CN218914862U - Heat radiation structure and lamp - Google Patents
Heat radiation structure and lamp Download PDFInfo
- Publication number
- CN218914862U CN218914862U CN202222638925.1U CN202222638925U CN218914862U CN 218914862 U CN218914862 U CN 218914862U CN 202222638925 U CN202222638925 U CN 202222638925U CN 218914862 U CN218914862 U CN 218914862U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- water tank
- annular water
- ribs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to the technical field of lamps and accessories thereof, in particular to a heat dissipation structure and a lamp; including heating panel, the cover that looses, rib and water-cooling heat dissipation subassembly, the water-cooling heat dissipation subassembly includes annular water tank, a plurality of heat conduction post, a plurality of semiconductor refrigeration piece and heat insulating frame, owing to all inlay between every adjacent two ribs and be equipped with a heat conduction post, carry the inside to annular water tank with the heat of a plurality of rib absorption through a plurality of heat conduction posts, and utilize a plurality of semiconductor refrigeration piece to refrigerate the water in the annular water tank, thereby utilize the water in the annular water tank and a plurality of heat conduction post heat transfer, thereby reduce the temperature of a plurality of heat conduction posts, make a plurality of rib absorptive heat carry the inside to annular water tank through a plurality of heat conduction posts all the time, thereby discharge the heat of rib absorptive, make the radiating effect more ideal.
Description
Technical Field
The utility model relates to the technical field of lamps and parts thereof, in particular to a heat dissipation structure and a lamp.
Background
The luminous plate of the lamp generates heat, the heat cannot be dissipated, the service life of the lamp is low, the existing lamp is cooled by adopting a mode of arranging cooling holes and the like, the cooling effect is poor, and the service life of the lamp is influenced.
In order to solve the problems, the prior published patent (CN 213656563U) discloses a heat dissipation structure and a lamp, and belongs to the technical field of lamps and parts thereof, wherein the heat dissipation structure comprises a heat dissipation plate, a heat dissipation sleeve and ribs, and the heat dissipation plate is provided with through holes; the heat dissipation sleeve is arranged on the heat dissipation plate, and an inner hole of the heat dissipation sleeve is opposite to the through hole; the rib quantity is a plurality of, and the rib is located on the inner wall of heat dissipation cover, and a plurality of ribs are arranged along the inner wall looks interval of heat dissipation cover, have enlarged heat radiating area through a plurality of ribs with above-mentioned structure, have improved the radiating effect.
However, in the existing lamp radiating structure, the radiating effect is improved only by arranging a plurality of ribs on the radiating sleeve and expanding the radiating area by the ribs, but the heat absorbed by the ribs cannot be discharged from the radiating sleeve, so that the radiating effect is not ideal.
Disclosure of Invention
The utility model aims to provide a heat radiation structure and a lamp, and aims to solve the technical problems that the heat radiation effect is improved in a mode that the heat radiation area is enlarged by only arranging a plurality of ribs on a heat radiation sleeve, but the heat absorbed by the ribs cannot be discharged from the heat radiation sleeve, and the heat radiation effect is not ideal.
In order to achieve the above purpose, the utility model provides a heat radiation structure, which comprises a heat radiation plate, a heat radiation sleeve, ribs and a water-cooling heat radiation assembly, wherein a through hole is formed in the heat radiation plate, the heat radiation sleeve is fixedly connected with the heat radiation plate, an inner hole of the heat radiation sleeve is opposite to the through hole, a plurality of ribs are arranged on the inner wall of the heat radiation sleeve, and the ribs are uniformly distributed on the inner wall of the heat radiation sleeve;
the water cooling heat dissipation assembly comprises an annular water tank, a plurality of heat conduction columns, a plurality of semiconductor refrigerating sheets and a heat insulation frame, wherein the annular water tank is detachably connected with the heat dissipation plate and sleeved outside the heat dissipation sleeve, a plurality of heat conduction columns are further arranged on the inner wall of the heat dissipation sleeve, one heat conduction column is embedded between every two adjacent ribs, one end, far away from the ribs, of each heat conduction column is located inside the annular water tank, a plurality of semiconductor refrigerating sheets are further arranged on the outer side wall of the annular water tank, each cold end of each semiconductor refrigerating sheet is located inside the annular water tank, a plurality of heat insulation frames are further arranged on the outer side wall of the annular water tank, and each heat insulation frame corresponds to one hot end of each semiconductor refrigerating sheet.
The upper surface of the heat dissipation sleeve is also provided with a plurality of clamping grooves, and each clamping groove corresponds to one heat conduction column.
