CN209919117U

CN209919117U - Laser cutting device of wafer

Info

Publication number: CN209919117U
Application number: CN201920214675.4U
Authority: CN
Inventors: 陈义红; 李贵林; 陈聪; 李陵江
Original assignee: ANTE LASER Co Ltd
Current assignee: ANTE LASER Co Ltd
Priority date: 2019-02-20
Filing date: 2019-02-20
Publication date: 2020-01-10
Anticipated expiration: 2029-02-20

Abstract

The utility model discloses a laser cutting device of wafer, including board and the wafer cutting device of setting on the board, the feed side and the ejection of compact side of board all are equipped with the conveying mechanism who carries the wafer, two be equipped with the shooting positioning mechanism of wafer between the conveying mechanism, one side of shooting positioning mechanism is equipped with the suction means of wafer, it is equipped with and can reciprocates the laser cutter to shoot positioning mechanism one side. The utility model provides a pair of laser cutting device of wafer, through shooting positioning mechanism, it is more accurate to make the laser cutting ware fix a position, and cooperation conveying mechanism and suction means, the quick accurate cutting wafer that can automize.

Description

Laser cutting device of wafer

Technical Field

The invention relates to the technical field of wafer processing, in particular to a laser cutting device for a wafer.

Background

The wafer is prepared by purifying, melting and distilling silicon dioxide to obtain silicon crystal rods, and then grinding, polishing and slicing the silicon crystal rods by a wafer factory. The wafer can be used to process and manufacture various circuit device structures to become IC products with specific electrical functions. The processing of wafers requires that an entire wafer be divided into individual chips by the size of the chip. The existing processing mode is realized by matching a cutting machine with a manual work or matching a vacuum ceramic sucker with a moving mechanism.

When carrying out laser cutting machine to the wafer on, if adopt vacuum ceramic sucking disc cooperation moving mechanism to absorb the wafer and place the processing bench, although production efficiency is very fast, but, the machine is after long-time operation, and the moving mechanism of the vacuum ceramic sucking disc that carries out the fine setting and X, Y axle can produce the deviation, leads to the wafer to place the inaccuracy of position, and then leads to the fact the increase of rejection rate.

If the special anti-abrasion gloves are worn manually, wafers can be placed on the processing table manually one by one, defective products of the wafers can be better avoided, the labor is consumed, the consumed time is long, and the improvement of the production efficiency is not facilitated.

Therefore, there is a need for a laser cutting apparatus for a wafer that can solve the above problems.

Disclosure of Invention

The invention aims to provide a laser cutting device for a wafer, which can enable a laser cutter to be positioned more accurately through a shooting positioning mechanism, and can automatically, quickly and accurately cut the wafer by matching with a conveying mechanism and a suction mechanism.

In order to achieve the purpose, the invention provides a laser cutting device for a wafer, which comprises a machine table and a wafer cutting device arranged on the machine table, wherein conveying mechanisms for conveying the wafer are arranged on the feeding side and the discharging side of the machine table, a shooting and positioning mechanism for the wafer is arranged between the two conveying mechanisms, a sucking mechanism for the wafer is arranged on one side of the shooting and positioning mechanism, and a laser cutter capable of moving up and down is arranged on one side of the shooting and positioning mechanism.

As a further improvement of the invention, the conveying mechanism comprises a mounting frame, and a material supporting platform which can linearly reciprocate under the action of a driving mechanism is horizontally arranged at the upper edge of the mounting frame; the upper part of the mounting frame and the material supporting platform are respectively provided with a first steering roller and a guide wheel which are positioned at the same height and have horizontally extending axes; the device also comprises a feeding belt which is arranged along the moving direction of the material supporting platform and sleeved on the first steering roller and the guide wheel, and a power device and a belt tightening device of the feeding belt are also arranged on the mounting rack.

