CN209983024U

CN209983024U - EMI shielding grounding gasket

Info

Publication number: CN209983024U
Application number: CN201920323306.9U
Authority: CN
Inventors: 汪水
Original assignee: HUIZHOU VOIR TECHNOLOGY Co Ltd
Current assignee: HUIZHOU VOIR TECHNOLOGY Co Ltd
Priority date: 2019-03-14
Filing date: 2019-03-14
Publication date: 2020-01-21
Anticipated expiration: 2029-03-14

Abstract

The utility model discloses an EMI shielding grounding gasket, which comprises a silicon core and a base, wherein the silicon core is of a tubular structure, the outer layer of the silicon core is wrapped with a layer of shielding body, the shielding body is conductive silica gel, the conductive silica gel comprises silver nickel powder, the silicon core is fixedly arranged on the base, and the base is made of metal; above-mentioned EMI shields grounding gasket, through the cooperation setting of silicon core, shielding body and base, can let the user establish EMI shield cover in nonlinear 2D or 3D structure, save the equipment inner space than installing traditional shield cover additional, reduced equipment thickness, can establish the ground point in flexible circuit board or other minimum spaces as required, ensure that high conductivity, easy compression, the pressure demand is little, the uniformity of electrical performance can be ensured to characteristics such as resilience good.

Description

EMI shielding grounding gasket

Technical Field

The utility model relates to an electromagnetic interference's technical field specifically is an EMI shields ground connection gasket.

Background

Each company in the electronics industry is faced with CE/EMI requirements. The use of electronic devices is increasing and electromagnetic interference has become a new social public nuisance. Because the current used by the micro, light and integrated electronic circuits and elements is weak current, the power of the control signal is close to the power of the external electromagnetic wave noise, thus easily causing malfunction, sound and image obstruction, and meanwhile, the electronic product can emit electromagnetic waves with different frequencies and interfere with nearby electronic communication equipment. Especially, modern military uses a large amount of electronic equipment, besides preventing external electromagnetic interference, the electromagnetic wave of the electronic equipment is prevented from leaking outwards, the leakage risks of being received by enemies and causing disclosure besides interfering other surrounding equipment, and radiation and immunity must be considered in the early stage of new product development. There are several types of EMI shielding grounding gaskets currently known to the public:

1. conductive silicone rubber pad, it is high to have added a large amount of metal powder in order to make the silica gel material electrically conductive and lead to compressive strength, is difficult when being applied to the microminiature electron by the little part compression, even by the compression of great part after again because the metal powder that self added leads to the resilience performance poor, consequently contact surface and connectivity after long-term use relatively poor lead to whole impedance of taking a border on too high.

2. Hollow electrically conductive silicon rubber pad improves on former basis and has increased the through-hole structure, has optimized the difficult compressed problem of gasket to a certain extent, but resilience performance under the long-term compression is not optimized and even has some losses after the influence of environmental temperature difference.

3. The hollow silicone rubber pad coated with the conductive film is characterized in that metal powder is not added into silicone rubber of the pad, the hollow silicone rubber pad is not provided with conductivity, the rebound resilience is obviously improved compared with the former two pads, the hollow silicone rubber pad is mainly conductive by virtue of a layer of metal foil (such as a polyimide film) coated on the surface, the surface of the metal foil is very smooth, so that the friction force is small, the hollow silicone rubber pad is easily influenced by severe vibration and falling when the hollow silicone rubber pad is used in the fields of vehicle-mounted equipment and mobile electronics and is displaced from a contact surface, and meanwhile, because the surface flatness of the metal foil is excellent, when the hollow silicone rubber pad is contacted with some uneven surfaces (such as.

SUMMERY OF THE UTILITY MODEL

In view of this, there is a need for an EMI shielding grounding gasket.

The utility model provides an EMI shields ground connection gasket, includes silicon core and base, the silicon core is the tubular structure, the outer parcel one deck shielding body of silicon core, the shielding body is electrically conductive silica gel, electrically conductive silica gel includes silver nickel powder, silicon core fixed mounting in on the base, the base is the metal material.

In one embodiment, the shield has a thickness of 0.1 mm.

In one embodiment, the base comprises a clamping portion with two bent ends, and the clamping portion is clamped on the silicon core.

