CN209994756U - Ultrathin heat conduction device - Google Patents

Abstract

The utility model relates to the technical field of heat dissipation, in particular to an ultrathin heat conduction device, which comprises an upper shell, a lower shell and a liquid charging pipe; the peripheries of the upper shell and the lower shell are hermetically connected, the micro-channel is designed in the prefabricated upper and lower shells to form an ultrathin heat conduction device, the capillary microstructure forms a structure convenient for gas-liquid phase change circulation through the arrangement of the micro-channel, and heat of one or more heat source points is quickly and uniformly transferred out through the process of vaporization heat absorption and liquefaction heat release of a working medium; in this scheme, through the setting in support column district, support column district and heat source point are corresponding, and the heat is dispelled the heat at the support column district at first, and heat radiating area is big, and the heat dissipation is fast, then through the first miniflow channel district of both sides and the setting in second miniflow channel district, can divide the heat dissipation, forms capillary force, more does benefit to quick heat transfer, and above-mentioned structure setting, heat dissipation heat conduction speed is fast, and even hot effect is good.

Description

Ultrathin heat conduction device

Technical Field

The utility model relates to a heat dissipation technical field especially relates to an ultra-thin heat conduction device.

Background

The packaging space of the electronic chip is smaller and smaller, so that the heat dissipation area of the chip in the field of microelectronics is reduced, and the heat flux density is increased. The reliability of electronic components decreases sharply with the temperature rise, and hot spots generated by high heat flux density seriously affect the performance and the service life of the electronic components. The traditional aluminum and copper radiators with fins can not meet the heat dissipation requirements of devices with high heat flux density. The conventional vapor chamber comprises an upper shell, a liquid absorption core, support columns, a lower shell, a liquid filling pipe and other structures, the number of components is large, the thickness of the structure is larger (generally 3-4 mm), and along with the size of a portable electronic product is smaller and smaller, the thickness of the vapor chamber is required to be lower than 1mm, even lower than 0.4 mm.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an ultra-thin heat conduction device aims at effectively solving how quick, the even heat dissipation problem of narrow and small space high heat flux density electronic component.

In order to achieve the above object, the present invention provides an ultra-thin heat conduction device, which comprises an upper casing, a lower casing, and a liquid filling pipe, wherein the peripheries of the upper casing and the lower casing are hermetically connected, the inner wall of the upper casing and/or the lower casing forms a capillary microstructure by etching, the capillary microstructure has a micro channel, and one end of the liquid filling pipe penetrates between the upper casing and the lower casing and is communicated with the micro channel; the length-width ratio of the upper shell and the lower shell is between 2 and 5, the capillary microstructure comprises a support column area which is uniformly distributed, and a first micro-channel area and a second micro-channel area which are respectively positioned at two sides of the support column area, and the support column area corresponds to the heat source point.

The support columns in the support column area are distributed in a matrix shape, and the left side and the right side of the matrix are arc-shaped.

Wherein the first micro-channel area and the second micro-channel area are linear micro-channels.

Wherein, the capillary microstructure is a centrosymmetric structure.

Wherein, the cross section of the micro flow channel is in an inverted trapezoid shape.

The upper shell and the lower shell are welded together in a diffusion welding mode.

One of the upper shell and the lower shell is provided with a groove structure, and a capillary microstructure is formed in the groove through etching; the thickness of the upper shell is 0.1-2.5 mm, and the thickness of the lower shell is 0.1-2.5 mm.

Wherein, the shell is made of metal; the number of the liquid filling pipes is one or more.

Wherein, the micro-channel is internally provided with deionized water.

In the technical scheme, the peripheries of an upper shell and a lower shell are hermetically connected, a capillary microstructure of the inner wall of the upper shell and/or the lower shell is/are positioned in a closed space, a micro flow channel is designed in the prefabricated upper shell and the prefabricated lower shell to form an ultrathin heat conduction device, the capillary microstructure forms a structure convenient for gas-liquid phase change circulation by taking the gas-liquid phase change principle as the basis and by the arrangement of the micro flow channel, a working medium with large vaporization latent heat is selected, heat is absorbed by vaporization of the working medium, and the heat of one or more heat source points is rapidly and uniformly transferred in the process of liquefaction and heat release; in this scheme, through the setting in support column district, support column district and heat source point are corresponding, and the heat is dispelled the heat at the support column district at first, and heat radiating area is big, and the heat dissipation is fast, then through the first miniflow channel district of both sides and the setting in second miniflow channel district, can divide the heat dissipation, forms capillary force, more does benefit to quick heat transfer, and above-mentioned structure setting, heat dissipation heat conduction speed is fast, and even hot effect is good.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural view of the ultra-thin heat conduction device of the present invention.

The reference numbers illustrate:

1. a lower housing; 2. an upper housing; 3. a capillary microstructure; 4. a liquid filling pipe; 5. a support post area; 6. a first flow channel region; 7. a second flow channel region.

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.

As shown in fig. 1, the ultra-thin heat conduction device of the present invention includes an upper casing 2, a lower casing 1, and a liquid filling pipe 4, wherein the peripheries of the upper casing and the lower casing are hermetically connected, the inner wall of the upper casing and/or the lower casing forms a capillary microstructure 3 by etching, the capillary microstructure has a micro channel, and one end of the liquid filling pipe penetrates between the upper casing and the lower casing and is communicated with the micro channel; the length-width ratio of the upper shell and the lower shell is between 2 and 5, the capillary microstructure comprises a support column area 5 uniformly distributed in the middle, and a first micro-channel area 6 and a second micro-channel area 7 which are respectively positioned on two sides of the support column area, and the support column area corresponds to the heat source point.

According to the technical scheme, the peripheries of an upper shell and a lower shell are hermetically connected, a capillary microstructure of the inner wall of the upper shell and/or the lower shell is/are positioned in a closed space, a micro flow channel is designed in the prefabricated upper shell and the prefabricated lower shell to form an ultrathin heat conduction device, the capillary microstructure forms a structure convenient for gas-liquid phase change circulation by taking the gas-liquid phase change principle as the basis and by the arrangement of the micro flow channel, a working medium with large vaporization latent heat is selected, heat is absorbed by vaporization of the working medium, and heat of one or more heat source points is rapidly and uniformly transferred in the process of liquefaction and heat release; in this scheme, through the setting in support column district, support column district and heat source point are corresponding, and the heat is dispelled the heat at the support column district at first, and heat radiating area is big, and the heat dissipation is fast, then through the first miniflow channel district of both sides and the setting in second miniflow channel district, can divide the heat dissipation, forms capillary force, more does benefit to quick heat transfer, and above-mentioned structure setting, heat dissipation heat conduction speed is fast, and even hot effect is good.

In addition, the flow channel (micro flow channel) of the capillary microstructure liquid working medium on the inner wall of the shell has certain capillary force, and the capillary microstructure and the shell are integrally manufactured, so that the process structure can greatly reduce the thickness and the size of the heat conductor, can effectively solve the heat dissipation problem of the high heat flux density electronic component in a narrow space, and overcomes the problems of large size and poor heat dissipation of a split type flow channel structure; the transmission efficiency is far higher than that of a solid heat conductor or other heat dissipation structures, and the problem of small size of an electronic product can be solved due to the small size.

Preferably, a plurality of support columns in the support column area are distributed in a matrix shape, the left side and the right side of the matrix are arc-shaped, the design is combined with the characteristic of heat source point heat dissipation, the heat dissipation is fast, and the heat dissipation effect is good.

Preferably, the first micro-channel area and the second micro-channel area are linear micro-channels, and the heat conduction speed is high.

Preferably, the capillary microstructure is a centrosymmetric structure, and the uniform heating effect is good.

Preferably, the cross section of the micro flow channel is in an inverted trapezoid shape, so that heat transfer is facilitated.

Particularly, the liquid filling pipe is provided with a channel which is convenient for detecting the sealing property of the cavity, filling working media and degassing; one end of the liquid filling pipe penetrates between the upper shell and the lower shell, the sealing performance of the cavity is detected, working media are conveniently filled in the flow channel, the space of the inner flow channel of the upper shell and the lower shell is conveniently vacuumized, and non-condensable gas in the space of the inner flow channel of the upper shell and the lower shell is removed.

Preferably, a support column 5 is arranged between the upper shell and the lower shell, and the support column is positioned in the center of the capillary structure. Through the setting of bearing structure, the purpose increases overall structure intensity, keeps inside cavity shape, and the evaporation of the boiling working medium of hindrance that also can be as few as possible through the setting of support column.

Preferably, the support column is integrally formed with the upper housing and/or the lower housing. The supporting structure and the shell are designed into a whole, the structure is stable, and the assembly is convenient.

Specifically, one of the upper shell and the lower shell is provided with a groove structure, and a capillary microstructure is formed in the groove by etching, so that the structure is more compact and reasonable; the backflow channel and the shell are integrally manufactured, and the thickness and the size of the heat conductor can be greatly reduced by the process structure.

Preferably, the thickness of the upper shell is 0.1-2.5 mm, and the thickness of the lower shell is 0.1-2.5 mm; the requirement of small size of electronic products is met.

Specifically, the shell is made of metal and has good heat-conducting property.

In a preferred embodiment, the number of the priming tubes may also be one or more. In the embodiment shown in the figure, the ultrathin heat conduction device is provided with only one pipeline, the free end of the liquid filling pipe can be opened to vacuumize the micro-channel before use, then the liquid working medium is filled into the micro-channel, and after the working medium is filled, the free end of the liquid filling pipe is plugged, so that the ultrathin heat conduction device is ensured to have stable heat dissipation performance in the working process.

Specifically, deionized water is arranged in the micro-channel, and the capillary structure of the micro-channel has good wettability, so that sufficient backflow capillary force is provided for the condensed working medium.

It should be noted that, in the above embodiment, the phase change medium may be water, and is preferably deionized water, which refers to pure water after removing impurities in the form of ions. The latent heat of vaporization of water is great, through the heat absorption of phase change medium vaporization and the exothermic process of liquefaction, can go out the quick transmission of the heat of heat source to reach higher heat-conduction efficiency, satisfy the heat dissipation demand of the electronic product of high integrated level.

The above is only the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all of which are in the utility model discloses a conceive, utilize the equivalent structure transform that the content of the specification and the attached drawings did, or directly/indirectly use all to include in other relevant technical fields the patent protection scope of the present invention.

Claims (9)

1. An ultrathin heat conduction device is characterized by comprising an upper shell, a lower shell and a liquid filling pipe, wherein the peripheries of the upper shell and the lower shell are connected in a sealing manner, the inner wall of the upper shell and/or the lower shell forms a capillary microstructure through etching, the capillary microstructure is provided with a micro channel, and one end of the liquid filling pipe penetrates between the upper shell and the lower shell and is communicated with the micro channel; the length-width ratio of the upper shell and the lower shell is between 2 and 5, the capillary microstructure comprises a support column area which is uniformly distributed, and a first micro-channel area and a second micro-channel area which are respectively positioned at two sides of the support column area, and the support column area corresponds to the heat source point.

2. The ultra-thin heat transfer device of claim 1, wherein the plurality of support columns in the support column region are arranged in a matrix, and the left and right sides of the matrix are curved.

3. The ultra-thin heat transfer device of claim 1, wherein the first microchannel region and the second microchannel region are linear microchannels.

4. The ultra-thin heat transfer device of claim 2, wherein the capillary microstructure is a centrosymmetric structure.

5. The ultra-thin heat transfer device of claim 1, wherein the cross-section of the micro flow channel is an inverted trapezoid.

6. The ultra-thin heat transfer device of claim 3, wherein the upper and lower housings are welded together by diffusion welding.

7. The ultra-thin heat transfer device of claim 1, wherein one of the upper housing and the lower housing is provided with a groove structure, and a capillary microstructure is etched in the groove structure; the thickness of the upper shell is 0.1-2.5 mm, and the thickness of the lower shell is 0.1-2.5 mm.

8. The ultra-thin heat transfer device as claimed in any one of claims 1 to 7, wherein the housing is made of metal; the number of the liquid filling pipes is one or more.

9. The ultra-thin heat transfer device of any of claims 1-7, wherein the micro flow channel has deionized water therein.