As a further improvement of the invention, one side of the lower part of the mounting rack is provided with a second steering roller which is used for guiding the feeding belt to turn horizontally and can rotate axially, the other side of the lower part of the mounting rack is provided with a third steering roller which is used for guiding the feeding belt to turn upwards, and the belt tightening device is arranged at the upper part of the third steering roller.

As a further improvement of the invention, the belt tightening device comprises a pushing mechanism, a sliding cover capable of moving back and forth along the moving direction of the material supporting platform under the action of the pushing mechanism is arranged on the upper end surface of the pushing mechanism, and a fourth steering roller for guiding the feeding belt to turn upwards and horizontally moving the tightening belt is arranged on the upper end surface of the sliding cover.

As a further improvement of the present invention, the suction mechanism comprises a first horizontal moving mechanism arranged along the conveying direction of the wafer, the first horizontal moving mechanism is provided with a mounting seat reciprocating along the arrangement direction of the first horizontal moving mechanism, and the upper part of the mounting seat is provided with two mutually parallel mechanical arms for sucking the wafer.

As a further improvement of the invention, the mechanical arm is provided with a sucking disc which is horizontally arranged and can move up and down at the lower part of one end far away from the mounting seat, and the sucking disc is provided with a plurality of air suction pipes which are arranged around the axis of the sucking disc.

As a further improvement of the invention, the shooting positioning mechanism comprises a second horizontal moving mechanism and a fixed frame arranged on one side of the second horizontal moving mechanism, and a bearing platform linked with the second horizontal moving mechanism is arranged on the second horizontal moving mechanism; the fixing frame is connected with a camera and a frame located below the camera, the frame is located above the second horizontal moving mechanism and is higher than the bearing platform in height, and a light supplement lamp is arranged on the inner side of the frame.

As a further improvement of the invention, the plummer comprises a bottom plate, wherein a hollow bulge part is arranged on the bottom plate, a cavity is formed inside the side wall of the bulge part, the cavity is communicated with an air suction pipe joint arranged on the side wall of the bulge part, and an adsorption part communicated with the cavity is also arranged on the upper side of the bulge part; the adsorption part comprises a groove arranged on the upper side of the protruding part and a through hole arranged in the groove, the groove is communicated with the cavity through the through hole, and the air suction pipe joints are at least two and are uniformly arranged around the center of the protruding part.

As a further improvement of the invention, the outer side of the boss is further provided with at least three pressing devices for assisting in pressing the wafer, the pressing devices are uniformly arranged around the center of the boss, each pressing device comprises a pressing sheet and a motor capable of driving the pressing sheet to horizontally rotate, and a gap corresponding to a space required by the rotation of the pressing sheet is also reserved at the outer edge of the upper side of the boss.

As a further improvement of the present invention, the second horizontal movement mechanism includes a first linear movement mechanism and a second linear movement mechanism arranged perpendicularly to each other.

Advantageous effects

Compared with the prior art, the laser cutting device for the wafer has the advantages that:

1. according to the invention, the origin is positioned by the shooting positioning mechanism, then the bearing platform is moved to the lower part of the laser cutter, and the laser cutter carries out cutting processing according to the positioning information. The laser cutting machine is different from the prior art in that the bearing table needs to be finely adjusted to align to a fixed position, so that the deviation of the machine caused by long-time work is avoided, the rejection rate is greatly reduced, and the laser cutting machine is positioned more accurately. Meanwhile, the conveying mechanism and the suction mechanism are matched, the wafer can be automatically, rapidly and accurately cut, manual transfer of the wafer can be replaced, damage caused by manual transfer of the wafer is avoided, labor is saved, automation of a wafer production line is achieved, and production efficiency of the whole wafer production line is improved.

2. The second steering roller can drive the feeding belt to rotate and is used for transporting the wafer. Meanwhile, the belt tightening device can tighten the feeding belt through horizontal movement, so that the feeding belt cannot loosen and fall off along with the displacement change of the material supporting platform, and the working stability of the whole device is ensured.

