CN209786152U - microwave switch matrix for real-time microwave tomography - Google Patents
microwave switch matrix for real-time microwave tomography Download PDFInfo
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- CN209786152U CN209786152U CN201920655388.7U CN201920655388U CN209786152U CN 209786152 U CN209786152 U CN 209786152U CN 201920655388 U CN201920655388 U CN 201920655388U CN 209786152 U CN209786152 U CN 209786152U
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Abstract
The utility model relates to a microwave switch matrix for real-time microwave tomography, which comprises a metal shell, a solid microwave switch chip, a radio frequency circuit board and a grounded coplanar waveguide structure, wherein a plurality of solid microwave switch chips form a single-pole double-throw microwave switch module and a single-pole N-throw microwave switch module; the external interface of the metal shell comprises a power supply and control interface, N SMA interfaces for connecting the sensor electrodes, and an emitting end SMA interface and a receiving end SMA interface which are respectively connected with an emitting end and a receiving end; the upper surface of the radio frequency circuit board is a signal ground part and is fully contacted with the metal shell. The utility model has the advantages that: the utility model discloses a microwave switch matrix based on solid-state microwave switch chip has compensatied the not enough that microwave switch matrix switching speed of traditional mechanical type is low, utilizes reasonable structural design to make non-mechanical microwave switch matrix when high-speed switch switches, also can reach lower insertion loss and higher isolation.
Description
Technical Field
The utility model belongs to microwave switch matrix field, concretely relates to microwave switch matrix for real-time microwave tomography.
Background
In a microwave tomography system or a microwave sensing system, a microwave switch matrix is widely adopted to realize switching of microwave signal transmission paths. A typical application case is that a signal transmitting end, a signal receiving end and N sensor electrodes are combined to build a link, that is, a microwave switch matrix with a 2 × N structure is required.
The existing microwave switch matrix product has low switch switching speed and low integration optimization degree, and cannot meet the technical requirements of real-time microwave tomography.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming not enough among the prior art, provide a microwave switch matrix for real-time microwave tomography, optimize the integration with solid-state microwave switch chip through the transmission line and the control interface of ground connection coplane waveguide structure, effectively realize in the microwave tomography system the connection of transmitting terminal and receiving terminal to two arbitrary electrodes of sensor to compact structure, reliability height, isolation between signal channel are high, switching speed is fast (can reach nanosecond level).
The microwave switch matrix for real-time microwave tomography comprises a metal shell, solid-state microwave switch chips, a radio frequency circuit board and a grounded coplanar waveguide structure, wherein a plurality of the solid-state microwave switch chips form a single-pole double-throw microwave switch module and a single-pole N-throw microwave switch module; the external interface of the metal shell comprises a power supply and control interface, N SMA interfaces for connecting the sensor electrodes, and an emitting end SMA interface and a receiving end SMA interface which are respectively connected with an emitting end and a receiving end;
The upper surface of the radio frequency circuit board is a signal ground part and is fully contacted with the metal shell, the bottom surface of the radio frequency circuit board is welded with solid-state microwave switch chips, and high-frequency microwave signal ports of all the solid-state microwave switch chips are connected through a grounded coplanar waveguide structure; the grounding coplanar waveguide structure comprises a metal conductor microwave signal path part, a metal layer and a metal through hole; the designed characteristic impedance of the grounded coplanar waveguide structure is consistent with the characteristic impedance of other parts of the microwave signal path;
The single-pole double-throw microwave switch module mainly comprises N single-pole double-throw solid-state microwave switch chips; the signal ends of the N SMA interfaces for connecting the sensor electrodes are correspondingly connected with the common ends of the N single-pole double-throw solid-state microwave switch chips; the single-pole double-throw solid-state microwave switch chip comprises three ports: a common port, a port number one and a port number two; the single-pole double-throw solid-state microwave switch chip comprises two states: the common end is connected to the first port, and the common end is connected to the second port; the first port of the N single-pole double-throw solid-state microwave switch chips is connected with a topological structure on one side of a microwave signal transmitting end in the microwave tomography system, and the second port of the N single-pole double-throw solid-state microwave switch chips is connected with a topological structure on one side of a microwave signal receiving end in the microwave tomography system; at the same time, the common end of one single-pole double-throw solid-state microwave switch chip is connected to the first port, and the common end of the rest N-1 single-pole double-throw solid-state microwave switch chips is connected to the second port;
the topological structure of the transmitting end is a single-pole N-throw microwave switch module, and the single-pole N-throw microwave switch module is formed by connecting a plurality of single-pole double-throw solid-state microwave switch chips or a plurality of single-pole four-throw solid-state microwave switch chips or a single-pole N-throw solid-state microwave switch chip; the common end of the single-pole N-throw microwave switch module is connected with an emission end SMA interface of an emission end in a microwave tomography system, and the rest N switch ports of the single-pole N-throw microwave switch module are correspondingly connected with the first ports of the N single-pole double-throw solid-state microwave switch chips;
The topological structure of the receiving end is a single-pole N-throw microwave switch module, and the single-pole N-throw microwave switch module is formed by connecting a plurality of single-pole double-throw solid-state microwave switch chips or a plurality of single-pole four-throw solid-state microwave switch chips or a single-pole N-throw solid-state microwave switch chip; the common end of the single-pole N-throw microwave switch module is connected with a receiving end SMA interface of a receiving end in a microwave tomography system, and the rest N switch ports of the single-pole N-throw microwave switch module are correspondingly connected with the second ports of the N single-pole double-throw solid-state microwave switch chips.
preferably, the method comprises the following steps: the central metal thin rods of all the SMA interfaces are used as signal ends of the interfaces, and the signal ends are connected with the interfaces of the radio frequency circuit board in a welding mode; the metal shell is used as a signal ground, and all the SMA interfaces and the power supply and control interfaces are fixed on the metal shell through screws and are fully contacted with the connecting surface of the metal shell.
Preferably, the method comprises the following steps: the microwave signal connection between the solid-state microwave switch chips is a high-frequency microwave signal.
Preferably, the method comprises the following steps: the metal conductor microwave signal path part on the radio frequency circuit board is used as a signal path, the upper and lower metal layers of the radio frequency circuit board are used as signal ground parts, a plurality of metal through holes are connected with the upper and lower signal ground parts, the metal through holes are close to the edge of the signal ground, and the distance between the metal through holes is not more than 1/4 wavelengths of the highest working frequency.
The utility model has the advantages that: the utility model discloses a microwave switch matrix based on solid-state microwave switch chip has compensatied the not enough that microwave switch matrix switching speed of traditional mechanical type is low, utilizes reasonable structural design to make non-mechanical microwave switch matrix when high-speed switch switches, also can reach lower insertion loss and higher isolation. In real-time microwave tomography's application, the microwave switch matrix that needs high-speed switch switching speed realizes the formation of image and rebuilds the real-time collection of required data, and switching speed need reach the nanosecond rank in some applications, the utility model discloses can satisfy the demand that this type of real-time microwave tomography was used.
Drawings
Fig. 1 is an outline view of the microwave switch matrix for real-time microwave tomographic imaging according to the present invention;
FIG. 2 is an exploded view of the microwave switch matrix for real-time microwave tomography according to the present invention;
FIG. 3 is a state diagram of a single-pole double-throw solid-state microwave switch chip;
FIG. 4 is a schematic connection diagram of a 2 × 8 microwave switch matrix;
Fig. 5 is a schematic diagram of a grounded coplanar waveguide structure transmission line.
Description of reference numerals: the microwave switch comprises a metal shell 1, a power supply and control interface 2, N SMA interfaces 3, an emission end SMA interface 4, a receiving end SMA interface 5, a solid-state microwave switch chip 6, a radio frequency circuit board 7, a signal end 8, a metal conductor microwave signal path part 9, a metal layer 10 and a metal through hole 11.
Detailed Description
The present invention will be further described with reference to the following examples. The following description of the embodiments is merely provided to aid in understanding the invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
The microwave switch matrix for real-time microwave tomography is a microwave switch matrix formed by connecting a plurality of solid-state microwave switch chips by adopting a grounded coplanar waveguide structure transmission line, and for a sensor system with N electrodes, the microwave switch matrix mainly comprises a metal shell 1, a solid-state microwave switch chip 6 and a radio frequency circuit board 7, wherein the plurality of solid-state microwave switch chips 6 form a single-pole double-throw microwave switch module and a single-pole N-throw microwave switch module.
The closed metal shell 1 mainly functions to isolate electromagnetic wave signal interference between a circuit of the internal microwave switch matrix and the outside, and an external interface of the metal shell 1 comprises a power supply and control interface 2, N SMA interfaces 3 for connecting sensor electrodes, a transmitting end SMA interface 4 and a receiving end SMA interface 5 which are respectively connected with a transmitting end and a receiving end.
The single-pole double-throw microwave switch module mainly comprises N single-pole double-throw solid-state microwave switch chips. And signal ends 8 of the N SMA interfaces 3 for connecting the sensor electrodes are correspondingly connected with the common ends of the N single-pole double-throw solid-state microwave switch chips. The single-pole double-throw solid-state microwave switch chip mainly has three ports: a common port, a port number one and a port number two; two states: the common terminal is connected to port number one and the common terminal is connected to port number two. A first port of the N single-pole double-throw solid-state microwave switch chips is used for connecting a topological structure on one side of a microwave signal transmitting end in the microwave tomography system, and a second port of the N single-pole double-throw solid-state microwave switch chips is used for connecting a topological structure on one side of a microwave signal receiving end in the microwave tomography system. At the same time, the common end of one single-pole double-throw solid-state microwave switch chip is connected to the first port, and the common end of the rest N-1 single-pole double-throw solid-state microwave switch chips is connected to the second port.
The topological structure of the transmitting end is mainly a single-pole N-throw microwave switch module, and can be formed by connecting a plurality of single-pole double-throw or single-pole four-throw or single-pole N-throw solid-state microwave switch chips. The common end of the single-pole and N-throw microwave switch module is connected with an emission end SMA interface 4 of an emission end in a microwave tomography system, and the rest N switch ports are correspondingly connected with the first ports of the N single-pole and double-throw solid-state microwave switch chips.
the topological structure of the receiving end is mainly a single-pole N-throw microwave switch module, and can be formed by connecting a plurality of single-pole double-throw or single-pole four-throw or single-pole N-throw solid-state microwave switch chips. The common end of the single-pole double-throw microwave switch module is connected with a receiving end SMA interface 5 of a receiving end in a microwave tomography system, and the remaining N switch ports are correspondingly connected with the second ports of the N single-pole double-throw solid-state microwave switch chips.
The microwave signal between the solid-state microwave switch chips 6 is connected into a high-frequency microwave signal, the design of a transmission line based on a grounded coplanar waveguide structure is adopted on the radio-frequency circuit board 7, and the designed characteristic impedance of the transmission line is consistent with the characteristic impedance values of the SMA interface and other parts.
The power supply and the control line of the solid-state microwave switch chip 6 belong to direct current or low-frequency signals, the wiring of the power supply and the control line cannot damage the grounded coplanar waveguide structure of the high-frequency signals, and the wiring can be implemented by external flying wires of a circuit board or wiring layers in the circuit board, which are different from the high-frequency microwave signals or signal ground.
As shown in fig. 1, a microwave switch matrix having a 2 × 8 structure is taken as an example. In the application of real-time microwave tomography, the transmitting end SMA interface 4 and the receiving end SMA interface 5 can be used as the transmitting end and the receiving end of a microwave signal, and the N SMA interfaces 3 are eight ports for connecting the electrodes of the sensor.
As shown in fig. 2, the microwave switch matrix for real-time microwave tomography includes all solid-state microwave switch chips 6, a radio frequency circuit board 7, a metal shell 1, an SMA interface, a power supply and a control interface 2. The central metal thin rod of all SMA interfaces serves as the signal end 8 of the interface. On the radio frequency circuit board 7, the microwave signal path adopts the transmission line design of the grounded coplanar waveguide structure, and the path connection of the microwave signal is realized by controlling a plurality of solid-state microwave switch chips. The metal shell 1 is used as a signal ground, and all the SMA interfaces, the power supply and the control interface 2 are mechanically fixed on the metal shell 1 through screws and are fully contacted with the connecting surface of the metal shell 1. And signal terminals 8 of all the SMA interfaces are connected with the interface of the radio frequency circuit board 7 in a welding manner. Meanwhile, the solid-state microwave switch chip 6 is welded on the bottom surface of the radio frequency circuit board 7, the upper surface of the radio frequency circuit board 7 is a signal ground part, and the surface is not provided with an insulating layer and is directly exposed to be in full contact with the metal shell 1.
the single-pole double-throw switch can be used as a basic component unit of the microwave switch matrix of the present invention, and fig. 3 is a state diagram of a single-pole double-throw solid-state microwave switch chip. The single-pole double-throw solid-state microwave switch chip can realize two working states through control, wherein the working states are as follows, namely, the state 1: the common end is communicated with the first port; state 2: the common terminal is conducted with the second port.
fig. 4 is a schematic connection diagram of a microwave switch matrix of a 2 × 8 structure, which is an example of an eight-electrode microwave imaging sensor. The common terminals A to H of the eight single-pole double-throw solid-state microwave switch chips are correspondingly connected with eight SMA interfaces for connecting the sensor electrodes. One ports of the eight single-pole double-throw solid-state microwave switch chips are all connected with a topological structure on one side of a microwave signal transmitting end in the microwave tomography system, and the second ports of the eight single-pole double-throw solid-state microwave switch chips are all connected with a topological structure on one side of a microwave signal receiving end in the microwave tomography system.
At the same time, the common end of only one single-pole double-throw solid-state microwave switch chip is connected to the first port, and the common end of the rest N-1 single-pole double-throw solid-state microwave switch chips is connected to the second port. In fig. 4, the topology of the transmitting end and the receiving end is mainly a single-pole N-throw microwave switch module, which may be composed of a plurality of single-pole double-throw/single-pole four-throw or a single-pole N-throw solid-state microwave switch chip. The common end of the two single-pole double-throw solid-state microwave switch chips is respectively connected with SMA interfaces of a transmitting end and a receiving end in the microwave tomography system, and the rest switch ports are respectively and correspondingly connected with the two output ports of the N single-pole double-throw solid-state microwave switch chips in two communication states.
In fig. 2, the connections between the high-frequency microwave signal ports between all the solid-state microwave switch chips 6 soldered on the radio frequency circuit board 7 adopt a grounded coplanar waveguide structure. As shown in fig. 5, the path of the microwave high-frequency signal adopts a grounded coplanar waveguide structure, the metal conductor microwave signal path portion 9 on the radio frequency circuit board 7 serves as a high-frequency microwave signal path, the upper and lower metal layers 10 of the radio frequency circuit board 7 serve as signal ground portions, the plurality of metal via holes 11 are connected with the upper and lower signal ground portions, the positions of the via holes are as close as possible to the edge of the signal ground, and the distance between the via holes must not be greater than 1/4 wavelengths of the highest operating frequency. The designed characteristic impedance of the grounded coplanar waveguide structure is consistent with the characteristic impedance of the other parts of the microwave signal path. The matched characteristic impedance may reduce signal loss due to reflection of the microwave signal propagating in different parts.
the utility model discloses a working process does: in the application of real-time microwave tomography, different test data are acquired by controlling a microwave switch matrix to transform a signal path in a microwave sensor, and the typical sequence of the test is as follows: the first test data is that the transmitting end of a microwave signal is connected with a first electrode of a microwave imaging sensor, and the receiving end of the microwave signal is connected with a second electrode; the second test data is that the transmitting end is continuously connected with the first electrode, and the receiving end is connected with the third electrode; in the same way, the N-1 test data is the transmitting end which is continuously connected with the first electrode, and the receiving end is connected with the N electrode; the Nth test data is that the transmitting end is connected to the second electrode, and the receiving end is connected to the third electrode; by analogy, the last test data is that the transmitting end is connected to the No. N-1 electrode, and the receiving end is connected to the No. N electrode. The number of the test data in one period is N (N-1)/2, and all the test data are used as data required by a microwave imaging image reconstruction algorithm.
Claims (4)
1. A microwave switch matrix for real-time microwave tomography, comprising: the microwave switch comprises a metal shell (1), solid-state microwave switch chips (6), a radio frequency circuit board (7) and a grounded coplanar waveguide structure, wherein a plurality of the solid-state microwave switch chips (6) form a single-pole double-throw microwave switch module and a single-pole N-throw microwave switch module; the external interface of the metal shell (1) comprises a power supply and control interface (2), N SMA interfaces (3) for connecting the electrodes of the sensor, and an emitting end SMA interface (4) and a receiving end SMA interface (5) which are respectively connected with an emitting end and a receiving end;
The upper surface of the radio frequency circuit board (7) is a signal ground part and is fully contacted with the metal shell (1), the bottom surface of the radio frequency circuit board (7) is welded with the solid-state microwave switch chips (6), and high-frequency microwave signal ports of all the solid-state microwave switch chips (6) are connected through a grounded coplanar waveguide structure; the grounding coplanar waveguide structure comprises a metal conductor microwave signal path part (9), a metal layer (10) and a metal through hole (11); the designed characteristic impedance of the grounded coplanar waveguide structure is consistent with the characteristic impedance of other parts of the microwave signal path;
The single-pole double-throw microwave switch module mainly comprises N single-pole double-throw solid-state microwave switch chips; the signal ends (8) of the N SMA interfaces (3) for connecting the sensor electrodes are correspondingly connected with the common ends of the N single-pole double-throw solid-state microwave switch chips; the single-pole double-throw solid-state microwave switch chip comprises three ports: a common port, a port number one and a port number two; the single-pole double-throw solid-state microwave switch chip comprises two states: the common end is connected to the first port, and the common end is connected to the second port; the first port of the N single-pole double-throw solid-state microwave switch chips is connected with a topological structure on one side of a microwave signal transmitting end in the microwave tomography system, and the second port of the N single-pole double-throw solid-state microwave switch chips is connected with a topological structure on one side of a microwave signal receiving end in the microwave tomography system; at the same time, the common end of one single-pole double-throw solid-state microwave switch chip is connected to the first port, and the common end of the rest N-1 single-pole double-throw solid-state microwave switch chips is connected to the second port;
the topological structure of the transmitting end is a single-pole N-throw microwave switch module, and the single-pole N-throw microwave switch module is formed by connecting a plurality of single-pole double-throw solid-state microwave switch chips or a plurality of single-pole four-throw solid-state microwave switch chips or a single-pole N-throw solid-state microwave switch chip; the common end of the single-pole N-throw microwave switch module is connected with an emission end SMA interface (4) of an emission end in a microwave tomography system, and the rest N switch ports of the single-pole N-throw microwave switch module are correspondingly connected with the first ports of the N single-pole double-throw solid-state microwave switch chips;
the topological structure of the receiving end is a single-pole N-throw microwave switch module, and the single-pole N-throw microwave switch module is formed by connecting a plurality of single-pole double-throw solid-state microwave switch chips or a plurality of single-pole four-throw solid-state microwave switch chips or a single-pole N-throw solid-state microwave switch chip; the common end of the single-pole N-throw microwave switch module is connected with a receiving end SMA interface (5) of a receiving end in a microwave tomography system, and the rest N switch ports of the single-pole N-throw microwave switch module are correspondingly connected with the second ports of the N single-pole double-throw solid-state microwave switch chips.
2. a microwave switch matrix for real-time microwave tomography as claimed in claim 1, wherein: the central metal thin rods of all the SMA interfaces are used as signal ends (8) of the interfaces, and the signal ends (8) are connected with the interfaces of the radio frequency circuit board (7) in a welding mode; the metal shell (1) is used as a signal ground, and all the SMA interfaces and the power supply and control interface (2) are fixed on the metal shell (1) through screws and are fully contacted with the connecting surface of the metal shell (1).
3. A microwave switch matrix for real-time microwave tomography as claimed in claim 1, wherein: microwave signals between the solid-state microwave switch chips (6) are connected into high-frequency microwave signals.
4. A microwave switch matrix for real-time microwave tomography as claimed in claim 1, wherein: a metal conductor microwave signal path part (9) on a radio frequency circuit board (7) is used as a signal path, an upper metal layer (10) and a lower metal layer (10) of the radio frequency circuit board (7) are used as signal ground parts, a plurality of metal through holes (11) are connected with the upper signal ground part and the lower signal ground part, the metal through holes (11) are close to the edge of the signal ground, and the distance between the metal through holes (11) is not more than 1/4 wavelengths of the highest working frequency.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920655388.7U CN209786152U (en) | 2019-05-09 | 2019-05-09 | microwave switch matrix for real-time microwave tomography |
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| CN201920655388.7U CN209786152U (en) | 2019-05-09 | 2019-05-09 | microwave switch matrix for real-time microwave tomography |
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| CN209786152U true CN209786152U (en) | 2019-12-13 |
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Effective date of registration: 20220826 Address after: Room 307, No. 32, Gaoji Street, Xihu District, Hangzhou City, Zhejiang Province, 310002 Patentee after: Zhejiang Zheneng Digital Technology Co.,Ltd. Patentee after: ZHEJIANG ENERGY R & D INSTITUTE Co.,Ltd. Address before: 5 / F, building 1, 2159-1 yuhangtang Road, Wuchang Street, Yuhang District, Hangzhou City, Zhejiang Province 310001 Patentee before: ZHEJIANG ENERGY R & D INSTITUTE Co.,Ltd. |