CN209879448U - Heat abstractor for computer central processing unit - Google Patents
Heat abstractor for computer central processing unit Download PDFInfo
- Publication number
- CN209879448U CN209879448U CN201921192259.5U CN201921192259U CN209879448U CN 209879448 U CN209879448 U CN 209879448U CN 201921192259 U CN201921192259 U CN 201921192259U CN 209879448 U CN209879448 U CN 209879448U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat exchange
- condenser
- computer
- processing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a heat dissipation device for a central processing unit of a computer, which comprises a cover body, wherein the cover body is provided with an inner cavity, the bottom of the inner cavity is provided with a condensation plate, the condensation plate is attached to the upper surface of the central processing unit, the bottom of the cover body is provided with a flange, the upper surface of the flange on one side is provided with a condenser, and the condenser and the condensation plate form a heat exchange loop through a condensation pipe; the condenser plate upper surface still vertically installs a plurality of cooling tubes, the intraductal heat dissipation working medium that fills of cooling tube. The heat dissipation device for the central processor of the computer is simple in structure, the central processor is subjected to centralized heat dissipation through the condensation assembly, the spiral loop pipe is arranged in the condensation plate, the heat exchange fins are stacked capillary pipes, the heat exchange surface area is increased, and the heat exchange efficiency is improved; the spherical radiating pipe is arranged above the condensing plate to absorb heat for the second time, so that the radiating performance is further improved, the heat generated by the central processing unit can be rapidly radiated, and the normal operation of the central processing unit is ensured.
Description
Technical Field
The utility model relates to a computer field specifically is a heat abstractor for computer central processing unit.
Background
The central processing unit is an ultra-large scale integrated circuit and is an operation core and a control core of a computer. Its functions are mainly to interpret computer instructions and to process data in computer software. The central processing unit mainly comprises an arithmetic unit, a controller, a cache memory and a bus for realizing data, control and state of the connection among the arithmetic unit, the controller and the cache memory. It is called three core components of electronic computer together with internal memory and input/output device.
Because the central processing unit is the central hub of the whole computer, the central processing unit needs to carry out a large amount of operation conversion on external input signals in the running process of the computer, so that the generated heat is huge, and in order to maintain the normal running of the central processing unit, the central processing unit needs to be radiated, the working temperature of the central processing unit is ensured to be kept within a certain range, and the fault caused by high temperature is avoided; the heat dissipating double-fuselage of the central processing unit used in the market at present basically adopts the form of the air-cooling fin plus fan, the radiating efficiency is lower, especially when the high-power operation of the central processing unit, this kind of simple heat dissipating double-fuselage obviously has not met the demand.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor for computer central processing unit to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a heat dissipation device for a central processor of a computer comprises a cover body, wherein the cover body is provided with an inner cavity, the bottom of the inner cavity is provided with a condensation plate, the condensation plate is attached to the upper surface of the central processor, the bottom of the cover body is provided with a flange, the upper surface of the flange on one side is provided with a condenser, and the condenser and the condensation plate form a heat exchange loop through a condensation pipe; the condenser plate upper surface still vertically installs a plurality of cooling tubes, the intraductal heat dissipation working medium that fills of cooling tube.
As a further aspect of the present invention: the condensing plate comprises a plate body and a coil, wherein the coil is horizontally laid on the plate body, and the coil is provided with a liquid inlet and a liquid return port which are connected with the condenser.
As a further aspect of the present invention: the coil pipe is a spiral return pipe.
As a further aspect of the present invention: the condenser includes heat transfer fan and heat transfer fin, the heat transfer fan is vertical to be installed on the left side inner wall of condenser, heat transfer fin installs on condenser right side inner wall, heat transfer fin below is connected with inlet and liquid return mouth.
As a further aspect of the present invention: the heat exchange fin is provided with a water collecting tank below, and the left side of the water collecting tank is connected with a drain pipe.
As a further aspect of the present invention: the radiating pipe is a spherical long pipe.
As a further aspect of the present invention: the heat dissipation working medium is compressed helium.
As a further aspect of the present invention: the heat exchange fins are S-shaped capillaries stacked vertically, each capillary comprises an inflow end, an outflow end and a branch, the inflow end of each layer of capillary is communicated with the liquid return port, the outflow end of each layer of capillary is communicated with the liquid inlet, and the branch is arranged between the inflow end and the outflow end.