3. The second steering roller is provided with a driving wheel which guides the second steering roller to rotate axially, and the driving wheel is in transmission connection with a power device. The driving wheel is driven by the power device and drives the second steering roller so as to drive the whole feeding belt. The power device is not directly arranged on the material supporting platform, so that the vibration generated by the power device does not influence the stability of wafer conveying.

4. This device provides stable and sufficient light filling lamp, improves and shoots the definition to can be directly through the image processing after shooing, find the setpoint of adding man-hour, make things convenient for laser cutting ware's processing, thereby can the accurate positioning wafer, avoided machine wearing and tearing etc. to cause the location inaccurate.

5. The adsorption part on the bearing table can uniformly provide adsorption force during working, and the object to be processed is stabilized. The adsorption part can be arranged in an opening shape and can also be communicated with a plurality of grooves, so that the controllability and the stability of airflow can be improved.

6. The plummer utilizes absorption portion and closing device, further realizes the fixed of wafer, makes the difficult skew of wafer at the in-process that the plummer removed, fixes a position more accurately. Particularly, the arrangement of the grooves ensures that the wafer is not easy to deform and the air flow is easy to control when being adsorbed.

The invention will become more apparent from the following description when taken in conjunction with the accompanying drawings, which illustrate embodiments of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a partial enlarged view of portion B of FIG. 1;

FIG. 3 is a front view of the present invention;

FIG. 4 is a top view of the present invention;

FIG. 5 is a schematic view of the internal structure of the conveying mechanism;

FIG. 6 is a perspective view of the transport mechanism;

FIG. 7 is a schematic view of the construction of the photographing positioning mechanism;

fig. 8 is a front view of the shooting-positioning mechanism;

FIG. 9 is a top view of the stage of the camera positioning mechanism;

FIG. 10 is an enlarged view of a portion A of FIG. 9;

fig. 11 is a partially enlarged view of the stage and the frame of the imaging positioning mechanism.

Wherein, 1-machine table; 2-a conveying mechanism; 21-a mounting frame; 211-a first turning roll; 212-a second turning roll; 213-a third turning roll; 22-a drive mechanism; 23-a material supporting platform; 231-a guide wheel; 232-cantilever; 233-a fifth turning roll; 24-a feed belt; 25-a power plant; 26-a belt take-up device; 261-a pushing mechanism; 262-a sliding cover; 263-fourth rotating roller; 3-a suction mechanism; 31-a robotic arm; 32-a suction cup; 33-suction pipe; 34-a mounting seat; 35-a first movement mechanism; 4-a shooting positioning mechanism; 41-a second moving mechanism; 42-a carrier table; 421-a bottom plate; 421 a-waste port; 421 b-mounting hole; 422-a boss; 422 a-groove; 422 b-through holes; 422 c-step surface; 422 d-notch; 423-suction pipe joint; 424-a compression device; 424 a-tabletting; 424 b-motor; 43-a holder; 44-a camera; 45-a frame; 5-laser cutter.

Detailed Description

Embodiments of the present invention will now be described with reference to the accompanying drawings.

Examples

The specific implementation mode of the invention is shown in fig. 1-4, and the laser cutting device for wafer comprises a machine table 1 and a wafer cutting device arranged on the machine table 1, wherein conveying mechanisms 2 for conveying wafer are arranged on the feeding side and the discharging side of the machine table 1, a shooting and positioning mechanism 4 for wafer is arranged between the two conveying mechanisms 2, a sucking mechanism 3 for wafer is arranged on one side of the shooting and positioning mechanism 4, and a laser cutter 5 capable of moving up and down is arranged on one side of the shooting and positioning mechanism 4.

