CN209992021U - Stacking temperature and humidity detection system capable of being built quickly - Google Patents
Stacking temperature and humidity detection system capable of being built quickly Download PDFInfo
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- CN209992021U CN209992021U CN201920939191.6U CN201920939191U CN209992021U CN 209992021 U CN209992021 U CN 209992021U CN 201920939191 U CN201920939191 U CN 201920939191U CN 209992021 U CN209992021 U CN 209992021U
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Abstract
The utility model belongs to the technical field of circuit control, especially, relate to the heap humiture detection system that can build fast. The control chip circuit stacking device comprises a first stacking plate used for bearing a control chip circuit and a second stacking plate used for bearing a sensor circuit, wherein the two sides of the first stacking plate and the two sides of the second stacking plate are provided with row nuts, and the first stacking plate can be installed on the second stacking plate in a pluggable mode. The control chip circuit comprises a main control circuit, a reset circuit, a serial port circuit, a power supply conversion circuit and a power supply interface which are sequentially connected, and the power supply indication circuit is connected with the power supply conversion circuit. Through the modular design of the stacking, the mounting and switching among the stacking plates of different bearing chips are facilitated, and different function changes can be realized. The anti-interference capability of the main control circuit can be enhanced by arranging the reset button and the pull-up resistor on the reset pin of the control chip. And a short-circuit bonding pad is arranged on the power supply indicating circuit, so that the energy-saving mode can be started conveniently.
Description
Technical Field
The utility model belongs to the technical field of circuit control, especially, relate to a pile up change temperature and humidity measurement system that can build fast.
Background
The traditional connection mode is that the temperature and humidity sensor is connected to a main control board by a DuPont wire. As policies change, child programming has opened up various training classes, and the age bracket for learning programming is lower, resulting in the need for simpler and simpler corresponding hardware for software programming. In order to train students to learn programming, teachers adopt a traditional teaching mode, and the sensors are connected to a development board through DuPont wires for use. This approach is acceptable for high school and college, but not as easy for elementary and middle schools. Moreover, this connection has a great disadvantage: dupont lines are easily misplaced. If the plug is not firmly inserted, problems such as poor contact and the like can also occur.
The most immediate problem resulting from these drawbacks is the inefficiency of the teacher in class. The standard class period is essentially 40-45 minutes. In the course of the lesson, if the students cannot keep up with the rhythm of the teacher because of the problems, the teacher can certainly help the students to search the cause of the problems. Therefore, the whole class can be used for searching the problems and the problems are solved.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model discloses a following technical scheme can solve:
the utility model provides a can pile up attitude and humidity measurement system of piling up of putting up fast, pile up the board including the first stacked plate that is used for bearing control chip circuit and the second that is used for bearing sensor circuit, first stacked plate includes first PCB board and installs row mother in first PCB board both sides, the board is piled up to the second includes second PCB board and installs row mother in second PCB board both sides, through the row mother with the row mother of second PCB board both sides inserts first PCB board both sides, realize that first stacked plate is pluggable installs on the board is piled up to the second. Through the modular design of the stacking, the installation and the switching among the stacking plates of different bearing chips are convenient.
Preferably, the first stacking plate is provided with a control chip circuit, the control chip circuit comprises a main control circuit, a reset circuit, a serial port circuit, a power conversion circuit, a power indication circuit and a power interface, the main control circuit, the reset circuit, the serial port circuit, the power conversion circuit and the power interface are sequentially connected, and the power indication circuit is connected with the power conversion circuit. The external 5V power supply voltage is converted into 3.3V voltage through the power supply conversion circuit, so that the use of the control chip and the power supply indicating circuit is facilitated. The main control circuit is convenient to download programs through the serial port circuit, and can be connected with other functional modules through the serial port circuit.
Preferably, the position of the female pin on the first PCB and the second PCB is provided with a label, and the same position of the first PCB and the second PCB has the same label. The functional symbols on the second PCB are designed to be the same as the functional symbols on the first PCB, so that a unified standard is formed, and different second PCBs can be switched and used conveniently.
Preferably, the female pin row positions on one side of the first PCB and the second PCB are sequentially marked as 3V3, SWC, VIO, D13/SCK, D11/MOSI, D12/MISO, SWD, SCL, SDA, AREF, A0, A1, A2, A3, A4 and A5 from left to right, and the female pin row positions on the other side of the first PCB and the second PCB are sequentially marked as 5V, GND, RESET, D0/RX0, D1/TX0, D2/RX1, D3/TX1, D4, D5, D6, D7, D8, D9, D10/SS, D11/MOSI and D12/MISO from left to right, and the pins on the first PCB and the second PCB are connected to the corresponding female pin row positions.
