CN209911914U - Computer radiator - Google Patents

Computer radiator Download PDF

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Publication number
CN209911914U
CN209911914U CN201920873233.0U CN201920873233U CN209911914U CN 209911914 U CN209911914 U CN 209911914U CN 201920873233 U CN201920873233 U CN 201920873233U CN 209911914 U CN209911914 U CN 209911914U
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China
Prior art keywords
water
cooling head
heat dissipation
heat
radiator
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Expired - Fee Related
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CN201920873233.0U
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Chinese (zh)
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龚小蓉
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Individual
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Individual
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Priority to CN201920873233.0U priority Critical patent/CN209911914U/en
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Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a computer radiator, which comprises a water cooling head, a water pump and a heat dissipation assembly, wherein at least two heat pipes are arranged on the water cooling head, the heat pipes penetrate through the water cooling head, both ends of each heat pipe are fixedly connected with the heat dissipation assembly, a liquid outlet of the water cooling head is communicated with the heat dissipation assembly, the water pump is fixed on the heat dissipation assembly, a liquid inlet of the water pump is communicated with the heat dissipation assembly, and a liquid outlet of the water pump is communicated with a liquid inlet of the water cooling head; the computer radiator has the advantages of reasonable structure, convenience in installation and high reliability.

Description

Computer radiator
Technical Field
The utility model belongs to the technical field of the computer fittings of department of calculation, concretely relates to computer radiator.
Background
At present, with the rapid development of electronic products, computers have become indispensable articles for daily life of people, and no matter whether work or leisure and entertainment, people can not leave the computer at present, a CPU is the most important component in the computer, is responsible for the operation calculation of the computer, has large workload, is easy to generate a large amount of heat, can slow down the operation speed of the computer, even can burn the CPU in serious cases, and therefore needs a radiator to cool and radiate the CPU of the computer. With the further pursuit of the heat dissipation effect of the CPU, the water-cooled heat sink is produced. However, the prior art water-cooled radiators are generally split, i.e. the water-cooled head and the heat dissipation assembly are separated and communicated with each other through a pipeline, thereby causing the following problems: compared with the installation of the water-cooling radiator of the air-cooled radiator, the installation is more complex, and a user needs to have strong manual capability, so that certain inconvenience is brought to the convenient installation and use of the water-cooling radiator; secondly, the pipeline connecting the water cooling head and the heat dissipation assembly is relatively long, the joint is easy to loosen or the pipeline is damaged to cause coolant leakage in the maintenance process (such as dust removal) and the maintenance process of the computer due to touch or bending, once the coolant leaks, the computer is damaged frequently, the economic loss of a user is greatly increased, and the reliability of the water cooling radiator in use is reduced.
Disclosure of Invention
In view of this, the utility model aims at providing a computer radiator that rational in infrastructure, simple to operate and reliability are high.
In order to solve the technical problem, the technical scheme of the utility model is that:
the utility model provides a computer radiator, includes water-cooling head, water pump and radiator unit, be provided with two piece at least heat pipes on the water-cooling head, the heat pipe runs through the water-cooling head, and the both ends of every heat pipe all with radiator unit fixed connection, the liquid outlet and the radiator unit of water-cooling head are linked together, the water pump is fixed in on the radiator unit, just the inlet of water pump with the radiator unit is linked together, the liquid outlet and the inlet of water-cooling head of water pump are linked together. The heat pipes are arranged, and the heat pipes have certain hardness, so that the heat dissipation assembly can be rigidly supported, and the radiator is integrated, the integral structure of the radiator is simplified, and the radiator is convenient to install by a user; meanwhile, the problem that the pipeline is leaked due to the fact that the radiator is possibly collided or bent to be disassembled to the connecting pipeline during maintenance and repair in use is avoided, and therefore reliability and stability of the radiator during use are improved. Secondly, the heat pipe can also guide the heat generated when the CPU works to the heat dissipation assembly from the water cooling head; that is, the radiator can still perform effective heat radiation work when the water pump fails, thereby further improving the reliability of the radiator.
Preferably, the water cooling head is arranged in a hollow mode, a plurality of spoilers are arranged in the water cooling head along the transverse direction of the water cooling head, the spoilers are fixed to the top and the bottom of the inner wall of the water cooling head respectively, the spoilers are arranged in a staggered mode, and the liquid inlet and the liquid outlet of the water cooling head are located on two sides of the water cooling head respectively.
Preferably, the heat dissipation assembly comprises a water tank, a plurality of heat dissipation fins are sleeved on the outer wall of the water tank, and the heat dissipation fins are fixedly connected with the water tank.
Preferably, the heat pipe penetrates through the heat dissipation fins from bottom to top or extends into the water tank.
Preferably, the heat dissipation assembly is far away from the water cooling head, the water pump is located between the water cooling head and the heat dissipation assembly, and the water pump is fixed at the bottom of the heat dissipation assembly.
Preferably, the heat dissipation assembly further comprises a fan, the fan is located on one side of the water tank, and the fan is fixedly connected with the heat dissipation fins.
Preferably, the water cooling head is a pure copper water cooling head.
Preferably, the heat pipe is arranged in a U shape.
Preferably, the water tank is an aluminum alloy water tank, and the radiating fins are aluminum alloy radiating fins.
The technical effects of the utility model mainly embody in following aspect: because a plurality of heat pipes which are mutually matched with the water-cooling head and the heat dissipation assembly are arranged, and the heat pipes have certain hardness, the heat dissipation assembly can be rigidly supported, so that the heat dissipation assembly and the water-cooling head form a whole, namely an integrated radiator, the integral structure of the radiator is simplified, and the installation of the radiator can be completed only by fixing the water-cooling head on a CPU seat during the installation, thereby improving the convenience during the installation of the radiator and simplifying the installation difficulty; meanwhile, the problem that the cooling liquid leaks due to the fact that the radiator is possibly collided or bent to be disassembled to the connecting pipeline when the radiator is used for maintaining or repairing the computer is avoided, and therefore reliability and stability of the radiator when the radiator is used are improved. Secondly, the heat pipe can also guide the heat generated when the CPU works to the heat dissipation assembly from the water cooling head; that is, the radiator can still perform effective heat radiation work when the water pump fails, thereby further improving the reliability of the radiator.
