CN209820680U - Dustproof packaging structure of micro differential pressure sensor - Google Patents
Dustproof packaging structure of micro differential pressure sensor Download PDFInfo
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- CN209820680U CN209820680U CN201920681909.6U CN201920681909U CN209820680U CN 209820680 U CN209820680 U CN 209820680U CN 201920681909 U CN201920681909 U CN 201920681909U CN 209820680 U CN209820680 U CN 209820680U
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Abstract
The utility model discloses a little differential pressure sensor's dustproof packaging structure, relate to the chip package field, in this packaging structure, set up the sensor module in the inside cavity structure of sensor housing main part in area two air cocks, set up dustproof baffle between the front of little differential pressure sensor chip and signal conditioning chip and second suction nozzle in the cavity structure, dustproof baffle's existence can effectively avoid getting into the working chamber at sensor module place from the impurity in the gas that the second suction nozzle got into, thereby avoid impurity to act on the front pollution chip of little differential pressure sensor chip and signal conditioning chip, and then improve the reliability and the precision of whole sensor product, ensure the long-term effectual work of sensor product.
Description
Technical Field
The utility model belongs to the technical field of the chip package and specifically relates to a little differential pressure sensor's dustproof packaging structure.
Background
The micro differential pressure sensor is a sensor for measuring a small difference between two pressures, when the micro differential pressure sensor works, one end of the micro differential pressure sensor acts on a back cavity of a pressure sensor chip, the other end of the micro differential pressure sensor acts on the front surface of the pressure sensor chip, and the output of the micro differential pressure sensor is the difference of the pressures at the two ends. The micro differential pressure sensor has small measuring range and high precision requirement, and if dust or small particle impurities enter the sensor in the using process, the output error of the sensor or the damage of the sensor can be caused.
SUMMERY OF THE UTILITY MODEL
The invention provides a dustproof packaging structure of a micro differential pressure sensor aiming at the problems and the technical requirements, and the dustproof packaging structure can avoid impurities from acting on a micro differential pressure sensor chip, so that the reliability and the precision of the whole sensor product are improved.
The technical scheme of the utility model as follows:
a dustproof packaging structure of a micro differential pressure sensor comprises: the sensor comprises a sensor shell main body, a sensor sealing rear cover, a sensor module and a dustproof baffle; the sensor shell main body comprises a cavity structure, and the sensor sealing rear cover is arranged at an opening of the cavity structure and is sealed with the sensor shell main body; the sensor shell main body also comprises a first air inlet nozzle and a second air inlet nozzle which are communicated with the cavity structure inside the sensor shell main body and the external environment, the communication port of the first air inlet nozzle and the cavity structure is positioned in the working cavity, the communication port of the second air inlet nozzle and the cavity structure is positioned in the air cavity, and the side wall where the second air inlet nozzle of the cavity structure and the communication port of the cavity structure are positioned is contacted with the dustproof baffle; the sensor module is arranged in the working cavity and comprises a sensor substrate, a micro differential pressure sensor chip and a signal conditioning chip, wherein the micro differential pressure sensor chip and the signal conditioning chip are arranged on the sensor substrate, the micro differential pressure sensor chip is electrically connected with the signal conditioning chip, the sensor substrate is provided with a vent hole at a position right opposite to the micro differential pressure sensor chip, the sensor substrate is covered at a communication port of the first air inlet nozzle and the cavity structure, and the vent hole on the sensor substrate is right opposite to the first air inlet nozzle; and a sensor pin is also arranged on the sensor sealing rear cover, and the micro differential pressure sensor chip is connected to the sensor pin for signal extraction.
The further technical scheme is that the first air inlet nozzle is of a conical structure, and the aperture of one end, communicated with the external environment of the sensor shell main body, of the first air inlet nozzle is smaller than that of one end, communicated with the cavity structure inside the sensor shell main body, of the first air inlet nozzle.