Preferably, the main control circuit comprises a main control chip LGT8FX8H, the RESET terminal of the main control chip LGT8FX8H is connected with the key S1 and the pull-up resistor R1, and a capacitor is connected between the GND and VCC pins of the main control chip LGT8FX 8H. The RESET pin connects to button S1 for program restart. By arranging the pull-up resistor R1 for outputting high level, the anti-interference capability of the circuit can be enhanced. A diode U $2 is connected in parallel across the pull-up resistor R1 for fast recovery after reset is completed.
Preferably, the serial port circuit includes a chip HT42B534, pins 10 and 3 of the chip HT42B534 are grounded through capacitors C4 and C3, respectively, pin 1 and pin 2 of the chip HT42B534 are connected to a USB interface, and a protection resistor F1 is connected to a USB pin VBUS. By setting the protective resistor F1, the damage of the USB interface due to overcurrent is avoided.
Preferably, the power supply indicating circuit comprises a short-circuit bonding pad J3, a resistor R7 and an LED lamp U $7 which are connected in sequence. The power supply indicating circuit is used for indicating whether the power supply is normal or not. Set up short circuit pad J3 at voltage input end, extinguish the LED lamp through short circuit pad J3, reduce the power consumption, can reach the effect of saving the electric energy.
Preferably, the power conversion circuit employs a chip NCP1117, and capacitors C8 and C9 are provided at a pin 3 and a pin 2 of the chip NCP1117, respectively. After the VBUS voltage passes through an LDO (NCP1117-3V3) of the power supply conversion circuit, the stable step-down voltage is output and reduced to 3.3V, and then the power supply is supplied to the main control chip.
Preferably, the control chip circuit further comprises a power supply switching circuit, and the power supply switching circuit adopts a pad J2. The power supply switching circuit is mainly used for switching logic level power supplies, and 5V or 3.3V voltage can be conveniently selected by the control circuit according to requirements through the arrangement of the bonding pad J2.
Preferably, a sensor circuit is arranged on the second stacked board, the sensor circuit comprises a sensor chip, the SDA pin and the SCL pin of the sensor chip are connected with a voltage of 3.3V through a pull-up resistor R6 and a pull-up resistor R5, respectively, and a short-circuit pad JP1 is arranged between the connection point of R6 and the pull-up resistor R5 and the 3.3V point voltage. A shorting pad JP1 is provided between the resistors R6, R5 and 3.3V for controlling whether pull-up resistor R6 and resistor R5 are activated.
The utility model discloses owing to adopted above technical scheme, have apparent technological effect: through the modular design of the stacking, the mounting and switching among the stacking plates of different bearing chips are facilitated, and different function changes can be realized. The anti-interference capability of the main control circuit can be enhanced by arranging the reset button and the pull-up resistor on the reset pin of the control chip. And a short-circuit bonding pad is arranged on the power supply indicating circuit, so that the energy-saving mode can be started conveniently.
Drawings
Fig. 1 is an oblique view of the external structure of the detection system of the present invention.
Fig. 2 is an exploded external view of the detection system of the present invention.
Fig. 3 is a layout diagram for installing and using the detection system of the present invention.
Fig. 4 is a circuit block diagram of the detection system of the present invention.
Fig. 5 is a main control circuit diagram of the detection system of the present invention.
Fig. 6 is a serial communication circuit diagram of the detection system of the present invention.
Fig. 7 is a sensor circuit diagram of the detection system of the present invention.
Fig. 8 is a power conversion circuit diagram of the detection system of the present invention.
Fig. 9 is a circuit diagram of the power switching of the detection system of the present invention.
Fig. 10 is a reset circuit diagram of the detection system of the present invention.
Fig. 11 is a circuit diagram of the power supply indicating circuit of the detecting system of the present invention.