As shown in fig. 5-6, the conveying mechanism 2 includes a mounting frame 21, a material supporting platform 23 linearly reciprocating under the action of a driving mechanism 22 is horizontally disposed on the upper edge of the mounting frame 21, and the path length for conveying the wafer is determined by the movement of the material supporting platform 23. The upper part of the mounting frame 21 and the material supporting platform 23 are respectively provided with a first steering roller 211 and a guide wheel 231 which are positioned at the same height and have horizontally extending axes; the device also comprises a feeding belt 24 which is arranged along the moving direction of the material supporting platform 23 and is sleeved on the first steering roller 211 and the guide wheel 231, and a power device 25 and a belt tightening device 26 of the feeding belt 24 are further arranged on the mounting frame 21. The wafer is placed on the feed belt 24, and the position of the wafer is transferred by the movement of the feed belt 24.

The device can replace the manual work to shift the wafer, avoids manual transportation wafer to produce the damage, has also saved the manual work. Meanwhile, after the device is applied to the field of wafer production and processing, the automation of a wafer production line can be effectively improved, and the production efficiency of the whole wafer production line is further improved.

A second steering roller 212 which is used for guiding the feeding belt 24 to turn horizontally and can rotate axially is arranged on one side of the lower portion of the mounting frame 21, a third steering roller 213 which is used for guiding the feeding belt 24 to turn upwards is arranged on the other side of the lower portion of the mounting frame 21, and the belt tightening device 26 is arranged on the upper portion of the third steering roller 213. The belt tightening device 26 can tighten the feeding belt 24 through horizontal movement, so that the feeding belt 24 cannot loosen and fall off along with the displacement change of the material supporting platform 23, and the working stability of the whole device is ensured.

The second turning roll 212 is provided with a driving wheel 251 for guiding the second turning roll to rotate axially, and the driving wheel 251 is in transmission connection with the power device 25. The driving wheel 251 is driven by the power device 25, and the driving wheel 251 drives the second steering roller 212 so as to drive the whole feeding belt 24; the second turning roller 212 can rotate the feeding belt 24 for transporting the wafer.

The belt tightening device 26 includes a pushing mechanism 261, a sliding cover 262 capable of reciprocating along the moving direction of the material supporting platform 23 under the action of the pushing mechanism 261 is disposed on the upper end surface of the pushing mechanism 261, and a fourth turning roller 263 for guiding the feeding belt 24 to turn upwards and horizontally moving the tightening belt is disposed on the upper end surface of the sliding cover 262.

The material supporting platform 23 is provided with two cantilevers 232 extending in the same direction along the moving direction of the material supporting platform 23, the cantilevers 232 and the material supporting platform 23 are located on the same horizontal plane, and each cantilever 232 is provided with a feeding belt 24. The cantilever 232 together with the pallet platform 23 just forms a U-shape. The middle part of the cantilever 232 and one end far away from the mounting rack are provided with guide wheels 231 for mounting the feeding belt 24; the lower end surface of one end of the cantilever 232 close to the mounting rack is provided with a fifth steering roller 233 for mounting the feeding belt 24.

Also, in the present invention, the suction mechanism 3 includes a first horizontal movement mechanism 35 arranged along the wafer conveyance direction. The first horizontal movement mechanism 35 is provided with a mounting base 34 which reciprocates along the arrangement direction thereof, and two parallel robot arms 31 for sucking the wafers are provided on the upper portion of the mounting base 34. The robot arm 31 is provided with a suction cup 32 which is horizontally arranged and can move up and down at a lower portion of one end far from the mounting base 34, and the suction cup 32 is provided with a plurality of suction pipes 33 arranged around the axial center thereof. The suction pipe 33 sucks the wafer, so that the wafer can be stably sucked by the suction cup 32 and cannot easily fall off.

In addition, as shown in fig. 7-11, the shooting positioning mechanism 4 includes a second horizontal moving mechanism 41 and a fixing frame 43 disposed on one side thereof, and the second horizontal moving mechanism 41 is provided with a bearing platform 42 linked with the second horizontal moving mechanism 41; the fixed frame 43 is connected with a camera 44 and a frame 45 positioned below the camera 44, the frame 45 is positioned above the second horizontal moving mechanism 41 and has a height greater than that of the bearing table 42, and a light supplement lamp is arranged on the inner side of the frame 45. According to the device, the wafer is placed on the bearing table 42, the camera 44 can be used for positioning the original point before each cutting, then the bearing table 42 is moved to the processing station, the laser cutter 5 is arranged at the processing station, the cutting processing can be carried out according to the positioning information, the device is different from the prior art that the bearing table 42 needs to be finely adjusted to align the fixed position, the deviation possibly caused by long-time working of the machine is avoided, and the rejection rate is greatly reduced.

In this embodiment, the frame 45 has a square structure, and the light supplement lamps inside the frame are all a plurality of LED lamps arranged in a row. The light filling effect that provides like this is more even, avoids causing the not enough condition of corner position light with a light. In addition, the frame 45 may be circular or other regular polygonal shape. The bearing table 42 comprises a bottom plate 421, a hollow boss 422 is arranged on the bottom plate 421, a cavity is formed inside the side wall of the boss 422, the cavity is communicated with an air suction pipe joint 423 arranged on the side wall of the boss 422, and an adsorption part communicated with the cavity is further arranged on the upper side of the boss 422. The cutting of the wafer requires that criss-cross dividing lines be scribed on the wafer, and the use of laser cutting can minimize the generation of debris. However, the wafer still needs to have holes cut therein and the like, and the dropped chips need to be collected. The invention can effectively fix the wafer to be processed, is convenient for processing and use of laser cutting, and can collect the chips falling from the cutting holes, thereby keeping the processing tidiness of a precision instrument. The protrusion 422 has a circular ring structure, and the diameter of the protrusion is smaller than the minimum width of the outer contour of the frame 45, so that the wafer on the susceptor 42 can be completely covered by the shooting positioning and light supplementing.

Meanwhile, the adsorption part comprises a groove 422a arranged on the upper side of the protruding part 422 and a through hole 422b arranged in the groove 422a, the groove 422a is communicated with the cavity through the through hole 422b, the groove 422a is a plurality of arc-shaped groove bodies and is uniformly arranged around the center of the protruding part 422, the through holes 422b are in one-to-one correspondence with the groove 422a, and the air pumping pipe joints 423 are at least two and are uniformly arranged around the center of the protruding part 422. Different from adsorbing through a plurality of holes, the device controls air flow easily through the adsorption part formed by the groove 422a, so that the adsorption force borne by the wafer is uniform, the wafer is prevented from being unstable due to the adsorption of the holes, and the error probability is reduced. The groove 422a adsorbs the wafer in a sectional mode, so that the wafer is prevented from being bent and deformed due to the influence of air pressure while certain adsorption force is ensured.

Further, a step 422c recessed downward is provided at an inner edge of an upper side of the boss 422, and the suction portion is provided on a top side of the step 422 c. The outer side of the protruding part 422 is further provided with at least three pressing devices 424 for assisting in pressing the wafer, the pressing devices 424 are uniformly arranged around the center of the protruding part 422, each pressing device 424 comprises a pressing piece 424a and a motor 424b capable of driving the pressing piece 424a to horizontally rotate, and a notch 422d corresponding to a space required by the rotation of the pressing piece 424a is further reserved at the outer edge of the upper side of the protruding part 422. The wafer can be picked and placed by rotating the pressing piece 424a corresponding to the notch 324, so that the pressing piece 424a can make the wafer in a relatively flat plane without affecting the shooting and positioning of the camera 44. A waste material port 421a is arranged at the center of the protruding part 422 on the bottom plate 421, the waste material port 421a is inclined and is communicated with the bottom side of the bottom plate 421, and can be communicated with a dust collector and the like to collect and discharge fallen debris during cutting, so that normal cutting work is prevented from being influenced; the bottom plate 421 is further provided with a plurality of mounting holes 421b for connecting with the second horizontal moving mechanism 41.