Each semiconductor refrigerating sheet is in an arc-shaped structure, the heat insulation frame comprises a frame body and a connecting plate, the frame body is covered outside the corresponding hot end of each semiconductor refrigerating sheet, one end, close to the annular water tank, of the frame body is provided with the connecting plate, and the connecting plate is connected with the outer side wall of the annular water tank in a detachable mode.
The annular water tank comprises a tank body and a mounting ring, wherein the tank body is sleeved outside the heat dissipation sleeve, the mounting ring is arranged at one end, close to the heat dissipation plate, of the tank body, and the mounting ring is detachably connected with the heat dissipation plate.
The heat dissipation structure further comprises a plurality of heat extraction components, and each heat insulation frame is provided with the heat extraction components at one end far away from the annular water tank.
Each heat extraction component comprises a mounting frame and an exhaust fan, wherein the mounting frame is mounted inside the heat insulation frame and located at one end, far away from the annular water tank, of the heat insulation frame, and the exhaust fan is arranged on the mounting frame.
The utility model also provides a lamp, which comprises the radiating structure, a bottom cover, a circuit board, a main light source and a lamp shade, wherein the circuit board is arranged on the bottom cover, the radiating plate is arranged above the bottom cover through screws, the main light source is arranged at one end of the radiating sleeve, which is far away from the radiating plate, the main light source is electrically connected with the circuit board, a connecting circuit between the main light source and the circuit board penetrates through the inside of the radiating sleeve, one end of each heat insulation frame, which is far away from the annular water tank, penetrates through the bottom cover, and the lamp shade is detachably connected with the bottom cover and covers the outside of the main light source.
According to the radiating structure and the lamp, the radiating area is enlarged by arranging the ribs in the radiating sleeve, so that the radiating effect is improved, the heat absorbed by the ribs is conveyed to the inside of the annular water tank through the plurality of heat conducting columns as the heat conducting columns are embedded between every two adjacent ribs, the water in the annular water tank is refrigerated through the plurality of semiconductor refrigerating sheets, the water in the annular water tank is used for exchanging heat with the plurality of heat conducting columns, the temperature of the plurality of heat conducting columns is reduced, the heat absorbed by the ribs is always conveyed to the inside of the annular water tank through the plurality of heat conducting columns, and the heat absorbed by the ribs is discharged, so that the radiating effect is more ideal.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a heat dissipation structure according to a first embodiment of the present utility model.
Fig. 2 is a schematic view of a first embodiment of the present utility model without a heat insulating frame.
Fig. 3 is an enlarged view of a partial structure at a of fig. 2 provided by the present utility model.
Fig. 4 is a schematic structural diagram of a heat dissipating structure according to a second embodiment of the present utility model.
Fig. 5 is a schematic diagram of a split structure of a lamp provided by the utility model.
101-cooling plate, 102-cooling jacket, 103-rib, 104-annular water tank, 105-heat conduction column, 106-semiconductor refrigerating sheet, 107-heat insulation frame, 108-box, 109-mounting ring, 110-through hole, 111-clamping groove, 112-frame, 113-connecting plate, 201-heat extraction component, 202-mounting frame, 203-exhaust fan, 301-bottom cover, 302-circuit board, 303-main light source and 304-lampshade.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
First embodiment:
referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of a heat dissipating structure according to a first embodiment, fig. 2 is a schematic structural diagram of a heat insulating frame not mounted in the first embodiment, and fig. 3 is a partial enlarged structural diagram of a portion a of fig. 2.
The utility model provides a heat dissipation structure: the heat radiation device comprises a heat radiation plate 101, a heat radiation sleeve 102, ribs 103 and a water cooling heat radiation assembly, wherein the water cooling heat radiation assembly comprises an annular water tank 104, a plurality of heat conduction columns 105, a plurality of semiconductor refrigerating sheets 106 and a heat insulation frame 107, and the annular water tank 104 comprises a tank body 108 and a mounting ring 109. The problem that the heat dissipation effect is not ideal enough because the heat absorbed by the ribs 103 cannot be discharged from the heat dissipation sleeve 102 is solved by the scheme that the heat dissipation effect is improved only by arranging the ribs 103 on the heat dissipation sleeve 102 and expanding the heat dissipation area by the ribs 103 is solved.
For this embodiment, the through hole 110 is provided on the heat dissipation plate 101, the heat dissipation sleeve 102 is fixedly connected with the heat dissipation plate 101, the inner hole of the heat dissipation sleeve 102 is opposite to the through hole 110, a plurality of ribs 103 are provided on the inner wall of the heat dissipation sleeve 102, the ribs 103 are uniformly distributed on the inner wall of the heat dissipation sleeve 102, and the heat dissipation area is enlarged by adopting the above structure through the mode that a plurality of ribs 103 are provided in the heat dissipation sleeve 102, thereby improving the heat dissipation effect.
Wherein the annular water tank 104 is detachably connected with the heat dissipation plate 101 and sleeved outside the heat dissipation sleeve 102, a plurality of heat conduction columns 105 are further arranged on the inner wall of the heat dissipation sleeve 102, one heat conduction column 105 is embedded between each two adjacent ribs 103, one end of each heat conduction column 105 far away from the ribs 103 is positioned inside the annular water tank 104, a plurality of semiconductor refrigerating sheets 106 are further arranged on the outer side wall of the annular water tank 104, the cold end of each semiconductor refrigerating sheet 106 is positioned inside the annular water tank 104, a plurality of heat insulation frames 107 are further arranged on the outer side wall of the annular water tank 104, each heat insulation frame 107 corresponds to the hot end of one semiconductor refrigerating sheet 106, as one heat conduction column 105 is embedded between each two adjacent ribs 103, the heat absorbed by the ribs 103 is conveyed to the inside of the annular water tank 104 through the heat conducting columns 105, the semiconductor refrigerating sheets 106 are used for refrigerating water in the annular water tank 104, so that the water in the annular water tank 104 exchanges heat with the heat conducting columns 105, the temperature of the heat conducting columns 105 is reduced, the heat absorbed by the ribs 103 is always conveyed to the inside of the annular water tank 104 through the heat conducting columns 105, the heat absorbed by the ribs 103 is discharged, the heat dissipation effect is more ideal, and the heat dissipation effect is prevented from being influenced by the fact that the heat dissipated by the heat end of the semiconductor refrigerating sheet 106 is overflowed at the heat dissipation sleeve 102 due to the heat shielding frame 107.
Secondly, a plurality of clamping grooves 111 are further formed in the upper surface of the heat dissipation sleeve 102, and each clamping groove 111 corresponds to one heat conduction column 105, and the clamping grooves 111 are formed in the upper surface of the heat dissipation sleeve 102, so that the heat conduction columns 105 can be mounted more conveniently.
Meanwhile, each semiconductor refrigerating sheet 106 is arranged in an arc structure, the heat insulation frame 107 comprises a frame 112 and a connecting plate 113, the frame 112 is covered outside the corresponding hot end of the semiconductor refrigerating sheet 106, one end, close to the annular water tank 104, of the frame 112 is provided with the connecting plate 113, the connecting plate 113 is connected with the outer side wall of the annular water tank 108 in a detachable mode, each semiconductor refrigerating sheet 106 is arranged in an arc structure, the semiconductor refrigerating sheet 106 is installed on the annular water tank 104 more conveniently, the connecting plate 113 is fixed on the annular water tank 104 by using screws, the heat insulation frame 107 is installed, the connecting plate 113 is fixedly connected with the frame 112, and the structure is firmer by adopting an integral molding technology in manufacturing.
In addition, the case 108 is sleeved outside the heat dissipation sleeve 102, the mounting ring 109 is disposed at one end of the case 108 near the heat dissipation plate 101, the mounting ring 109 is detachably connected with the heat dissipation plate 101, and after the case 108 is sleeved outside the heat dissipation sleeve 102, the mounting ring 109 is fixed on the heat dissipation plate 101 by using screws, so that the installation of the annular water tank 104 is completed.
When the heat dissipation structure of the embodiment is used, the heat dissipation area is enlarged by arranging the ribs 103 in the heat dissipation sleeve 102, so that the heat dissipation effect is improved, the heat dissipation effect is more ideal because the heat dissipation effect is discharged by embedding the ribs 103 between every two adjacent ribs 103, the heat dissipation effect is more ideal because the heat dissipation effect is formed by covering the semiconductor cooling fins 106 with the heat insulation frame 107, and the heat dissipation effect is prevented from being influenced by the heat dissipation effect of the semiconductor cooling fins 106 at the heat dissipation sleeve 102 due to the heat dissipation of the semiconductor cooling fins 106.
Second embodiment:
referring to fig. 4, fig. 4 is a schematic structural diagram of a heat dissipation structure according to a second embodiment.
The utility model provides a heat dissipation structure further comprising a plurality of heat extraction assemblies 201, wherein each heat extraction assembly 201 comprises a mounting frame 202 and an exhaust fan 203.
For this embodiment, the heat extraction assembly 201 is disposed at one end of each heat insulation frame 107 away from the annular box 108, and the heat extraction assembly 201 is disposed at one end of each heat insulation frame 107 away from the annular box 108, so that the heat extraction assembly 201 is utilized to accelerate the discharge rate of heat emitted by the hot end of the semiconductor refrigeration sheet 106, thereby reducing the temperature of the hot end of the semiconductor refrigeration sheet 106, and making the refrigeration effect of the cold end of the semiconductor refrigeration sheet 106 better.
Wherein, the mounting bracket 202 is installed the inside of heat insulating frame 107, and is located the heat insulating frame 107 is kept away from the one end of annular water tank 104, be provided with on the mounting bracket 202 exhaust fan 203 the one end that the heat insulating frame 107 kept away from annular water tank 104 is installed the mounting bracket 202 install exhaust fan 203 on the mounting bracket 202, utilize exhaust fan 203 to accelerate the rate of discharge of the heat that the hot junction of semiconductor refrigeration piece 106 gives off.
When the heat radiation structure and the lamp are used, the mounting frame 202 is mounted at one end, far away from the annular water tank 104, of the heat insulation frame 107, the exhaust fan 203 is mounted on the mounting frame 202, and the exhaust fan 203 is utilized to accelerate the discharge rate of heat emitted by the hot end of the semiconductor refrigerating sheet 106, so that the temperature of the hot end of the semiconductor refrigerating sheet 106 is reduced, and the refrigerating effect of the cold end of the semiconductor refrigerating sheet 106 is better.
Referring to fig. 5, the present utility model further provides a lamp, including the heat dissipation structure described above, and further including a bottom cover 301, a circuit board 302, a main light source 303, and a lamp cover 304, where the bottom cover 301 is provided with the circuit board 302, the heat dissipation plate 101 is mounted above the bottom cover 301 by screws, the main light source 303 is disposed at an end of the heat dissipation sleeve 102 away from the heat dissipation plate 101, the main light source 303 is electrically connected with the circuit board 302, a connection line between the main light source 303 and the circuit board 302 is disposed inside the heat dissipation sleeve 102, one end of each heat insulation frame 107 away from the annular water tank 104 extends through the bottom cover 301, and the lamp cover 304 is detachably connected with the bottom cover 301 and covers the outside of the main light source 303.
In this embodiment, the connection line between the main light source 303 and the circuit board 302 is disposed through the heat dissipation sleeve 102, so that the ribs 103 disposed on the inner wall of the heat dissipation sleeve 102 absorb heat generated during operation of the connection line, so as to dissipate heat of the lamp, and since one end of each heat insulation frame 107, which is far away from the annular water tank 104, penetrates through the bottom cover 301, heat emitted by the hot end of the semiconductor refrigeration sheet 106 is transferred to the outside of the lamp through the heat insulation frame 107, so that heat emitted by the hot end of the semiconductor refrigeration sheet 106 is prevented from overflowing and dissipating inside the lamp, and the heat dissipation effect is affected.
The above disclosure is only a preferred embodiment of the present utility model, and it should be understood that the scope of the utility model is not limited thereto, and those skilled in the art will appreciate that all or part of the procedures described above can be performed according to the equivalent changes of the claims, and still fall within the scope of the present utility model.
Claims (7)
1. The heat dissipation structure comprises a heat dissipation plate, a heat dissipation sleeve and ribs, wherein the heat dissipation plate is provided with a through hole, the heat dissipation sleeve is fixedly connected with the heat dissipation plate, an inner hole of the heat dissipation sleeve is opposite to the through hole, the inner wall of the heat dissipation sleeve is provided with a plurality of ribs, the ribs are uniformly distributed on the inner wall of the heat dissipation sleeve,
the device also comprises a water cooling assembly;
the water cooling heat dissipation assembly comprises an annular water tank, a plurality of heat conduction columns, a plurality of semiconductor refrigerating sheets and a heat insulation frame, wherein the annular water tank is detachably connected with the heat dissipation plate and sleeved outside the heat dissipation sleeve, a plurality of heat conduction columns are further arranged on the inner wall of the heat dissipation sleeve, one heat conduction column is embedded between every two adjacent ribs, one end, far away from the ribs, of each heat conduction column is located inside the annular water tank, a plurality of semiconductor refrigerating sheets are further arranged on the outer side wall of the annular water tank, each cold end of each semiconductor refrigerating sheet is located inside the annular water tank, a plurality of heat insulation frames are further arranged on the outer side wall of the annular water tank, and each heat insulation frame corresponds to one hot end of each semiconductor refrigerating sheet.