Fig. 12 is a pin layout diagram of the control chip of the detection system of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
As shown in fig. 1, 2 and 3, a stackable temperature and humidity detection system capable of being rapidly built comprises a first stacked board for bearing a control chip circuit and a second stacked board for bearing a sensor circuit, wherein the first stacked board comprises a first PCB (printed circuit board) 1 and row nuts 2 arranged on two sides of the first PCB 1, the second stacked board comprises a second PCB 3 and row nuts 2 arranged on two sides of the second PCB 3, and the row nuts 2 on two sides of the second PCB 3 are inserted into the row nuts 2 on two sides of the first PCB 1, so that the first stacked board can be mounted on the second stacked board in a pluggable manner. The first stacking board for carrying the control chip circuit and the second stacking board for carrying the sensor circuit adopt a plug structure which can be conveniently installed. The control chip circuit on the first stacking board is used for master control; the sensor circuit on the second stacked board may be a different sensor, for example, when it is necessary to detect the ambient temperature and humidity, the second stacked board with a temperature and humidity sensor is used; when it is desired to detect an environmental odor, a second stacked plate with an odor sensor is used. Thereby, free switching of different modules is facilitated. The row female plug 2 adopts a row female plug which is universal on the market, and the row female plug 2 has an upper end and a lower end, wherein the upper end is a female plug with a hole, and the lower part is a male plug with a needle. When the PCB is installed, the row female connector 2 is inserted into the hole corresponding to the PCB through the male plug, and the male plug penetrates out of the hole corresponding to the PCB. When two PCBs are mounted in a superposed mode, male plugs of the upper row of female plugs 2 of the first PCB 1 are inserted into female plugs of the second PCB 3.
As shown in fig. 4, in this embodiment, a control chip circuit is disposed on the first stacked board, the control chip circuit includes a main control circuit, a reset circuit, a serial port circuit, a power conversion circuit, a power indication circuit, and a power interface, the main control circuit, the reset circuit, the serial port circuit, the power conversion circuit, and the power interface are sequentially connected, and the power indication circuit is connected to the power conversion circuit. The power interface is used for connecting an external 5V power supply, and one side of the 5V power supply directly supplies power to the serial port circuit. On the other hand, after passing through the power conversion circuit, the 5V power supply is stepped down from 5V to 3.3V, and then the power indication circuit is directly supplied with power by 3.3V. On the other hand, the 3.3V power supply after voltage reduction supplies power to the main control circuit. The serial circuit is used for communication among the circuit boards, and the USB interface is arranged on the serial circuit and can be used for supplying power and downloading programs for the serial circuit. Through the reset circuit, the main control circuit can quickly recover the initial state after outputting the control signal.
In this embodiment, the pin positions of the row 2 of the first PCB 1 and the second PCB 3 are provided with labels, and the same position of the first PCB 1 and the second PCB 3 has the same label. With the same lead wire pin of row female contact pin design on first PCB board 1 and the second PCB board 3, when will bear the weight of the first pile piece that the sensor second pile piece inserted and bears the weight of control chip circuit, the wiring pin corresponds the accuracy, convenient to use.
In this embodiment, the female pin row positions on one side of the first PCB 1 and the second PCB 3 are sequentially marked as 3V3, SWC, VIO, D13/SCK, D11/MOSI, D12/MISO, SWD, SCL, SDA, AREF, a0, a1, a2, A3, A4, and A5 from left to right, and the female pin row positions on the other side of the first PCB 1 and the second PCB 3 are sequentially marked as 5V, GND, RESET, D0/RX0, D1/TX0, D2/RX1, D3/TX1, D4, D5, D6, D7, D8, D9, D10/SS, D11/MOSI, and D12/o from left to right, so as to correspondingly connect the female pin row positions on the first PCB 1 and the second PCB 3 to the female pin row. 5V, GND and 3.3V are led out from the USB socket, D0 and D1 are led out from the serial port chip, and the rest are led out from the main chip. The main control board and the sensor which are produced have the same specification, namely the pins correspond up and down, and the main control board and the sensor can be used only by using a pin or a female stack connection.
In this embodiment, as shown in fig. 5, the main control circuit includes a main control chip LGT8FX8H, a RESET terminal of the main control chip LGT8FX8H is connected to the key S1 and the pull-up resistor R1, and a capacitor is connected between the GND and VCC pins of the main control chip LGT8FX 8H. Capacitors C1 and C2 are connected between VCC and GND of the main control chip LGT8FX8H and used for filtering a power supply. In addition, the RESET pin is connected to a button S1 for program restart. And the pull-up resistor R1 is used for outputting high level and enhancing the anti-interference capability of the circuit. A diode U $2 is connected in parallel across the pull-up resistor R1 for fast recovery after reset is completed.