The technical scheme is that the bottom edge of the dustproof baffle is propped against the bottom of the cavity structure, the opposite top edge of the dustproof baffle is propped against the sensor sealing rear cover, and at least one side edge of the dustproof baffle is spaced from the side wall of the cavity structure by a preset distance.
The utility model has the beneficial technical effects that:
the application discloses a dustproof packaging structure of a micro differential pressure sensor, in the packaging structure, a dustproof baffle is arranged between the front surfaces of a micro differential pressure sensor chip 8 and a signal conditioning chip 9 and a second air inlet nozzle 6, can prevent impurities from entering the working cavity where the sensor module is positioned, prevent the impurities from acting on the front surfaces of the micro differential pressure sensor chip 8 and the signal conditioning chip 9, meanwhile, the first air inlet nozzle 5 communicated with the back cavity of the micro differential pressure sensor chip 8 adopts a special conical structure, reduces the probability that impurities such as dust and particles fall into the back cavity of the micro differential pressure sensor chip 8, therefore, impurities are effectively prevented from acting on the back face of the micro differential pressure sensor chip 8, the micro differential pressure sensor chip 8 and the signal conditioning chip 9 provide all-around dustproof protection, the reliability and the precision of the whole sensor product are improved, and long-term effective work of the sensor product is ensured. Meanwhile, when the dustproof baffle is directly contacted with the sensor sealing rear cover, the dustproof baffle can not only play a dustproof effect, but also enhance the strength of the internal structure of the sensor, prevent the sensor sealing rear cover from deforming to cause air leakage of the sensor, and further improve the reliability of the sensor.
Drawings
Fig. 1 is a side view of a dust-proof encapsulation structure of a micro differential pressure sensor disclosed in the present application.
Fig. 2 is a top view of a dust-proof encapsulation structure of the micro differential pressure sensor disclosed in the present application.
Detailed Description
The following describes the embodiments of the present invention with reference to the accompanying drawings.
The application discloses little differential pressure sensor's dustproof packaging structure please refer to fig. 1, and this dustproof packaging structure includes: sensor housing main part 1, sensor seal back lid 2, sensor module and dust guard 3.
The sensor shell main body 1 internally comprises a cavity structure, the sensor sealing rear cover 2 is arranged at the opening of the cavity structure and sealed with the sensor shell main body 1, and the sensor sealing rear cover 2 is also provided with a sensor pin 4 made of a metal material and used for leading out a signal. Still include first suction nozzle 5 and the second suction nozzle 6 of the cavity structure of intercommunication sensor housing main part 1 inside and external environment on the sensor housing main part 1, dust baffle 3 sets up in the cavity structure in sensor housing main part 1, dust baffle 3 separates the cavity structure for the working chamber and the air cavity of intercommunication, first suction nozzle 5 is arranged in the working chamber with the intercommunication mouth of cavity structure, second suction nozzle 6 is arranged in the air cavity with the intercommunication mouth of cavity structure, be the working chamber as in FIG. 1 left side, the right side is the air cavity. The specific setting mode of dust guard 3 can have the multiple, can connect on sensor housing main part 1 or directly be with the integrative structure of sensor housing main part 1, also can connect on sensor seal back lid 2 or directly be with the integrative structure of sensor seal back lid 2, nevertheless whatever kind of setting mode that adopts, dust guard 3 all contacts with the lateral wall at the second suction nozzle 6 of cavity structure and the intercommunication mouth place of cavity structure, the contact here can be direct continuous or the contact of laminating, this kind of structure can avoid gas to directly get into the working chamber after getting into the air cavity from second suction nozzle 6. For example, when the second air inlet nozzle 6 and the communication opening of the cavity structure are located at the bottom of the cavity structure, the dustproof baffle 3 is in contact with the bottom of the cavity structure: the dustproof baffle 3 can be directly connected with the bottom of the cavity structure, can also be connected with the side wall of the cavity structure and is contacted with the bottom, and can also be connected with the sensor sealing rear cover 2 and is contacted with the bottom of the cavity structure, and the dustproof baffle has various deformations in practical application. For example, when the second air inlet nozzle 6 and the communication port of the cavity structure are located on one side wall of the cavity structure, the dustproof baffle 3 contacts with the side wall of the cavity structure, and similarly, the actual deformation structure of the dustproof baffle is also multiple, and detailed description is omitted in this application.
Taking the example that the communication port of the second air intake nozzle 6 and the cavity structure is located at the bottom of the cavity structure, fig. 1 shows an implementation manner provided by the present application: the bottom edge of dust guard 3 is fixed and is formed protruding structure in the bottom of cavity structure, dust guard 3 can link to each other with sensor housing main part 1 as an solitary part this moment, also can be directly sensor housing main part 1 goes up integrative protruding structure, there is the interval and/or has the interval with the both sides wall of cavity structure between dust guard 3 and the sealed back lid 2 of sensor simultaneously, make working chamber and air cavity intercommunication, then gaseous can get into the working chamber through the interval between the both sides wall of dust guard 3 and the sealed back lid 2 of sensor and/or cavity structure after getting into the air cavity from second suction nozzle 6, thereby effectual stop dust or tiny particle impurity in the air cavity. In this case and in various other cases, it is further preferred that: the bottom edge of the dustproof baffle 3 is abutted against the bottom of the cavity structure, the top edge opposite to the bottom edge is directly abutted against the sensor sealing rear cover 2, at the moment, the dustproof baffle 3 has a dustproof effect, the dustproof baffle 3 can be directly contacted with the sensor sealing rear cover 2 to further enhance the internal structural strength of the sensor, the sensor sealing rear cover 2 is prevented from being deformed to cause air leakage of the sensor, at least one side edge of the dustproof baffle 3 is separated from the side wall of the cavity structure by a preset distance to enable the working cavity to be communicated with the air cavity, the preset distance is generally an empirical value, please refer to a top view shown in fig. 2, which shows a schematic diagram that two side edges of the dustproof baffle 3 are respectively separated from two side walls of the cavity structure by the preset distance, and the interval between the dustproof baffle 3 and the two side walls of the cavity.
The sensor module sets up in the working chamber, and the sensor module includes sensor base plate 7, little differential pressure sensor chip 8 and signal and conditions chip 9, and little differential pressure sensor chip 8 and signal are regulated chip 9 and all set up on sensor base plate 7, and the setting mode has a plurality ofly, for example glue on sensor base plate 7, and little differential pressure sensor chip 8 and signal are regulated chip 9 electric connection, and little differential pressure sensor chip 8 is connected to sensor pin 4 of sensor sealed back lid 2 and carries out the signal and draw forth. The sensor substrate 7 is provided with a vent hole 10 at a position opposite to the micro differential pressure sensor chip 8, the sensor substrate 7 is covered at a communication port between the first air inlet nozzle 5 and the cavity structure, the vent hole 10 on the sensor substrate 7 is opposite to the first air inlet nozzle 5, and the sensor substrate 7 seals the first air inlet nozzle 5, so that gas entering from the first air inlet nozzle 5 cannot enter the cavity structure but acts on the micro differential pressure sensor chip 8 through the vent hole 10. First suction nozzle 5 is the toper structure, and the aperture of the one end of the external environment of first suction nozzle 5 intercommunication sensor housing main part 1 is less than the aperture of the one end of the inside cavity structure of first suction nozzle intercommunication sensor housing main part 1, and this kind of toper structure can reduce the probability that impurity directly drops the back of the body chamber of differential pressure sensor chip 8. In practice, the second inlet nozzle 6 may be made with a similar conical structure. In this application, special toper structure has been adopted with first suction nozzle 5 of little differential pressure sensor chip 8's back of the body chamber intercommunication, can effectively avoid impurity to act on little differential pressure sensor chip 8's back, set up dustproof baffle between little differential pressure sensor chip 8 and signal conditioning chip 9's the front and the second suction nozzle 6, can effectively avoid impurity to act on little differential pressure sensor chip 8 and signal conditioning chip 9's front, all-round dustproof protection has been provided for little differential pressure sensor chip 8 and signal conditioning chip 9, thereby the reliability of whole sensor product has been improved.
What has been described above is only a preferred embodiment of the present application, and the present invention is not limited to the above embodiments. It is to be understood that other modifications and variations directly derivable or suggested by those skilled in the art without departing from the spirit and scope of the present invention are to be considered as included within the scope of the present invention.
Claims (3)
1. The utility model provides a little differential pressure sensor's dustproof packaging structure which characterized in that, dustproof packaging structure includes: the sensor comprises a sensor shell main body, a sensor sealing rear cover, a sensor module and a dustproof baffle; the sensor shell main body is internally provided with a cavity structure, and the sensor sealing rear cover is arranged at an opening of the cavity structure and is sealed with the sensor shell main body; the dustproof baffle is arranged in the cavity structure, the dustproof baffle divides the cavity structure into a working cavity and an air cavity which are communicated, the sensor shell main body further comprises a first air inlet nozzle and a second air inlet nozzle which are communicated with the cavity structure in the sensor shell main body and the external environment, a communication port of the first air inlet nozzle and the cavity structure is positioned in the working cavity, a communication port of the second air inlet nozzle and the cavity structure is positioned in the air cavity, and the side wall of the cavity structure where the second air inlet nozzle and the communication port of the cavity structure are positioned is contacted with the dustproof baffle; the sensor module is arranged in the working cavity and comprises a sensor substrate, a micro differential pressure sensor chip and a signal conditioning chip, wherein the micro differential pressure sensor chip and the signal conditioning chip are arranged on the sensor substrate, the micro differential pressure sensor chip is electrically connected with the signal conditioning chip, the sensor substrate is provided with a vent hole at the position opposite to the micro differential pressure sensor chip, the sensor substrate is covered at a communication port of the first air inlet nozzle and the cavity structure, and the vent hole on the sensor substrate is opposite to the first air inlet nozzle; the sensor sealing rear cover is also provided with sensor pins, and the micro differential pressure sensor chip is connected to the sensor pins for signal extraction.
2. The dust encapsulation of claim 1, wherein the first air inlet nozzle is tapered, and the aperture of the end of the first air inlet nozzle that communicates with the external environment of the sensor housing body is smaller than the aperture of the end of the first air inlet nozzle that communicates with the cavity structure inside the sensor housing body.
3. The dust-proof packaging structure of claim 1 or 2, wherein the bottom edge of the dust-proof baffle abuts against the bottom of the cavity structure, the opposite top edge abuts against the sensor-sealed rear cover, and at least one side edge of the dust-proof baffle is spaced from the side wall of the cavity structure by a predetermined distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920681909.6U CN209820680U (en) | 2019-05-13 | 2019-05-13 | Dustproof packaging structure of micro differential pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920681909.6U CN209820680U (en) | 2019-05-13 | 2019-05-13 | Dustproof packaging structure of micro differential pressure sensor |
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| Publication Number | Publication Date |
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| CN209820680U true CN209820680U (en) | 2019-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920681909.6U Active CN209820680U (en) | 2019-05-13 | 2019-05-13 | Dustproof packaging structure of micro differential pressure sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112611500A (en) * | 2020-12-31 | 2021-04-06 | 西人马联合测控（泉州）科技有限公司 | Pressure sensor |
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2019
- 2019-05-13 CN CN201920681909.6U patent/CN209820680U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112611500A (en) * | 2020-12-31 | 2021-04-06 | 西人马联合测控（泉州）科技有限公司 | Pressure sensor |
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