CN218215288U - Embedded heat pipe heat dissipation structure applied to ASAAC module - Google Patents
Embedded heat pipe heat dissipation structure applied to ASAAC module Download PDFInfo
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- CN218215288U CN218215288U CN202222616287.3U CN202222616287U CN218215288U CN 218215288 U CN218215288 U CN 218215288U CN 202222616287 U CN202222616287 U CN 202222616287U CN 218215288 U CN218215288 U CN 218215288U
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Abstract
The utility model discloses a be applied to interior heat pipe heat radiation structure that buries of ASAAC module, include: the ASAAC module comprises an upper shell and a bottom cover, wherein electronic devices of the ASAAC module are fixedly arranged on the top surface of the upper shell, at least one rectangular groove is formed in the bottom surface of the upper shell corresponding to the electronic devices, the rectangular grooves are transversely arranged along the width direction of the upper shell, and the bottom cover is fixedly arranged at the bottom of the upper shell and covers the rectangular grooves to correspondingly form a plurality of accommodating cavities; a heat pipe is correspondingly arranged in each accommodating cavity, and the size of each accommodating cavity is matched with that of each heat pipe; the heat pipe is a rectangular flat pipe with a hollow interior, a capillary structure is arranged on the inner wall of the heat pipe, and a cooling medium is filled in the capillary structure. The utility model discloses can dispel the heat conduction fast to the ASAAC module to do not crowd the installation usage space who accounts for electronic device.
Description
Technical Field
The utility model relates to an automobile field of wading. More specifically, the utility model relates to a be applied to embedded heat pipe heat radiation structure of ASAAC module.
Background
In recent years, the ASAAC module standard is rapidly applied to the industries of communication, radar and the like, the ASAAC module is generally arranged in a chassis, and the volume and the weight of the chassis are generally strictly required in airborne equipment. The smaller the volume of a chip in an ASAAC module is, the higher the power is, and the higher the requirement for heat dissipation is, at present, the case mainly dissipates heat of the ASAAC module, heat generated by electronic devices in the ASAAC module is transferred to the upper end and the lower end of the ASAAC module through heat conducting grease or a heat conducting pad, and then the heat is diffused out through a heat dissipation structure arranged in the case, so that many researches on the heat dissipation structure in the case are available in the prior art. However, the efficiency of heat generated by the electronic devices in the ASAAC module diffusing to the chassis also affects the overall heat dissipation performance. In order to enable heat generated by electronic devices in the ASAAC module to be rapidly diffused to the chassis, a heat dissipation structure for the ASAAC module itself is also provided, for example, a chinese patent with an authorization publication number of CN208706634U, a standard ASAAC high-performance heat dissipation structure is proposed, and heat dissipation performance of the heat dissipation cover plate is improved by providing heat dissipation teeth on an upper surface of a substrate and a temperature equalization plate on a lower surface of the substrate. However, the structure integrates the temperature-equalizing plate and the radiating fins in the ASAAC module, so that the requirement on the compactness of the chassis structure in airborne equipment is met, and the use space of electronic devices in the ASAAC module is reduced. Therefore, there is a need to develop a heat dissipation structure applied to an ASAAC module, which can rapidly diffuse heat generated by the electronic devices in the ASAAC module to the chassis, and does not occupy the space used by the electronic devices in the ASAAC module.
SUMMERY OF THE UTILITY MODEL
It is an object of the present invention to solve at least the above problems and to provide at least the advantages which will be described later.
To achieve these objects and other advantages in accordance with the purpose of the invention, there is provided a heat dissipation structure of embedded heat pipe applied to an ASAAC module, comprising: the electronic device of the ASAAC module is fixedly arranged on the top surface of the upper shell, at least one rectangular groove is formed in the bottom surface of the upper shell corresponding to the electronic device, the rectangular groove is transversely arranged along the width direction of the upper shell, and the bottom cover is fixedly arranged at the bottom of the upper shell and covers the rectangular grooves to correspondingly form a plurality of accommodating cavities; a heat pipe is correspondingly arranged in each accommodating cavity, and the size of each accommodating cavity is matched with that of each heat pipe; the heat pipe is a rectangular flat pipe with a hollow interior, a capillary structure is arranged on the inner wall of the heat pipe, and a cooling medium is filled in the capillary structure.
