CN205625581U - Cooking utensil and heat abstractor thereof - Google Patents

Abstract

The utility model provides a cooking utensil and a heat dissipation device thereof. Wherein the heat dissipation device of the cooking appliance includes a circuit board, a radiator and a fan, and components are installed on the circuit board; the radiator is arranged on the circuit board; the fan is arranged above the top surface of the radiator; The cooling vents on the top and bottom surfaces of the radiator, so that the fan blows the external cold air to the components through the cooling vents; or, a heat dissipation channel is formed between the radiator and the circuit board through the top and bottom surfaces of the radiator, so that The fan blows the external cold air to the components through the heat dissipation channel. The heat dissipation device of the cooking utensil provided by the utility model, by opening a heat dissipation port on the heat sink or forming a heat dissipation channel between the heat sink and the circuit board, the fan directly blows the external cold air to the heat sink mounted on the heat sink through the heat dissipation port or the heat dissipation channel. Inductors, capacitors and other components on the back can achieve a good heat dissipation effect on the components on the circuit board and prolong the service life of the circuit board.

Description

Cooking appliance and its cooling device

technical field

The utility model relates to the field of kitchen utensils, in particular to a heat dissipation device for a cooking appliance and a cooking appliance including the heat dissipation device.

Background technique

Existing electromagnetic cooking utensils, such as IH (electromagnetic heating) electric rice cookers, are mainly composed of circuit board components (comprising circuit boards, components, heat sinks, etc.), fans, coil disks, inner pots, etc.; The components on the board itself will generate heat, and the coil of the coil plate will also generate heat due to its own resistance. At the same time, due to the induction of the inner pot’s magnetic field, the heat will be radiated to the inside of the rice cooker and will also increase the temperature of the inner cavity of the rice cooker.

Generally speaking, the internal heat of the rice cooker is dissipated by the fan mounted on the circuit board assembly. The fan is close to the heat sink, and the IGBT (Insulated Gate Bipolar Transistor) and the bridge stack, which generate the most heat on the circuit board, are directly connected to the heat sink. On-chip, and the heat dissipation surface of the IGBT and the bridge stack is completely close to the heating surface of the heat sink, and the fan blows the air to the heat sink to dissipate the heat generated by the IGBT and the bridge stack.

However, because the heat sink is generally a whole piece and the end is attached to the circuit board, the wind from the fan can only blow to the front of the heat sink, that is, the surface of the flow guide slot, and pass through the fins on both sides of the flow guide slot. The back of the heat sink is a windless area, and the heat generated by the components in this area will gradually accumulate, and the surface temperature of the components will also rise; generally, the airless area of the circuit board will have For components such as inductors, resistors, and capacitors, if a large current passes through the circuit board, the temperature rise of the components such as inductors will exceed the standard, which will affect the life of the circuit board and may even cause safety problems.

Utility model content

The utility model aims at at least solving one of the technical problems existing in the prior art.

Therefore, an object of one aspect of the present invention is to provide a heat dissipation device for cooking utensils that can effectively cool down the components mounted on the back of the heat sink on the circuit board.

The object of another aspect of the present utility model is to provide a cooking appliance comprising the above-mentioned heat dissipation device for the cooking appliance.

In order to achieve the above object, an embodiment of one aspect of the present invention provides a heat dissipation device for cooking utensils, including: a circuit board, on which components are installed; on the board; and a fan, the fan is located above the top surface of the radiator; wherein, the radiator is provided with a heat dissipation port that runs through the top surface and the bottom surface of the radiator, so that the fan Blow the external cold air to the components through the heat dissipation port; or, a heat dissipation channel passing through the top surface and the bottom surface of the heat sink is formed between the heat sink and the circuit board, so that the fan The external cold air is blown to the components through the heat dissipation channel.