As a further aspect of the present invention: the wind box is arranged above the cover body, a micro motor is fixedly mounted on the upper surface of the wind box, the lower end of the micro motor is connected with a transmission shaft which is led into the wind box, blades are mounted on the transmission shaft, and the blades are arranged in two rows.
Compared with the prior art, the beneficial effects of the utility model are that:
the heat dissipation device for the central processor of the computer is simple in structure, the central processor is subjected to centralized heat dissipation through the condensation assembly, the spiral loop pipe is arranged in the condensation plate, the heat exchange fins are stacked capillary pipes, the heat exchange surface area is increased, and the heat exchange efficiency is improved; the spherical radiating pipe is arranged above the condensing plate to absorb heat for the second time, so that the radiating performance is further improved, the heat generated by the central processing unit can be rapidly radiated, and the normal operation of the central processing unit is ensured.
Drawings
FIG. 1 is a schematic structural diagram of a heat dissipation device for a computer CPU;
FIG. 2 is a schematic diagram of a structure of a cooling plate in a heat dissipation device for a CPU;
FIG. 3 is a schematic view showing a capillary structure of a heat exchange fin in a heat sink for a CPU of a computer.
In the figure: 1-a central processing unit, 2-a cover body, 3-a condensation plate, 301-a plate body, 302-a coil pipe, 303-a liquid inlet, 304-a liquid return port, 4-a condensation pipe, 5-a condenser, 6-a heat exchange fan, 7-a heat exchange fin, 8-a heat dissipation pipe, 9-a heat dissipation working medium, 10-a flange, 11-an air box, 12-a transmission shaft, 13-a blade, 14-a micro motor, 15-a water collecting tank and 16-a drain pipe.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Example 1
Referring to fig. 1, a heat dissipation device for a central processing unit of a computer comprises a cover body 2, wherein the cover body 2 is provided with an inner cavity, a condensation plate 3 is arranged at the bottom of the inner cavity, the condensation plate 3 is attached to the upper surface of the central processing unit 1, a flange 10 is arranged at the bottom of the cover body 2, a condenser 5 is arranged on the upper surface of the flange 10 on one side, and the condenser 5 and the condensation plate 3 form a heat exchange loop through a condensation pipe 4; a plurality of radiating pipes 8 are vertically arranged on the upper surface of the condensation plate 3, and radiating working media 9 are filled in the radiating pipes 8;
referring to fig. 2, a specific form of the condensation plate 3 is not limited, in this embodiment, preferably, the condensation plate 3 includes a plate body 301 and a coil 302, the coil 302 is horizontally laid on the plate body 301, in order to improve heat exchange efficiency, the coil 302 is a spiral loop type pipe, and the coil 302 is provided with a liquid inlet 303 and a liquid return port 304 connected to the condenser 5; the low-temperature condensate flows into the coil 302 from the liquid inlet 303 to absorb heat of the central processing unit 1 and cool the central processing unit, and the high-temperature condensate after absorbing heat flows back into the condenser 5 from the liquid return port 304;
the specific form of the condenser 5 is not limited, in this embodiment, preferably, the condenser 5 includes a heat exchange fan 6 and a heat exchange fin 7, the heat exchange fan 6 is vertically installed on the left inner wall of the condenser 5, the heat exchange fin 7 is installed on the right inner wall of the condenser 5, the lower side of the heat exchange fin 7 is connected with the liquid inlet 303 and the liquid return port 304, the high-temperature condensate in the liquid return port 304 starts to be shunted after flowing into the heat exchange fin 7, so that the heat exchange area is greatly increased, heat in the high-temperature condensate is rapidly dissipated under the action of wind power of the left heat exchange fan 6, and the cooled condensate flows into the condensing plate 3 from the liquid inlet 303 again to perform circulating heat exchange;
because the condenser 5 can produce condensed water by the heat dissipation and liquefaction of the high-temperature condensate in the heat exchange process, a water collecting tank 15 is arranged below the heat exchange fins 7, and the left side of the water collecting tank 15 is connected with a water drainage pipe 16;
the specific form of the heat dissipation pipe 8 is not limited, and in this embodiment, preferably, the heat dissipation pipe 8 is a spherical long pipe, so that the heat dissipation area can be further increased, and the heat dissipation efficiency can be improved; the specific material of the heat dissipation working medium 9 filled in the heat dissipation tube 8 is not limited, and in this embodiment, preferably, the heat dissipation working medium 9 is compressed helium;
in order to prevent the heat emitted by the radiating pipe 8 from being gathered in the cover body 2, an air box 11 is arranged above the cover body 2, a micro motor 14 is fixedly arranged on the upper surface of the air box 11, the lower end of the micro motor 14 is connected with a transmission shaft 12 which is led into the air box 11, and blades 13 are arranged on the transmission shaft 12; in order to improve the heat dissipation efficiency of the air box 11, the blades 13 are arranged in two rows; the micro motor 14 drives the blades 13 to rotate, so that heat emitted from the radiating pipe 8 can be rapidly discharged to the outside of the cover body 2.