Preferably, the top surface of the upper shell is provided with a heat conduction boss corresponding to the electronic device, and the heat conduction boss is embedded with a graphite sheet.
Preferably, the heat pipe is disposed along a width direction of the upper case.
Preferably, the capillary structure includes a first capillary structure disposed on the inner wall of the heat pipe close to the upper housing and a second capillary structure disposed on the inner wall of the heat pipe close to the bottom cover, a gap is left between the first capillary structure and the second capillary structure, and the aperture of the first capillary structure is smaller than the aperture of the second capillary structure.
Preferably, a third capillary structure is arranged on the inner wall of the heat pipe close to the upper shell and corresponding to the position of the electronic device, the first capillary structure is arranged on two sides of the third capillary structure, and the aperture of the third capillary structure is smaller than that of the first capillary structure.
Preferably, a plurality of support columns are arranged in the heat pipe at intervals along the length direction of the heat pipe, two ends of each support column are fixedly connected with the inner wall of the heat pipe, and the side walls of the support columns are provided with the first capillary structures.
Preferably, the thickness of the heat pipe is 0.5 to 0.75 times the thickness of the upper case.
The utility model discloses at least, include following beneficial effect:
the utility model provides an embed heat pipe heat radiation structure for ASAAC module, through set up the heat pipe in the holding chamber in the casing with the electron device of ASAAC module produce the heat spread to the both ends of casing and bottom 2 rapidly, and then reach the purpose of spreading to the quick both ends of quick-witted case fast; and the heat pipe does not occupy the use space of the electronic device additionally. When the ASAAC module is subjected to rapid heat dissipation and conduction, the problems that in the prior art, the heat dissipation structure of the ASAAC module is complex, and installation and use space of electronic devices is occupied are solved.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
Fig. 1 is a schematic structural view of the heat dissipation structure of the embedded heat pipe of the present invention;
fig. 2 is a bottom view of the bottom surface of the upper housing of the present invention;
fig. 3 is a schematic cross-sectional structural view of the heat dissipation structure of the embedded heat pipe in the length direction according to the present invention;
fig. 4 is a schematic cross-sectional structure view of the heat dissipation structure of the embedded heat pipe in the width direction according to the present invention;
fig. 5 is a schematic cross-sectional structural view of the heat pipe of the present invention.
Detailed Description
The present invention is described in further detail below with reference to the attached drawings so that those skilled in the art can implement the invention by referring to the description.
It is to be noted that the experimental methods described in the following embodiments are all conventional methods unless otherwise specified, and the reagents and materials described therein are commercially available unless otherwise specified; in the description of the present invention, the terms "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
As shown in fig. 1-5, the utility model provides an it buries heat pipe heat radiation structure to be applied to ASAAC module, include: the electronic device of the ASAAC module is fixedly arranged on the top surface of the upper shell 1, the bottom surface of the upper shell 1 is provided with at least one rectangular groove 11 corresponding to the electronic device, the rectangular groove is transversely arranged along the width direction of the upper shell 1, and the bottom cover 2 is fixedly arranged on the bottom of the upper shell 1 and covers each rectangular groove 11 to correspondingly form a plurality of accommodating cavities 5; a heat pipe 4 is correspondingly arranged in each accommodating cavity 5, and the size of each accommodating cavity 5 is matched with that of each heat pipe 4; the heat pipe 4 is a rectangular flat pipe with a hollow interior, a capillary structure is arranged on the inner wall of the heat pipe, and a cooling medium is filled in the capillary structure.