The heat dissipation device of the cooking utensil provided by the above-mentioned embodiments of the utility model includes a circuit board, a heat sink and a fan. The heat dissipation channels on the top and bottom surfaces of the radiator, so that the fan can directly blow the external cold air to the windless area on the back of the radiator through the cooling opening or cooling channel, so that the airflow can be formed in the airless area, so that the circuit installed on the The heat generated by components such as inductors, capacitors, and resistors on the board during the working process is discharged due to the flow of airflow, thereby achieving a good heat dissipation effect on the components on the circuit board, effectively solving the problem of existing technology. The middle fan can only blow to the front of the heat sink, and the back of the heat sink is a windless area, so the components installed on the back of the heat sink cannot cool down well, which will cause the temperature rise of the components to exceed the standard, affect the service life of the circuit board, and even cause safety hazards. The situation of the problem occurs, and the structure is simple and the processing is convenient.

It should be noted that the position and shape of the vent or heat dissipation channel can be adjusted according to the position and quantity of components on the back of the radiator. As long as it does not deviate from the concept of the utility model, it is within the scope of protection of the utility model.

In addition, the heat dissipation device of the cooking utensil provided by the above-mentioned embodiments of the utility model also has the following additional technical features:

According to an embodiment of the present invention, one end of the heat sink is connected to the circuit board, and the heat sink is provided with a heat dissipation port penetrating through the top surface and the bottom surface of the heat sink, and the heat dissipation The mouth is opened at a position close to the one end.

In the above-mentioned embodiment, the heat dissipation port is provided on the heat sink, and is close to the end connected to the heat sink and the circuit board, so that the heat dissipation port can be effectively ensured that the components on the circuit board are directly opposite to each other, so that the fan can direct the external cold air Blow to the components, so as to effectively ensure the cooling effect of the components.

According to an embodiment of the present invention, one end of the heat sink is connected to the circuit board, and the heat sink is provided with a heat dissipation port penetrating through the top surface and the bottom surface of the heat sink, and the heat dissipation The opening is a heat dissipation gap opened at the one end.

In the above-mentioned embodiment, the heat dissipation port is opened on the heat sink, and it is a heat dissipation gap opened at one end of the heat sink connected to the circuit board, which can further ensure the contact area between the heat dissipation port and the circuit board, thereby effectively ensuring the external The cold air can dissipate heat from the components on the circuit board through the heat dissipation port, which makes the processing of the heat dissipation port convenient and low in cost.

According to an embodiment of the present invention, an IGBT and a bridge stack are installed on the bottom surface of the heat sink, and the heat dissipation opening is opened between the IGBT and the bridge stack .

In the above embodiment, the IGBT and the bridge stack are installed on the bottom surface of the radiator, that is, the heat dissipation surface of the IGBT and the bridge stack is in close contact with the bottom surface of the radiator, and the radiator is blown by a fan. Dissipate the heat generated when the insulated gate bipolar transistor and the bridge stack work; the heat dissipation port is opened between the insulated gate bipolar transistor and the bridge stack, on the one hand, it is convenient for the inductance, capacitance, resistance on the circuit board on the back of the radiator At the same time that the components and components are effectively cooled, the IGBT and the bridge stack are further effectively cooled by the flowing airflow blowing to the back of the radiator; on the other hand, the setting of the heat dissipation port does not affect the IGBT and the bridge. Normal assembly of the bridge stack.

According to an embodiment of the present utility model, one end of the radiator is connected to the circuit board, and a top surface penetrating the radiator is formed between the one end of the radiator and the circuit board. and the installation gap on the bottom surface, the installation gap is the heat dissipation channel.

In the above-mentioned embodiment, when the heat sink and the circuit board are assembled, an installation gap penetrating the top surface and the bottom surface of the heat sink is formed between the heat sink and the circuit board, so that the fan can blow the external cold air through the installation gap to the Inductors, resistors, capacitors and other components on the back of the radiator can effectively cool down the components; and a heat dissipation channel is directly formed between the radiator and the circuit board without additional cooling ports on the radiator, making the whole The processing of the cooling device is simple and the molding is convenient.

According to an embodiment of the present invention, the bottom surface of the heat sink is perpendicular to the circuit board, and the top surface of the heat sink is disposed close to the edge of the circuit board.

According to an embodiment of the present invention, the heat sink includes a plurality of heat sinks arranged at intervals, and a flow guide groove is formed between two adjacent heat sink fins, and the length direction of the flow guide groove is parallel to the circuit. plate.