In one embodiment, the base is made of copper material.

Above-mentioned EMI shields grounding gasket, through the cooperation setting of silicon core, shielding body and base, can let the user establish EMI shield cover in nonlinear 2D or 3D structure, save the equipment inner space than installing traditional shield cover additional, reduced equipment thickness, can establish the ground point in flexible circuit board or other minimum spaces as required, ensure that high conductivity, easy compression, the pressure demand is little, the uniformity of electrical performance can be ensured to characteristics such as resilience good.

Drawings

Fig. 1 is a schematic view of an assembly structure of an EMI shielding grounding gasket according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of the EMI shielding grounding gasket of fig. 1 according to an embodiment of the present invention.

As shown in the accompanying drawings: silicon core 10, base 20, clamping part 21, shield 30.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, an EMI shielding grounding gasket comprises a silicon core 10 and a base 20, wherein the silicon core 10 is of a tubular structure, a layer of shielding body 30 wraps the outer layer of the silicon core 10, the shielding body 30 is conductive silica gel, the conductive silica gel comprises silver nickel powder, the silicon core 10 is fixedly mounted on the base 20, and the base 20 is made of metal.

When the gasket is installed, the ultra-soft rubber tube formed by combining the silicon core 10 and the shielding body 30 can be easily compressed by contacting electronic components with different sizes, meanwhile, the high resilience support of the silicon core 10 ensures that the shielding body 30 still keeps high resilience under a long-term compressed environment, the metal base 30 is tightly attached to the bottom of the rubber tube and simultaneously tightly buckled with two ends of the rubber tube, the lap joint impedance formed by the connection of the two is very low, the bottom of the base 20 is spot-welded on a client product, and the firmness of the base enables people to completely avoid worrying about the problem of friction force; the surface of the gasket is provided with a layer of conductive silica gel filled with silver and nickel powder at a high proportion, soft frosted particles can be observed after microscopic amplification, and the gasket is not easy to displace in a vibration environment or in accidental falling by matching with a compression ratio of 30-50%.

Like this, EMI shielding ground connection gasket, through the cooperation setting of silicon core 10, shield 30 and base 20, can let the user establish EMI shield cover in nonlinear 2D or 3D structure, has saved equipment inner space than installing traditional shield cover additional, has reduced equipment thickness, can establish the ground point in flexible circuit board or other minimum spaces as required, ensures that characteristics such as high electric conductivity, easy compression, pressure demand are little, the resilience is good can ensure the uniformity of electrical performance.

Further, in order to minimize the influence of the shield 30 on the softness of the silicon core 10, the thickness of the shield 30 is 0.1 mm.

Therefore, although the high-proportion filling of the silver-nickel powder influences the self resilience, the high-proportion filling of the silver-nickel powder does not influence the softness of the silicon core 10, because the thickness of the shielding body 30 is only 0.1mm, the influence of the filled silver-nickel powder on the softness of the silicon core 10 is reduced to the minimum, the resilience of the internal silicon core 10 can completely support the rebound of the shielding body 30 with the thickness of 0.1mm, so that the silicon core 10 can be easily compressed to 50 percent to keep good connection with contact surfaces with different roughness, and meanwhile, the characteristic of low resistance on the surface is ensured.

Further, in order to make the silicon core 10 and the base 20 more stably installed, the base 20 includes a clamping portion 21 with two bent ends, and the clamping portion 21 is clamped on the silicon core 10.

Thus, the clamping part 21 is firmly clamped in the silicon core 10, so that the silicon core 10 and the base 20 cannot be easily separated.

Further, the base 20 is made of copper material.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An EMI shielding grounding gasket, comprising: including silicon core and base, the silicon core is the tubular structure, the outer parcel one deck shield body of silicon core, the shield body is electrically conductive silica gel, electrically conductive silica gel includes silver nickel powder, silicon core fixed mounting in on the base, the base is the metal material.

2. The EMI shielding grounding gasket of claim 1, wherein: the thickness of the shielding body is 0.1 mm.

3. The EMI shielding grounding gasket of claim 1, wherein: the base comprises clamping parts with two bent ends, and the clamping parts are clamped on the silicon core.

4. The EMI shielding grounding gasket of claim 1, wherein: the base is made of copper material.