CN209996047U

CN209996047U - circuit board for electromagnetic heating and electromagnetic heating cooking utensil

Info

Publication number: CN209996047U
Application number: CN201920297997.XU
Authority: CN
Inventors: 朱泽春; 崔卫民; 谢伟峰; 寿东升
Original assignee: Joyoung Co Ltd
Current assignee: Shandong Jiuchuang Home Appliance Co ltd
Priority date: 2019-03-08
Filing date: 2019-03-08
Publication date: 2020-01-31
Anticipated expiration: 2029-03-08

Abstract

The utility model discloses an circuit board for electromagnetic heating, including the PCB board, set up IGBT, rectifier bridge heap on the PCB board, and the radiator, the radiator is including being located the fixed part that is used for IGBT, rectifier bridge heap installation on the PCB board, extending to the outer second fixed part of PCB board and heat dissipation wing, is equipped with on the fixed part and supplies IGBT, the fixed platform of rectifier bridge heap, the PCB board corresponds fixed part department and runs through there are a plurality of louvres, and the diameter of louvre is 1mm to 5mm, and the interval of adjacent louvre is 1mm to 3mm the utility model discloses can improve the radiating effect of circuit board with the help of the louvre, the utility model discloses still provide electromagnetic heating cooking utensils that have above-mentioned circuit board for electromagnetic heating.

Description

circuit board for electromagnetic heating and electromagnetic heating cooking utensil

[ technical field ] A method for producing a semiconductor device

The utility model relates to a kitchen cooking utensil especially relates to kinds of circuit boards and electromagnetic heating cooking utensil for electromagnetic heating.

[ background of the invention ]

Because of the characteristics of energy saving and high efficiency, is widely applied to kitchen cooking appliances, of electromagnetic heating cooking appliances are generally provided with circuit boards for electromagnetic heating, each circuit board is provided with an Insulated Gate Bipolar Transistor (IGBT for short), when the IGBT is turned on, the resonant circuit is charged, when the IGBT is turned off, the resonant circuit discharges to generate an alternating magnetic field, and the alternating magnetic field cuts a pot placed on an electromagnetic wire coil to heat the pot, and of the electromagnetic heating cooking appliances is generally provided with a radiator on the circuit board to radiate the IGBT in order to reduce the temperature of the IGBT, but the radiating effect of the existing circuit board structure still needs to be improved.

[ Utility model ] content

The utility model aims to solve the technical problem that overcome prior art not enough and provide kinds of circuit boards and electromagnetic heating cooking utensil for the electromagnetic heating, improve the radiating effect of circuit board.

In order to solve the technical problem, the utility model adopts the following technical scheme:

circuit board for electromagnetic heating, including PCB board, IGBT, rectifier bridge heap of setting on the PCB board, and the radiator, the radiator is including being located the fixed part that is used for IGBT, rectifier bridge heap installation on the PCB board, extending to the outer second fixed part of PCB board and heat dissipation wing, is equipped with on the fixed part and supplies IGBT, the fixed platform of rectifier bridge heap, the PCB board corresponds fixed part department and runs through and has a plurality of louvres, and the diameter of louvre is 1mm to 5mm, and the interval of adjacent louvre is 1mm to 3 mm.

In the embodiment of the present invention, the heat dissipating fins are located at a greater height above the heat sink than below the heat sink.

The utility model discloses an embodiment, at least part the louvre is seted up in the PCB board department that the IGBT corresponds.

In the embodiment of the present invention, the area of the PCB board penetrated with the heat dissipation holes is larger than the area of the th fixing portion covering the PCB board.

In the embodiment of the present invention, the heat dissipation holes extend from the fixing portion to the inside of the PCB, at least to the pins of the IGBT.

In the embodiment of the present invention, the heat sink includes a plate body, the two sides of the plate body are provided with heat dissipation fins, and the thickness of the plate body at the fixing portion is greater than the thickness of the plate body at the second fixing portion.