In the above-mentioned embodiment, a part of the wind blown by the fan to the radiator is directed to the coil disk of the cooking utensil from the guide groove, so as to effectively dissipate the heat generated by the coil of the coil disk due to its own resistance during operation; The heat dissipation opening on the heat sink or the heat dissipation channel formed between the heat sink and the circuit board directly blows to the components such as inductors, capacitors, and resistors installed on the back of the heat sink, so that the heat generated by these components during work is due to the airflow The flow is drained away to realize the effect of effectively dissipating heat from the components on the circuit board.

An embodiment of another aspect of the present invention provides a cooking appliance, comprising: a body, a coil disk is disposed in the body; and the heat dissipation device of the cooking appliance according to any one of the above-mentioned embodiments.

The cooking utensil provided by the above-mentioned embodiments of the utility model includes a body and a heat dissipation device installed on the body, and a part of the wind blown by the fan of the heat dissipation device passes through the heat dissipation port provided on the radiator or the heat dissipation formed between the radiator and the circuit board. The channel directly blows to the components such as inductors, capacitors, and resistors installed on the back of the radiator to achieve effective cooling of the components on the circuit board.

According to an embodiment of the present invention, the circuit board support, the circuit board is mounted on the circuit board support, the circuit board support is provided with air guiding ribs, and the air guiding ribs are located on the fan of the heat dissipation device. The front of the air outlet is used to guide the wind to the coil disk.

In the above-mentioned embodiment, the circuit board support realizes the fixing effect on the circuit board, and the air guide rib is provided on the circuit board support, and the other part of the wind blown by the fan of the heat dissipation device is further blown to the coil disk in the body along the air guide rib. Realize the heat dissipation effect on the coil disk, so as to achieve the effective heat dissipation effect on the circuit board and the coil disk at the same time, so as to effectively ensure that the heat dissipation effect on the coil disk and the circuit board can be realized at the same time by using one fan.

According to one embodiment of the present utility model, the cooking appliance is an IH electric rice cooker or an IH electric pressure cooker.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will become apparent from the description which follows, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present utility model will become apparent and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

Fig. 1 is a three-dimensional schematic diagram of a partial structure of a cooking utensil according to an embodiment of the present invention;

Fig. 2 is a schematic top view of a partial structure of the cooking utensil shown in Fig. 1;

Fig. 3 is a schematic cross-sectional view of a partial structure of the cooking utensil shown in Fig. 1;

Fig. 4 is a schematic cross-sectional structural view of the heat dissipation device shown in Fig. 3 assembled on the circuit board support;

Fig. 5 is a three-dimensional structural schematic diagram of the heat dissipation device shown in Fig. 4 assembled on the circuit board support;

Fig. 6 is a schematic cross-sectional structural view of the heat dissipation device according to another embodiment of the present invention assembled on the circuit board support;

FIG. 7 is a schematic diagram of the assembly structure of the radiator and the circuit board in the heat dissipation device shown in FIG. 6 .

Wherein, the corresponding relationship between reference numerals and component names in Fig. 1 to Fig. 7 is:

10 circuit board, 101 components, 20 radiator, 201 heat dissipation port, 202 heat dissipation channel, 203 insulated gate bipolar transistor, 204 bridge stack, 205 heat sink, 206 diversion groove, 30 fan, 40 body, 50 coil plate , 60 circuit board brackets, 601 air guide ribs.

detailed description

In order to more clearly understand the above purpose, features and advantages of the utility model, the utility model will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

In the following description, a lot of specific details are set forth in order to fully understand the utility model, but the utility model can also be implemented in other ways different from those described here, therefore, the protection scope of the utility model is not limited by the following disclosure The limitations of specific examples.

The heat dissipation device and the cooking appliance according to some embodiments of the present utility model will be described below with reference to the accompanying drawings.

As shown in FIGS. 1 to 7 , the embodiment of the first aspect of the present invention provides a heat dissipation device for a cooking appliance, including: a circuit board 10 , a radiator 20 and a fan 30 .

