CN105900237A - Interposer for mems-on-lid microphone - Google Patents

Interposer for mems-on-lid microphone Download PDF

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Publication number
CN105900237A
CN105900237A CN201580003848.2A CN201580003848A CN105900237A CN 105900237 A CN105900237 A CN 105900237A CN 201580003848 A CN201580003848 A CN 201580003848A CN 105900237 A CN105900237 A CN 105900237A
Authority
CN
China
Prior art keywords
lid
mike
wall
insert
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580003848.2A
Other languages
Chinese (zh)
Inventor
J·斯泽赫
J·沃森
G·瑟维斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Knowles Electronics LLC
Original Assignee
Knowles Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knowles Electronics LLC filed Critical Knowles Electronics LLC
Publication of CN105900237A publication Critical patent/CN105900237A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H04R1/083—Special constructions of mouthpieces
    • H04R1/086—Protective screens, e.g. all weather or wind screens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
    • H04R23/006—Transducers other than those covered by groups H04R9/00 - H04R21/00 using solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Abstract

A microphone includes an interposer, a lid, and a base. The interposer includes at least one wall portion that forms a cavity. The wall portion includes a first side and a second side that are opposite from each other. The lid is coupled to the first side of the interposer and the base is coupled to the second side of the interposer such that the lid and the base enclose the cavity. A microelectromechanical system (MEMS) device is disposed in the cavity. The interposer structurally supports one or both of the lid and the base. The interposer includes a plurality of plated regions that are configured to electrically connect the lid and the base. The plated regions are configured to at least partially be exposed and open to the cavity.