In addition, in the present embodiment, the second horizontal movement mechanism 41 includes a first linear movement mechanism and a second linear movement mechanism that are arranged perpendicular to each other. The first linear moving mechanism and the second linear moving mechanism can be matched with a screw rod and a motor, namely, the motor drives the screw rod to rotate, so that a sliding block in threaded fit with the screw rod reciprocates along the screw rod, or a driving cylinder is directly utilized to realize linear motion of an X axis and a Y axis on a horizontal plane, thereby realizing horizontal movement of the bearing table 42.

In this embodiment, it should be noted that:

the drive mechanism 22 is a magnetically coupled cylinder. The reciprocating movement of the material supporting platform 23 is driven by a magnetic coupling cylinder.

The power device is not directly arranged on the material supporting platform 23, so that the vibration generated by the power device does not influence the stability of wafer conveying.

The sliding cover 262 moves in the opposite direction to the direction of movement of the material holding platform 23.

One end of the upper edge of the mounting frame 21 is provided with a limiting column which is arranged at two sides of the material supporting platform 23 in the moving direction and used for preventing the wafer from falling.

The laser machine is connected with the laser cutter 5 through optical fibers, and a focusing mirror is arranged in the laser cutter 5. The holder 43 is provided with a height adjustment mechanism of the laser cutter 5, such as a lead screw, for focusing to accommodate wafers of different thicknesses.

When the wafer conveying device is used, a wafer is conveyed to the position right below the suction disc 32 through the conveying mechanism 2 on the feeding side of the machine table 1, then the wafer is adsorbed through the suction disc 32 and is transferred to the bearing table 42 through the first moving mechanism 35; then, the wafer is transferred to the lower part of the frame 45 through the second moving mechanism 41, and the original point of the wafer is determined through shooting and positioning of the camera 44; after the origin is determined, the related information is transmitted to the laser cutter 5, the position of the laser cutter 5 is finely adjusted, meanwhile, the wafer is transported to the lower part of the laser cutter 5 by the second moving mechanism 41, and the bearing table 42 is moved along the X axis and the Y axis by the first linear moving mechanism and the second linear moving mechanism of the second moving mechanism 41, so that the laser cutting is completed.

The wafer after laser cutting is conveyed to the feeding end of the second moving mechanism 41 again, is adsorbed by another sucking disc 32, is transferred to the conveying mechanism 2 on the discharging side of the machine table 1 through the first moving mechanism 35, and is conveyed to the discharging end through the conveying mechanism 2, and the whole processing process is completed.

The present invention has been described in connection with the preferred embodiments, but the present invention is not limited to the embodiments disclosed above, and is intended to cover various modifications, equivalent arrangements, which are within the spirit of the invention.

Claims

1. The utility model provides a laser cutting device of wafer, includes board (1) and sets up the wafer cutting device on board (1), its characterized in that, the feed side and the ejection of compact side of board (1) all are equipped with conveying mechanism (2) of carrying the wafer, two be equipped with shooting positioning mechanism (4) of wafer between conveying mechanism (2), one side of shooting positioning mechanism (4) is equipped with suction means (3) of wafer, it is equipped with laser cutter (5) that can reciprocate to shoot positioning mechanism (4) one side.

2. Laser cutting device for wafers as claimed in claim 1, characterized in that the transport mechanism (2) comprises a mounting frame (21), the upper edge of the mounting frame (21) is horizontally provided with a material supporting platform (23) which is linearly reciprocated under the action of a driving mechanism (22); the upper part of the mounting frame (21) and the material supporting platform (23) are respectively provided with a first steering roller (211) and a guide wheel (231) which are positioned at the same height and the axes of which extend horizontally; the device also comprises a feeding belt (24) which is arranged along the moving direction of the material supporting platform (23) and sleeved on the first steering roller (211) and the guide wheel (231), and a power device (25) and a belt tightening device (26) of the feeding belt (24) are also arranged on the mounting frame (21).