In this embodiment, as shown in fig. 6 and 10, the serial port circuit includes a chip HT42B534, pins 10 and 3 of the chip HT42B534 are grounded through capacitors C4 and C3, respectively, pin 1 and pin 2 of the chip HT42B534 are connected to a USB interface, and a protection resistor F1 is connected to a USB pin VBUS. F1 is a fuse of 500MA, the maximum current can not exceed 500MA, the power supply port VBUS of the usb is connected with the fuse F1 firstly, then the fuse is output to a 5V pin on the layout, then the fuse is connected with VDD on the serial port chip, and the fuse is a self-recovery fuse. The self-healing fuse functions as follows: the zero power resistance is low, the self impedance of the self-resetting fuse is low, the power loss is small during normal work, and the surface temperature is low; the overcurrent protection speed is high, and the response speed of the self-resetting fuse in an overcurrent state is much higher than that of other overcurrent protection devices due to the material characteristics of the self-resetting fuse; the self-locking operation is carried out, the self-resetting fuse is locked in a high-resistance state by a tiny current in an overcurrent protection state, and the low-resistance state can be recovered only after a power supply is cut off or overcurrent disappears; the automatic reset is realized, the self-reset fuse automatically resets after the overcurrent protection function (fault removal) is realized, and the replacement is not needed; the self-resetting fuse has excellent heavy current resistance, and some specifications can bear 100A current impact. Resistors R2 and R4 are provided on pins 6 and 11, respectively. The reset circuit comprises a capacitor C10, one end of the capacitor C10 is connected with a DTR pin of the chip HT42B534, and the other end of the capacitor C10 is connected with a reset pin of the main control chip. The DTR pin of serial chip HT42B534 is connected to the RESET pin of main control chip LGT8FX8H through a 100nf capacitor C10, which is necessary for downloading programs into the chip, in order to perform automatic RESET during downloading programs.
In this embodiment, as shown in fig. 11, the power indicator circuit includes a shorting pad J3, a resistor R7, and an LED lamp U $7, which are connected in sequence. The power supply indicating circuit is connected with the power supply conversion circuit to obtain a low-voltage power supply for indicating whether the power supply is normal or not. The short-circuit bonding pad J3 is arranged at the voltage input end, if a user needs low-power-consumption debugging, more power consumption is consumed when the LEDs are turned on, and therefore the short-circuit bonding pad J3 needs to be short-circuited to reduce power consumption.
In this embodiment, as shown in fig. 8, the power conversion circuit employs a chip NCP1117, and capacitors C8 and C9 are respectively disposed on pin 3 and pin 2 of the chip NCP 1117. After the VBUS voltage passes through an LDO (NCP1117-3V3) of the power supply conversion circuit, the stable step-down voltage is output and reduced to 3.3V, and then the power supply is supplied to the main control chip. In addition, two capacitors are added for power supply filtering.
In this embodiment, as shown in fig. 9, the control chip circuit further includes a power switching circuit, and the power switching circuit employs a pad J2. The power supply switching circuit is mainly used for logic level power supply switching, and a bonding pad J2 in the application adopts a bonding pad with the model of JUMPER-32-3, which means that a bonding pad connection required by a user is selected from three bonding pads, if the bonding pad connection is 5V, VBUS is connected with VCC, and if the bonding pad connection is 3.3V, VCC is connected with 3.3V. The pin on the VCC corresponding layout is VIO, the current logic level, and the default short circuit is 5V.
In this embodiment, as shown in fig. 7, a sensor circuit is disposed on the second stacked board, the sensor circuit includes a sensor chip, the SDA pin and the SCL pin of the sensor chip are connected to a voltage of 3.3V through a pull-up resistor R6 and a pull-up resistor R5, respectively, and a shorting pad JP1 is disposed between the connection point of R6 and the pull-up resistor R5 and the voltage of the 3.3V. The communication mode between the sensor circuit and the main control board is IIC, and the needed pins are VCC, GND, SCL and SDA. The two pins of SDA and SCL are respectively connected with resistors R6 and R5, and the resistors R6 and R5 are connected with 3.3V voltage together. A shorting pad JP1 is provided between the resistors R6, R5 and 3.3V. The function of the pad is to select whether pull-up resistor R6 and resistor R5 are enabled. If SCL and SDA are not pulled up on the collocated master control circuitry, then the pull-up resistor on the sensor board needs to be activated. A pull-up resistor is set on the sensor by default. Two capacitors C6 and C7 were also added to the 3.3v supply for filtering.
