CN209929297U - Surface-mounted diode packaging structure - Google Patents
Surface-mounted diode packaging structure Download PDFInfo
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- CN209929297U CN209929297U CN201921033358.9U CN201921033358U CN209929297U CN 209929297 U CN209929297 U CN 209929297U CN 201921033358 U CN201921033358 U CN 201921033358U CN 209929297 U CN209929297 U CN 209929297U
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- jumper
- copper frame
- packaging
- plastic
- pin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to a surface-mounted diode packaging structure, which comprises a plastic packaging body, wherein a copper frame substrate is arranged in the plastic packaging body structure, an anti-overflow groove is arranged on the copper frame substrate, a packaging chip is welded on the anti-overflow groove, the front surface of the packaging chip is provided with a jumper, the jumper is a square head, the front surface of the chip is welded with a jumper head, and the jumper extended from the jumper head is welded and connected with a wing-shaped pin; the airfoil shaped pin is above the parting line of the plastic body and protrudes out of the body. The utility model discloses the plastic envelope body is highly thin, and copper frame base plate replaces the one end pin, and the dress of being convenient for is used, and the outside has protruding outer edge to be convenient for dispel the heat, jumps the piece straight and other end wing section pin welding, alleviates welding alternation stress, and the wing section pin is visited out more than the body parting line, and the encapsulation stress that appears among the release forming process, and the matching nature is good moreover, and "#" welding position is big on the base plate, and chip package size range is wide, suitable extensive using widely.
Description
Technical Field
The utility model belongs to the technical field of the diode, concretely relates to subsides dress diode packaging structure.
Background
The structural design of the semiconductor device package is not only related to the reliability and stability of the electrical performance of the product application, but also plays an important role in the thermal performance of the circuit and the miniaturization and integration of the whole machine. The packaging body is used for protecting the chip, the connecting lead and the like, so that the chip is prevented from being damaged by external force and being influenced by external environment; the design of the internal structure and the matching of the thermal expansion coefficients of the internal chip, the substrate, the frame, the wires, etc. are very related to the package body and the thermal expansion coefficient between the package body and the internal chip, the substrate, the frame, the wires, etc., and the actual application space is considered. With the progress of the integration technology, the chip packaging is developed to be light, thin, short and small, the through hole plug-in devices can not meet the requirements of circuit application, and compared with the direct plug-in devices, the chip device has the advantages of small volume, light weight, high reliability and strong vibration resistance; the welding spot defect rate is low, and the high-frequency characteristic is good; electromagnetic and radio frequency interference is reduced, automation is easy to realize, and production efficiency is improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a packaging structure of surface mounting diode rectifier, this structural design is reasonable, novel, can replace the heavy current cut straightly components and parts among the practical application, and more former product reduce cost reaches 30% -50%, and the product volume dwindles 40% -60%, and weight reduction 60% -80%, reaches save material, energy, equipment, man-hour purpose.
In order to achieve the above object, the technical solution of the present invention is as follows.
A surface-mounted diode packaging structure comprises a plastic packaging body, wherein a copper frame substrate is arranged in the plastic packaging body structure, a # anti-overflow groove is formed in the copper frame substrate, a packaging chip is welded on the anti-overflow groove, a jumper is arranged on the front surface of the packaging chip, the jumper is a square head, a jumper head is welded on the front surface of the chip, and the jumper extending from the head of the jumper is connected with a wing-shaped pin in a welding manner; the wing-shaped pin is arranged above the parting line of the plastic body and extends out of the body; the lower bottom surface of the wing-shaped pin and the lower bottom surface of the copper frame substrate are on the same plane.
The size of the copper frame substrate is 9.8 × 14.5mm, and the size of the "#" type anti-overflow slot is 7.4 × 7.4 mm; the depth of the overflow preventing groove is 0.1mm, the thickness of the base plate is 1.2mm, and the height of the protruding outer edges at the two sides is 1.8 mm.
The head of the jumper is square, the size of the head is 5.0 x 5.Omm, the center of the jumper is provided with a square bulge, the length and the width of the bulge are 1.5mm, the height of the bulge is 0.7mm, and the thickness of the jumper is 0.5 mm.
The width of the wing-shaped pin is 4.0mm, the thickness of the pin is 0.7mm, the length of the body extending above the parting line of the plastic package body is 2.5mm, and the size from the inner side edge of the lower bottom surface of the pin to the outer edge of the copper frame substrate is 2.5 mm.
The plastic packaging height of the plastic packaging body is 3.5 mm.
The lower bottom surface of the wing-shaped pin and the lower bottom surface of the copper frame substrate are on the same plane.
And the copper frame substrate, the jumper, the airfoil-shaped pin and the chip are welded by low-temperature solder.
The utility model discloses an appearance is the platykurtic, and the rectangle encapsulation, the structure is the plastic packaging body. A wing-shaped lead terminal is led out of one end of the packaging body and is 2.5mm away from the plastic packaging body, so that a safe design interval is achieved; another side pin and chip carrier copper frame base plate in an organic whole, get rid of unilateral pin in the design, copper frame base plate size is 9.8 x 14.5mm, designs for the spill, and outer along protruding, the outer edge exposes in the plastic envelope body outside during the encapsulation, and copper frame base plate design thickness is 1.2mm, and outer along protruding height is 1.8mm, and the copper frame base plate thickens, and the bottom exposes and does not have the plastic envelope parcel, effectively guarantees the heat dissipation. The lead-free surface mount device is suitable for surface mounting without leads, reduces stray capacitance and unnecessary inductance, is beneficial to high-frequency application, does not need a mounting through hole with pin polarity, and reduces the number of required substrate layers. And the assembly process during the internal production is simplified, the matching application of the raw materials on the automatic assembly equipment is facilitated, the production efficiency is improved, and the automatic supply and automatic mounting equipment for mounting the devices can be adopted during the mounting and application. The jumper is a square head, so that the effective contact area with the chip is ensured, the thickness of the copper material is 1.0mm, the designed length and width area is larger than the area of the chip to be welded, the influence of injection molding stress is avoided during plastic packaging and glue injection, and the chip, the jumper and the plastic packaging are ensured to be in thermal expansion fit; the jumper strip does not adopt a bending mode, adopts the design that the square head is flatly extended to the wing-shaped lead terminal in a welding connection mode, guarantees the relieving and the releasing of welding stress, and the wing-shaped lead terminal is located on the upper portion of a parting line of the plastic package body, so that the releasing of post-curing stress is facilitated, and the mechanical stress damage during the bending of a pin is avoided. The copper frame substrate is provided with a # -shaped anti-overflow groove, so that mechanical stress generated when the copper frame substrate is stamped is prevented from being cracked besides solder overflow; the two sides of the substrate are provided with the convex outer edges which can be tightly contacted with the plastic package body, so that the plastic package area is increased, the compact packaging effect is ensured, the outer edges can also better transmit the heat of the copper frame substrate, and the good heat dissipation effect is ensured; the plastic package thickness of the upper part of the jumper is 0.5mm, and the thin design is favorable for heat dissipation; the thickness of the plastic package body is 3.5 mm. The whole novel design can fully consider heat dissipation, thermal expansion matching between the structural component in selecting materials, producing, assembling and applying, and the automatic equipment collocation and utilization in production and application, and the key is satisfied, thereby improving the reliability and yield of the product application link, solving the space requirement required by the circuit integration technology assembly, and being suitable for wide popularization and application.
The utility model discloses a beneficial effect lie in: the utility model discloses the plastic envelope body is highly thin, and copper frame base plate replaces the one end pin, and the dress of being convenient for is used, and the outside has protruding outer edge to be convenient for dispel the heat, jumps the piece straight and other end wing section pin welding, alleviates welding alternation stress, and the wing section pin is visited out more than the body parting line, and the encapsulation stress that appears among the release forming process, and the matching nature is good moreover, and "#" welding position is big on the base plate, and chip package size range is wide, suitable extensive using widely.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic structural diagram of the internal components of the present invention.
Fig. 3 is a schematic top view of the present invention.
Fig. 4 is a schematic side view of the present invention.
The notation in the figure is: 1, plastic packaging a body, 2, a copper frame substrate, 3 jumper bars, 4 wing-shaped pins, 5 packaging chips, 6 substrate anti-overflow grooves, 7 jumper bar square heads and 8 frame outer edges;
Detailed Description
The following description of the embodiments of the present invention will be provided in conjunction with the accompanying drawings for better understanding of the invention.