3. Laser cutting device for wafers as claimed in claim 2, characterized in that one side of the lower part of the mounting frame (21) is provided with a second turning roller (212) for guiding the feed belt (24) to turn horizontally and axially, the other side of the lower part of the mounting frame (21) is provided with a third turning roller (213) for guiding the feed belt (24) to turn upwards, and the belt tightening device (26) is arranged on the upper part of the third turning roller (213).

4. The laser cutting device for wafer as set forth in claim 3, characterized in that the belt tightening device (26) comprises a pushing mechanism (261), a sliding cover (262) capable of reciprocating along the moving direction of the material supporting platform (23) under the action of the pushing mechanism (261) is provided on the upper end surface of the pushing mechanism (261), and a fourth turning roller (263) for guiding the feeding belt (24) to turn upwards and horizontally moving the tightening belt is provided on the upper end surface of the sliding cover (262).

5. The laser cutting device for wafer as set forth in claim 1, characterized in that the suction mechanism (3) comprises a first horizontal moving mechanism (35) arranged along the conveying direction of the wafer, the first horizontal moving mechanism (35) is provided with a mounting seat (34) reciprocating along the arrangement direction, and the upper part of the mounting seat (34) is provided with two mutually parallel mechanical arms (31) for sucking the wafer.

6. Laser cutting device for wafers as claimed in claim 5, characterized in that the robot arm (31) is provided with a horizontally arranged suction cup (32) which can be moved up and down at the lower part of the end remote from the mounting seat (34), the suction cup (32) being provided with a plurality of suction ducts (33) arranged around its axis.

7. The laser cutting device for wafer as claimed in claim 1, wherein the shooting positioning mechanism (4) comprises a second horizontal moving mechanism (41) and a fixing frame (43) arranged on one side of the second horizontal moving mechanism, and a bearing table (42) linked with the second horizontal moving mechanism (41) is arranged on the second horizontal moving mechanism (41); the utility model discloses a light-filling lamp, including mount (43), frame (45) that are connected with camera (44) on mount (43) and are located camera (44) below, frame (45) are located the top of second horizontal migration mechanism (41) and the height that its height is greater than plummer (42), frame (45) inboard is equipped with the light filling lamp.

8. The laser cutting device for wafers as set forth in claim 7, wherein the carrying table (42) comprises a bottom plate (421), a hollow protrusion (422) is provided on the bottom plate (421), a cavity is formed inside the side wall of the protrusion (422), the cavity is communicated with a suction pipe joint (423) provided on the side wall of the protrusion (422), and an absorption part communicated with the cavity is further provided on the upper side of the protrusion (422); the adsorption part comprises a groove (422a) arranged on the upper side of the bulge part (422) and a through hole (422b) arranged in the groove (422a), the groove (422a) is communicated with the cavity through the through hole (422b), and the suction pipe joints (423) are at least two and are uniformly arranged around the center of the bulge part (422).

9. The laser cutting device for wafer as claimed in claim 8, characterized in that the outer side of the protrusion (422) is further provided with at least three pressing devices (424) for assisting in pressing the wafer, the pressing devices (424) are uniformly arranged around the center of the protrusion (422), the pressing devices (424) comprise pressing plates (424a) and motors (424b) capable of driving the pressing plates (424a) to horizontally rotate, and the outer edge of the upper side of the protrusion (422) is further provided with notches (422d) corresponding to spaces required by the rotation of the pressing plates (424 a).

10. Laser cutting device for wafers as set forth in claim 7 or 9, characterized in that the second horizontal moving mechanism (41) comprises a first linear moving mechanism and a second linear moving mechanism arranged perpendicular to each other.