In short, the above description is only a preferred embodiment of the present invention, and all the equivalent changes and modifications made in accordance with the claims of the present invention should be covered by the scope of the present invention.
Claims (10)
1. The utility model provides a can pile up heap humiture detection system who builds fast which characterized in that: including the first stacked plate that is used for bearing control chip circuit and the second stacked plate that is used for bearing sensor circuit, first stacked plate includes first PCB board (1) and installs row mother (2) in first PCB board (1) both sides, the second stacked plate includes second PCB board (3) and installs row mother (2) in second PCB board (3) both sides, through with the row mother (2) of second PCB board (3) both sides insert row mother (2) of first PCB board (1) both sides, realize that the first stacked plate can be inserted and pulled out install on the second stacked plate.
2. The rapidly-built stacking temperature and humidity detection system according to claim 1, characterized in that: the control chip circuit comprises a main control circuit, a reset circuit, a serial port circuit, a power conversion circuit, a power indication circuit and a power interface, wherein the main control circuit, the reset circuit, the serial port circuit, the power conversion circuit and the power interface are sequentially connected, and the power indication circuit is connected with the power conversion circuit.
3. The rapidly-built stacking temperature and humidity detection system according to claim 1 or 2, characterized in that: the pin positions of the upper row of the female pins (2) on the first PCB (1) and the second PCB (3) are provided with labels, and the same positions of the first PCB (1) and the second PCB (3) are provided with the same labels.
4. The rapidly-built stacking temperature and humidity detection system according to claim 3, characterized in that: the female pin row positions on one sides of the first PCB (1) and the second PCB (3) are sequentially marked as 3V3, SWC, VIO, D13/SCK, D11/MOSI, D12/MISO, SWD, SCL, SDA, AREF, A0, A1, A2, A3, A4 and A5 from left to right, and the female pin row positions on the other sides of the first PCB (1) and the second PCB (3) are sequentially marked as 5V, GND, RESET, D0/RX0, D1/TX0, D2/RX1, D3/TX1, D4, D5, D6, D7, D8, D9, D10/SS, D11/MOSI and D12/MISO from left to right, so that the corresponding female pin rows on the first PCB (1) and the second PCB (3) are connected into the corresponding pin rows.
5. The rapidly-built stacking temperature and humidity detection system according to claim 2, characterized in that: the main control circuit comprises a main control chip LGT8FX8H, a RESET end of the main control chip LGT8FX8H is connected with a key S1 and a pull-up resistor R1, and a capacitor is connected between GND and a VCC pin of the main control chip LGT8FX 8H.
6. The rapidly-built stacking temperature and humidity detection system according to claim 2, characterized in that: the serial circuit comprises a chip HT42B534, pins 10 and 3 of the chip HT42B534 are grounded through capacitors C4 and C3 respectively, pins 1 and 2 of the chip HT42B534 are connected with a USB interface, and a pin VBUS of the USB is connected with a protection resistor F1.
7. The rapidly-built stacking temperature and humidity detection system according to claim 6, characterized in that: the power supply indicating circuit comprises a short-circuit bonding pad J3, a resistor R7 and an LED lamp U $7 which are connected in sequence.
8. The rapidly-built stacked temperature and humidity detection system according to claim 2, 5, 6 or 7, characterized in that: the power conversion circuit adopts a chip NCP1117, and capacitors C8 and C9 are respectively arranged on a pin 3 and a pin 2 of the chip NCP 1117.
9. The rapidly-built stacked temperature and humidity detection system according to claim 2, 5, 6 or 7, characterized in that: the control chip circuit further comprises a power supply switching circuit, and the power supply switching circuit adopts a bonding pad J2.
10. The rapidly-built stacked temperature and humidity detection system as claimed in claim 1, 2, 5, 6 or 7, wherein: a sensor circuit is arranged on the second stacked board, the sensor circuit comprises a sensor chip, an SDA pin and an SCL pin of the sensor chip are respectively connected with 3.3V voltage through a pull-up resistor R6 and a pull-up resistor R5, and a short-circuit bonding pad JP1 is arranged between a connection point of R6 and the pull-up resistor R5 and the 3.3V point voltage.
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CN201920939191.6U CN209992021U (en) | 2019-06-21 | 2019-06-21 | Stacking temperature and humidity detection system capable of being built quickly |
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CN201920939191.6U CN209992021U (en) | 2019-06-21 | 2019-06-21 | Stacking temperature and humidity detection system capable of being built quickly |
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