CN210007704U

CN210007704U - kinds of optical network units

Info

Publication number: CN210007704U
Application number: CN201920995999.6U
Authority: CN
Inventors: 李祥; 朱岩涛; 高修东
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2020-01-31
Anticipated expiration: 2029-06-28

Abstract

The embodiment of the application shows optical network units, and the optical network unit provided by the embodiment of the application has the advantages that the receiving pin of the optical receiving submodule is welded on the -th bonding pad, and the optical receiving submodule is arranged at the end of the round square tube body close to the PCB circuit board, so that the length of the receiving pin exposed and leaked in the air is shortened.

Description

kinds of optical network units

Technical Field

The embodiment of the application relates to the optical communication technology, in particular to optical network units.

Background

Generally, an Optical transceiver assembly (BOSA) is arranged in the Optical Network Unit, and the BOSA receives a service transmitted by the OLT through an Optical fiber and provides various broadband services to a user.

In order to ensure the transmission quality of signals, the BOSA structure is designed in the industry, please refer to fig. 1, and usually, a BOSA receiving end 3 and a transmitting end 2 are connected to a Printed Circuit Board (PCB) 1 of an ONU through a flexible Circuit Board 4, which avoids the problems of serious impedance mismatch, signal distortion and the like caused by the fact that a tube leg with a long BOSA leaks in the air during the signal transmission process to a certain extent at .

SUMMERY OF THE UTILITY MODEL

Based on the above technical problems, the present application aims to provide optical network units to solve the technical problems in the prior art.

The embodiment of the application shows optical network units, which comprise a shell, a PCB, an optical transceiver component and a flexible circuit board, wherein the PCB and the optical transceiver component are arranged in the shell, the optical transceiver component is arranged on the upper surface of the PCB, the optical transceiver component comprises a light emission sub-module, a light reception sub-module, a round square tube body and a light transceiver end, the light emission sub-module and the light transceiver end are respectively arranged at two opposite ends of the round square tube body, the light reception sub-module is arranged at the end of the round square tube body close to the PCB, the reception sub-module is arranged perpendicular to the optical axis direction of the light emission sub-module, a transmitting pin of the light emission sub-module is connected with the PCB through the flexible circuit board, a th bonding pad is arranged on the PCB at a position corresponding to a receiving pin of the light reception sub-module, and the receiving pin is inserted into the th bonding pad.

According to the technical scheme, optical network units are shown in the embodiment of the application, the receiving pins of the optical receiving sub-modules in the optical network units provided by the embodiment are welded on the -th welding disc, and the optical receiving sub-modules are arranged at the ends of the round and square tube bodies close to the PCB circuit board, so that the lengths of the receiving pins which are exposed and leaked in the air are shortened.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a BOSA of a design common in the industry;

FIG. 2 is a schematic diagram of an optical network unit shown in accordance with the preferred embodiment at ;

FIG. 3 is a schematic structural diagram illustrating a housing according to a preferred embodiment at ;

FIG. 4 is a diagram illustrating the connection between components of an optical network unit according to in a preferred embodiment;

FIG. 5 is a schematic diagram of a PCB circuit board shown in accordance with a preferred embodiment of ;

FIG. 6 is a schematic diagram of a PCB circuit board shown in accordance with yet another preferred embodiment;

FIG. 7 is a schematic diagram of an optical transceiver assembly shown in accordance with the preferred embodiment at ;

FIG. 8 is a schematic view of a round, square tube body according to in accordance with a preferred embodiment;

FIG. 9 is a schematic diagram of a flexible circuit board shown in accordance with the preferred embodiment of ;

FIG. 10 is a schematic illustration showing the connection of the bracket, optical transceiver module and fiber flange according to ;

FIG. 11 is a schematic view of a stand shown in accordance with a preferred embodiment at ;

FIG. 12 is a schematic view of a stand shown in accordance with yet another preferred embodiment ;

fig. 13 is a schematic view of the connection of the bracket to the optical transceiver module according to in a preferred embodiment.

Detailed Description

To make the purpose, technical solutions and advantages of the exemplary embodiments of the present application clearer, the technical solutions in the exemplary embodiments of the present application will be clearly and completely described below with reference to the drawings in the exemplary embodiments of the present application, and it is obvious that the described exemplary embodiments are only partial embodiments of the present application , but not all embodiments.

The technical solution in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of , but not all embodiments.

, the core link of optical fiber communication, is the conversion of optical and electrical signals, optical fiber communication uses optical signals carrying information to transmit in optical fiber/optical waveguide, and uses the passive transmission characteristic of light in optical fiber to realize low-cost and low-loss information transmission.

The optical transceiver module realizes the above photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electrical signals is the core function of the optical transceiver module. The optical transceiver module is electrically connected with an external upper computer through a gold finger on the circuit board, the main electrical connection comprises power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the gold finger becomes a standard mode of the optical transceiver module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical transceiver modules.

Please refer to fig. 2 for a structure of the optical network unit 100. The optical network unit comprises: housing 110, PCB circuit board 120, optical transceiver component 130, and flexible circuit board 140. The PCB circuit board 120, the optical transceiver module 130 and the flexible circuit board 140 are disposed in the housing 110. The optical transceiver module 130 and the flexible circuit board 140 are disposed on the upper surface of the PCB 120. The structural relationship among the housing 110, the PCB 120, the optical transceiver module 130, and the flexible circuit board 140 will be described in detail below.

Referring to fig. 3, the structure of the housing 110 may include an upper housing 111 and a lower housing 112, where the upper housing 111 and the lower housing 112 are made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation, and an assembly manner of combining the upper housing 111 and the lower housing 112 is adopted, so as to facilitate installation of devices such as the PCB 120 into the housing 111, and does not make the housing 110 of the optical network unit into a body structure, so that when the devices such as the circuit board are assembled, the positioning member, the heat dissipation and the electromagnetic shielding structure cannot be installed, and production automation is not facilitated, further step, please refer to fig. 3, where the surface of the upper housing 111 is provided with a plurality of fins 111a, the side wall of the lower housing 112 is provided with a plurality of ventilation openings 112a, heat generated by the devices in the housing 110 during operation may be diffused through the fins 111a of the upper housing and the ventilation openings 112a of the lower housing 110, and the optical network unit 100 is generally provided with a plurality of operation indicating lamps 160, and the upper housing 111b and the lower housing 112 is provided with a plurality of windows cavities for receiving and receiving the PCB assemblies, and receiving the PCB 111 and receiving the PCB 130.

In the technical solution shown in the embodiment of the present application, in order to save the usage amount of the flexible circuit board, only the transmitting terminal of the optical transceiver module 130 is connected to the PCB 120 through the flexible circuit board 140. Specifically, referring to fig. 4, a connection relationship between the optical transceiver assembly 130 and the PCB circuit board may be shown, wherein the optical transceiver assembly 130 is disposed on the upper surface of the PCB circuit board 120, the transmitting end of the optical transceiver assembly 130 is connected to the PCB circuit board 120 through the flexible circuit board 140, and the receiving end of the optical transceiver assembly 130 is soldered to the PCB circuit board.

In a feasible embodiment, the structure of the PCB 120 can be seen in fig. 5, wherein the wiring on the PCB 120 controls the wiring of the main chip 121, wherein the main chip 121 is disposed on the upper surface of the PCB 120. in a feasible embodiment, a cage 125 can be disposed on the periphery of the main chip 121. in particular, referring to fig. 6, the cage 125 is disposed on the upper surface of the PCB 120, the main chip 121 is disposed in the cage 106, a heat sink can be disposed on the cage 125, the heat sink has a raised structure such as fins for increasing the heat dissipation area, the main chip 121 is wrapped in the cage 125, the heat generated by the main chip 121 can be conducted to the cage 125 and finally diffused by the heat sink on the cage, continuing to fig. 4 and 5, the PCB 120 is disposed with a pad 122 at a position corresponding to the receiving end of the optical transceiver module 130, the receiving end of the optical transceiver module 130 is soldered to a pad 122 of the PCB 120, the PCB 120 is disposed with a second pad 124, the transmitting end of the optical transceiver module 130 is soldered to the second pad 120 of the PCB 120, and the support legs are disposed at other positions corresponding to the positioning holes 123 of the support legs of the PCB 120.

In an feasible embodiment, the structure of the optical transceiver module 130 can refer to fig. 7, wherein the optical transceiver module 130 includes a tosa 131, a tosa 132, a round tube 133 and an optical transceiver 134, wherein the tosa 131, the tosa 132 and the optical transceiver 134 are connected by the round tube 133, wherein the round tube can refer to fig. 8, the round tube 133 shown in the embodiment of the present application can include a square tube 133a and a round tube 133b that are connected with each other, grooves (not shown in fig. 6) are provided on sides of the square tube 133a, wherein the tosa 132 is partially fixed in the grooves, receiving pins (not shown in fig. 6) of the tosa 132 extend out of the grooves, and the round tube 133b extends through the square tube 133a in a direction perpendicular to the grooves, and the optical transceiver 131 and the optical transceiver 134 are respectively located at two opposite ends of the round tube 133.