In the technical scheme, the embedded heat pipe heat dissipation structure can be used as a plug-in unit of a chassis and attached to an electronic device in an ASAAC module, the heat pipe 4 is a phase change heat pipe and is correspondingly arranged on the bottom surface of the upper housing 1 relative to the position of the electronic device of the ASAAC module, the area close to the electronic device of the ASAAC module is an evaporation area, the area far away from the electronic device of the ASAAC module is a condensation area, a cooling medium absorbs heat in the evaporation area and evaporates into gas, the heat is released from the condensation area and condenses into liquid, the liquid flows back to the evaporation area through the capillary structure, and the released heat during condensation is transferred outwards through the upper housing 1 and the bottom cover 2; and the heat pipe 4 is a rectangular flat pipe, and can rapidly diffuse heat to the two ends of the upper shell 1 and the bottom cover 2, thereby achieving the purpose of rapidly diffusing the heat to the two ends of the case. The cooling medium can be selected from the cooling medium used by a conventional soaking plate, and the capillary structure is formed by sintering copper powder with different meshes to form micropores with different diameters. The heat pipe 4 is arranged in the rectangular groove 11 on the bottom surface of the upper shell 1, and does not occupy the use space of an electronic device additionally. According to the size of the electronic device of the ASAAC module, one electronic device may be provided with a plurality of heat pipes 4 corresponding to the bottom of the upper case 1, the plurality of heat pipes 4 are arranged in parallel at intervals, and the width of the plurality of heat pipes 4 can collectively cover the corresponding electronic device. The shell can also be directly used as a bottom substrate of the ASAAC module, and the occupied volume of the ASAAC module is further saved.
In another embodiment, the top surface of the upper case 1 is provided with a heat conducting boss 3 corresponding to the electronic device, and a graphite sheet is embedded in the heat conducting boss 3. Through heat conduction boss 3 makes the casing can laminate the electron device setting realizes thermal accurate conduction, the graphite flake can further increase heat conduction efficiency.
In another embodiment, the heat pipe 4 is disposed along the width direction of the upper case 1. Referring to fig. 4, the installation direction of the casing in the chassis is shown, the casing and the ASAAC module are inserted into a plurality of slots in the chassis together, and the heat pipe 4 is arranged along the width direction of the upper casing 1, and can conduct heat to the upper end and the lower end of the casing through the heat pipe 4, so as to conduct heat to the chassis quickly.
In another embodiment, the capillary structure includes a first capillary structure 41 disposed on the inner wall of the heat pipe 4 close to the upper housing 1 and a second capillary structure 44 disposed on the inner wall of the heat pipe 4 close to the bottom cover 2, a gap is left between the first capillary structure 41 and the second capillary structure 44, and the pore diameter of the first capillary structure 41 is smaller than that of the second capillary structure 44.
The inner wall of the heat pipe 4 close to the upper shell 1 is closer to an electronic device than the inner wall close to the bottom cover 2, so that the area of the inner wall of the heat pipe 4 close to the upper shell 1, which corresponds to the electronic device, is an evaporation area, the areas of the other inner walls on the heat pipe are condensation areas, a cooling medium absorbs heat in the evaporation area and evaporates into gas, releases heat in the condensation areas and condenses into liquid, and flows back to the evaporation area through the capillary structure. A gap is left between the first capillary structure 41 and the second capillary structure 44 to provide a vapor chamber for the gas generated in the evaporation region, so as to reduce the gas flow resistance, so that the gas can flow to the condensation region quickly. The pore size of the first capillary structure 41 is smaller than that of the second capillary structure 44, so that the capillary force of the first capillary structure 41 is larger than that of the second capillary structure 44, and the liquid condensed in the second capillary structure 44 can rapidly flow back to the first capillary structure 41 and finally flow back to the evaporation area.
In another embodiment, a third capillary structure 42 is disposed on a portion of the heat pipe 4 close to the inner wall of the upper housing 1, where the portion corresponds to the electronic device, the first capillary structure 41 is disposed on two sides of the third capillary structure 42, and an aperture of the third capillary structure 42 is smaller than an aperture of the first capillary structure 41.
As can be seen from the above, a portion of the heat pipe 4, which is close to the inner wall of the upper housing 1 and corresponds to the electronic device, is an evaporation area, the aperture of the third capillary structure 42 is smaller than the aperture of the first capillary structure 41, and the capillary force of the third capillary structure 42 is larger than the capillary force of the first capillary structure 41, so that the condensed liquid can continuously and rapidly flow back into the third capillary structure 42 after rapidly flowing back into the first capillary structure 41, i.e., return to the evaporation area.
In another embodiment, a plurality of support columns 43 are arranged in the heat pipe at intervals along the length direction of the heat pipe 4, two ends of each support column 43 are respectively fixedly connected with the inner wall of the heat pipe 4, and the first capillary structure 41 is arranged on the side wall of each support column 43. The supporting columns 43 increase the overall strength of the heat pipe 4, and the heat pipe is squeezed by atmospheric pressure difference or external force.
In another embodiment, the thickness of the heat pipe 4 is 0.5 to 0.75 times the thickness of the upper case 1. The heat pipe 4 is disposed in the rectangular groove 11, so the thickness of the heat pipe 4 is related to the distance between the side of the heat pipe 4 facing the electronic device and the electronic device, and the heat conduction efficiency of the heat pipe 4 is affected. The thickness of the heat pipe 4 cannot be too thin, and is preferably 0.5 to 0.75 times the thickness of the upper case 1.
While the embodiments of the invention have been described above, it is not intended to be limited to the details shown, particular embodiments, but rather to those skilled in the art, having the benefit of the teachings of the present invention, which is capable of numerous modifications and alternative forms, and will be readily apparent to those skilled in the art, and it is not intended to limit the invention to the details shown and described without departing from the general concepts defined by the appended claims and their equivalents.
Claims (7)
1. The utility model provides an it buries heat pipe heat radiation structure to be applied to ASAAC module which characterized in that includes: the electronic device of the ASAAC module is fixedly arranged on the top surface of the upper shell, at least one rectangular groove is formed in the bottom surface of the upper shell corresponding to the electronic device, the rectangular groove is transversely arranged along the width direction of the upper shell, and the bottom cover is fixedly arranged at the bottom of the upper shell and covers the rectangular grooves to correspondingly form a plurality of accommodating cavities; a heat pipe is correspondingly arranged in each accommodating cavity, and the size of each accommodating cavity is matched with that of each heat pipe; the heat pipe is a rectangular flat pipe with a hollow inner part, a capillary structure is arranged on the inner wall of the heat pipe, and a cooling medium is filled in the capillary structure.
2. The embedded heat pipe heat dissipation structure applied to an ASAAC module as recited in claim 1, wherein the top surface of the upper case is provided with a heat conduction boss corresponding to the electronic device, and a graphite sheet is embedded in the heat conduction boss.
3. The embedded heat pipe heat dissipation structure applied to an ASAAC module according to claim 1, wherein the heat pipe is disposed along a width direction of the upper case.
4. The embedded heat pipe heat dissipation structure applied to an ASAAC module according to claim 3, wherein the capillary structure comprises a first capillary structure disposed on the inner wall of the heat pipe close to the upper housing and a second capillary structure disposed on the inner wall of the heat pipe close to the bottom cover, a gap is left between the first capillary structure and the second capillary structure, and an aperture of the first capillary structure is smaller than an aperture of the second capillary structure.
5. The embedded heat pipe heat dissipation structure applied to an ASAAC module according to claim 4, wherein the heat pipe is provided with a third capillary structure near a portion of the inner wall of the upper housing corresponding to the electronic device, the first capillary structure is provided on both sides of the third capillary structure, and an aperture of the third capillary structure is smaller than an aperture of the first capillary structure.
6. The embedded heat pipe heat dissipation structure applied to an ASAAC module as claimed in claim 4, wherein a plurality of support pillars are disposed at intervals along a length direction of the heat pipe in the heat pipe, two ends of each support pillar are respectively and fixedly connected to an inner wall of the heat pipe, and the first capillary structure is disposed on a side wall of each support pillar.
7. The embedded heat pipe heat dissipation structure applied to an ASAAC module as recited in claim 1, wherein the thickness of the heat pipe is 0.5 to 0.75 times the thickness of the upper case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222616287.3U CN218215288U (en) | 2022-09-29 | 2022-09-29 | Embedded heat pipe heat dissipation structure applied to ASAAC module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222616287.3U CN218215288U (en) | 2022-09-29 | 2022-09-29 | Embedded heat pipe heat dissipation structure applied to ASAAC module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218215288U true CN218215288U (en) | 2023-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222616287.3U Active CN218215288U (en) | 2022-09-29 | 2022-09-29 | Embedded heat pipe heat dissipation structure applied to ASAAC module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218215288U (en) |
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- 2022-09-29 CN CN202222616287.3U patent/CN218215288U/en active Active
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