The surface-mounted diode packaging structure shown in fig. 1 to 4 comprises a plastic package body 1, wherein a copper frame substrate 2 is arranged in the plastic package body 1, a # -shaped substrate anti-overflow groove 6 is formed in the copper frame substrate 2, a packaging chip 5 is welded on the # -shaped substrate anti-overflow groove 6, a jumper 3 is arranged on the front face of the packaging chip 5, the jumper 3 is a square head, and a jumper square head 7 is welded on the front face of the packaging chip 5; the jumper square head 7 is welded and connected with an airfoil-shaped pin 4 after extending; the wing-shaped pin 4 is arranged above the parting line of the plastic body 1 and extends out of the plastic package body 1; the lower bottom surface of the wing type pin 4 and the lower bottom surface of the copper frame substrate 2 are on the same plane. The base plate anti-overflow groove 6 is set to a "#" type anti-overflow groove. The outer part of the plastic package body 1 is provided with a frame outer edge 8.
The copper frame base plate 2 has a size of 9.8 × 14.5mm, and the "#" -type overflow preventing groove 6 has a size of 7.4 × 7.4 mm; the depth of the overflow preventing groove 6 is 0.1mm, the thickness of the base plate 2 is 1.2mm, and the height of the outer edge 8 of the protruding frames at two sides is 1.8 mm.
The head of the jumper 3 is square, the size of the jumper is 5.0 × 5.0mm, and the size of the jumper square head 7 is 1.5 mm.
The width of the airfoil-shaped pin 4.0mm, the pin thickness of 0.7mm, the length of the body extending above the parting line of the plastic package body 1 is 2.5mm, and the size from the inner side edge of the lower bottom surface of the pin to the outer edge of the copper frame substrate 2 is 2.5 mm.
The plastic package height of the plastic package body 1 is 3.5 mm.
The lower bottom surfaces of the wing-shaped pins 4 and the lower bottom surface of the copper frame substrate 2 are on the same plane.
And the copper frame substrate 2, the jumper 3, the airfoil-shaped pin 4 and the chip 5 are welded by low-temperature solder.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (7)
1. A paste dress diode packaging structure which characterized in that: the packaging structure comprises a plastic packaging body, wherein a copper frame base plate is arranged in the structure of the plastic packaging body, a # -shaped anti-overflow groove is formed in the copper frame base plate, a packaging chip is welded on the # -shaped anti-overflow groove, a jumper is arranged on the front surface of the packaging chip, the jumper is a square head, the head of the jumper is welded on the front surface of the chip, and the jumper extending from the head of the jumper is connected with a wing-shaped pin in a welding manner; the wing-shaped pin is arranged above the parting line of the plastic body and extends out of the body; the lower bottom surface of the wing-shaped pin and the lower bottom surface of the copper frame substrate are on the same plane.
2. A surface mount diode package structure as recited in claim 1, wherein: the size of the copper frame substrate is 9.8 × 14.5mm, and the size of the "#" type anti-overflow slot is 7.4 × 7.4 mm; the depth of the overflow preventing groove is 0.1mm, the thickness of the base plate is 1.2mm, and the height of the protruding outer edges at the two sides is 1.8 mm.
3. A surface mount diode package structure as recited in claim 1, wherein: the jumping sheet is characterized in that the head of the jumping sheet is square, the size of the jumping sheet is 5.0 x 5.0mm, a square bulge is arranged in the center of the jumping sheet, the length and the width of the bulge are 1.5mm, the height of the bulge is 0.7mm, and the thickness of the jumping sheet is 0.5 mm.
4. A surface mount diode package structure as recited in claim 1, wherein: the width of the wing-shaped pin is 4.0mm, the thickness of the pin is 0.7mm, the length of the body extending above the parting line of the plastic package body is 2.5mm, and the size from the inner side edge of the lower bottom surface of the pin to the outer edge of the copper frame substrate is 2.5 mm.
5. A surface mount diode package structure as recited in claim 1, wherein: the plastic package height of the plastic package body is 3.5 mm.
6. A surface mount diode package structure as recited in claim 1, wherein: the lower bottom surface of the wing-shaped pin and the lower bottom surface of the copper frame substrate are on the same plane.
7. A surface mount diode package structure as recited in claim 1, wherein: and the copper frame substrate, the jumper, the airfoil-shaped pin and the chip are welded by low-temperature solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921033358.9U CN209929297U (en) | 2019-07-03 | 2019-07-03 | Surface-mounted diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921033358.9U CN209929297U (en) | 2019-07-03 | 2019-07-03 | Surface-mounted diode packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209929297U true CN209929297U (en) | 2020-01-10 |
Family
ID=69093692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921033358.9U Active CN209929297U (en) | 2019-07-03 | 2019-07-03 | Surface-mounted diode packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209929297U (en) |
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2019
- 2019-07-03 CN CN201921033358.9U patent/CN209929297U/en active Active
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