With continued reference to fig. 4, during the assembly process, the end of the rosa 130 where the rosa 132 is mounted is disposed adjacent to the upper surface of the PCB 120. the receive pin 132a of the rosa 132 is directly soldered to the land 122. the receive pin 132a is connected to the land 122 of the PCB, wherein may provide power to the rosa 130, may output the electrical signal formed by the photoelectric conversion of the rosa 130 to other external devices, the transmit pin 131a of the rosa 131 is soldered to the second land 124 of the PCB through the flexible circuit board 140, the transmit pin 131a is soldered to the second land 124 of the PCB through the flexible circuit board 140, may provide power to the rosa 131, and may provide data to be transmitted from other devices to the optical transmitter for the optical transmitter to transmit in the form of optical signal.

Referring to fig. 9, the structure of the flexible circuit board 140 may include a socket 141 corresponding to the emission pin 131a disposed at an end of the flexible circuit board 140, the emission pin 131a is inserted into the socket 141 of the flexible circuit board 140 and then is soldered and fixed, and the other end of the flexible circuit board 140 is soldered and fixed to the second pad 124 of the PCB 120.

In an feasible embodiment, the optical network unit 100 further includes a fiber flange 170, referring to fig. 10, the fiber flange 170 is connected to the optical transceiver end 134 through an optical fiber, referring to fig. 3, a bottom end of the lower housing 112 is provided with a notch 112b for avoiding the fiber flange 170, and the fiber flange 170 penetrates through the notch 112 b.

In the optical network unit 100 provided in the above embodiment, the receiving pin 132a of the optical receive sub-module 132 is soldered to the th solder pad 122, and since the optical receive sub-module 132 is disposed at the end of the circular-square tube body 133 close to the PCB 120, the length of the receiving pin 132a exposed in the air is shortened, meanwhile, the transmitting pin 131a of the optical transmit sub-module 131 is connected to the PCB 120 through the flexible circuit board 140, and since the flexible circuit board 140 has strict requirements on impedance control, signals are transmitted on the flexible circuit board 140 to ensure signal quality.

In the optical network unit 100 shown above, since the receiving pin 132a of the rosa 132 and the PCB 120 are connected to by soldering, the soldering has a limited structural strength, meanwhile, the transmitting pin 131a of the rosa 131 is connected to the PCB 120 through the flexible circuit board 140, the flexible circuit board 140 is not fixed, during the use, the rosa 130 may fall off from the PCB 120 due to vibration, therefore, a bracket is required to be installed on the rosa 130 to prevent the rosa 130 from falling off from the PCB 120 during vibration and fall.

Optionally, the optical network unit 100 shown in the embodiment of the present application further includes a bracket 150, the connection relationship between the bracket and the optical transceiver module can be referred to in fig. 10, the structure of the bracket 150 can be referred to in fig. 11, wherein the bracket 150 includes a th side plate 151, a second side plate 152, and a support leg 153, specifically, in fig. 12, wherein an upper surface 152a of the second side plate 152 is fixedly connected to a 0 end of the th side plate 151, the 1 th side plate 151 is perpendicular to the second side plate 152 to ensure that the th side plate 151 and the second side plate 152 are in more sufficient contact with the surface (including the top surface and the side wall) of the square tube body, a side surface 152b of the second side plate 152 is provided with a solder hole 152c penetrating through the second side plate 152, a side surface 152b of the second side plate 152 is soldered to the side wall of the square tube body 133a through the solder hole 152c to perform a fixing function, the number of the solder holes 152c can be determined according to requirements, a lower surface 152d of the second side plate 152b is connected to the support leg 153, the support leg 153a of the second side plate 152b is connected to a of the support leg 153, a support leg 153a of the support leg 153b is connected to a of the support leg 153, a of the support leg 153, the support leg 153b of the support leg 153, the support leg 153 of the support leg 153.

Referring to fig. 13, the bottom surface of the th side plate 151 is attached to the top surface of the square tube 133a, and in a specific production process, the top surface of the th side plate 151 may be engraved with a two-dimensional code of a manufacturer, and the side surface 152b of the second side plate 152 is welded to the side wall of the square tube 133a through the welding hole 152 c.

In order to increase the stability of the bracket 150 to the optical transceiver module 130, the bracket 150 according to the embodiment of the present application further includes -th limit angle 154 and a second limit angle 155, the -th limit angle 154 and the second limit angle 155 are disposed on the sidewall 152e of of the second side plate 152, the side of the -th limit angle 154 opposite to the second limit angle 155 is the -th arc surface 154a, the side of the second limit angle 155 opposite to the -th limit angle 154 is the second arc surface 155a, the distance from the center of the circular tube 133b to the sidewall is equal to the distance from the center of the circular tube 133b to the -th arc surface 154a or the second arc surface 155a, and the distance from the center of the circular tube 133b to the sidewall is equal to the distance from the center of the circular tube 133b to the -th arc surface 154a or the second arc surface 155a, and the distance from the -th arc surface 154a or the second arc surface 155a to the circular tube 133b plays a role in clamping the optical transceiver module 130.

Compared with the existing optical network unit 100, the bracket 150 adopted by the optical network unit 100 shown in the embodiment of the application can fix the optical transceiver component 130 only through the th side plate 151 and the second side plate 152 and the structure of the supporting leg 153.

It should be understood that the terms "", "second", "third", and the like in the description and in the claims of the present application and in the accompanying drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Furthermore, the terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a product or device that comprises the series of elements is not necessarily limited to the explicitly listed elements, but may include other elements not expressly listed or inherent to such product or device.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

The optical network unit of kinds includes shell, PCB circuit board, optical receiving and transmitting assembly, flexible circuit board;

the PCB, the optical transceiver component and the flexible circuit board are arranged in the shell, the PCB is arranged on the lower surface of the shell, and the optical transceiver component is arranged on the upper surface of the PCB;

wherein the optical transceiver component comprises: the optical transceiver comprises a light emitting sub-module, a light receiving sub-module, a round and square tube body and a light transceiving end;

the optical receiving sub-module is arranged at the end of the round square tube body close to the PCB, and the receiving sub-module is arranged perpendicular to the optical axis direction of the optical transmitting sub-module;

the emission pin of the light emission secondary module is connected with the PCB through a flexible circuit board;

the PCB circuit board is provided with th bonding pads at positions corresponding to the receiving pins of the light receiving sub-module, and the receiving pins are welded with the th bonding pads.
2. The optical network unit of claim 1, further comprising: a support;

the support comprises an th side plate, a second side plate and a support leg;

the upper surface of the second side plate is fixedly connected with the end of the side plate, the side plate is perpendicular to the second side plate, the side surface of the second side plate is provided with a welding hole penetrating through the second side plate, and the lower surface of the second side plate is fixedly connected with the supporting leg;

the PCB is provided with a positioning hole at a position corresponding to the supporting leg, and the supporting leg penetrates through the positioning hole;

the bottom surface of the th side plate is attached to the top surface of the round and square pipe body, and the side surface of the second side plate is welded with the side wall of the round and square pipe body through the welding hole.
3. The ONU of claim 2, wherein the support legs comprise th support leg and a second support leg;

the supporting leg is arranged at the end of the lower surface of the second side plate, and the second supporting leg is arranged at the other end of the lower surface of the second side plate;

the width between the outer side wall of the th support leg and the outer side wall of the second support leg is greater than the width of the second side panel.
4. The ONU of claim 2 or 3, wherein the round and square tube comprises a round tube and a square tube which are communicated with each other, wherein sides of the square tube are provided with grooves, the OSM and the OST are respectively positioned at two opposite ends of the round tube, and the OSM is arranged in the groove;

the bracket also comprises an th limiting angle and a second limiting angle, wherein the th limiting angle and the second limiting angle are arranged on the side wall of the second side plate;

the side surface of the th limiting angle opposite to the second limiting angle is a arc surface, and the side surface of the second limiting angle opposite to the th limiting angle is a second arc surface;

the distance from the center of the circular pipe body (133a) to the side wall is equal to the distance from the center of the circular pipe body to the th cambered surface or the second cambered surface.
5. The optical network unit of claim 1, wherein the housing comprises an upper housing and a lower housing;

the upper shell and the lower shell form containing cavities;

the surface of the upper shell is provided with a plurality of fins.
6. The ONU of claim 5, wherein the sidewall of the lower housing is provided with a plurality of vents.
7. The ONU of claim 5, further comprising a fiber flange, wherein the fiber flange is connected to the optical transceiver end via an optical fiber;

the lower shell is provided with a notch used for avoiding the optical fiber flange, and the optical fiber flange penetrates through the notch.
8. The optical network unit of claim 5, wherein the PCB circuit board further comprises: a cage and a main chip;

the cage is arranged on the upper surface of the PCB, a main chip is arranged in the cage, and the main chip is electrically connected with the PCB.