CN209783782U

CN209783782U - Pressure sensor

Info

Publication number: CN209783782U
Application number: CN201920938908.5U
Authority: CN
Inventors: 赖冬云; 赵春银
Original assignee: Wenzhou Yuanda Electronic Technology Co Ltd
Current assignee: Wenzhou Yuanda Electronic Technology Co Ltd
Priority date: 2019-06-20
Filing date: 2019-06-20
Publication date: 2019-12-13
Anticipated expiration: 2029-06-20

Abstract

The utility model discloses a pressure sensor, its technical scheme main points are including the sensor housing and be located the ceramic chip of sensor housing, be provided with the detection module rather than the looks adaptation in the sensor housing, detection module including the chip housing and ceramic chip, ceramic chip is located inside the chip housing, and the center department of chip housing lower extreme set up with the first pressure hole that draws of ceramic chip looks adaptation, detection module is still including the thermistor that is located chip housing lower extreme, and thermistor and the mutual electric connection of ceramic chip, the sensor housing lower part is equipped with the detection chamber with detection module looks adaptation, the center department that detects the chamber bottom has still seted up the second and has drawn the pressure hole, sensor housing upper end is still pressfitting has interface structure. The utility model discloses it is high to have the precision, simple structure, and the assembly is swift, and production efficiency is high, can carry out the effect that detects to the temperature.

Description

Pressure sensor

Technical Field

the utility model relates to a detection device technical field, concretely relates to pressure sensor.

Background

The existing pressure sensor with higher precision and reliability is a ceramic pressure sensor. The working principle is as follows: the pressure is directly acted on the front surface of the ceramic diaphragm to make the diaphragm produce small deformation, the thick film resistor is printed on the back surface of the ceramic diaphragm to connect into a Wheatstone bridge (closed bridge), because of the piezoresistance effect of the piezoresistor, the bridge produces a voltage signal which is in direct proportion to the pressure, highly linear and in direct proportion to the excitation voltage, the standard signal is calibrated to 2.0/3.0/3.3mV/V according to the difference of pressure measuring ranges, etc., and can be compatible with the strain type sensor.

At present, Chinese patent with publication number CN 207703391U discloses a ceramic chip pressure sensor, which comprises

The sensor comprises a sensor shell, wherein an installation space is arranged in the sensor shell, threads are formed on the side wall of the installation space, a ceramic chip is arranged in the installation space, a thread pressing ring is arranged at the upper end of the ceramic chip, the threads on the outer surface of the thread pressing ring are matched and connected with the threads on the side wall of the installation space, the lower end surface of the thread pressing ring extends downwards to form a protection ring, the ceramic chip is arranged in the protection ring, the upper end surface of the ceramic chip is abutted against the lower end surface of the thread pressing ring, the lower end surface of the protection ring is lower than or flush with the lower end surface of the ceramic chip; the utility model has the advantages of simple structure, convenient use, good protection effect on the ceramic chip and capability of ensuring the precision.

This patent is through setting up screw thread clamping ring and downwardly extending's protection ring, support and press "O" type circle at ceramic chip lower extreme and make to have good guard action to ceramic chip, guarantees the advantage of precision, nevertheless makes pressure sensor inner structure in disorder, influences the precision, also can lead to the assembling process loaded down with trivial details, reduces production efficiency, and pressure sensor can only detect the pressure of medium simultaneously, can't detect the temperature simultaneously. It is therefore desirable to improve upon existing pressure sensors.

SUMMERY OF THE UTILITY MODEL

not enough to prior art exists, the utility model provides a pressure sensor has the precision height, simple structure, and the assembly is swift, and production efficiency is high, can carry out the effect that detects to the temperature.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a pressure sensor, including sensor housing and the ceramic chip that is located sensor housing, be provided with the detection module rather than the looks adaptation in the sensor housing, detection module including chip housing and ceramic chip, ceramic chip is located inside the chip housing, and the center department of chip housing lower extreme sets up and draws the pressure hole with the first drawing of ceramic chip looks adaptation, detection module is still including the thermistor that is located chip housing lower extreme, and thermistor and the mutual electric connection of ceramic chip, sensor housing lower part be equipped with the detection chamber of detection module looks adaptation, the center department of detecting the chamber bottom has still seted up the second and has drawn the pressure hole, sensor housing upper end is still pressfitting has interface structure.

The utility model discloses further set up to: the chip shell comprises a chip bottom box and a chip pressing plate which are connected in a buckling mode, connecting clamping grooves and connecting buckles which are matched with each other are respectively arranged on the chip bottom box and the chip pressing plate, wiring metal sheets which are connected with two ends of the thermistor in a tin soldering mode are embedded in two sides of the chip bottom box, and pressing plate through holes which are matched with the upper ends of the ceramic chips are formed in the middle of the chip pressing plate.

The utility model discloses further set up to: an annular groove is formed in the bottom of the chip bottom box, and a first sealing ring abutting against the lower end of the ceramic chip is arranged in the annular groove.

The utility model discloses further set up to: the upper end of the detection cavity is provided with a limit step, the limit step is provided with a second sealing ring which is abutted against the lower end of the chip bottom box, and the detection cavity is internally provided with the thermistor.

The utility model discloses further set up to: the interface structure is provided with a plurality of binding posts fixedly connected with the interface structure in an inserting mode, the binding posts and the binding post metal sheets are respectively and electrically connected with the back of the ceramic chip through signal lines, and the lower end of the interface structure is further provided with at least three pressing openings.

To sum up, the utility model discloses following beneficial effect has:

1. The sensor shell has the advantages that the sensor shell is simple in internal structure, rapid to assemble and high in production efficiency in a modular mode of the detection module, meanwhile, the detection accuracy is improved, and the practicability and the using effect of the sensor shell are improved by detecting the temperature in a mode of arranging the thermistor at the lower end of the chip shell;

2. be connected the processing and the production of the detection module of being convenient for through box and chip clamp plate buckle mode at the bottom of the chip, and inlay the installation and the signal transmission of establishing the wiring sheetmetal thermistor of being convenient for through the both sides of box at the bottom of the chip, be used for fixed ceramic chip through the chip clamp plate simultaneously and prevent that ceramic chip from moving in the chip casing and influence the detection precision.

Drawings

Fig. 1 is a perspective view of the present invention.

Fig. 2 is a bottom view of the present invention.

Fig. 3 is a schematic cross-sectional view taken along line a-a in fig. 2.

Fig. 4 is an explosion diagram of the present invention.

Fig. 5 is an exploded view of the detection module of fig. 4.

Reference numerals: 1. a sensor housing; 2. a detection module; 3. a ceramic chip; 4. a first pressure guide hole; 5. a thermistor; 6. a detection chamber; 7. a second pressure leading hole; 8. an interface structure; 9. a chip bottom case; 10. pressing a chip plate; 11. a connecting clamping groove; 12. connecting a buckle; 13. a wiring metal piece; 14. a press plate through hole; 15. an annular groove; 16. a first seal ring; 17. a limiting step; 18. a second seal ring; 19. a binding post; 20. and (6) pressing the opening.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The embodiment discloses a pressure sensor, as shown in fig. 1 to 5, which includes a sensor housing 1 and a ceramic chip 3 located in the sensor housing 1, wherein a detection module 2 adapted to the sensor housing 1 is arranged in the sensor housing 1, the detection module 2 includes a chip housing and the ceramic chip 3, the ceramic chip 3 is located in the chip housing, a first pressure-leading hole 4 adapted to the ceramic chip 3 is formed in the center of the lower end of the chip housing, the detection module 2 further includes a thermistor 5 located at the lower end of the chip housing, the thermistor 5 is electrically connected to the ceramic chip 3, a detection cavity 6 adapted to the detection module 2 is arranged at the lower part of the sensor housing 1, a second pressure-leading hole 7 is further formed in the center of the bottom of the detection cavity 6, and an interface structure 8 is further pressed at the upper end of the sensor housing 1; the modularized mode of the detection module 2 enables the sensor shell 1 to be simple in internal structure, fast to assemble and high in production efficiency, meanwhile, the detection accuracy is improved, the temperature is detected in a mode that the thermistor 5 is arranged at the lower end of the chip shell, and the practicability and the using effect of the sensor shell are improved.

The chip shell comprises a chip bottom box 9 and a chip pressing plate 10 which are connected in a buckling mode, wherein the chip bottom box 9 and the chip pressing plate 10 are respectively provided with a connecting clamping groove 11 and a connecting buckle 12 which are matched with each other, two sides of the chip bottom box 9 are embedded with wiring metal sheets 13 which are in tin soldering connection with two ends of the thermistor 5, and the middle part of the chip pressing plate 10 is provided with a pressing plate through hole 14 which is matched with the upper end of the ceramic chip 3; the bottom chip box 9 and the chip pressing plate 10 are connected in a buckling mode so as to facilitate processing and production of the detection module 2, the wiring metal sheets 13 are embedded on two sides of the bottom chip box 9 so as to facilitate installation and signal transmission of the thermistor 5, and the chip pressing plate 10 is used for fixing the ceramic chip 3 so as to prevent the ceramic chip 3 from moving in the chip shell and influencing detection precision.

An annular groove 15 is formed in the bottom of the chip bottom box 9, and a first sealing ring 16 which is pressed against the lower end of the ceramic chip 3 is arranged in the annular groove 15; the annular groove 15 and the first sealing ring 16 are mutually matched to ensure the sealing performance of the ceramic chip 3, and meanwhile, the ceramic chip 3 can be prevented from moving in the chip shell along the axial direction to detect the detection accuracy of the module 2.

The upper end of the detection cavity 6 is provided with a limit step 17, the limit step 17 is provided with a second sealing ring 18 which is pressed against the lower end of the chip bottom box 9, and the detection cavity 6 is internally provided with the thermistor 5; the limit step 17 and the second sealing ring 18 are matched with each other to ensure the sealing performance of the detection module 2, and meanwhile, the detection module 2 can be prevented from moving along the axial direction to detect the detection precision of the detection module 2.

A plurality of binding posts 19 fixedly connected with the interface structure 8 are inserted in the interface structure 8, the binding posts 19 and the binding post metal sheets 13 are respectively and electrically connected with the back of the ceramic chip 3 through signal wires, and the lower end of the interface structure 8 is also provided with at least three press-fit openings 20; the detection module 2 carries out processing analysis in transmitting the signal that detects to the host computer with detection module 2 matched with through terminal 19 on the interface structure 8, the back of ceramic chip 3 is provided with control circuit board, terminal 19 and wiring sheetmetal 13 pass through the signal line and handle on transmitting the signal that detects to control circuit board, processing analysis in transmitting the host computer through interface structure 8 rethread, the nip 20 is convenient for the application of force and is made interface structure 8 lid fit the upper end of sensor housing 1.

The working process is as follows: the medium draws pressure hole 7 from the second and gets into in detecting chamber 6, and thermistor 5 detects the temperature, and inside the medium passed through and got into detection module 2 from first pressure hole 4 that draws simultaneously, ceramic chip 3 detected pressure, and the signal that thermistor 5 and ceramic chip 3 detected passes through interface structure 8 and transmits to the host computer in and handles the analysis.

To sum up, the utility model discloses following beneficial effect has:

1. The sensor shell 1 is simple in internal structure, rapid to assemble and high in production efficiency through the modularization mode of the detection module 2, meanwhile, the detection accuracy is improved, and the practicability and the using effect of the sensor shell are improved by detecting the temperature through the mode of arranging the thermistor 5 at the lower end of the chip shell;

2. Be connected the processing and the production of the detection module 2 of being convenient for through the buckle mode of box 9 and chip clamp plate 10 at the bottom of the chip, and inlay the installation and the signal transmission of establishing wiring sheetmetal 13 thermistor 5 of being convenient for through the both sides of box 9 at the bottom of the chip, be used for fixed ceramic chip 3 through chip clamp plate 10 simultaneously and prevent that ceramic chip 3 from moving in the chip casing and influence the detection precision.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, any modification, equivalent replacement, or improvement made within the design concept of the present invention should be included within the protection scope of the present invention.

Claims

1. A pressure sensor comprises a sensor shell (1) and a ceramic chip (3) positioned in the sensor shell (1), and is characterized in that: be provided with in sensor housing (1) with detection module (2) rather than the looks adaptation, detection module (2) including the chip casing and ceramic chip (3), inside ceramic chip (3) were located the chip casing, and the center department of chip casing lower extreme seted up with the first pressure hole (4) of drawing of ceramic chip (3) looks adaptation, detection module (2) still including thermistor (5) that are located chip casing lower extreme, and thermistor (5) and ceramic chip (3) electric connection each other, sensor housing (1) lower part is equipped with detection chamber (6) with detection module (2) looks adaptation, the center department of detecting chamber (6) bottom has still seted up the second and has drawn pressure hole (7), sensor housing (1) upper end still pressfitting has interface structure (8).

2. A pressure sensor as claimed in claim 1, wherein: the chip shell comprises a chip bottom box (9) and a chip pressing plate (10) which are connected in a buckling mode, a connecting clamping groove (11) and a connecting buckle (12) which are matched with each other are respectively arranged on the chip bottom box (9) and the chip pressing plate (10), wiring metal sheets (13) which are connected with thermistors (5) through tin soldering are embedded on two sides of the chip bottom box (9), and pressing plate through holes (14) which are matched with the upper ends of ceramic chips (3) are formed in the middle of the chip pressing plate (10).

3. A pressure sensor as claimed in claim 2, wherein: an annular groove (15) is formed in the bottom of the chip bottom box (9), and a first sealing ring (16) which is pressed against the lower end of the ceramic chip (3) is arranged in the annular groove (15).

4. a pressure sensor as claimed in claim 2, wherein: the upper end of the detection cavity (6) is provided with a limit step (17), the limit step (17) is provided with a second sealing ring (18) which is pressed against the lower end of the chip bottom box (9), and the detection cavity (6) is internally provided with the thermistor (5).

5. A pressure sensor as claimed in claim 2, wherein: a plurality of binding posts (19) fixedly connected with the interface structure (8) are arranged on the interface structure in a penetrating mode, the binding posts (19) and the wiring metal sheets (13) are respectively electrically connected with the back of the ceramic chip (3) through signal lines, and at least three pressing openings (20) are further formed in the lower end of the interface structure (8).