The working principle of the embodiment is as follows:
the condensing plate 3 of the heat dissipation device for the computer central processor is attached to the upper surface of the central processor 1, the condensate flowing in the coil 302 in the condensing tube 3 absorbs the heat of the central processor and flows into the heat exchange fins 7 in the condenser 5 from the liquid return port 304 to start shunting, so that the heat exchange area is greatly increased, the heat in the high-temperature condensate is quickly dissipated under the action of the wind power of the left heat exchange fan 6, and the cooled condensate flows into the condensing plate 3 from the liquid inlet 303 again to perform circulating heat exchange; the cooling tube 8 that the condensation plate 3 top set up carries out the secondary absorption to the heat, and the heat that gives out is arranged to the cover body 2 outside under 11 effects of bellows, realizes central processing unit's heat dissipation.
Example 2
Referring to fig. 3, since the condensate flowing into the heat exchange fins 7 from the liquid return pipe 304 absorbs a large amount of heat dissipated by the cpu, in order to rapidly cool the high-temperature condensate, the surface area of the heat exchange fins 7 needs to be as large as possible, so this embodiment is further improved on the basis of embodiment 1, and the improvement is: the heat exchange fins 7 are S-shaped capillaries which are vertically stacked; the specific structure of the capillary tube is not limited, in this embodiment, preferably, the capillary tube includes an inflow end 701, an outflow end 702, and a branch 703, the inflow end 701 of each layer of capillary tube is communicated with the liquid return port 304, the outflow end 702 of each layer of capillary tube is communicated with the liquid inlet 303, and the branch 703 is disposed between the inflow end 701 and the outflow end 702; because each layer of capillary tube is provided with the branch 703, the high-temperature condensate in the liquid return port 304 is highly dispersed, the heat dissipation surface area is greatly increased, heat can be quickly dissipated, and the heat exchange efficiency of the condenser is improved.
The heat dissipation device for the computer central processor is simple in structure, the central processor is subjected to centralized heat dissipation through the condensation assembly, the spiral loop pipe is arranged in the condensation plate 3, the heat exchange fins 7 are stacked capillary pipes, the heat exchange surface area is increased, and the heat exchange efficiency is improved; the spherical radiating pipe is arranged above the condensing plate 3 to absorb heat for the second time, so that the radiating performance is further improved, the heat generated by the central processing unit 1 can be rapidly radiated, and the normal operation of the central processing unit 1 is ensured.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (9)
1. A heat dissipation device for a computer central processor comprises a cover body (2) and is characterized in that the cover body (2) is provided with an inner cavity, a condensation plate (3) is arranged at the bottom of the inner cavity, the condensation plate (3) is attached to the upper surface of a central processor (1), a flange (10) is arranged at the bottom of the cover body (2), a condenser (5) is arranged on the upper surface of the flange (10) on one side, and the condenser (5) and the condensation plate (3) form a heat exchange loop through a condensation pipe (4); still vertical a plurality of cooling tubes (8) of installing of condensation plate (3) upper surface, cooling tube (8) intussuseption is filled with heat dissipation working medium (9).
2. The heat sink for computer central processing unit according to claim 1, wherein the condensation plate (3) comprises a plate body (301) and a coil (302), the coil (302) is horizontally laid on the plate body (301), and the coil (302) is provided with a liquid inlet (303) and a liquid return port (304) connected with the condenser (5).
3. The heat sink for a computer cpu as set forth in claim 2, wherein the coil (302) is a spiral-wound tube.
4. The heat dissipation device for the computer central processor according to claim 1, wherein the condenser (5) comprises a heat exchange fan (6) and heat exchange fins (7), the heat exchange fan (6) is vertically installed on the left inner wall of the condenser (5), the heat exchange fins (7) are installed on the right inner wall of the condenser (5), and the lower portion of the heat exchange fins (7) is connected with the liquid inlet (303) and the liquid return port (304).
5. The heat sink for a computer central processor according to claim 4, wherein a water collection tank (15) is provided below the heat exchange fins (7), and a drain pipe (16) is connected to the left side of the water collection tank (15).
6. The heat dissipating device for a computer cpu as set forth in claim 1, wherein the heat dissipating pipe (8) is a ball-type long pipe.
7. The heat sink for computer cpu according to claim 1, wherein the heat dissipating working medium (9) is compressed helium gas.
8. The heat sink for the computer central processor according to claim 4, wherein the heat exchanging fins (7) are vertically stacked S-shaped capillaries, the capillaries comprise an inflow end (701), an outflow end (702) and a branch (703), the inflow end (701) of each layer of capillaries is communicated with the liquid return port (304), the outflow end (702) of each layer of capillaries is communicated with the liquid inlet port (303), and the branch (703) is arranged between the inflow end (701) and the outflow end (702).
9. The heat sink for the central processor of the computer according to any one of claims 1 to 8, wherein an air box (11) is arranged above the cover body (2), a micro motor (14) is fixedly arranged on the upper surface of the air box (11), a transmission shaft (12) leading into the air box (11) is connected to the lower end of the micro motor (14), blades (13) are arranged on the transmission shaft (12), and the blades (13) are arranged in two rows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921192259.5U CN209879448U (en) | 2019-07-26 | 2019-07-26 | Heat abstractor for computer central processing unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921192259.5U CN209879448U (en) | 2019-07-26 | 2019-07-26 | Heat abstractor for computer central processing unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209879448U true CN209879448U (en) | 2019-12-31 |
Family
ID=68949445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921192259.5U Active CN209879448U (en) | 2019-07-26 | 2019-07-26 | Heat abstractor for computer central processing unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209879448U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113758331A (en) * | 2021-09-16 | 2021-12-07 | 西安交通大学 | Mechanical disturbance drives immersion type liquid cooling sintering capillary core copper base heat abstractor |
-
2019
- 2019-07-26 CN CN201921192259.5U patent/CN209879448U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113758331A (en) * | 2021-09-16 | 2021-12-07 | 西安交通大学 | Mechanical disturbance drives immersion type liquid cooling sintering capillary core copper base heat abstractor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107680947A (en) | A kind of Phase cooling system | |
| CN209879448U (en) | Heat abstractor for computer central processing unit | |
| CN107509362A (en) | A kind of Phase cooling type electronic cabinet | |
| CN110707250A (en) | Fin type phase change heat dissipation device | |
| CN209461449U (en) | A kind of computer chip water-cooling radiating structure | |
| CN212970511U (en) | Electrical equipment applying heat dissipation device | |
| CN208242072U (en) | Cooling system based on phase-change thermal energy conversion | |
| CN110145953A (en) | A kind of separate type micro-channel capillary siphon heat exchanger | |
| CN106937517B (en) | Heat abstractor for be used for frame server chip | |
| CN102736711A (en) | Structure improvement of condensation device and heat dissipation module of condensation device | |
| CN207070569U (en) | A kind of radiator based on open-porous metal | |
| CN112105231A (en) | Pulsating heat pipe type blade server heat management system | |
| CN2907193Y (en) | Heat radiator | |
| CN208796185U (en) | Radiator | |
| CN203120349U (en) | Evaporation-cooled device for cabinet body of power device | |
| CN202257414U (en) | Novel laptop radiator | |
| CN220750537U (en) | Integrated water cooling machine capable of efficiently radiating heat | |
| CN216694560U (en) | Vertical high-efficient water-air heat exchanger | |
| CN219658090U (en) | Liquid cooling heat dissipation system of server | |
| CN213462750U (en) | Pulsating heat pipe type blade server heat management system | |
| CN213847412U (en) | Circulating cooling device of data center | |
| CN215909735U (en) | Loop heat pipe traction converter cooling system with improved structure | |
| CN210599139U (en) | Oil cooler | |
| CN208187152U (en) | A kind of steeple net formula cooling tower | |
| CN212062120U (en) | Transformer heat abstractor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |