CN209803402U - Optical module cooling system and board card - Google Patents
Optical module cooling system and board card Download PDFInfo
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- CN209803402U CN209803402U CN201920975887.4U CN201920975887U CN209803402U CN 209803402 U CN209803402 U CN 209803402U CN 201920975887 U CN201920975887 U CN 201920975887U CN 209803402 U CN209803402 U CN 209803402U
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Abstract
the utility model provides an optical module cooling system and integrated circuit board relates to the technical field of heat-radiating equipment. The optical module radiating system comprises a radiating assembly and a temperature regulating assembly; the heat dissipation assembly is used for contacting with the optical module assembly; the temperature regulation and control assembly comprises a refrigeration portion, the refrigeration portion is connected with the heat dissipation assembly, and the refrigeration portion can be used for cooling the heat dissipation assembly so as to improve the heat dissipation efficiency of the heat dissipation assembly to the optical module assembly. The problem of the heat of the powerful optical module of current integrated form integrated circuit board can't dispel fast, influence integrated circuit board service performance is solved. Through setting up radiator unit and temperature regulation and control subassembly, not only radiator unit can contact the heat dissipation with optical module subassembly, and the refrigeration portion of temperature regulation and control subassembly can contact supplementary heat dissipation with radiator unit moreover, maintains optical module subassembly and works under the preferred temperature condition, improves the life of optical module.
Description
Technical Field
The utility model belongs to the technical field of the cooling device technique and specifically relates to an optical module cooling system and integrated circuit board are related to.
background
The OTN (optical transport network) device for optical communication is used to receive, amplify and transmit metro information data. Among them, the optical module CFP (optical communication interface, module supporting hot plug) is the most important element in the OTN device for optical communication. Because the CFP of the optical module generates heat during operation and needs to dissipate heat, the transmission capacity is increased with the development of optical communication, and the heat productivity of the corresponding optical module is also increased.
With the higher integration level required by the optical communication equipment, the height of a board card of the optical communication OTN equipment is greatly reduced when the integrated design is carried out; under the condition that the height of a board card is 0.5-1U (44.45 mm is 1U), the traditional radiator can only meet the requirement of a radiating radiator with internal heat consumption of a single optical module 20W, the heat generated by the existing high-power optical module cannot be dissipated, and the board card cannot work at a non-preset temperature, so that the service performance of the optical module is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an optical module cooling system and integrated circuit board to the heat that has solved the current powerful optical module that leads to can't dispel fast, influences the problem of integrated circuit board service property.
The utility model provides an optical module cooling system, include: the temperature control device comprises a heat dissipation assembly and a temperature regulation assembly;
The heat dissipation assembly is used for contacting with the optical module assembly;
The temperature regulation and control subassembly includes the refrigeration portion, the refrigeration portion with radiator unit connects, just the refrigeration portion can be used for right radiator unit's cooling is in order to improve radiator unit is right the radiating efficiency of optical module subassembly.
further, the temperature control assembly further comprises a heating portion, the heating portion is connected with the heat dissipation assembly, and the heating portion can be used for heating the heat dissipation assembly, so that the heat dissipation assembly heats the optical module assembly.
furthermore, the temperature regulation and control subassembly includes the semiconductor refrigeration piece, the semiconductor refrigeration piece can be connected with radiator unit for radiator unit heat dissipation and heating.
further, the temperature regulation and control assembly further comprises a first radiator, a connecting plate and a heat insulation frame;
The first radiator is arranged on the semiconductor refrigerating sheet;
The heat insulation frame is sleeved on the periphery of the semiconductor refrigerating sheet, one side of the heat insulation frame is connected with the connecting plate, the other side of the heat insulation frame is connected with the bottom surface of the first radiator, and the connecting plate is used for being fixedly connected with the PCB.
further, the temperature regulation and control assembly further comprises a control board, a first relay and a second relay;
the first relay and the second relay are respectively connected with the semiconductor refrigerating sheet, the first relay is used for controlling the refrigerating part to work, and the second relay is used for controlling the heating part to work;
the first relay and the second relay are respectively connected with the control board, and the control board can control the first relay and the second relay to be selectively switched on according to the temperature of the optical module assembly.
