CN209853264U - Potsherd feed mechanism for semiconductor packaging - Google Patents
Potsherd feed mechanism for semiconductor packaging Download PDFInfo
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- CN209853264U CN209853264U CN201920456769.2U CN201920456769U CN209853264U CN 209853264 U CN209853264 U CN 209853264U CN 201920456769 U CN201920456769 U CN 201920456769U CN 209853264 U CN209853264 U CN 209853264U
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- ceramic wafer
- workbench
- potsherd
- fixed mounting
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Abstract
The utility model discloses a ceramic wafer feeding mechanism for semiconductor packaging, which comprises a workbench, wherein a vibrating screen is fixedly arranged at the upper left part of the workbench, a material placing platform is fixedly arranged at the middle part of the right side of the upper surface of the workbench, a motor is fixedly arranged at the lower right side of the workbench, an electric control rotary table is welded at the right rear side of the upper surface of the workbench, a camera is fixedly arranged at the upper surface of the electric control rotary table, a ceramic wafer turnover plate is rotatably arranged at the upper middle part of the side wall of the material placing platform, a material pushing cylinder sleeved outside the ceramic wafer turnover plate is fixedly arranged at the upper right part of the side wall of the material placing platform, the device adopts mechanization to replace manual mode to feed and turn over the ceramic wafer, replaces personnel to judge the positive side and the negative side of the ceramic wafer through advanced influence identification technology, greatly reduces the probability that the ceramic wafer enters, the production efficiency is improved.
Description
Technical Field
The utility model relates to a semiconductor package technical field specifically is a potsherd feed mechanism for semiconductor packaging.
Background
The semiconductor technology is a technology for manufacturing components and integrated circuits by taking semiconductors as materials, and is widely applied to the life of people, a ceramic wafer is used in the semiconductor packaging process, the front side and the back side of the ceramic wafer are different, during production, one side of the ceramic wafer needing to be processed is required to be upwards put into equipment, the existing equipment mainly depends on manpower for feeding, manual feeding is used, the labor intensity is high, the production efficiency is low, the error rate is high, and the like.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a potsherd feed mechanism for semiconductor package to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a ceramic wafer feeding mechanism for semiconductor packaging comprises a workbench, wherein a vibrating screen is fixedly mounted at the upper left part of the workbench, a storage platform is fixedly mounted at the middle part of the right side of the upper surface of the workbench, a motor is fixedly mounted at the lower right side of the workbench, an electric control rotary table is welded at the rear right side of the upper surface of the workbench, a camera is fixedly mounted at the upper surface of the electric control rotary table, a ceramic wafer turnover plate is rotatably mounted at the upper middle part of the side wall of the storage platform, a material pushing cylinder sleeved outside the ceramic wafer turnover plate is fixedly mounted at the upper right part of the side wall of the storage platform, a ceramic wafer track is welded between the storage platform and the vibrating screen, a conveying belt is fixedly mounted at the left side wall of the storage platform, synchronous belt pulleys are clamped at the right ends of the motor and the ceramic wafer turnover plate, synchronous belts are sleeved outside the synchronous belts, a material pushing rod positioned at, the camera, the motor and the material pushing cylinder are all electrically connected with an external computer through power supply data wires.
Preferably, electric putter is inserted to the lower lateral wall of shale shaker inner chamber, and the upper end welding of shale shaker has the top cap, the feed inlet has been seted up to the left end of top cap, the upper portion welding of shale shaker inner chamber left side wall has the sunshade that is located the feed inlet downside, electric putter's upper end fixed mounting has vibration tray, electric putter passes through the power cord and is connected with the external power electricity.
Preferably, the middle part of the upper surface of the workbench is clamped with a wiring port protective cover.
Preferably, the ceramic plates vertically roll in the ceramic plate tracks.
Preferably, the height of the upper end of the electric control rotary table is greater than that of the object placing table.
Preferably, the upper surface of the object placing table is an inclined plane with a middle part protruding and two sides gradually decreasing.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model provides a potsherd feed mechanism for semiconductor package, the device adopts the mechanization to replace manual mode to carry out material loading and upset to the potsherd, judges the positive and negative of potsherd through advanced influence identification technique replacement personnel, and it is the wrong probability of machined surface orientation to reduce the potsherd to get into the processing lines by a wide margin, uses manpower sparingly resource, improves the product precision, promotes production efficiency.
Drawings
Fig. 1 is a front view of the present invention;
fig. 2 is a right side view of the present invention;
fig. 3 is a top view of the present invention;
fig. 4 is the structural schematic diagram of the ceramic wafer turnover plate and the object placing table of the present invention.
In the figure: 1. the device comprises a workbench, a vibrating screen 2, a ceramic wafer rail 3, a camera 4, a material pushing cylinder 5, a material placing table 6, a synchronous belt 7, a synchronous belt wheel 8, a motor 9, a ceramic wafer overturning plate 10, a material pushing rod 11, a conveying belt 12, an electric push rod 13, a vibrating tray 14, a feed inlet 15, a top cover 16, a shield 17, an electric control rotary table 18, a wiring port protective cover 19 and ceramic wafers 20.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a ceramic chip feeding mechanism for semiconductor packaging comprises a workbench 1, a vibrating screen 2 is fixedly arranged at the upper left part of the workbench 1, a storage table 6 is fixedly arranged at the middle part of the right side of the upper surface of the workbench 1, a motor 9 is fixedly arranged at the lower right side of the workbench 1, an electric control rotary table 18 is welded at the rear right side of the upper surface of the workbench 1, a camera 4 is fixedly arranged on the upper surface of the electric control rotary table 18, a ceramic chip turnover plate 10 is rotatably arranged at the upper middle part of the side wall of the storage table 6, a material pushing cylinder 5 sleeved outside the ceramic chip turnover plate 10 is fixedly arranged at the upper right part of the side wall of the storage table 6, a ceramic chip track 3 is welded between the storage table 6 and the vibrating screen 2, a conveying belt 12 is fixedly arranged on the left side wall of the storage table 6, synchronous belt pulleys 8 are clamped at the right ends of the motor 9 and the, the left side of the material pushing cylinder 5 is fixedly provided with a material pushing rod 11 positioned on the upper side of the object placing table 6, the camera 4, the motor 9 and the material pushing cylinder 5 are electrically connected with an external computer through a power supply data line, the existing image dynamic identification technology is a perfect electronic technology, the existing image dynamic identification technology is applied to the effect that the camera 4 identifies the positive and negative sides of the ceramic chip 20 in the patent, the motor 9 is a common stepping motor which can switch the positive and negative sides in the market, a digital signal which is used for judging the positive and negative sides of the ceramic chip 20 by the image dynamic identification technology can be converted into an electric signal for controlling the positive and negative rotation of the motor 9 by a simple AD signal converter, the circuit is a common combination in the field, detailed description is not given in the text, and it needs to be noted that the control circuit controls the rotation amplitude of the motor 9 to rotate 90 degrees by using.
Particularly, 2 inner chambers of shale shaker's lower lateral wall is pegged graft and is had electric putter 13, and the upper end welding of shale shaker 2 has top cap 16, feed inlet 15 has been seted up to top cap 16's left end, the upper portion welding of 2 inner chambers of shale shaker left side walls has sunshade 17 that is located feed inlet 15 downside, electric putter 13's upper end fixed mounting has vibration tray 14, electric putter 13 is connected with the external power source electricity through the power cord, electric putter 13 is common electric drive push rod on the market, can carry out push-and-pull operation with fixed cycle after the circular telegram repeatedly, vibration tray 14 can be to potsherd track 3 slope according to the demand, be convenient for derive potsher.
Specifically, a wiring port protective cover 19 is clamped in the middle of the upper surface of the workbench 1.
Specifically, the ceramic plates 20 vertically roll inside the ceramic plate rail 3.
Specifically, the height of the upper end of the electrically controlled turntable 18 is greater than the height of the object placing table 6.
Specifically, the upper surface of the platform 6 is an inclined surface with a convex middle part and gradually reduced towards two sides.