The utility model discloses kind of electromagnetic heating cooking utensil has still been provided, be equipped with electromagnetic wire coil, fan and control circuit board in casing, the casing, control circuit board is foretell kind of circuit boards for the electromagnetic heating, the second fixed part of radiator is equipped with the fixed orifices, circuit board for the electromagnetic heating passes through the fixed orifices and fixes to the casing on.

In the embodiment of the present invention, the PCB board has an installation positioning hole, the inner side of the housing has a corresponding positioning column, and the positioning hole is sleeved outside the positioning column.

The utility model discloses an in the embodiment, the inboard of casing still is equipped with the boss double-screw bolt, and the PCB board is equipped with the screw, and the PCB board supports to press on the boss double-screw bolt.

In the embodiment of the present invention, the inner side of the housing is further provided with a buckle, and the PCB board is fixed with the buckle.

The utility model has the advantages that:

1. the utility model discloses fixed part department that corresponds the radiator on the PCB board runs through and has a plurality of louvres, makes the fixed part obtain effectively to the forced air cooling through the louvre to make IGBT and rectifier bridge on the fixed part to pile up and can obtain effectual heat dissipation, and through fixed IGBT of fixed part and rectifier bridge, make the two all can dispel the heat.

2. The height of the radiating fins above the radiator is greater than that below the radiator. The height below the heat dissipation fins is lower, so that the heat dissipation fins can be conveniently connected and fixed with the PCB.

3. The radiating holes are formed in the PCB corresponding to the IGBT. With the help of the radiating holes, cooling air can penetrate through the PCB to better cool the radiator, and the position of the cooling air corresponds to the IGBT, so that the part of the radiator corresponding to the IGBT is better air-cooled, and the IGBT is better radiated.

These features and advantages of the present invention will be disclosed in more detail in the following detailed description and the accompanying drawings.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic diagram of a circuit board for electromagnetic heating according to the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1;

fig. 3 is a sectional view of the circuit board for electromagnetic heating of the present invention;

FIG. 4 is a reverse side view of the circuit board for electromagnetic heating of the present invention;

FIG. 5 is a schematic view of an electromagnetic heating cooking appliance;

fig. 6 is an exploded view of the electromagnetic heating cooking appliance.

Reference numerals:

the heat dissipation structure comprises a PCB (printed circuit board) 1, heat dissipation holes 11, mounting positioning holes 12, screw holes 13, an IGBT2, pins 21, a rectifier bridge stack 3, a heat sink 4, fixing parts 41, second fixing parts 42, fixing holes 421, heat dissipation fins 43, screw holes 44 and a board body 45;

the electromagnetic fan comprises a shell 100, a positioning column 101, a boss stud 102, an electromagnetic wire coil 200, a fan 300 and a control circuit board 400.

[ detailed description ] embodiments

The utility model provides a circuit board for electromagnetic heating, including the PCB board, set up IGBT, rectifier bridge heap on the PCB board, and the radiator, the radiator is including being located the fixed part that is used for IGBT, rectifier bridge heap installation on the PCB board, extending to the outer second fixed part of PCB board and heat dissipation wing, is equipped with on the fixed part and supplies IGBT, the fixed platform of rectifier bridge heap, the PCB board corresponds fixed part department and runs through and has a plurality of louvres, and the diameter of louvre is 1mm to 5mm, and the interval of adjacent louvre is 1mm to 3 mm.

Example

Referring to fig. 1 and 2, the utility model provides a kinds of circuit boards for electromagnetic heating, including PCB board 1, the IGBT2, the rectifier bridge heap 3 of setting on the PCB board, and radiator 4, radiator 4 is including being located the PCB board for IGBT, rectifier bridge heap installation's fixed part 41, extend to the outer second fixed part 42 of PCB board and heat dissipation wing 43, be equipped with on the fixed part 41 and supply IGBT, rectifier bridge heap fixed platform, PCB board 1 corresponds fixed part department 41 and has run through a plurality of louvres 11, the diameter of louvre 11 is 1mm to 5mm, the interval of adjacent louvre 11 is 1mm to 3mm, make louvre 2 fixed part 387 effectively to the forced air cooling through louvre 11 to make IGBT and rectifier bridge heap on the fixed part can obtain effectual heat dissipation, particularly, can refer to fig. 1 and 4, the diameter of louvre 11 is 1mm to 5mm, when its diameter is less than 1mm, the radiating effect is limited, when its diameter is greater than 5mm, influence the intensity of and the rectifier bridge heap can be more than the broken intensity of PCB board, and the diameter of this radiator is more than the broken intensity of this, and the interval of this PCB board is more reasonable, and the influence the PCB board when the PCB board, and the interval of this PCB board, and the PCB board is more than the damaged area of PCB board, and the damaged area of this, and the PCB board, and the area of this interval of this, and the PCB board, and the area of this interval of this PCB board.

