CN209894137U - Wafer surface shape measuring device based on reverse Hartmann light path - Google Patents
Wafer surface shape measuring device based on reverse Hartmann light path Download PDFInfo
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- CN209894137U CN209894137U CN201921015793.9U CN201921015793U CN209894137U CN 209894137 U CN209894137 U CN 209894137U CN 201921015793 U CN201921015793 U CN 201921015793U CN 209894137 U CN209894137 U CN 209894137U
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- wafer
- light modulator
- spatial light
- color camera
- surface shape
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Abstract
The utility model relates to a wafer surface shape of face measuring device based on reverse hartmann light path. The measuring device comprises an outer packaging case, a feeding platform, a spatial light modulator, a micro lens, a color camera and a computer. The spatial light modulator and the color camera are fixed at the same height and are respectively positioned at two sides of the measured wafer, and the micro lens is positioned between the spatial light modulator and the wafer light path. The feeding platform consists of a screw rod guide rail motion platform controlled by a servo motor and is used for conveying the wafer to be detected. The outer wrapping case is composed of a black and opaque stainless steel plate, and can play a good role in shading light. The measuring method comprises the following steps: the computer controls the spatial light modulator to output images, the images are converged by the micro lens and then are irradiated on the wafer to be measured, the images are collected by the color camera and are processed in the computer, and the surface shape data of the wafer surface can be obtained. The utility model discloses can acquire wafer shape of face data fast, compensate the defect that current detection means exists.
Description
Technical Field
The utility model belongs to the technical field of measure, a wafer surface shape of face measuring device based on reverse hartmann light path is related to. The method is mainly used for measuring the surface shape of the surface of the wafer.
Background
With the rapid development of electronic information technology, the scale of the semiconductor industry has been increasing year by year, and the capacity of semiconductor integrated circuits has been increasing year by year. The demand of society for semiconductor integrated circuits has not only been met, which means that the requirements for component selection and subsequent processing become more demanding, placing greater demands on both quality and quality. The quality of the surface shape of a wafer, which is used as a raw material for processing a semiconductor integrated circuit, directly affects the quality of a product to be processed subsequently.
In practical application, the surface shape of a wafer belongs to the microscopic field, the environmental requirement is harsh, common device equipment is used, or the measurement requirement is difficult to meet due to precision or environment, and the surface to be measured is easy to damage by the existing wafer surface shape measurement method such as a mechanical probe method; microscopy and laser interferometry are complex and costly. Therefore, it is very important to make up for the deficiency of the existing wafer surface shape measurement work.
Disclosure of Invention
The utility model discloses to prior art's not enough, provided a high accuracy, low cost, simple structure's measuring device.
The utility model discloses an outsourcing machine case, pay-off platform, spatial light modulator, microlens, color camera and computer.
The outer wrapping case is composed of a stainless steel plate painted with black paint, and rectangular door openings with the same size are formed in two sides of the outer wrapping case.
The feeding platform consists of a screw rod guide rail moving platform controlled by a servo motor, and can enter and exit from the door openings of the openings at the two sides of the outer packaging case and is used for conveying the wafers to be tested.
The spatial light modulator is arranged in an outer-wrapping case, modulates the phase of light waves and outputs a sine phase modulation fringe image signal.
The microlens is arranged between the spatial light modulator and the wafer to be measured, and the fringe image output by the spatial light modulator is amplified, so that the measurement precision of the wafer surface shape in unit area is improved.
The color camera is arranged in the outer casing, the photosensitive element is a COMS photosensitive array, and the top of the camera lens is provided with a camera aperture for filtering stray light.
The computer is arranged outside the outer casing and used for controlling the spatial light modulator to modulate the phase of the light waves and output sinusoidal phase modulation fringe image signals, and simultaneously controlling the color camera to collect fringe images reflected by the surface of the wafer and the motion of the feeding platform and process pictures shot by the color camera.
The beneficial effects of the utility model reside in that:
1. the light shading effect of the outer casing is good. The all-black opaque outer casing has a good shading effect, the inside of the device can reach a suitable working environment, the interference of ambient light on light and shade stripes output by the spatial light modulator is eliminated, and the measuring result is more accurate.
2. Color camera aperture filtering. The top of the color camera lens is provided with a small hole for filtering stray light and further improving the measurement precision.
3. And (5) real-time online rapid measurement. The feeding platform is driven by a servo motor, and the assembly line measurement in industrial production is realized.
Drawings
FIG. 1 is a view showing the overall structure of the apparatus of the present invention;
fig. 2 is a schematic diagram of the optical path of the device of the present invention.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
As shown in FIG. 1, the housing case 1 of the present embodiment has a length of 800mm, a width of 400mm and a height of 600 mm. The lower parts of the two sides of the outsourcing machine case are provided with door openings with the same size, the length of 90mm and the height of 40mm, and the door openings just enough for the feeding platform to enter and exit. The feeding platform 2 is driven by a servo motor, can freely enter and exit door openings formed in two sides of the outsourcing case, and has only one degree of freedom (the stroke is 800 mm) of an X axis.
The optical path of the measuring device is shown in fig. 2 and consists of a feeding platform 2, a spatial light modulator 3, a microlens 4, a color camera 5, a computer 6 and a measured wafer 7. The spatial light modulator, the microlens and the color camera are all fixed by a stainless steel support, and the whole light path plane is perpendicular to the feeding platform in a plane (namely perpendicular to the X axis of the degree of freedom of the feeding platform and in the Y axis direction), so that the feeding platform can pass through. The spatial light modulator is connected with a computer through a communication line, and the command requirement of the computer on light modulation is realized. The micro lens is arranged on the light path between the space light and the wafer to realize the convergence of the light. One end of the color camera is connected with the computer through a communication line, so that the color camera can complete communication with the computer and can timely receive the collected images.
The utility model discloses a working process:
the utility model discloses a device realizes carrying out quick, high accuracy measurement to wafer surface shape of face based on reverse hartmann light path. The method comprises the steps that firstly, a spatial light modulator is controlled by a computer to modulate the phase of light waves, four sine phase modulation fringe image signals with the phase difference of pi/2 are output, fringe images are converged by a micro lens and then projected on the surface of a wafer, and the computer controls a color camera to collect and process four fringe images reflected by the wafer to be measured, so that the surface shape data of the wafer can be obtained.
The measurement steps are as follows:
1. the circuit is connected, the device is placed stably, and the computer and the feeding platform can work normally.
2. The servo motor drives the feeding platform to send the wafer to be measured to the center of the optical axis of the camera, so that the wafer to be measured can be imaged completely in the camera.
3. The spatial light modulator starts to work, a sine phase modulation fringe image is output, and the fringe image is converged by the micro lens and projected on the surface of the measured wafer.
4. The fringe image is deformed after being reflected by the surface of the wafer to be detected, and the computer controls the color camera to collect the deformed fringe image.
5. And processing the deformed stripe image in a computer to obtain wafer surface shape data.
Claims (3)
1. The utility model provides a wafer surface shape of face measuring device based on reverse hartmann light path, includes outsourcing quick-witted case, pay-off platform, spatial light modulator, microlens, color camera and computer, wherein:
the outer wrapping case is composed of a stainless steel plate painted with black paint, and rectangular door openings with the same size are formed in two sides of the outer wrapping case;
the feeding platform consists of a screw rod guide rail motion platform controlled by a servo motor;
the spatial light modulator is arranged in the outer packaging case, modulates the phase of light waves and outputs a sine phase modulation fringe image signal;
the microlens is arranged between the spatial light modulator and the wafer to be measured, and the fringe image output by the spatial light modulator is amplified so as to improve the measurement precision of the wafer surface shape in unit area;
the color camera is arranged in the outer packaging case, and the photosensitive element is a COMS photosensitive array;
the computer is arranged outside the outer casing and used for controlling the spatial light modulator to modulate the phase of the light waves and output sinusoidal phase modulation fringe image signals, and simultaneously controlling the color camera to collect fringe images reflected by the surface of the wafer and the motion of the feeding platform and process pictures shot by the color camera.
2. The wafer surface shape measuring device based on the reverse Hartmann optical path as claimed in claim 1, wherein: the top of the lens of the color camera is provided with a camera aperture for filtering stray light.
3. The wafer surface shape measuring device based on the reverse Hartmann optical path as claimed in claim 1, wherein: the feeding platform can enter and exit from the door openings of the openings at the two sides of the outer-packaging case and is used for conveying the wafer to be tested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921015793.9U CN209894137U (en) | 2019-07-02 | 2019-07-02 | Wafer surface shape measuring device based on reverse Hartmann light path |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921015793.9U CN209894137U (en) | 2019-07-02 | 2019-07-02 | Wafer surface shape measuring device based on reverse Hartmann light path |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209894137U true CN209894137U (en) | 2020-01-03 |
Family
ID=69001741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921015793.9U Expired - Fee Related CN209894137U (en) | 2019-07-02 | 2019-07-02 | Wafer surface shape measuring device based on reverse Hartmann light path |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209894137U (en) |
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2019
- 2019-07-02 CN CN201921015793.9U patent/CN209894137U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200103 Termination date: 20200702 |