Description

The insert of MEMS microphone on lid
Cross-Reference to Related Applications
Entitled " the Interposer for MEMS-on-lid of patent application claims submission on January 9th, 2014 Microphone " the rights and interests of U.S. Provisional Patent Application No.61/925359, the full content of this patent application leads to Cross the overall mode quoted to be comprised in herein.
Technical field
The application relates to MEMS microphone, and constructs more particularly, to it.
Background technology
Use various types of acoustic equipment.One example of acoustic equipment is mike.Generally come Saying, mike converts acoustic waves into the signal of telecommunication.Mike sometimes includes that multiple parts, the plurality of parts include micro- Electronic mechanical system (MEMS) parts and integrated circuit (such as, special IC (ASIC)).
The acoustical behavior of microphone assembly partly with front volume (that is, the air between barrier film and acoustical ports of assembly Volume) and rear volume (that is, encapsulation cavity and barrier film the volume of air comprised) between ratio be correlated with.In allusion quotation In the top port device of type, parts are attached directly to substrate or substrate and acoustical ports is positioned in top or lid On so that front volume is bigger relative to rear volume.This is not that the optimal performance for microphone assembly is (that is, highly sensitive Property, flat wideband response) needed for preferably than.
In other constructs, MEMS component is arranged on the lid of assembly rather than in substrate.In this situation Under, need to form conducting path so that the signal of telecommunication (via suprabasil conductive welding disk) produced by MEMS component Outside can be arrived.The signal of telecommunication arrive external conduct pad time, these signals just can by such as cell phone, The such customer service circuit of circuit found in the miscellaneous equipment that computer or mike are put is utilized.
MEMS microphone is typically provided in the such device of such as cell phone and personal computer.Expecting will These devices are made to the least.Result, it is desirable to MEMS microphone is made to the least.
Electrically connect to set up between the lid and substrate of mike, to using on lid owing to wall comprises plating coating ventilating hole The further miniaturization of the MEMS microphone that MEMS (MEMES-on-lid) constructs and cost reduction have challenge Property.Plating coating ventilating hole requires the sizable space on substrate (PCB) and almost without staying for accommodating MEMS The additional space of the cavity area of wafer and integrated circuit.
Accompanying drawing explanation
In order to be more fully understood by the disclosure, it should mediate a settlement accompanying drawing with reference to detailed description below, wherein:
Fig. 1 includes the axonometric chart of the first example of the insert of the various embodiments according to the present invention；
Fig. 2 includes the axonometric chart of the insert of Fig. 1 of the various embodiments according to the present invention；
Fig. 3 includes the line A-A along Fig. 1 of the various embodiments according to the present invention intercepts, Fig. 1 and Fig. 2 The side sectional view of current path of device；
Fig. 4 includes the axonometric chart of the second example of the insert of the various embodiments according to the present invention；
Fig. 5 includes the axonometric chart of the 3rd example of the insert of the various embodiments according to the present invention.
It will be understood by those skilled in the art that the element illustrated in the accompanying drawings is in order to succinct and clear.It will also be understood that can With according to specifically occurring that order describes or describes specific action and/or step, and those skilled in the art will manage Solving, this specific aim about order is the most unwanted.It will also be understood that except stating the most in this article Beyond specific meanings, term used herein and expressing also has as relative to the respective investigation of its correspondence and research Its ordinary meaning that these terms in field and expression are given.
Detailed description of the invention
The scheme providing the insert utilized in MEMS microphone is described.Insert is on the one hand by plating Wall forms, and wherein plating is towards the inside of mike." plating " refers to that using non-electrical shikishima plating process to come to surface adds Metallization.Insert is used as the structural support of mike and also is used as current path.This insert can be with micro- Electronic mechanical system (MEMS) assembly and/or special IC (ASIC) are positioned on same surface.Can be Wire is used to engage between MEMS component and ASIC.
Scheme described herein is particularly well-suited to MEMS microphone structure on lid.On lid, MEMS refers to MEMS component is arranged on the lid (or lid) of device rather than in substrate (or substrate).Substrate (or base Plate) generally include the trace for transmitting the signal of telecommunication or other conductive path.
In multiple embodiments in these embodiments, mike includes insert, lid and substrate.This insertion Part includes at least one the wall portion forming cavity.This wall portion includes relative to each other first and second.This lid coupling Receive insert first, this substrate is couple to second of this insert so that lid and substrate close cavity. Cavity is provided with microelectromechanical systems (MEMS) device.Insert structurally supports in lid and substrate One or both.Insert includes the multiple plated area being configured to lid and substrate be electrically connected.Plated area quilt It is configured to be at least partially exposed to this cavity and this cavity is opened at least in part.
In some instances, this at least one wall portion includes the first wall and the second wall, and the plurality of plated area includes It is arranged on the first plated area at the first wall and is arranged on the second plated area at the second wall.In other example, Mike also includes the special IC (ASIC) being arranged in this cavity.
In other side, MEMS is couple to lid.In some instances, lid includes that multilamellar FR-4 is printed Circuit board.In other example, substrate includes at least in part by the printed circuit board (PCB) of insulation construction.
In other side, this at least one wall includes RF shielding part.RF shielding part is Faraday shield or farad Pad (for two examples).In other side, this at least one wall portion includes the first wall and the second wall, and should Multiple plated area include the first plated area being arranged at the first wall, and are provided with RF shielding at the second wall Part.In other example, it is provided through the port of lid.
One example of microphone assembly 100 is described referring now to Fig. 1, Fig. 2 and Fig. 3.Microphone assembly 100 Including insert 102.Insert includes wall 104 and conduction plating part 127.Microphone assembly 100 includes lid 108, Microelectromechanical systems (MEMS) parts 110 and special IC (ASIC) 112.Port 114 extends through Cross lid 108.Power path 126 from MEMS component 110, extends to ASIC 112, by leading by wire 116 Line 118, extends to conductive welding disk 120, by the conduction plating part 127 on insert 102, through conductive through hole 122, and extend to the external conduct pad 124 being positioned in substrate 125.External conduct pad 124 is couple to visitor Family electronic unit, the such as parts in cellular telephone or personal computer (for two examples).Conduction plating part 127 internal cavities being exposed to microphone assembly 100.
MEMS component 110 includes barrier film and backboard.MEMS component 110 will (receive via port 114) Acoustic energy is converted into the signal of telecommunication.This signal of telecommunication is processed by ASIC 112, such as, performs enlarging function or noise Eliminate function.
It will be understood that microphone assembly 110 described herein is MEMS microphone on lid, wherein MEMS component (and ASIC possibly) is connected to the lid of microphone assembly rather than is connected to substrate.Lid 108 are constructed by multilamellar FR-4 printed circuit board (PCB) (PCB).Substrate 125 1 aspect can be printed circuit board (PCB), or Person can be constructed by electrically insulating material.Laser direct forming (Laser Direct Structuring) can be used to produce Or structure conduction plating part 127.
Referring now to Fig. 3, the current path from MEMS component to ASIC is described.As described, MEMS Parts 110 and ASIC 112 are arranged on the lid 108 of microphone assembly 100.Power path 126 is configured to The outside of mike 100 will be sent out to from MEMS component 110, the signal of telecommunication that processed by ASIC 112, In the outside of this mike 100, the signal of telecommunication can be used by customer equipment further and process.Such as, it will be appreciated that , microphone assembly 100 can be disposed in the such device of such as cell phone or personal computer.Other Example is possible.
Insert 102 is plated with the first metal layer 132 (such as, copper) and the second metal level 134 (such as, copper). Insert 102 is also constructed by electrically insulating material 136.Insert 102 forms cavity 131.When microphone assembly 100 Time assembled, MEMS component 110 and ASIC 112 is arranged in this cavity.
Power path 126 by electric wire 116, extends to ASIC 112 from MEMS component 110, by electric wire 118, Extend to conductive welding disk 120, by insert 102, through conductive through hole 122, and extend to external conductive weldering Dish 124.It will be understood that all parts in shown in figures herein is connected or coupled to one with electric welding material 128 Rise.
It can be seen that insert 102 is the structural support of microphone assembly 100, and it is used to electric current Path 126.Will be further appreciated that insert 102 and MEMS component 110 and ASIC 112 are positioned at same On one surface (that is, the surface of lid 108).Because top surface and basal surface contain close with solder after reflow The welding metallization ring of envelope, so the epoxy technique that need not add is come between insert 102 and lid 108 Or acoustic seal is provided between insert 102 and substrate 125.
Another example of insert 400 is described referring now to Fig. 4.Insert 400 includes wall portion 402.Insert 400 form cavity 405, dispose the internal part of mike in cavity 405.It will be understood that insert 400 It is positioned between lid and substrate (or substrate), and can be positioned according to the insert 102 in Fig. 1 Identical mode between lid 108 and substrate 125 is arranged relative to these parts.Faraday's pad 408 It is arranged in wall portion 402.The purpose of faraday's pad 408 is to provide raising RF vulnerability to jamming.
At MEMS component (on lid) and external equipment, (it is couple to suprabasil weldering to conduction plating part 404 Dish) between carry signal.Contrary with the example shown in Fig. 1 to Fig. 3, plating part is attached to form wall portion here The electrically insulating material 406 of 402.
Because all electrical connection runs along the inner surface of insert, so this insert structure in Fig. 4 makes chamber The volume of body 405 is greatly increased.In some instances, cavity volume adds 47% compared with mike before. In some respects, because there is space between solder joint lid, insert and substrate PCB surface coupled together, Need additional epoxy technique to produce acoustic seal between insert and lid and substrate PCB.
The another example of insert 500 is described referring now to Fig. 5.Insert 500 include wall portion 502, cavity 504, Conduction plating part 506 and Horse hoof Faraday shield 508.The purpose of Faraday shield 508 is to improve RF anti-interference Property.
It will be understood that insert 500 is positioned between lid and substrate (or substrate), and can be according to The identical mode being positioned between lid 108 and substrate 125 with the insert 102 in Fig. 1 is come relative to these Parts are arranged.
At MEMS component (on lid) and external device (ED), (it is couple to suprabasil weldering to conduction plating part 506 Dish) between carry signal.Contrary with the example shown in Fig. 1 to Fig. 3, plating part is attached to form wall portion here The electrically insulating material 510 of 502.
There is described herein the preferred embodiment of the present invention, including known for inventor for performing the optimal of the present invention Embodiment.It should be understood that what illustrated embodiment was merely exemplary, and should not be construed as institute The restriction of the scope of attached claim.

Claims (10)

1. a mike, this mike includes:
Insert, this insert includes at least one the wall portion forming cavity, and described wall portion includes first and second, Described first and described second toward each other；
Lid, this lid is couple to described first of described insert；
Substrate, this substrate is couple to described second of described insert so that described lid and described substrate close institute State cavity；
The microelectromechanical systems MEMS being arranged in described cavity；
Described insert is made structurally to support one or both in described lid and described substrate, described insert Including multiple plated area, the plurality of plated area is configured to electrically connect described lid and described substrate, described plating Deposited region is configured to be at least partially exposed to this cavity and open this cavity at least in part.
Mike the most according to claim 1, wherein, at least one wall portion described includes the first wall and second Wall, and wherein, the plurality of plated area includes the first plated area being arranged at described first wall and is arranged on The second plated area at described second wall.
Mike the most according to claim 1, it is special that described mike also includes being arranged in described cavity Integrated circuit ASIC.
Mike the most according to claim 1, wherein, described MEMS is couple to described lid.
Mike the most according to claim 1, wherein, described lid includes multilamellar FR-4 printed circuit board (PCB).
Mike the most according to claim 1, wherein, described substrate includes at least in part by insulant The printed circuit board (PCB) of structure.
Mike the most according to claim 1, wherein, at least one wall described includes RF shielding part.
Mike the most according to claim 7, wherein, described RF shielding part includes Faraday shield or method Draw pad.
Mike the most according to claim 1, wherein, at least one wall portion described includes the first wall and second Wall, and wherein, the plurality of plated area includes being arranged on the first plated area at described first wall, and its In at described second wall, be provided with RF shielding part.
Mike the most according to claim 1, wherein, is provided through the port of described lid.
CN201580003848.2A 2014-01-09 2015-01-08 Interposer for mems-on-lid microphone Pending CN105900237A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461925359P 2014-01-09 2014-01-09
US61/925,359 2014-01-09
PCT/US2015/010616 WO2015105969A1 (en) 2014-01-09 2015-01-08 Interposer for mems-on-lid microphone

Publications (1)

Publication Number Publication Date
CN105900237A true CN105900237A (en) 2016-08-24

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Application Number Title Priority Date Filing Date
CN201580003848.2A Pending CN105900237A (en) 2014-01-09 2015-01-08 Interposer for mems-on-lid microphone

Country Status (5)

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US (1) US9307328B2 (en)
KR (1) KR20160096207A (en)
CN (1) CN105900237A (en)
DE (1) DE112015000379T5 (en)
WO (1) WO2015105969A1 (en)

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US9307328B2 (en) 2016-04-05

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