Referring to fig. 2 and 3, in the present embodiment, the heat dissipation fins 43 are located at a greater height above the heat sink than below. Because the height below the radiating fins is lower, the distance between the radiator main body and the PCB is smaller, and therefore the radiator 4 and the PCB 1 can be conveniently connected and fixed. Specifically, referring to fig. 2, the heat sink 4 is provided with screw holes 44, and the PCB board is provided with corresponding screw holes, through which screws pass to fix the heat sink 4 to the PCB board 1.

In this embodiment, referring to fig. 1, the heat sink 4 is disposed near the edge of the PCB, the second fixing portion 42 of the heat sink 4 extends to the outside of the PCB, so that the second fixing portion 42 can be fixed to the cooking device, for example, a screw hole can be disposed on the second fixing portion 42 to facilitate fixing, thereby simplifying the structure of the PCB, and increasing the utilization space of the PCB.

In this embodiment, at least a portion of the heat dissipation hole 11 is opened at the PCB corresponding to the IGBT. With the help of the radiating holes, cooling air can penetrate through the PCB to better cool the radiator, and the position of the cooling air corresponds to the IGBT, so that the part of the radiator corresponding to the IGBT is better air-cooled, and the IGBT is better radiated.

In this embodiment, the area of the PCB board with the heat dissipation holes penetrating through is half larger than the area of the th fixing portion 41 covering the PCB board, when the th fixing portion 41 covers the PCB board, the heat dissipation effect of the covering area is poor, and the area covered by the heat dissipation holes on the PCB board is larger than the covering area of the th fixing portion 41, so as to promote the heat dissipation of the covering area of the th fixing portion.

In this embodiment, referring to fig. 2, the heat dissipation hole 11 extends from the fixing portion 41 into the PCB and at least extends to the pin 21 of the IGBT2, so the pin 21 can also be cooled by air through the heat dissipation hole 11.

Referring to fig. 1-4, in the present embodiment, the heat sink 4 includes a plate 45, and heat dissipation fins 43 are disposed on two sides of the plate 45, so that a gap defined by may exist between the plate 45 and the PCB 1, and cooling air passing through the PBC through the heat dissipation holes 11 may flow in the gap between the plate 45 and the PCB 1. the plate 45 is located at the -th fixing portion 41 and has a thickness greater than that of the plate 45 located at the second fixing portion 42. since the IGBT and the bridge rectifier 3 are fixed to the -th fixing portion 41, the strength of the -th fixing portion 41 is required to be higher, so that the thickness of the plate 45 is greater, and the design may reduce the material of the plate 45 and the cost of the heat sink.

The utility model discloses a circuit board for electromagnetic heating is when the assembly, earlier with radiator 4 through the fix with screw to the PCB board, radiator 4 is being close to the pin of IGBT and rectifier bridge heap after fixing to the PCB board, through bending the pin to warp the main part that makes IGBT and rectifier bridge heap be located fixed part 41, rethread screw is fixed IGBT and rectifier bridge heap respectively on the fixed part 41 of radiator, IGBT and rectifier bridge heap can cool off with the help of with the going on of radiators, and correspond fixed part 41 department on the PCB board and run through and have a plurality of louvres, can advance through the louvre and step down the temperature of radiator, make the radiator can keep good radiating effect.

Example two

The present embodiment proposes electromagnetic heating cooking appliances, which may be an electromagnetic oven, and may also be an electric cooker or an electromagnetic heating cooking appliance such as an electric pressure cooker, and the present embodiment is described by taking an electromagnetic oven as an example, the cooking appliance of the present embodiment includes a housing 100, an electromagnetic wire coil 200, a fan 300, and a control circuit board 400, the control circuit board is a circuit board for electromagnetic heating of embodiment , referring to fig. 2 and 5, the second fixing portion 42 of the heat sink 4 is provided with a fixing hole 421, and the circuit board for electromagnetic heating is fixed to the housing 100 through the fixing hole 421, specifically, the fixing hole 421 may be a screw hole, and the circuit board is fixed to the housing 100 through the fixing hole 421 by a screw.

In this embodiment, referring to fig. 5 and 6, the PCB board 1 is provided with a mounting positioning hole 12, a corresponding positioning column 101 is disposed inside the housing 100, and the positioning hole 12 is sleeved outside the positioning column 101. The circuit board can be accurately fixed to the housing 100 by the cooperation of the positioning holes 12 and the positioning posts 101.

In this embodiment, the inner side of the casing 100 is further provided with a boss stud 102, the PCB is provided with a screw hole 13, and the PCB abuts against the boss stud 102. With the aid of the protruding stud 102, the PCB is not required to be tightly attached to the housing 100, so that the heat dissipation of the PCB can be promoted, and the heat dissipation hole 11 is facilitated to play a role of heat dissipation.

In other embodiments of the present invention, a buckle may be further disposed on the inner side of the housing, and the PCB board is fixed to the buckle. Of course, various fixing modes such as screw fixing, buckle fixing and the like can be adopted.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that the present invention includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification which does not depart from the functional and structural principles of the present invention is intended to be included within the scope of the claims.

Claims

The utility model provides a kind of circuit board for electromagnetic heating, including PCB board, IGBT, rectifier bridge heap of setting on the PCB board, and the radiator, the radiator is including being located the fixed part that is used for IGBT, rectifier bridge heap installation on the PCB board, extending to the outer second fixed part of PCB board and heat dissipation wing, is equipped with on the fixed part and supplies IGBT, the fixed platform of rectifier bridge heap, a serial communication port, the PCB board corresponds fixed part department and runs through there are a plurality of louvres, and the diameter of louvre is 1mm to 5mm, and the interval of adjacent louvre is 1mm to 3 mm.
2. The circuit board for kinds of electromagnetic heating according to claim 1, wherein the heat dissipating fins are located at a greater height above the heat sink than below the heat sink.
3. The kinds of circuit boards for electromagnetic heating as claimed in claim 1, wherein at least some of the heat dissipation holes are opened at a PCB board corresponding to the IGBT.
4. The circuit board for kinds of electromagnetic heating of claim 1, wherein the area of the PCB board having the heat dissipation holes therethrough is larger than half of the area of the fixing portion covering the PCB board.
5. The kinds of circuit boards for electromagnetic heating of claim 1, wherein the heat dissipation holes extend from the fixing portion to the inside of the PCB board at least to the pins of the IGBT.
6. The kind of electromagnetic heating circuit boards of any of claim 1 to 5, wherein the heat sink comprises a plate body, the plate body is provided with heat dissipating fins on both sides thereof, and the thickness of the plate body at the fixing portion is greater than that of the plate body at the second fixing portion.
7, electromagnetic heating cooking utensil, including the casing, is equipped with electromagnetic wire coil, fan in the casing, and control circuit board, characterized by, the control circuit board is the kind of electromagnetic heating circuit board of any of claims 1 to 6, the second fixed part of radiator is equipped with the fixed orifices, the electromagnetic heating circuit board is fixed to the casing through the fixed orifices.
8. The kinds of electromagnetic heating cooking utensil of claim 7, wherein, the PCB board has a positioning hole, the inside of the shell has a corresponding positioning post, the positioning hole is sleeved outside the positioning post.
9. The electromagnetic heating cooking utensil of claim 7, wherein the inside of the shell is further provided with a boss stud, the PCB is provided with a screw hole, and the PCB is pressed against the boss stud.
10. The electromagnetic heating cooking utensil of claim 7, wherein the inside of the shell is further provided with a buckle, and the PCB is fixed with the buckle in a clamping way.