Drawings
Fig. 1 is a schematic structural diagram of a computer heat sink according to the present invention.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings, so as to make the technical solution of the present invention easier to understand and master.
In the present embodiment, it should be understood that the terms "middle", "upper", "lower", "top", "right side", "left end", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In addition, in the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a bolt fixing manner, a pin fixing manner, a welding fixing manner, or a hollow rotating shaft connection manner, which is commonly used in the prior art, and therefore, the detailed description thereof is omitted in this embodiment.
As shown in fig. 1, this embodiment provides a computer radiator, including water-cooling head 1, water pump 2 and radiator unit 3, be provided with two piece at least heat pipes 4 and be interval arrangement on the water-cooling head 1, certainly also can dispose like three or four heat roots according to the user demand of difference, heat pipe 4 is transversely to run through water-cooling head 1, and the both ends of every heat pipe 4 are all upwards buckled and are the U-shaped setting, and radiator unit 3 fixed connection. The liquid outlet of water-cooling head 1 is linked together through the pipeline with radiator unit 3, and water pump 2 is fixed in on the radiator unit 3, and the inlet of water pump 2 is linked together with radiator unit 3, and the liquid outlet of water pump 2 is linked together with the inlet of water-cooling head 1. The plurality of heat pipes 4 are arranged, and the heat pipes 4 have certain hardness, so that the heat dissipation assembly 3 can be rigidly supported, the radiator is integrated, the overall structure of the radiator is simplified, namely, the installation and fixation of the radiator can be completed only by fixing the water cooling head 1 on the CPU, and the convenience in installation and use of a user is improved; meanwhile, the integral structure also avoids the problem that the pipeline is leaked due to the fact that the radiator is possibly collided or bent to be disassembled to the connecting pipeline when in use because of computer maintenance or repair, thereby improving the reliability and stability of the radiator when in use. Secondly, the heat pipe 4 can also guide the heat generated when the CPU works to the heat dissipation component 3 from the water cooling head 1 for heat dissipation; that is, the radiator can still perform effective heat radiation work when the water pump 2 fails, thereby further improving the reliability of the radiator.
As shown in fig. 1, in a preferred embodiment, the water cooling head 1 is hollow, a plurality of spoilers 11 are disposed in the water cooling head 1 along a transverse direction thereof, the spoilers 11 are respectively fixed to a top and a bottom of an inner wall of the water cooling head 1 in an integrally formed manner, the spoilers 11 are arranged in a staggered manner, and a liquid inlet and a liquid outlet of the water cooling head 1 are respectively located on two sides of the water cooling head 1. The spoiler 11 can effectively increase the heat conduction area of the water cooling head 1 and is beneficial to heat conduction, when cooling liquid enters the water cooling head 1 from the liquid inlet of the water cooling head 1, the spoiler 11 can generate disturbance to the flow of the cooling liquid, and even if the cooling liquid generates turbulence when flowing, the heat is fully absorbed and taken away by the cooling liquid; secondly, the spoiler 11 positioned at the top of the water-cooled inner part also helps to further conduct heat into the heat pipe; the water cooling head 1 is a pure copper water cooling head, which is beneficial to heat conduction.
As shown in fig. 1, in a preferred embodiment, the heat dissipation assembly 3 includes a water tank 31, a plurality of heat dissipation fins 32 are sleeved on an outer wall of the water tank 31, and the heat dissipation fins 32 are fixed to the water tank 31 by welding or by interference fit. The heat pipe 4 penetrates through the heat dissipation fins 32 from bottom to top or the heat pipe 4 extends into the water tank 31, the heat pipe 4 dissipates the heat brought out by the water cooling head 1 through the heat dissipation fins 32, or the heat pipe 4 is conducted into the cooling liquid in the water tank 31 and then dissipated by the heat dissipation fins 32. The water tank 31 is an aluminum alloy water tank 31, and the heat dissipation fins 32 are aluminum alloy heat dissipation fins, but the water tank 31 and the heat dissipation fins 32 may be made of pure copper according to different configuration requirements. The heat sink assembly 3 further includes a fan 33, the fan 33 is located at one side of the water tank 31, and the fan 33 and the heat sink fins 32 are fixed by bolts or snaps, and the fan 33 can further enhance the effect of the heat sink fins 32.
In the preferred embodiment, the heat sink assembly 3 is located away from the water head 1, the water pump 2 is located between the water head 1 and the heat sink assembly 3, and the water pump 2 is fixed to the bottom of the heat sink assembly 3, as shown in fig. 1. Facilitates coolant line placement while not being readily accessible for routine computer maintenance or repair.
The technical effects of the utility model mainly embody in following aspect: because a plurality of heat pipes which are mutually matched with the water-cooling head and the heat dissipation assembly are arranged, and the heat pipes have certain hardness, the heat dissipation assembly can be rigidly supported, so that the heat dissipation assembly and the water-cooling head form a whole, namely an integrated radiator, the integral structure of the radiator is simplified, and the installation of the radiator can be completed only by fixing the water-cooling head on a CPU seat during the installation, thereby improving the convenience during the installation of the radiator and simplifying the installation difficulty; meanwhile, the problem that the cooling liquid leaks due to the fact that the radiator is possibly collided or bent to be disassembled to the connecting pipeline when the radiator is used for maintaining or repairing the computer is avoided, and therefore reliability and stability of the radiator when the radiator is used are improved. Secondly, the heat pipe can also guide the heat generated when the CPU works to the heat dissipation assembly from the water cooling head; that is, the radiator can still perform effective heat radiation work when the water pump fails, thereby further improving the reliability of the radiator.
Of course, the above is only a typical example of the present invention, and besides, the present invention can also have other various specific embodiments, and all technical solutions adopting equivalent replacement or equivalent transformation are all within the scope of the present invention as claimed.

Claims (9)

1. The utility model provides a computer radiator, includes water-cooling head, water pump and radiator unit, its characterized in that: the water cooling device is characterized in that at least two heat pipes are arranged on the water cooling head, the heat pipes penetrate through the water cooling head, the two ends of each heat pipe are fixedly connected with the radiating assembly, the liquid outlet of the water cooling head is communicated with the radiating assembly, the water pump is fixed on the radiating assembly, the liquid inlet of the water pump is communicated with the radiating assembly, and the liquid outlet of the water pump is communicated with the liquid inlet of the water cooling head.
2. The computer heat sink of claim 1, wherein: the water-cooling head is the cavity setting, be provided with a plurality of spoilers in the water-cooling head along its transverse direction, the spoiler is fixed in the top and the bottom of water-cooling head inner wall respectively, just the spoiler is crisscross setting each other, and the inlet and the liquid outlet of water-cooling head are located the water-cooling head both sides respectively.
3. The computer heat sink of claim 1, wherein: the heat dissipation assembly comprises a water tank, wherein a plurality of heat dissipation fins are sleeved on the outer wall of the water tank and fixedly connected with the water tank.
4. A computer heat sink as claimed in claim 3, wherein: the heat pipe penetrates through the radiating fins from bottom to top or extends into the water tank.
5. The computer heat sink of claim 1, wherein: the heat dissipation assembly is far away from the water cooling head, the water pump is located between the water cooling head and the heat dissipation assembly, and the water pump is fixed at the bottom of the heat dissipation assembly.
6. A computer heat sink as claimed in claim 3, wherein: the heat dissipation assembly further comprises a fan, the fan is located on one side of the water tank, and the fan is fixedly connected with the heat dissipation fins.
7. The computer heat sink of claim 1, wherein: the water cooling head is a pure copper water cooling head.
8. The computer heat sink of claim 1, wherein: the heat pipe is arranged in a U shape.
9. A computer heat sink as claimed in claim 3, wherein: the water tank is an aluminum alloy water tank, and the radiating fins are aluminum alloy radiating fins.
CN201920873233.0U 2019-06-12 2019-06-12 Computer radiator Expired - Fee Related CN209911914U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920873233.0U CN209911914U (en) 2019-06-12 2019-06-12 Computer radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920873233.0U CN209911914U (en) 2019-06-12 2019-06-12 Computer radiator

Publications (1)

Publication Number Publication Date
CN209911914U true CN209911914U (en) 2020-01-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920873233.0U Expired - Fee Related CN209911914U (en) 2019-06-12 2019-06-12 Computer radiator

Country Status (1)

Country Link
CN (1) CN209911914U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112179163A (en) * 2020-09-14 2021-01-05 东莞汉旭五金塑胶科技有限公司 Water-cooling radiator capable of increasing radiating area

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112179163A (en) * 2020-09-14 2021-01-05 东莞汉旭五金塑胶科技有限公司 Water-cooling radiator capable of increasing radiating area

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20200107

Termination date: 20200612