The working principle is as follows: when the utility model is used, a worker fills a proper amount of ceramic plates 20 into the vibrating screen 2 through the feed inlet 15, the power supply of the electric push rod 13 is started, the electric push rod 13 starts to move up and down periodically, the ceramic plates 20 are shaken and placed into the ceramic plate track 3, when the ceramic plates 20 slide along the ceramic plate track 3, the camera 4 discriminates the ceramic plates 20, judges the direction of the ceramic plates 20 and feeds back to the system, according to the information provided by the camera 4, the motor 9 is controlled to rotate correspondingly, the synchronous belt 7 drives the ceramic wafer turnover plate 10 to rotate clockwise or anticlockwise, so that the processing surface of the ceramic wafer 20 falling on the ceramic wafer turnover plate 10 faces upwards, the piston rod of the pushing cylinder 5 extends out, the pushing rod 11 is driven to push the ceramic wafer 20 onto the conveyor belt 12, the conveyor belt 12 is directly butted with external processing equipment, and the ceramic wafers 20 are sent to a processing production line in a uniform direction; the device adopts the mechanization to replace manual mode to carry out material loading and upset to potsherd 20, judges potsherd 20's positive and negative through advanced influence identification technique replacement personnel, and it is the wrong probability of machined surface orientation to reduce potsherd 20 to get into the processing lines by a wide margin, saves manpower resources, improves the product precision, promotes production efficiency.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a potsherd feed mechanism for semiconductor package, includes workstation (1), its characterized in that: the utility model discloses a vibrating screen for the kitchen cabinet, including workstation (1), motor (6), automatically controlled revolving stage (18) and camera, the upper left portion fixed mounting of workstation (1) has shale shaker (2), and the middle part fixed mounting on workstation (1) upper surface right side has puts thing platform (6), the lower right side fixed mounting of workstation (1) has motor (9), the right back side welding of workstation (1) upper surface has automatically controlled revolving stage (18), the last fixed surface of automatically controlled revolving stage (18) installs camera (4), put the well upper portion of thing platform (6) lateral wall and rotate and install potsherd returning face plate (10), and put the upper right portion fixed mounting of thing platform (6) lateral wall and cup joint in potsherd cylinder (5) that pushes away of potsherd returning face plate (10) outside, it has potsherd track (3) to weld between thing platform (6) and shale shaker (2), and the left side wall fixed mounting who puts thing platform (6) has conveyer belt (12), the, synchronous belt (7) have been cup jointed to the outside of synchronous pulley (8), the left side fixed mounting who pushes away material cylinder (5) has and is located ejector tie rod (11) of putting thing platform (6) upside, camera (4), motor (9) and push away material cylinder (5) all are connected with outside computer electricity through the power data line.
2. The ceramic wafer feeding mechanism for semiconductor package as claimed in claim 1, wherein: electric putter (13) have been pegged graft to the lower lateral wall of shale shaker (2) inner chamber, and the upper end welding of shale shaker (2) has top cap (16), feed inlet (15) have been seted up to the left end of top cap (16), the upper portion welding of shale shaker (2) inner chamber left side wall has sunshade (17) that is located feed inlet (15) downside, the upper end fixed mounting of electric putter (13) has vibration tray (14), electric putter (13) are connected with external power source electricity through the power cord.
3. The ceramic wafer feeding mechanism for semiconductor package as claimed in claim 1, wherein: the middle part of the upper surface of the workbench (1) is clamped with a wiring port protective cover (19).
4. The ceramic wafer feeding mechanism for semiconductor package as claimed in claim 1, wherein: and the ceramic plates (20) vertically roll in the ceramic plate track (3).
5. The ceramic wafer feeding mechanism for semiconductor package as claimed in claim 1, wherein: the height of the upper end of the electric control rotary table (18) is larger than that of the object placing table (6).
6. The ceramic wafer feeding mechanism for semiconductor package as claimed in claim 1, wherein: the upper surface of the object placing table (6) is an inclined plane with the middle part protruding and the two sides gradually decreasing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920456769.2U CN209853264U (en) | 2019-04-07 | 2019-04-07 | Potsherd feed mechanism for semiconductor packaging |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920456769.2U CN209853264U (en) | 2019-04-07 | 2019-04-07 | Potsherd feed mechanism for semiconductor packaging |
Publications (1)
Publication Number | Publication Date |
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CN209853264U true CN209853264U (en) | 2019-12-27 |
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CN201920456769.2U Active CN209853264U (en) | 2019-04-07 | 2019-04-07 | Potsherd feed mechanism for semiconductor packaging |
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CN (1) | CN209853264U (en) |
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2019
- 2019-04-07 CN CN201920456769.2U patent/CN209853264U/en active Active
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Address after: 214135 fourth floor, building 30, zone B, HUanPu International Industrial Park, No. 15, Hanjiang Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Yilong semiconductor equipment (Wuxi) Co.,Ltd. Address before: 116600 95-2 Tieshan East Road, Jinzhou District, Dalian City, Liaoning Province Patentee before: WING LOONG EQUIPMENT (DALIAN) CO.,LTD. |