Wherein, components and parts 101 are installed on the circuit board 10; Radiator 20 is located on the circuit board 10; Fan 30 is arranged on the top surface of radiator 20; The heat dissipation opening 201 that runs through the top surface and the bottom surface of the heat sink 20, so that the fan 30 blows the external cold air to the component 101 through the heat dissipation opening 201; or, as shown in Figures 6 and 7, the heat sink 20 and the circuit board 10 A heat dissipation channel 202 is formed between the top surface and the bottom surface of the heat sink 20 , so that the fan 30 blows the external cold air to the component 101 through the heat dissipation channel 202 .

The heat dissipation device of the cooking utensil provided by the above-mentioned embodiments of the utility model includes a circuit board 10, a heat sink 20 and a fan 30, and the heat sink 20 is provided with a heat dissipation port 201 that runs through its top surface and bottom surface, or the heat sink 20 and the circuit A heat dissipation channel 202 is formed between the plates 10 to pass through the top surface and the bottom surface of the radiator 20, so that the fan 30 can directly blow the external cold air to the windless area on the back side of the radiator 20 through the heat dissipation opening 201 or the heat dissipation channel 202, thereby Make the windless area form an airflow, so that the heat generated by components 101 such as inductors, capacitors, and resistors installed on the circuit board 10 in the working process can be discharged due to the flow of airflow, thereby realizing the protection of the circuit board 10. The effect of the components 101 on the heat dissipation is good, which effectively solves the problem that in the prior art, the fan 30 can only blow to the front of the heat sink, and the back of the heat sink is a windless area, so that the components 101 installed on the back of the heat sink cannot cool down well. As a result, the temperature rise of the components 101 exceeds the standard, affecting the service life of the circuit board 10 , and even causing safety problems. The structure is simple and the processing is convenient.

It should be noted that the position and shape of the heat dissipation opening 201 or the heat dissipation channel 202 can be adjusted according to the position and quantity of the components 101 on the back of the radiator 20. within range.

In the first embodiment of the present utility model, one end of the heat sink 20 is connected to the circuit board 10, and the heat sink 20 is provided with a heat dissipation port 201 that runs through the top surface and the bottom surface of the heat sink 20, and the heat dissipation port 201 is opened at a position near one end.

In the above-mentioned embodiment, the heat dissipation port 201 is provided on the heat sink 20 and is close to one end of the heat sink 20 connected to the circuit board 10, so that it can effectively ensure that the heat dissipation port 201 is arranged directly opposite to the components 101 on the circuit board 10, As a result, the fan 30 blows the external cold air directly to the component 101 , thereby effectively ensuring the effect of cooling the component 101 .

In the second embodiment of the present utility model, as shown in FIGS. The heat dissipation opening 201, and the heat dissipation opening 201 is a heat dissipation gap opened at one end.

In the above-mentioned embodiment, the heat dissipation port 201 is provided on the heat sink 20, and is a heat dissipation gap provided at one end of the heat sink 20 connected to the circuit board 10, so that the contact area between the heat dissipation port 201 and the circuit board 10 can be further ensured, Therefore, it can effectively ensure the cooling effect of the external cold air on the components 101 on the circuit board 10 through the cooling vents 201 , and make the processing of the cooling vents 201 convenient and low in cost.

Further, as shown in FIG. 5 , an IGBT 203 and a bridge stack 204 are installed on the bottom surface of the heat sink 20 , and a heat dissipation port 201 is opened between the IGBT 203 and the bridge stack 204 .

In the above embodiment, the IGBT 203 and the bridge stack 204 are installed on the bottom surface of the heat sink 20, that is, the heat dissipation surfaces of the IGBT 203 and the bridge stack 204 are in close contact with the bottom surface of the heat sink 20 The fan 30 blows the heat sink 20 to dissipate the heat generated when the IGBT 203 and the bridge stack 204 work; While effectively cooling the components 101 such as inductors, capacitors, and resistors on the circuit board 10 on the back of the radiator 20, the insulated gate bipolar transistor 203 and the bridge stack 204 are further effectively cooled by the flowing air flow blown to the back of the radiator 20. Lowering the temperature; on the other hand, the setting of the heat dissipation vent 201 does not affect the normal assembly of the IGBT 203 and the bridge stack 204 .

In the third embodiment of the present utility model, as shown in Figure 6 and Figure 7, one end of the radiator 20 is connected to the circuit board 10, and a through radiator is formed between one end of the radiator 20 and the circuit board 10 The installation gap between the top surface and the bottom surface of 20 is the heat dissipation channel 202 .

In the above embodiment, when the heat sink 20 is assembled with the circuit board 10, an installation gap penetrating the top surface and the bottom surface of the heat sink 20 is formed between the heat sink 20 and the circuit board 10, so that the fan 30 can pass the external cold air through the heat sink 20 and the circuit board 10. The installation gap is blown to components 101 such as inductors, resistors, and capacitors installed on the back side of the heat sink 20 to realize an effective cooling effect on the components 101; It is necessary to additionally provide a heat dissipation port 201 on the radiator 20, so that the processing and molding of the entire heat dissipation device are simple.

In some embodiments of the present invention, as shown in FIG. 5 and FIG. 7 , the bottom surface of the radiator 20 is perpendicular to the circuit board 10 , and the top surface of the radiator 20 is disposed close to the edge of the circuit board 10 .

Further, as shown in FIG. 1 , FIG. 2 and FIG. 5 , the radiator 20 includes a plurality of cooling fins 205 arranged at intervals, and a flow guide groove 206 is formed between two adjacent cooling fins 205 , and the length direction of the flow guide groove 206 is parallel to the circuit board 10 .

In the above-mentioned embodiment, a part of the wind blown by the fan 30 to the radiator 20 is directed from the flow guide groove 206 to the coil disk of the cooking utensil, so as to effectively dissipate the heat generated by the coil of the coil disk due to its own resistance during the working process; A part is blown directly to components 101 such as inductors, capacitors, and resistors installed on the back side of the radiator 20 from the heat dissipation opening 201 provided on the radiator 20 or the heat dissipation channel 202 formed between the radiator 20 and the circuit board 10, so that these components The heat generated by the device 101 during operation is dissipated due to the flow of the airflow, so as to achieve the effect of effectively dissipating heat from the components 101 on the circuit board 10 .

An embodiment of another aspect of the present invention provides a cooking utensil, as shown in Figure 1 and Figure 3, comprising: a body 40 and the heat dissipation device of the cooking utensil described in any of the above-mentioned embodiments, wherein the inside of the body 40 A coil disk 50 is provided.

The cooking utensil provided by the above-mentioned embodiments of the utility model includes a body 40 and a heat dissipation device installed on the body 40, and a part of the wind blown out by the fan 30 of the heat dissipation device is blown to the radiator, and passes through the heat dissipation port 201 provided on the radiator 20. Or the heat dissipation channel 202 formed between the heat sink 20 and the circuit board 10 directly blows to the components 101 such as inductors, capacitors, and resistors installed on the back of the heat sink 20, so as to realize the effective heat dissipation of the components 101 on the circuit board 10 Effect.

In one embodiment of the present utility model, as shown in Fig. 3, Fig. 4 and Fig. 6, the cooking utensil also includes a circuit board support 60, the circuit board 10 is installed on the circuit board support 60, and the circuit board support 60 is provided with The air guiding rib 601 is located in front of the air outlet of the fan 30 of the cooling device, and is used to guide the wind to the coil disk 50 .

In the above-mentioned embodiment, the circuit board support 60 realizes the fixing function to the circuit board 10, and the circuit board support 60 is provided with an air guiding rib 601, and the other part of the wind blown by the fan 30 of the cooling device is further blown along the air guiding rib 601 to The coil disk 50 in the main body realizes the heat dissipation effect on the coil disk 50, thereby achieving the effect of effectively cooling the circuit board 10 and the coil disk 50 at the same time, so as to effectively ensure that the coil disk 50 and the circuit board 50 can be cooled by using a fan 30 at the same time. The cooling effect of the plate 10.

In some embodiments of the present utility model, the cooking appliance is an IH electric rice cooker or an IH electric pressure cooker.

Of course, the cooking utensils can also be other cooking utensils that simultaneously dissipate heat to the circuit board 10 and the heating device through the fan 30, in addition to the above-mentioned IH electric rice cooker or IH electric pressure cooker. within the scope of protection of utility models.

In summary, the heat dissipation device of the cooking utensil provided by the utility model, by opening a heat dissipation port on the heat sink or forming a heat dissipation channel between the heat sink and the circuit board, a part of the wind blown by the fan of the heat dissipation device passes through the heat sink The diversion groove on the top blows to the coil disk in the main body to realize the heat dissipation effect on the coil disk, and because the insulated gate bipolar transistor and the bridge stack on the circuit board are close to the bottom surface of the radiator, the heat is directly blown by the fan The radiator realizes the cooling effect on the insulated gate bipolar transistor and the bridge stack; the other part blows directly to the inductor installed on the back of the radiator through the cooling opening on the radiator or the cooling channel formed between the radiator and the circuit board. , Capacitors, resistors and other components, to achieve the effect of effective heat dissipation for the components on the circuit board, so as to achieve the effect of effective heat dissipation for the circuit board and the coil plate at the same time.

In the description of this specification, descriptions of the terms "some embodiments", "one embodiment" and the like mean that specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment of the present invention or example. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the description of this specification, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description , rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, should not be construed as limiting the present utility model.

The above descriptions are only preferred embodiments of the utility model, and are not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims (10)

1. the heat abstractor of a cooking apparatus, it is characterised in that including:

Circuit board, described circuit board is provided with components and parts；

Radiator, described radiator is located on described circuit board；With

Fan, described fan is located at the top of the top surface of described radiator；

Wherein, described radiator offers the thermovent of top surface and the basal surface running through described radiator, So that outside cold wind is blowed to described components and parts through described thermovent by described fan；Or, described radiator and institute State top surface and the heat dissipation channel of basal surface being formed with through described radiator between circuit board, so that described Outside cold wind is blowed to described components and parts through described heat dissipation channel by fan.

The heat abstractor of cooking apparatus the most according to claim 1, it is characterised in that

The one end of described radiator is connected with described circuit board, described radiator offers and runs through described The top surface of radiator and the thermovent of basal surface, and described thermovent is opened in the position near described one end Put place.

The heat abstractor of cooking apparatus the most according to claim 1, it is characterised in that

The one end of described radiator is connected with described circuit board, described radiator offers and runs through described The top surface of radiator and the thermovent of basal surface, and described thermovent is the heat radiation being opened in described one end Breach.

The heat abstractor of cooking apparatus the most according to claim 3, it is characterised in that

Being provided with insulated gate bipolar transistor and Qiao Dui on the basal surface of described radiator, described thermovent is opened It is located between described insulated gate bipolar transistor and described bridge heap.

The heat abstractor of cooking apparatus the most according to claim 1, it is characterised in that

The one end of described radiator is connected with described circuit board, the described one end of described radiator and institute State top surface and the assemblage gap of basal surface being formed with through described radiator between circuit board, described installation Gap is described heat dissipation channel.

The heat abstractor of cooking apparatus the most according to any one of claim 1 to 5, its feature exists In,

The basal surface of described radiator is perpendicular to described circuit board, and the top surface of described radiator is near described electricity The edge of road plate is arranged.

The heat abstractor of cooking apparatus the most according to claim 6, it is characterised in that

Described radiator includes multiple spaced fin, is formed and lead between adjacent two described fin Chute, the length direction of described guiding gutter is parallel to described circuit board.

8. a cooking apparatus, it is characterised in that including:

Body, described internal is provided with coil panel；With

The heat abstractor of the cooking apparatus as according to any one of claim 1 to 7.

Cooking apparatus the most according to claim 8, it is characterised in that also include:

Circuit board support, described circuit board is arranged on described circuit board support, described circuit board support sets Wind-guiding muscle, described wind-guiding muscle is had to be positioned at the air outlet front of the fan of described heat abstractor, for being guided by wind Described coil panel.

Cooking apparatus the most according to claim 8 or claim 9, it is characterised in that

Described cooking apparatus is IH electric cooker or IH electric pressure cooking saucepan.