radiating fin 6 through the semiconductor refrigerating fin 13, the fan 7 introduces the air from the air inlet 29 and blows the air to the radiating fin 6 through the fan vent 31 on the shell 8 in the machine body, the cold air takes away the heat on the radiating fin 6, the air which completes the heat exchange is discharged out of the machine body from the air outlet 30 on the shell 8 in the machine body, thereby the temperature of the liquid in the container is continuously reduced, the temperature sensor 16 continuously detects the temperature of the liquid, and when the liquid is cooled to the set temperature by heat dissipation. The mode is different from the heat dissipation cooling mode, and the semiconductor cooling plate 13 is electrified for cooling, so that the temperature of the liquid can be reduced to be below the room temperature.

When the device is selected to keep warm: the working mode is set through the function key 15, the temperature required to be kept warm is set through the function upper key 11 and the function lower key 14, the module function key 15 is pressed again, and the equipment starts to keep warm. The temperature sensor 16 detects the liquid temperature; if the current liquid temperature is lower than the heat preservation temperature, the equipment energizes the heating pipe 1 to heat the liquid so as to enable the liquid to reach the set temperature and preserve the heat; if the current liquid temperature is higher than the holding temperature, the room temperature detection sensor 32 detects that the liquid temperature is also higher than the room temperature. Starting a fan 7 by the equipment to reduce the temperature of the liquid to a set temperature and preserving the heat; if the current liquid temperature is higher than the heat preservation temperature and the set heat dissipation temperature is lower than the room temperature detected by the room temperature detection sensor 32, it indicates that refrigeration is required. The equipment starts the fan 7, and the semiconductor refrigeration block 13 is started by electrifying to cool together, so that the liquid temperature is reduced to the set temperature and the heat is preserved.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A liquid heating, heat dissipating, and cooling device, comprising: the device comprises a heating pipe (1), a heat conduction pipe (2), a sensor tubular metal waterproof shell (3), a machine body lower shell (4), a heat pipe installation block (5), a machine body middle shell (8), a machine body upper cover (9) and a heating pipe support (18); the machine body lower shell (4) and the machine body upper cover (9) are respectively arranged at the bottom and the top of the machine body middle shell (8), and the heat pipe mounting block (5) is arranged on the machine body lower shell (4);

the heat pipe installation block (5) is provided with a temperature sensor assembly installation hole (19), a heat pipe installation hole (20) and a heating pipe installation hole (21), the heating pipe support (18) is connected in the heating pipe installation hole (21) and extends towards the lower part of the machine body lower shell (4), the heating pipe (1) is annular and is connected to the bottom of the heating pipe support (18), the heat pipe (2) is arranged in the heat pipe installation hole (20) and extends downwards to the upper part of the heating pipe (1), and the sensor tubular metal waterproof shell (3) is arranged in the temperature sensor assembly installation hole (19) and extends downwards to the upper part of the heating pipe (1);

a temperature sensor (16) and a sealing rubber plug (17) are arranged in the tubular metal waterproof sensor shell (3), the sealing rubber plug (17) is arranged above the temperature sensor (16), and the temperature sensor (16) is in contact with the inner wall of the tubular metal waterproof sensor shell (3);

a semiconductor refrigerating sheet (13) is arranged above the heat pipe mounting block (5), a radiating fin (6) is arranged on the machine body lower shell (4), and the semiconductor refrigerating sheet (13) is clamped between the radiating fin (6) and the heat pipe mounting block (5);

a fan (7) is arranged in the machine body middle shell (8), a fan vent (31) is arranged in the center of the interior of the machine body middle shell (8), the fan (7) is opposite to the fan vent (31), an air inlet (29) is arranged below the outer wall of the machine body middle shell (8), an air outlet (30) is arranged above the outer wall of the machine body middle shell (8), and the fan (7) is located between the air inlet (29) and the air outlet (30); the improved multifunctional temperature sensor is characterized in that a circuit board (12) is arranged at the bottom of the upper cover (9) of the machine body, a function upper key (11), a function lower key (14) and a function key (15) are arranged on the upper surface of the upper cover (9) of the machine body, a temperature sensor (16) and a fan (7) are connected to the circuit board (12) through wires respectively, and a room temperature detection sensor (32) is further arranged on the circuit board (12).

2. A liquid heating, heat dissipating and cooling device as claimed in claim 1, wherein the heat pipe mounting block (5) is mounted on the lower housing (4) by a heat pipe mounting block mounting screw (22).

3. A liquid heating, heat dissipating and cooling device as claimed in claim 1, wherein the heat sink (6) is mounted to the lower housing shell (4) by a heat sink screw (23).

4. A liquid heating, heat dissipating and cooling device as claimed in claim 1, wherein the fan (7) is mounted to the housing (8) by means of heat dissipating fan mounting screws (24).

5. A liquid heating, heat dissipating and cooling device as claimed in claim 1, wherein the circuit board (12) is mounted to the housing upper cover (9) by circuit board mounting screws (25).

6. A liquid heating, heat dissipating and cooling apparatus as claimed in claim 1, wherein the upper housing cover (9) is mounted to the housing (8) by cover mounting screws (26).

7. A liquid heating, heat radiating and refrigerating device as claimed in claim 1, wherein said lower housing (4) is mounted on the housing middle shell (8) by housing lower shell mounting screws (27).

8. A liquid heating, heat dissipating and cooling device as claimed in claim 1, wherein the upper housing cover (9) is provided with a power cord mounting hole (28), and the power cord is connected to the circuit board (12) through the power cord mounting hole (28).