CN103430457A - High frequency module - Google Patents
High frequency module Download PDFInfo
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- CN103430457A CN103430457A CN2012800134946A CN201280013494A CN103430457A CN 103430457 A CN103430457 A CN 103430457A CN 2012800134946 A CN2012800134946 A CN 2012800134946A CN 201280013494 A CN201280013494 A CN 201280013494A CN 103430457 A CN103430457 A CN 103430457A
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- conductor
- control signal
- switch
- base plate
- multilager base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/10—Auxiliary devices for switching or interrupting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
- H01P1/2135—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using strip line filters
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/0057—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B15/00—Suppression or limitation of noise or interference
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Transceivers (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Filters And Equalizers (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A multilayer board (20) comprises therein wire conductors (W1 to W3), ground conductors (G1 to G4), interlayer connection conductors (V1 to V5), and a matching inductor (L1). A control signal input terminal (21) is formed on the second main surface (lower surface) of the multilayer board (20). An electrode on which a high frequency switch (31) is attached is in electrical continuity with the wire conductors (W1, W2) through the interlayer connection conductors (V2, V3). A wire conductor (W1) for control signals is formed on a dielectric layer close to the second main surface (lower surface) of the multilayer board (20). The wire conductor (W2) for high frequency signals is formed on a dielectric layer close to the first main surface (upper surface) of the multilayer board (20). The ground conductor (G3) which overlaps the wire conductor (W1) for control signals in planer view, and the ground conductor (G1) for conducting matching elements, are separated by a separation portion (S). With this structure, the influence of harmonic noise caused by the input of a high frequency switch control signal is reduced, and the deterioration of the communication property can be improved.
Description
Technical field
The present invention relates to a kind of high-frequency model that is equipped with HF switch and high frequency filter on multilager base plate, particularly a kind of high-frequency model with control signal input terminal of the control signal of inputting HF switch.
Background technology
Can switch between a plurality of communication bands in the communication equipment communicated, generally between antenna and transmission circuit, possess front-end module.For example, in patent documentation 1, the front-end module that possesses HF switch is disclosed.
Fig. 1 is the circuit diagram of the front-end module shown in patent documentation 1.In this front end module, the transmitted signal input part of HF switch 1 is connected with power amplifier 13 by low pass filter 5,6.Receiving signal efferent 3 is connected with low noise amplifier 14 by band pass filter 10,11,12.The efferent 4 of HF switch 1 is connected with antenna 15.
The prior art document
Patent documentation
Patent documentation 1: the special table of Japan Patent 2004-517583 communique
Summary of the invention
Invent technical problem to be solved
As shown in patent documentation 1, by HF switch is carried to multilayer ceramic substrate together with duplexer and filter etc., can form small-sized high-frequency model.But, if the configuration of each wiring pattern of comprising the multilayer ceramic substrate surface electrode is not processed the phase mutual interference between can connecting up.Especially in the situation to the HF switch of using serial data signal and clock signal input control signal, because serial data signal and clock signal (HF switch control signal) have more harmonic component, the wiring of this HF switch control signal is treated as problem.
The problems referred to above are not limited to occur in filter to the interference between HF switch, and occurring in antenna is also same to the interference between HF switch.
The present invention is in order to address the above problem, and the high-frequency model that take provides the impact that weakens the harmonic noise that the HF switch control signal produces and improve the deterioration of communication characteristic is purpose.
The technical scheme that the technical solution problem adopts
The present inventor investigates by experiment, find the be added to high-frequency signal circuit of HF switch of harmonic noise that the HF switch control signal the produces grounding conductor layer by multilager base plate inside, and the reason that this stack occurs is, because control signal approaches same earthing conductor with wiring conductor and the wiring conductor that the high-frequency signal that HF switch is arranged flows through.In addition, while also finding the electronic devices and components beyond possessing HF switch, the grounding conductor layer of the harmonic noise that the HF switch control signal produces by the multilager base plate inside earthing conductor with above-mentioned electronic devices and components conducting that is added to, and the reason that this stack occurs is, because approach wiring conductor for control signal with the earthing conductor (coupling element conductive earthing conductor) of above-mentioned electronic devices and components conducting.
Therefore, in order to address the above problem, medium-high frequency module of the present invention adopts following structure.
(1) the present invention has following feature.
Multilager base plate, this multilager base plate has a plurality of dielectric layers, be formed on the interlayer bonding conductor that wiring conductor on described dielectric layer and through-thickness run through described dielectric layer;
HF switch and electronic devices and components, this HF switch and electronic devices and components carry respectively on the 1st interarea of described multilager base plate; And
The control signal input terminal, this control signal input terminal is formed on the 2nd interarea of described multilager base plate and inputs the control signal of described HF switch,
The control signal be connected with described control signal input terminal is formed on the wiring conductor near the dielectric layer the 2nd interarea of described multilager base plate,
High-frequency signal that the high-frequency signal of described HF switch flows through wiring conductor is formed near the dielectric layer the 1st interarea of described multilager base plate.
(2) in (1), be preferably, the electronic devices and components conducting earthing conductor be connected with the earth terminal of described electronic devices and components is formed near the dielectric layer the 1st interarea of described multilager base plate.
(3) in (2), be preferably, described control signal is that electricity is separated with near the earthing conductor wiring conductor with described electronic devices and components conducting earthing conductor in described multilager base plate.
(4) in (2) or (3), be preferably, between described control signal is with wiring conductor and described electronic devices and components conducting earthing conductor, possess the earthing conductor that is different from described electronic devices and components conducting earthing conductor.
(5) in (1)～(4), be preferably, while overlooking described multilager base plate, be formed in the zone of described HF switch with the interlayer bonding conductor that carries out conducting between conductor that connects up in described HF switch and described control signal.
(6) in (1)～(5), when the described HF switch control signal that described HF switch is inputted from the control signal input terminal is serial data signal and clock signal, especially effective.
(7), in (1)～(6), described electronic devices and components are for example to be connected to the coupling element between described high-frequency signal wiring conductor and ground connection.
(8) in (7), described coupling element is, the inductance element for example consisted of the interlayer bonding conductor in described multilager base plate and wiring conductor.
(9), in (7), described coupling element is for example to carry the inductance element at the 1st interarea of described multilager base plate.
The invention effect
According to the present invention, electromagnetic field couples between wiring conductor and high-frequency signal wiring conductor for control signal, and control signal will be suppressed by the electromagnetic field couples between the element conductive earthing conductor with wiring conductor and coupling, and do not allow to be subject to the impact of the harmonic noise that produced by the input of HF switch control signal.Improve thus the deterioration of the communication characteristics such as receiving sensitivity reduction and transmitted signal distortion.
The accompanying drawing explanation
［ Fig. 1 ］ Fig. 1 is the circuit diagram of the front-end module shown in patent documentation 1.
［ Fig. 2 ］ Fig. 2 (A), Fig. 2 (B) are the sectional views for the major part of high-frequency model 100A, the 100B of the comparative example of the high-frequency model of the 1st described mode.
［ Fig. 3 ］ Fig. 3 is the sectional view of major part of the high-frequency model 101 of the 1st execution mode.
［ Fig. 4 ］ Fig. 4 is the structured flowchart of the high-frequency model 102 of the 2nd execution mode.
［ Fig. 5 ］ Fig. 5 is the serial data signal S(SDATA that is input to serial data input terminal SDATA) and be input to the clock signal S(SCLK of the sub-SCLK of clock signal input terminal) oscillogram.
［ Fig. 6 ］ Fig. 6 (A) is the major part sectional view of the high-frequency model 102 of the 2nd execution mode, and Fig. 6 (B) is the major part sectional view of high-frequency model 100C that relatively contrasts the existing structure of use.
［ Fig. 7 ］ Fig. 7 (A) is the major part sectional view of the high-frequency model 103 of the 3rd execution mode, and Fig. 7 (B) is the major part sectional view of high-frequency model 100D that relatively contrasts the existing structure of use.
［ Fig. 8 ］ Fig. 8 (A) is the major part sectional view of the high-frequency model 104 of the 4th execution mode, and Fig. 8 (B) is the major part sectional view of high-frequency model 100E that relatively contrasts the existing structure of use.
［ Fig. 9 ］ Fig. 9 is the sectional view of the high-frequency model 105 of the 5th execution mode.
［ Figure 10 ］ Figure 10 is the decomposition view of high-frequency model 105.
［ Figure 11 ］ Figure 11 is the decomposition view of the high-frequency model of the 6th execution mode.
Embodiment
" the 1st execution mode "
Fig. 2 (A), Fig. 2 (B) are the sectional views of major part of high-frequency model 100A, the 100B of comparative example for the high-frequency model of the 1st execution mode (existing general method for designing).In addition, Fig. 3 is the sectional view of major part of the high-frequency model 101 of the 1st execution mode.
In Fig. 2 (A), Fig. 2 (B) and Fig. 3, high-frequency model (100A, 100B, 101) possesses multilayer ceramic substrate (below, simply be called " multilager base plate ") 20 and carries the HF switch 31 at the 1st interarea (upper surface) of this multilager base plate 20.The inside of multilager base plate 20 possesses wiring conductor W1, W2, earthing conductor G1, G2, G3, interlayer bonding conductor V1, V2, V3.The 2nd interarea (lower surface) of multilager base plate 20 is formed with control signal input terminal 21.
The electrode and wiring conductor W1, the W2 that carry HF switch 31 carry out conducting by interlayer bonding conductor V2, V3.
Control signal for HF switch 31 is inputted from above-mentioned control signal input terminal 21.This control signal is through interlayer bonding conductor V1, and wiring conductor W1, reach the control signal input terminal that interlayer bonding conductor V2 is input to HF switch 31.
In the example of Fig. 2 (A), Fig. 2 (B), control signal with wiring conductor W1 and the wiring conductor W2 that has the high-frequency signal of HF switch to flow through all earthing conductor G1 layer near.As long as earthing conductor G1 is not earthing potential and be not utmost point low resistance completely, control signal can layer being coupled by earthing conductor G1 with wiring conductor W1 and wiring conductor W2.That is,, as shown in the arrow in Fig. 2 (A), Fig. 2 (B), above-mentioned control signal can be leaked to the wiring conductor W2 that the high-frequency signal of HF switch flows through.Consequently, the harmonic noise of control signal can be added on high-frequency signal.When this high-frequency signal is while receiving signal, can cause receiving sensitivity to reduce.If transmitted signal can cause the transmitted signal distortion.
On the other hand, in high-frequency model 101 in the 1st execution mode shown in Fig. 3, control signal is formed on wiring conductor W1 near the dielectric layer the 2nd interarea (lower surface) of multilager base plate 20, and has high-frequency signal wiring conductor W2 that the high-frequency signal of HF switch 31 flows through to be formed near the dielectric layer first interarea (upper surface) of multilager base plate 20.Therefore, control signal is separated from each other with wiring conductor W1 and high-frequency signal wiring conductor W2.
In addition, in this example, wiring conductor W1 and other grounding conductor layers such as being formed with earthing conductor G4 that connect up between conductor W2 for control signal.Therefore, control signal is fully blocked with the coupling of wiring conductor W1 and wiring conductor W2.
Moreover, the interlayer bonding conductor V2 be connected with the control signal input terminal of HF switch 31 linearly extension under the loading position of HF switch 31, thereby, while overlooking multilager base plate 20, in HF switch 31 and control signal, with the interlayer bonding conductor V2 that carries out conducting between conductor W1 that connects up, be formed in the zone of HF switch 31.Therefore, reduce near the control signal of the loading position wiring of conductor of HF switch 31, thereby reduced the control signal be leaked in high-frequency signal wiring conductor W2.
By above effect, fully suppressed control signal and harmonic wave thereof the high-frequency signal wiring conductor W2 that is added to.Improved thus the deterioration of the communication characteristics such as receiving sensitivity reduction and transmitted signal distortion.
" the 2nd execution mode "
Fig. 4 is the structured flowchart of the high-frequency model 102 of the 2nd execution mode.
The high-frequency model 102 of the 2nd execution mode possesses multilager base plate and carries the HF switch 31 on this multilager base plate, duplexer 32a～32d, duplexer 35, filter 34e, 34f, inductance La, Lb, Lc, Ld etc. for coupling.HF switch 31 possesses antenna port ANT, input/output port P1～P7, power supply terminal Vdd, earth terminal GND, serial data input SDATA, the sub-SCLK of clock signal input terminal and the power end Vio of digital circuit section.
Fig. 5 is the serial data signal S(SDATA that is input to above-mentioned serial data input terminal SDATA) and be input to the clock signal S(SCLK of the sub-SCLK of above-mentioned clock signal input terminal) oscillogram.HF switch 31 and clock signal S(SCLK) synchronously from serial data, read the data of specific bit.Carry out conduction and cut-off (ON/OFF) switching of the high frequency switches such as FET based on these data.
As shown, due to serial data signal S(SDATA) and clock signal S(SCLK) be square-wave signal, the intensity of its harmonic component is higher.And clock signal S(SCLK) be the continuous square-wave signal such as 26MHz, therefore be easy to become the reason of above-mentioned harmonic noise stack.
Fig. 6 (A) is the sectional view of major part of the high-frequency model 102 of the 2nd execution mode, and Fig. 6 (B) is the major part sectional view of high-frequency model 100C that relatively contrasts the existing structure of use.
In Fig. 6 (A), Fig. 6 (B), high-frequency model (102,100C) possesses multilager base plate 20 and carries the HF switch 31 on first interarea (upper surface) of this multilager base plate 20, duplexer 32, and coupling is with inductance 33 etc.The inside of multilager base plate 20 possesses wiring conductor W1～W3, earthing conductor G1～G3, interlayer bonding conductor V1～V7.The 2nd interarea (lower surface) of multilager base plate 20 is formed with control signal input terminal 21.
The electrode and wiring conductor W1, the W2 that are equipped with HF switch 31 carry out conducting by interlayer bonding conductor V2, V3.
Control signal for HF switch 31 is input to above-mentioned control signal input terminal 21.This control signal process interlayer bonding conductor V1, wiring conductor W1, and interlayer bonding conductor V2 is input to the control signal input terminal of HF switch 31.Coupling is connected with earthing conductor G1 by interlayer bonding conductor V6 with a terminal of inductance 33, and another terminal is connected with wiring conductor W2.One terminal of duplexer 32 is connected with wiring conductor W2 by interlayer bonding conductor V4, and another terminal is connected with wiring conductor W3.
In the example of Fig. 6 (B), the layer of wiring conductor (the high-frequency signal wiring conductor) W2 that has the high-frequency signal of HF switch to flow through with the earthing conductor G1 of coupling with inductance 33 conductings near.Therefore, as shown in the arrow in Fig. 6 (B), the harmonic noise of above-mentioned control signal can be added to and mate the element conductive earthing conductor G1 for coupling be connected with inductance 33.The harmonic noise of this control signal uses inductance 33 to leak into high-frequency signal wiring conductor W2 by coupling.As a result, the harmonic noise of the control signal high-frequency signal that is added to.When this high-frequency signal is while receiving signal, can cause receiving sensitivity to reduce.If transmitted signal can cause the transmitted signal distortion.
On the other hand, in the 2nd execution mode of the present invention, as shown in Fig. 6 (A), control signal is formed on wiring conductor W1 near the dielectric layer the 2nd interarea (lower surface) of multilager base plate 20, and the high-frequency signal wiring conductor W2 that has the high-frequency signal of HF switch 31 to flow through and coupling are formed near the dielectric layer of the 1st interarea (upper surface) of multilager base plate 20 with element conductive earthing conductor G1.Therefore, control signal is separated from each other with wiring conductor W1 and high-frequency signal wiring conductor W2.In addition, control signal also is separated from each other with element conductive earthing conductor G1 with wiring conductor W1 and coupling.
In addition, in this example, control signal is different from the grounding conductor layer of coupling with element conductive earthing conductor G1 by wiring conductor W1 and coupling with being formed with earthing conductor G2, G3 etc. between element conductive earthing conductor G1.Therefore, control signal is fully blocked with the coupling of element conductive earthing conductor G1 with wiring conductor W1 and coupling.
Moreover, the interlayer bonding conductor V2 be connected with the control signal input terminal of HF switch 31 linearly extension under the loading position of HF switch 31, thereby, while overlooking multilager base plate 20, in HF switch 31 and control signal, with the interlayer bonding conductor V2 that carries out conducting between conductor W1 that connects up, be formed in the zone of HF switch 31.Therefore, reduce near the wiring with conductor of control signal HF switch 31 loading positions, thereby reduce, be leaked to the control signal of coupling with element conductive earthing conductor G1 and high-frequency signal wiring conductor W2.
By above effect, fully suppressed control signal and harmonic wave thereof the high-frequency signal wiring conductor W2 that is added to.Improve thus the deterioration of the communication characteristics such as receiving sensitivity reduction and transmitted signal distortion.
" the 3rd execution mode "
Fig. 7 (A) is the major part sectional view of the high-frequency model 103 of the 3rd execution mode, and Fig. 7 (B) is the major part sectional view of high-frequency model 100D that relatively contrasts the existing structure of use.
As shown in Fig. 7 (A), Fig. 7 (B), high-frequency model (103,100D) possesses multilager base plate 20 and carries the HF switch 31 on the 1st interarea (upper surface) of this multilager base plate 20, electronic devices and components 36 etc.The inside of multilager base plate 20 possesses wiring conductor W1～W3, earthing conductor G1～G3, interlayer bonding conductor V1～V6.And the 2nd interarea (lower surface) of multilager base plate 20 is formed with control signal input terminal 21.
The electrode and wiring conductor W1, the W2 that carry HF switch 31 carry out conducting by interlayer bonding conductor V2, V3.
Control signal for HF switch 31 is inputted from above-mentioned control signal input terminal 21.This control signal is through interlayer bonding conductor V1, and wiring conductor W1, reach the control signal input terminal that interlayer bonding conductor V2 is input to HF switch 31.The earth terminal of electronic devices and components 36 is connected to earthing conductor (electronic devices and components conducting earthing conductor) G1 by interlayer bonding conductor V6, and other terminals are connected to wiring conductor W2, W3.
In the example of Fig. 7 (B), the layer of wiring conductor (the high-frequency signal wiring conductor) W2 that has the high-frequency signal of HF switch to flow through is near the layer of the earthing conductor G1 with electronic devices and components 36 conductings.Therefore, as shown in arrow in Fig. 7 (B), the electronic devices and components conducting earthing conductor G1 that the harmonic noise of above-mentioned control signal is added to and is connected with electronic devices and components 36.The harmonic noise of this control signal leaks into high-frequency signal wiring conductor W2, W3 by electronic devices and components 36.As a result, the harmonic noise of the control signal high-frequency signal that is added to.When this high-frequency signal is while receiving signal, can cause receiving sensitivity to reduce.If transmitted signal can cause the transmitted signal distortion.
On the other hand, in the 3rd execution mode of the present invention, shown in Fig. 7 (A), control signal is formed on wiring conductor W1 near the dielectric layer the 2nd interarea (lower surface) of multilager base plate 20, the high-frequency signal wiring conductor W2 that has the high-frequency signal of HF switch 31 to flow through and being formed near the dielectric layer first interarea (upper surface) of multilager base plate 20 with earthing conductor (the electronic devices and components conducting earthing conductor) G1 of electronic devices and components 36 conductings.Therefore, control signal is separated from each other with wiring conductor W1 and high-frequency signal wiring conductor W2.In addition, control signal also is separated from each other with wiring conductor W1 and electronic devices and components conducting earthing conductor G1.
In addition, in this example, between control signal is with wiring conductor W1 and electronic devices and components conducting earthing conductor G1, be formed with the earthing conductors such as G2, G3 that are different from electronic devices and components conducting earthing conductor G1.Therefore, control signal is fully blocked with the coupling of wiring conductor W1 and electronic devices and components conducting earthing conductor G1.
Moreover, the interlayer bonding conductor V2 be connected with the control signal input terminal of HF switch 31 linearly extension under the loading position of HF switch 31, thereby, while overlooking multilager base plate, in HF switch 31 and control signal, with the interlayer bonding conductor V2 that carries out conducting between conductor W1 that connects up, be formed in the zone of HF switch 31.Therefore, reduced and be positioned near the wiring of the control signal of HF switch 31 loading positions with conductor, thereby reduced the control signal that is leaked to electronic devices and components conducting earthing conductor G1 and high-frequency signal wiring conductor W2.
By above effect, fully suppressed control signal and harmonic wave thereof the high-frequency signal wiring conductor W2 that is added to.Improve thus the deterioration of the communication characteristics such as receiving sensitivity reduction and transmitted signal distortion.
" the 4th execution mode "
Fig. 8 (A) is the major part sectional view of the high-frequency model 104 of the 4th execution mode, and Fig. 8 (B) is the major part sectional view of high-frequency model 100E that relatively contrasts the existing structure of use.
As shown in Fig. 8 (A), Fig. 8 (B), high-frequency model (104,100E) possesses multilager base plate 20 and carries the HF switch 31 on the 1st interarea (upper surface) of this multilager base plate 20, duplexer 32 etc.The inside of multilager base plate 20 possesses wiring conductor W1～W3, earthing conductor G1～G4, interlayer bonding conductor V1～V5, coupling inductance L1.And the 2nd interarea (lower surface) of multilager base plate 20 is formed with control signal input terminal 21.
The electrode and wiring conductor W1, the W2 that carry HF switch 31 carry out conducting by interlayer bonding conductor V2, V3.
Different from the high-frequency model of structure shown in Fig. 6 (A), Fig. 6 (B), coupling is positioned at multilager base plate 20 with inductance L1.This coupling with inductance L1, by edgewise, extended a plurality of wiring conductors and along a plurality of interlayer bonding conductors of interlayer direction extension, formed.And coupling is connected with high-frequency signal wiring conductor W2 with the end of inductance L1, the other end is connected with element conductive earthing conductor G1 with coupling.
In the example of Fig. 8 (B), control signal approaches with the wiring conductor W2 of wiring conductor W1 and high-frequency signal and the layer of earthing conductor G4.Therefore, as shown in arrow in Fig. 8 (B), the harmonic noise of above-mentioned control signal is by the earthing conductor G4 high-frequency signal wiring conductor W2 that is added to.As a result, the harmonic noise of the control signal high-frequency signal that is added to.When this high-frequency signal is while receiving signal, can cause receiving sensitivity to reduce.If transmitted signal can cause the transmitted signal distortion.
On the other hand, in the 4th execution mode of the present invention, shown in Fig. 8 (A), control signal is formed on wiring conductor W1 near the dielectric layer the 2nd interarea (lower surface) of multilager base plate 20, and high-frequency signal wiring conductor W2 is formed near the dielectric layer first interarea (upper surface) of multilager base plate 20.Therefore, control signal is separated from each other with wiring conductor W1 and high-frequency signal wiring conductor W2.
In addition, in this example, while overlooking and control signal earthing conductor G3 and the coupling overlapping with wiring conductor W1 with element conductive earthing conductor G1, by separation unit S, separate.Therefore, control signal is fully blocked with the coupling of element conductive earthing conductor G1 with wiring conductor W1 and coupling.
Moreover, the interlayer bonding conductor V2 be connected with the control signal input terminal of HF switch 31 linearly extension under the loading position of HF switch 31, thereby, while overlooking multilager base plate 20, in HF switch 31 and control signal, with the interlayer bonding conductor V2 that carries out conducting between conductor W1 that connects up, be formed in the zone of HF switch 31.Therefore, reduce near the wiring of conductor of the control signal of HF switch 31 loading positions, thereby reduced the control signal be leaked in high-frequency signal wiring conductor W2.
By above effect, fully suppressed control signal and harmonic wave thereof the high-frequency signal wiring conductor W2 that is added to.Improve thus the deterioration of the communication characteristics such as receiving sensitivity reduction and transmitted signal distortion.
" the 5th execution mode "
Fig. 9 is the sectional view of the high-frequency model 105 of the 5th execution mode.Figure 10 is the decomposition view of high-frequency model 105.By multilager base plate and lift-launch, HF switch and the coupling on this multilager base plate formed with inductance this high-frequency model.Figure 10 (1)～(20) are the plane graphs of each layer of this multilager base plate.(1) be the superiors, (20) are orlops.In the superiors shown in (1), be formed with the electrode that carries HF switch and carry the electrode that mates the electricity consumption sense chip.At each layer shown in (2)～(19), be formed with various wiring conductors, various earthing conductor and interlayer bonding conductor (via conductors).
As shown in Figure 9, the inside of multilager base plate 20 possesses wiring conductor W1, W2, earthing conductor G1～G3, interlayer bonding conductor V1, V2, V3, V6, V7.The 2nd interarea (lower surface) of multilager base plate 20 is formed with control signal input terminal 21.Basic structure is with identical shown in the Fig. 6 (A) in the 2nd execution mode.
The electrode and wiring conductor W1, the W2 that carry HF switch 31 carry out conducting by interlayer bonding conductor V2, V3.
Control signal is formed on wiring conductor W1 near the dielectric layer the 2nd interarea (lower surface) of multilager base plate 20, and the high-frequency signal wiring conductor W2 that has the high-frequency signal of HF switch 31 to flow through and coupling are formed near the dielectric layer of first interarea (upper surface) of multilager base plate 20 with element conductive earthing conductor G1.Therefore, control signal is separated from each other with wiring conductor W1 and high-frequency signal wiring conductor W2.In addition, control signal also is separated from each other with element conductive earthing conductor G1 with wiring conductor W1 and coupling.
Be formed with on (20) and comprise control signal input terminal 21(serial data input terminal SDATA and clock signal input terminal SCLK at the layer of Figure 10) a plurality of terminals.Be formed with earthing conductor G3 on layer (19).Be formed with the wiring conductor W1 for control signal be connected with control signal input terminal 21 on layer (18).Be formed with earthing conductor G2 on layer (17).In addition, be formed with earthing conductor G1 on layer (5).Be formed with high-frequency signal wiring conductor W2 on layer (2).And, be formed with a plurality of electrode A 31 of carrying HF switch 31 and carry two electrode A 33 of coupling with inductance 33 on layer (1).Be formed with interlayer bonding conductor V2 on layer (3)～layer (19).
As described above, form sandwich construction.
" the 6th execution mode "
Figure 11 is the decomposition view of the high-frequency model of the 6th execution mode.The structure of the 5th execution mode is the structure of leakage that prevents the harmonic noise of the wiring conductor that is connected separately with the sub-SCLK of clock signal input terminal with serial data input terminal SDATA and interlayer bonding conductor etc.And the structure of the 6th execution mode is the structure of leakage that prevents the harmonic noise of the wiring conductor that is connected with the sub-SCLK of clock signal input terminal and interlayer bonding conductor etc.Other are identical with the 5th execution mode.
Be formed with on (20) and comprise serial data input terminal SDATA and the sub-SCLK(control signal of clock signal input terminal input 21 at the layer of Figure 11) a plurality of terminals.Be formed with earthing conductor G3 on layer (19).On layer (18), be formed with and the sub-SCLK(control signal of clock signal input terminal input terminal 21) wiring conductor W1 for the control signal that is connected.Be formed with earthing conductor G2 on layer (17).In addition, be formed with earthing conductor G1 on layer (5).Be formed with high-frequency signal wiring conductor W2 on layer (2).And, be formed with a plurality of electrode A 31 of carrying HF switch 31 and carry two electrode A 33 of coupling with inductance 33 on layer (1).Be formed with interlayer bonding conductor V2 on layer (3)～layer (19).
So, the wiring the conductor only sub-SCLK of clock signal input terminal used with the synchronous transmission serial data is connected separately and interlayer bonding conductor etc., even take structure as shown in Figure 9, also can fully suppress the leakage of the harmonic signal of clock signal to high-frequency signal wiring conductor W2.As a result, improve thus the deterioration of the communication characteristics such as receiving sensitivity reduction and transmitted signal distortion.
Label declaration
A31, A33 ... electrode
ANT ... antenna port
G1 ... coupling element conductive earthing conductor
G2, G3, G4 ... earthing conductor
GND ... earth terminal
L1 ... the coupling inductance
La, Lb, Lc, Ld ... the coupling inductance
P1～P7 ... input/output port
S ... separation unit
SCLK ... clock signal input terminal
SDATA ... the serial data input terminal
V1～V7 ... the interlayer bonding conductor
Vdd ... power supply terminal
W1 ... wiring conductor for control signal
W2 ... high-frequency signal wiring conductor
W3 ... the wiring conductor
20 ... multilager base plate
21 ... the control signal input terminal
31 ... HF switch
32,32a～32d ... duplexer
33 ... the coupling inductance
34e, 34f ... filter
35 ... duplexer
100A～100D ... high-frequency model
101～105 ... high-frequency model
Claims (9)
1. a high-frequency model, this high-frequency model possesses:
Multilager base plate, this multilager base plate has a plurality of dielectric layers, be formed on the interlayer bonding conductor that wiring conductor on described dielectric layer and through-thickness run through described dielectric layer;
HF switch and electronic devices and components, this HF switch and electronic devices and components carry respectively on the 1st interarea of described multilager base plate; And
The control signal input terminal, this control signal input terminal is formed on the 2nd interarea of described multilager base plate and inputs the control signal of described HF switch,
The control signal be connected with described control signal input terminal is formed on the wiring conductor near the dielectric layer the 2nd interarea of described multilager base plate,
High-frequency signal that the high-frequency signal of described HF switch flows through wiring conductor is formed near the dielectric layer the 1st interarea of described multilager base plate.
2. high-frequency model as claimed in claim 1, is characterized in that, the electronic devices and components conducting earthing conductor be connected with the earth terminal of described electronic devices and components is formed near the dielectric layer the 1st interarea of described multilager base plate.
3. high-frequency model as claimed in claim 2, is characterized in that, described control signal is separated on electricity with described electronic devices and components conducting earthing conductor with near the earthing conductor wiring conductor in described multilager base plate.
4. high-frequency model as claimed in claim 2 or claim 3, is characterized in that, between described control signal is with wiring conductor and described electronic devices and components conducting earthing conductor, possesses the earthing conductor different from described electronic devices and components conducting earthing conductor.
5. high-frequency model as described as any one in claim 1～4, is characterized in that, while overlooking described multilager base plate, the interlayer bonding conductor that carries out conducting with the wiring conductor in described HF switch and described control signal is formed in the zone of HF switch.
6. high-frequency model as described as any one in claim 1～5, is characterized in that, the control signal of the described HF switch that described HF switch is inputted from the control signal input terminal is serial data signal and clock signal.
7. high-frequency model as described as any one in claim 1～6, is characterized in that, described electronic devices and components are the coupling elements that are connected between described high-frequency signal wiring conductor and ground connection.
8. high-frequency model as claimed in claim 7, is characterized in that, described coupling element is the inductance element consisted of the interlayer bonding conductor in described multilager base plate and wiring conductor.
9. high-frequency model as claimed in claim 7, is characterized in that, described coupling components and parts are the inductance elements that carry on described multilager base plate the 1st interarea.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-065149 | 2011-03-24 | ||
| JP2011065149 | 2011-03-24 | ||
| PCT/JP2012/057122 WO2012128271A1 (en) | 2011-03-24 | 2012-03-21 | High frequency module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103430457A true CN103430457A (en) | 2013-12-04 |
| CN103430457B CN103430457B (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201280013494.6A Active CN103430457B (en) | 2011-03-24 | 2012-03-21 | High frequency module |
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| Country | Link |
|---|---|
| US (1) | US9300019B2 (en) |
| JP (1) | JP5655937B2 (en) |
| CN (1) | CN103430457B (en) |
| DE (1) | DE112012001397B4 (en) |
| WO (1) | WO2012128271A1 (en) |
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| CN109997311A (en) * | 2016-11-30 | 2019-07-09 | 株式会社村田制作所 | Circuit board, Coupler Module and communication device |
| CN111245448A (en) * | 2015-11-18 | 2020-06-05 | 株式会社村田制作所 | High-frequency module and communication device |
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| CN104995845B (en) * | 2013-02-12 | 2017-07-25 | 株式会社村田制作所 | High-frequency model and communicator |
| WO2016006676A1 (en) * | 2014-07-10 | 2016-01-14 | 株式会社村田製作所 | High-frequency module |
| KR102400978B1 (en) | 2015-09-30 | 2022-05-23 | 삼성전자주식회사 | Circuit board in power supply, electronic apparatus including the same and inductor |
| WO2018088410A1 (en) * | 2016-11-11 | 2018-05-17 | 株式会社村田製作所 | Switch ic, high frequency module and communication device |
| WO2018110513A1 (en) * | 2016-12-15 | 2018-06-21 | 株式会社村田製作所 | Active element, high-frequency module, and communication device |
| KR102542594B1 (en) * | 2016-12-16 | 2023-06-14 | 삼성전자 주식회사 | Multilayer printed circuit board and electronic apparatus including the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| US9300019B2 (en) | 2016-03-29 |
| CN103430457B (en) | 2015-05-13 |
| DE112012001397T5 (en) | 2014-01-30 |
| JPWO2012128271A1 (en) | 2014-07-24 |
| WO2012128271A1 (en) | 2012-09-27 |
| JP5655937B2 (en) | 2015-01-21 |
| DE112012001397B4 (en) | 2017-08-24 |
| US20140002209A1 (en) | 2014-01-02 |
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