Further, the heat dissipation assembly includes a second heat sink and a heat transfer member;
the second radiator is positioned on the optical module component, the heat transfer member is positioned between the second radiator and the optical module component, and the heat transfer member can be attached and connected with the temperature regulation and control component.
Further, the heat transfer member includes a heat pipe and a heat pipe extension;
The heat pipe extension part is arranged at one end part of the heat pipe, the heat pipe is positioned between the optical module component and the second radiator, and the heat pipe extension part is connected with the temperature regulation and control component so that heat generated by the temperature regulation and control component is transmitted to the optical module component through the heat pipe extension part.
further, the optical module assembly comprises an optical module, a shell and an elastic buckle;
The front end face of the shell is provided with a placing opening, the optical module is arranged in the shell, and the placing opening is used for taking and placing the optical module;
A hollow part is arranged on the upper end surface of the shell, and the heat dissipation assembly can penetrate through the hollow part to be in contact with the optical module;
The elastic buckle is arranged between the shell and the heat dissipation assembly, and is provided with a fixing claw facing the shell, and the elastic buckle is used for fixing the heat dissipation assembly on the shell.
Furthermore, a heat transfer metal plate is arranged between the heat dissipation assembly and the optical module, a protruding portion is arranged on the lower end face of the heat dissipation assembly, and the protruding portion is connected with the hollow portion in a clamped mode.
The utility model provides a board card, include: the end panel, the fan, the PCB and the optical module heat dissipation system;
Optical module cooling system connects on the PCB board, the end panel sets up a tip of PCB board, the fan is connected another tip of PCB board, just be provided with the fresh air inlet on the end panel.
The utility model provides an optical module cooling system, a cooling component and a temperature regulation and control component; the heat dissipation assembly is used for contacting with the optical module assembly; the temperature regulation and control assembly comprises a refrigeration portion, the refrigeration portion is connected with the heat dissipation assembly, and the refrigeration portion can be used for cooling the heat dissipation assembly so as to improve the heat dissipation efficiency of the heat dissipation assembly to the optical module assembly. Through setting up radiator unit and temperature regulation and control subassembly, not only radiator unit can contact the heat dissipation with optical module subassembly, and the refrigeration portion of temperature regulation and control subassembly can be connected supplementary heat dissipation with radiator unit moreover, maintains optical module subassembly and works under the preferred temperature condition, improves the life of optical module.
the utility model provides a board card, an end panel, a fan, a PCB and an optical module heat dissipation system; optical module cooling system connects on the PCB board, the end panel sets up a tip of PCB board, and another tip at the PCB board is connected to the fan, and is provided with the fresh air inlet on the end panel. The radiating assembly and the refrigeration portion of the optical module radiating system connected to the PCB are used for radiating the optical module assembly, and a fan arranged on the back is arranged at the tail end of the PCB so that outside air can be sucked from an air inlet of an end face plate arranged in front of the PCB, radiating of the board card is achieved, the radiating effect of the board card is improved, and the service life of the board card is guaranteed.
Drawings
in order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an optical module heat sink provided in embodiment 1 of the present invention;
Fig. 2 is an exploded view of an optical module assembly provided in embodiment 1 of the present invention;
fig. 3 is a top view of the heat dissipation assembly and the temperature control assembly provided in embodiment 1 of the present invention;
Fig. 4 is a bottom view of the heat dissipation assembly and the temperature control assembly provided in embodiment 1 of the present invention;
Fig. 5 is an exploded view of the connection between the heat dissipation assembly and the temperature control assembly provided in embodiment 1 of the present invention;
Fig. 6 is a schematic structural diagram of a temperature control assembly provided in embodiment 1 of the present invention;
fig. 7 is a schematic structural diagram illustrating a connection between a temperature control module and an optical module provided in embodiment 1 of the present invention;
fig. 8 is a circuit diagram of a refrigeration state of the temperature regulation and control assembly provided in embodiment 1 of the present invention;
Fig. 9 is a circuit diagram of a heating state of the temperature control assembly provided in embodiment 1 of the present invention;
fig. 10 is a circuit diagram of a power-off state of the temperature control assembly according to embodiment 1 of the present invention;
fig. 11 is a front view of the board card provided in embodiment 1 of the present invention;
Fig. 12 is a back view of the board card provided in embodiment 1 of the present invention;
Fig. 13 is a partial schematic view of the board card provided in embodiment 1 of the present invention.
Icon: 1-optical module heat dissipation system; 2-end panels; 3-a fan; 4-a PCB board; 11-an optical module assembly; 12-a heat dissipating component; 13-a temperature regulating component; 14-heat transfer metal plates; 15-elastic buckle; 111-an optical module; 112-a housing; 113-placing the opening; 114-a hollow-out; 121-a second heat sink; 122-a heat pipe; 123-heat pipe extension; 131-semiconductor refrigerating sheets; 132-a first heat sink; 133-a connecting plate; 134-an insulating frame; 135-a control panel; 136-a first relay; 137-a second relay; 138-supply terminals; 151-fixed jaw.
Detailed Description
the technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-7, the utility model provides an optical module cooling system 1, include: a heat dissipation assembly 12 and a temperature regulation assembly 13; the heat dissipation assembly 12 is used for contacting with the optical module assembly 11; temperature regulation and control subassembly 13 is connected with radiator unit 12 including the refrigeration portion, and the refrigeration portion can be used for the cooling to radiator unit 12 to improve radiator unit 12 and be to the radiating efficiency of optical module subassembly 11.
through setting up radiator unit 12 and temperature regulation and control subassembly 13, not only radiator unit 12 can contact the heat dissipation with optical module subassembly 11, and the refrigeration portion of temperature regulation and control subassembly 13 can be connected with radiator unit 12 and assist the heat dissipation moreover, maintains optical module subassembly 11 and works under the preferred temperature condition, improves optical module 111's life.
The heat dissipation assembly 12 is in contact with the optical module assembly 11, so that the heat dissipation assembly 12 and the optical module assembly 11 are attached to dissipate heat, and the heat dissipation effect is good.
The heat dissipation assembly 12 may be a heat dissipation fin, and a plurality of heat dissipation fins form a heat dissipation fin group to be connected to the optical module assembly 11, so as to dissipate heat of the optical module assembly 11.
Wherein, the refrigeration portion of temperature regulation and control subassembly 13 is connected with radiator unit 12, realizes that radiator unit 12 dispels the heat to radiator unit 12 when being poor to module component 11 radiating effect of focusing on, guarantees that radiator unit 12 has better radiating effect to module component 11 of focusing on.
The refrigeration part of the temperature regulation and control assembly 13 starts the refrigeration heat dissipation assembly 12, so that the working temperature of the optical module assembly 11 is lower, the performance of the optical module assembly 11 is improved, the heat dissipation capacity is improved, and the optical module assembly 11 with higher performance is further selected, for example, the heat power consumption of the optical module 111 can be supported to exceed forty watts and fifty watts.
Further, the temperature control assembly 13 further includes a heating portion, the heating portion is connected to the heat dissipation assembly 12, and the heating portion can be used for heating the heat dissipation assembly 12, so that the heat dissipation assembly 12 heats the optical module assembly 11.
because the optical module assembly 11 is below a lower working temperature (generally below zero), the optical module assembly cannot be started to work normally, the heating part of the temperature regulation and control assembly 13 can heat the heat dissipation assembly 12, so that the optical module assembly 11 is heated, and the temperature of the optical module assembly 11 is increased, so that the temperature of the optical module assembly 11 can be above the lower working temperature, and the various temperature use scenes of the optical module assembly 11 are ensured.
Further, the temperature regulation and control assembly 13 includes a semiconductor cooling plate 131, and the semiconductor cooling plate 131 can be connected with the heat dissipation assembly 12 and is used for dissipating heat and heating the heat dissipation assembly 12.
by using the temperature control assembly 13 as the semiconductor chilling plate 131, that is, by applying a forward current to the semiconductor chilling plate 131, the end face of the semiconductor connected with the heat dissipation assembly 12 is chilled, and the heat dissipation surface of the semiconductor chilling plate 131 correspondingly attached to the first heat sink 132 is absorbed by the first heat sink 132; the semiconductor cooling plate 131 is connected with a reverse current to heat the end face of the semiconductor connected with the heat radiation component 12, and the heat of the cooling surface of the semiconductor cooling plate 131 correspondingly attached to the first radiator 132 is absorbed by the first radiator 132.
the semiconductor refrigeration chip 131 is also called a hot spot refrigeration chip, and is a heat pump. Its advantages are no slide part, high reliability and no need of slide parts. When direct current is serially connected into a couple through two different semiconductor materials, heat can be absorbed and released at two ends of the couple respectively. When the positive and negative poles of the power supply of the semiconductor refrigeration piece 131 are electrified reversely, the lower end face of the semiconductor refrigeration piece 131 is in a heat release state, and the optical module assembly 11 is heated through the heat transfer component; when the positive and negative poles of the power supply of the semiconductor chilling plate 131 are electrified in the positive direction, the lower end face of the semiconductor chilling plate 131 is in a heat absorption state, and heat of the optical module assembly 11 is conveyed to the semiconductor chilling plate through the heat pipe for cooling and heat dissipation.
Further, the temperature regulation and control assembly 13 further includes a first heat sink 132, a connecting plate 133 and an insulating frame 134; the first heat sink 132 is disposed on the semiconductor chilling plate 131; the heat insulation frame 134 is sleeved on the periphery of the semiconductor chilling plate 131, one side of the heat insulation frame 134 is connected with the connecting plate 133, the other side of the heat insulation frame 134 is connected with the bottom surface of the first radiator 132 so as to isolate heat transfer between the chilling part and the heating part of the semiconductor chilling plate 131, and the connecting plate 133 is used for being fixedly connected with the PCB 4.
The first radiator 132 and the semiconductor chilling plate 131 are fixedly connected to the PCB board 4 by a connection plate 133 connected to the lowermost end, the connection plate 133 providing a connection plane; the heat pipe extension 123 is connected between PCB board 4 and connecting plate 133, realizes with heat pipe extension 123 fixed connection, and the cover is equipped with thermal-insulated frame 134 on the periphery of semiconductor refrigeration piece 131, and the heat transfer between the refrigeration section of isolated semiconductor refrigeration piece 131's up end and the terminal surface that heats of lower terminal surface guarantees the work efficiency of temperature regulation and control subassembly 13.
when the temperature of the optical module 111 is too high, the second radiator 121 cannot dissipate heat of the optical module 111, the power supply polarity of the semiconductor chilling plate 131 is positive and negative, the lower end face of the semiconductor chilling plate 131 chills, heat of the optical module 111 is output to the semiconductor chilling plate 131 through the heat pipe 122 for cooling and heat dissipation, and the first radiator 132 is located on the upper end face of the semiconductor chilling plate 131 and absorbs heat on the upper end face of the semiconductor chilling plate 131 to indirectly cool the optical module assembly 11.
wherein the connection plate 133 may be a copper plate; the connecting plate 133 is a copper plate, so that the heat transfer performance is good, and the cost is low.
the first heat sink 132 is located on the semiconductor cooling plate 131, and the first heat sink 132 is used for conducting heat to the semiconductor cooling plate 131.
further, the temperature regulation and control assembly 13 further comprises a control board 135, a first relay 136 and a second relay 137; a thermistor is arranged in the optical module assembly 11, the optical module assembly 11 is electrically connected with the PCB 4, and the control board 135 is electrically connected with the PCB 4, so that the PCB 4 can read the temperature value of the optical module assembly 11 and feed the temperature value back to the control board 135; the first relay 136 and the second relay 137 are respectively connected with the semiconductor refrigerating sheet 131, the first relay 136 is used for controlling the refrigerating part to work, and the second relay 137 is used for controlling the heating part to work; the first relay 136 and the second relay 137 are respectively connected to the control board 135, and the control board 135 can control the first relay 136 and the second relay 137 to be selectively turned on according to the temperature of the optical module assembly 11.
the photosensitive resistor in the optical module 111 senses the temperature of the optical module 111 and transmits a temperature signal to the PCB 4, the PCB 4 reads the temperature of the optical module 111 according to a 485 communication protocol and feeds the temperature value back to the control board 135, and the control board 135 sends an instruction according to the temperature value to control the communication between the first relay 136 and the second relay 137, so as to control the semiconductor chilling plate 131 to be in a chilling state or a heating state. Specifically, the photoresistor has no temperature value feedback, the no light module 111 is defaulted to work, the first relay 136 and the second relay 137 are both switched off, and the semiconductor refrigeration sheet 131 does not supply power; when the temperature value is lower than the lower working temperature value, the second relay 137 is attracted, the power supply polarity of the semiconductor chilling plate 131 is negative and positive, the end face of the semiconductor chilling plate 131 connected with the heat pipe 122 heats, namely the lower end face of the semiconductor chilling plate 131 is in a heat dissipation state; when the temperature value is a lower working temperature value, the second relay 137 is switched off, namely, the refrigerating sheet is in an inoperative state; when the temperature value reaches or even exceeds a higher working temperature value, the first relay 136 is closed, the power supply polarity of the semiconductor chilling plate 131 is positive or negative, the end face of the semiconductor chilling plate 131 connected with the heat pipe 122 is chilled, namely, the lower end face of the semiconductor is in a heat absorption state; when the temperature value is gradually reduced to the normal working temperature value, the first relay 136 is switched off, namely the refrigeration piece is in an inoperative state; in summary, when the optical module 111 is in the phase of different temperature values, the semiconductor chilling plate 131 can adjust the working state accordingly, which not only can ensure that the optical module 111 is at the optimal working temperature, but also can save energy and prevent the semiconductor chilling plate 131 from being in the working state for a long time.
The temperature range of the use environment of the optical module 111 is-40-65 ℃; the lower working temperature value of the optical module 111 refers to a temperature range below 0 ℃, the higher working temperature value of the optical module 111 refers to a temperature range above 70 ℃, and when the normal working temperature threshold value of the optical module 111 is between 0 ℃ and 50 ℃, the heat dissipation effect of the heat dissipation assembly 12 on the optical module 111 can be ensured, so that the refrigeration part of the temperature regulation and control assembly 13 does not need to be started.
wherein, the control panel 135 is connected with a display screen, a load, a first relay 136, a second relay 137 and a power supply terminal 138; the PCB 4 reads the temperature of the optical module 111 according to a 485 communication protocol and feeds the temperature value back to the control board 135; as shown in fig. 8, the voltage generated by the power supply is connected to the power supply terminal 138, and is communicated with the cooling portion of the semiconductor cooling plate 131 through the communicated first relay 136, that is, the cooling portion is an end surface connected to the heat pipe 122; as shown in fig. 9, the voltage generated by the power supply is communicated with the heating portion of the semiconductor cooling plate 131 through the communicated second relay 137, that is, the heating portion is an end surface connected to the heat pipe 122; as shown in fig. 10, the circuit is in an open state, i.e., the semiconductor chilling plate 131 is in an inactive state.
further, the heat dissipating module 12 includes a second heat sink 121 and a heat transfer member; the second heat sink 121 is located on the optical module assembly 11, the heat transfer member is located between the second heat sink 121 and the optical module assembly 11, and the heat transfer member can be attached to and connected to the temperature control assembly 13.
The second heat sink 121 is disposed on the optical module assembly 11, that is, the second heat sink 121 is directly attached to the optical module assembly 11 for heat dissipation, and the heat transfer member is located between the second heat sink 121 and the optical module 111, and is used for transferring heat generated by the optical module 111 to the temperature regulation and control assembly 13, and also transferring heat of the temperature regulation and control assembly 13 to the optical module assembly 11 as a medium for heat transfer.
Further, the heat transfer member includes a heat pipe 122 and a heat pipe extension 123; the heat pipe extension part 123 is arranged at one end of the heat pipe 122, the heat pipe 122 is located between the optical module assembly 11 and the semiconductor chilling plate 131, the heat pipe extension part 123 is attached to the lower end face of the semiconductor chilling plate 131, so that heat generated by the lower end face of the semiconductor chilling plate 131 is transmitted to the optical module assembly 11 through the heat pipe extension part 123, and heat generated by the optical module 111 can be transmitted to the lower end face of the semiconductor chilling plate 131 through the heat pipe 122.
The heat pipe extension 123 is arranged at one end of the heat pipe 122, so that the heat pipe extension 123 of the heat pipe 122 between the optical module assembly 11 and the first radiator 132 can be attached to the lower end face of the semiconductor chilling plate 131, heat generated by the lower end face of the semiconductor chilling plate 131 can be directly conveyed to the optical module assembly 11 through the heat pipe extension 123, the heating effect of a heating part of the semiconductor chilling plate 131 on the optical module assembly 11 is improved, the heat generated by the optical module assembly 11 can be transmitted to the lower end face of the semiconductor chilling plate 131 through the heat pipe 122, and cold temperature generated by the lower end face of the semiconductor chilling plate 131 can also dissipate heat of the optical module assembly 11.
Further, the optical module assembly 11 includes an optical module 111 and a housing 112; a placing opening 113 is arranged on the front end surface of the shell 112, the optical module 111 is arranged in the shell 112, and the placing opening 113 is used for taking and placing the optical module 111; a hollow portion 114 is disposed on an upper end surface of the housing 112, and the second heat sink 121 can contact the optical module 111 through the hollow portion 114.
The opening 113 is arranged on the front end face of the shell 112, so that the optical module assembly 11 can be taken and placed at the position where the opening 113 is arranged, the optical module 111 can be frequently plugged and replaced in the using process, and the operation is simpler and more convenient. The hollow portion 114 is disposed on the upper end surface of the housing 112, so that the second heat sink 121 can directly contact with the optical module 111 through the hollow portion 114 to dissipate heat, and the heat dissipation effect is improved.
the placing opening 113 is provided with a slide rail inside the housing 112, so that the optical module assembly 11 can be taken and placed at the placing opening 113 along the slide rail.
further, a heat transfer metal plate 14 is provided between the second heat sink 121 and the optical module 111.
By providing the heat transfer metal plate 14 between the first heat sink 132 and the optical module 111, it is ensured that the second heat sink 121 and the optical module 111 are in planar contact with each other, and that heat generated by the optical module 111 can be rapidly transferred to the first heat sink 132.
The heat transfer metal plate 14 may be a copper plate, which has good heat transfer performance and low cost.
furthermore, the device also comprises an elastic buckle 15; the elastic buckle 15 is disposed between the housing 112 and the heat dissipation assembly 12, and the elastic buckle 15 is provided with a fixing claw 151, the fixing claw 151 is disposed toward the housing 112, and the elastic buckle 15 is used for fixing the heat dissipation assembly 12 on the housing 112.
the elastic buckle 15 is arranged between the housing 112 and the second heat sink 121, so that the second heat sink 121 is fixed on the housing 112, the fixing claws 151 are fixed towards the housing 112, and when the optical module 111 is taken and placed, the elasticity is released, so that the optical module assembly 11 is fastened and fixed.
Further, a protruding portion is disposed on a lower end surface of the second heat sink 121, and the protruding portion is clamped with the hollow portion 114.
the lower end surface of the second heat sink 121 is provided with a protruding portion, so that the protruding portion is clamped with the hollow portion 114, and the second heat sink 121 is stably fixed at the upper end of the housing 112.
As shown in fig. 11-13, the utility model provides a board card, include: the end panel 2, the fan 3, the PCB 4 and the optical module heat dissipation system 1; optical module cooling system 1 is connected on PCB board 4, end panel 2 sets up a tip at PCB board 4, and fan 3 is connected another tip of PCB board 4, and be provided with the fresh air inlet on the end panel 2.
The radiator unit 12 and the refrigeration portion of the optical module cooling system 1 connected to the PCB 4 cool the optical module assembly 11 doubly, and a fan 3 arranged at the back is arranged at the tail end of the PCB 4, so that the external air can be sucked from the air inlet of the end plate 2 arranged in front of the PCB 4, the heat dissipation of the board card is realized, the heat dissipation effect of the board card is improved, and the service life of the board card is ensured.
Wherein, equipartition sets up in the air intake on the end panel 2 to what make outside air can the equipartition is inhaled and is entered into the integrated circuit board in, carries out the forced air cooling heat dissipation to optical module 111 in the integrated circuit board.
Equipment the utility model provides an operation of integrated circuit board as follows:
The shell 112 is welded and fixed on the PCB 4, and the optical module 111 is taken from the front end face of the shell 112 and fixed in the shell 112;
The second heat sink 121 is fixed on the housing 112 through the elastic buckle 15, and the bottom surface of the second heat sink 121 is flush with the upper surface of the optical module 111;
A plurality of heat pipes 122 are soldered between the second heat sink 121 and the case 112 by solder paste, and the heat pipe extension 123 is soldered at the lower end of the connection plate 133 by solder paste;
And then the semiconductor refrigeration sheet 131 sleeved with the heat insulation frame 134 and the first radiator 132 are assembled and locked on the connecting plate 133 by screws.
The utility model provides a heat dissipation principle of integrated circuit board does:
The technical scheme is that the TEC (semiconductor cooling plate 131) and the chassis fan 3 are firstly connected with electricity, then the optical module 111 is inserted, heat is generated in the working process of the optical module 111, the heat is 5-40W unequal, and the technical scheme mainly solves the problem that the optical module 111 with 30-40W power consumption:
First use condition of the optical module 111: when the temperature of the optical module 111 is lower than 0 ℃, the control board 135 supplies reverse current to the semiconductor chilling plate 131, the lower end face of the semiconductor chilling plate 131 heats at the moment, heat is conducted to the second radiator 121 through the heat pipe 122 and further conducted to the optical module 111, so that the starting temperature requirement of the optical module 111 is met, the optical module 111 works normally, and the control board 135 of the semiconductor chilling plate 131 is powered off.
The second operating condition of the optical module 111 is as follows: the temperature value of the optical module 111 is 0-50 ℃, the optical module works normally, the TEC is in a power-off state and does not work, and the second radiator 121 radiates heat to the optical module 111;
The second use condition of the optical module 111 is: when the temperature value of the optical module 111 reaches 70 ℃, the heat radiation performance of the second radiator 121 is insufficient, the TEC is electrified for refrigeration, the lower end surface of the semiconductor refrigeration sheet 131 is refrigerated at the time, the heat of the second radiator 121 is conducted to the lower end surface of the semiconductor refrigeration sheet 131 through the heat pipe 122 for heat radiation, and the heat generated by the upper end surface of the semiconductor refrigeration sheet 131 is radiated through the first radiator 132; when the temperature of the optical module 111 is gradually reduced to 50 ℃, the TEC is powered off.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. An optical module heat dissipation system, comprising: the temperature control device comprises a heat dissipation assembly and a temperature regulation assembly;
the heat dissipation assembly is used for contacting with the optical module assembly;
The temperature regulation and control subassembly includes the refrigeration portion, the refrigeration portion with radiator unit connects, just the refrigeration portion can be used for right radiator unit's cooling is in order to improve radiator unit is right the radiating efficiency of optical module subassembly.
2. The optical module heatsink system of claim 1, wherein the temperature regulation component further comprises a heating portion, the heating portion being connected to the heatsink component and the heating portion being operable to heat the heatsink component such that the heatsink component heats the optical module component.
3. the optical module cooling system of claim 2, wherein the temperature control assembly comprises a semiconductor cooling plate, and the semiconductor cooling plate is connectable to a cooling assembly for cooling and heating the cooling assembly.
4. The optical module cooling system of claim 3, wherein the temperature regulation assembly further comprises a first heat sink, a connection plate, and a thermally insulating frame;
The first radiator is arranged on the semiconductor refrigerating sheet;
The heat insulation frame is sleeved on the periphery of the semiconductor refrigerating sheet, one side of the heat insulation frame is connected with the connecting plate, the other side of the heat insulation frame is connected with the bottom surface of the first radiator, and the connecting plate is used for being fixedly connected with the PCB.
5. the optical module cooling system of claim 4, wherein the temperature regulation assembly further comprises a control board, a first relay, and a second relay;
The first relay and the second relay are respectively connected with the semiconductor refrigerating sheet, the first relay is used for controlling the refrigerating part to work, and the second relay is used for controlling the heating part to work;
The first relay and the second relay are respectively connected with the control board, and the control board can control the first relay and the second relay to be selectively switched on according to the temperature of the optical module assembly.
6. The light module heatsink system of claim 1, wherein the heatsink assembly comprises a second heatsink and a heat transfer member;
The second radiator is positioned on the optical module component, the heat transfer member is positioned between the second radiator and the optical module component, and the heat transfer member can be attached and connected with the temperature regulation and control component.
7. The light module cooling system of claim 6, wherein the heat transfer member comprises a heat pipe and a heat pipe extension;
the heat pipe extension part is arranged at one end part of the heat pipe, the heat pipe is positioned between the optical module component and the second radiator, and the heat pipe extension part is connected with the temperature regulation and control component so that heat generated by the temperature regulation and control component is transmitted to the optical module component through the heat pipe extension part.
8. The optical module heat dissipation system of claim 6, wherein the optical module assembly comprises an optical module, a housing, and a resilient clip;
The front end face of the shell is provided with a placing opening, the optical module is arranged in the shell, and the placing opening is used for taking and placing the optical module;
A hollow part is arranged on the upper end surface of the shell, and the heat dissipation assembly can penetrate through the hollow part to be in contact with the optical module;
the elastic buckle is arranged between the shell and the heat dissipation assembly, and is provided with a fixing claw facing the shell, and the elastic buckle is used for fixing the heat dissipation assembly on the shell.
9. the optical module cooling system according to claim 8, wherein a heat transfer metal plate is disposed between the heat sink and the optical module, and a protrusion is disposed on a lower end surface of the heat sink and engaged with the hollow portion.
10. a board card, comprising: an end panel, a fan, a PCB board, and a light module heat dissipation system as recited in any one of claims 1-9;
Optical module cooling system connects on the PCB board, the end panel sets up a tip of PCB board, the fan is connected another tip of PCB board, just be provided with the fresh air inlet on the end panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920975887.4U CN209803402U (en) | 2019-06-26 | 2019-06-26 | Optical module cooling system and board card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110161638A (en) * | 2019-06-26 | 2019-08-23 | 苏州格曼斯温控科技有限公司 | Optical module cooling system and board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110161638A (en) * | 2019-06-26 | 2019-08-23 | 苏州格曼斯温控科技有限公司 | Optical module cooling system and board |
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