2. The heat dissipating structure of claim 1,
the upper surface of the heat dissipation sleeve is also provided with a plurality of clamping grooves, and each clamping groove corresponds to one heat conduction column respectively.
3. The heat dissipating structure of claim 1,
every semiconductor refrigeration piece all is the arc structure setting, the heat insulating frame includes framework and connecting plate, the framework cover is established in the outside of the hot junction of corresponding semiconductor refrigeration piece, the framework is close to the one end of annular water tank is provided with the connecting plate, the connecting plate with the lateral wall of annular water tank is dismantled and is connected.
4. The heat dissipating structure of claim 1,
the annular water tank comprises a tank body and a mounting ring, wherein the tank body is sleeved outside the heat dissipation sleeve, the mounting ring is arranged at one end, close to the heat dissipation plate, of the tank body, and the mounting ring is detachably connected with the heat dissipation plate.
5. The heat dissipating structure of claim 1,
the heat dissipation structure further comprises a plurality of heat extraction components, and each heat extraction component is arranged at one end, far away from the annular water tank, of each heat insulation frame.
6. The heat dissipating structure of claim 5, wherein,
every the heat extraction subassembly all includes mounting bracket and exhaust fan, the mounting bracket is installed the inside of heat insulating frame, and be located the heat insulating frame is kept away from the one end of annular water tank, be provided with on the mounting bracket the exhaust fan.
7. A lamp comprising the heat dissipating structure of claim 1,
still include bottom, circuit board, main light source and lamp shade, be provided with on the bottom the circuit board, the heating panel passes through the screw and installs the top of bottom, main light source sets up the cooling jacket is kept away from the one end of heating panel, main light source with circuit board electric connection, main light source with connecting wire between the circuit board wears to locate the inside of cooling jacket, every the heat-insulating frame is kept away from the one end of annular water tank all runs through the bottom, the lamp shade with the connection is dismantled to the bottom, and the cover is established the outside of main light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222638925.1U CN218914862U (en) | 2022-10-08 | 2022-10-08 | Heat radiation structure and lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222638925.1U CN218914862U (en) | 2022-10-08 | 2022-10-08 | Heat radiation structure and lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218914862U true CN218914862U (en) | 2023-04-25 |
Family
ID=86050306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222638925.1U Active CN218914862U (en) | 2022-10-08 | 2022-10-08 | Heat radiation structure and lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218914862U (en) |
-
2022
- 2022-10-08 CN CN202222638925.1U patent/CN218914862U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110425435B (en) | Novel LED lamp with high-efficiency heat dissipation | |
| KR100939531B1 (en) | An apparatus for radiating heat of led lamp | |
| CN209749037U (en) | Heat radiator for photovoltaic inverter | |
| CN218914862U (en) | Heat radiation structure and lamp | |
| CN211146420U (en) | Heat radiator for L ED emitting diode | |
| CN216357881U (en) | Electrical control equipment of filtering system | |
| CN211184323U (en) | Internal isolation heat dissipation device for ballast | |
| CN212011625U (en) | Low-power consumption power module | |
| CN212211785U (en) | Case is deposited to intelligent control board with heat radiation structure | |
| CN211475637U (en) | High-efficient radiating LED street lamp | |
| CN218763269U (en) | LED lamp convenient to heat dissipation | |
| CN108224123B (en) | High-efficient heat dissipation type LED lamp | |
| CN219476424U (en) | High-power transformer for LED lamp | |
| CN219222135U (en) | Heat radiation structure of LED illuminating lamp | |
| CN218209475U (en) | Aluminum substrate and lampshade fixing structure for LED lamp | |
| CN210185298U (en) | Cooking equipment with LED illumination | |
| CN208903973U (en) | A kind of xenon lamp heat radiation module | |
| CN212080920U (en) | Glass wick heat abstractor | |
| CN215807953U (en) | High-power integrated LED lamp | |
| CN212805391U (en) | Semiconductor LED lamp heat radiation structure | |
| CN219718264U (en) | Router with good heat dissipation characteristic | |
| CN219351046U (en) | Novel distribution box | |
| CN220526688U (en) | Magnetic coil with heat radiation structure | |
| CN219046591U (en) | Circuit board chip radiating shell | |
| CN212204418U (en) | Outdoor lamp shell capable of dissipating heat quickly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |