CN209766362U - Double-spot tin device for producing semiconductor power device - Google Patents

Abstract

The utility model discloses a double-point tin device for producing a semiconductor power device, which comprises a base, a lifting mechanism, a controller, an XY adjusting platform and a point tin module, wherein the lifting mechanism is fixed on the base, and the point tin module is connected with the lifting mechanism through the XY adjusting platform; a supporting plate in the tin dispensing module is fixed on a tin dispensing bottom plate, a wire feeding bottom plate is fixed at the top of the supporting plate, a wire feeding frame and a wire passing frame are fixed on the wire feeding bottom plate, the wire passing frames correspond to the wire feeding frames one by one, wire passing wheels are arranged on the wire passing frames, and wire passing holes are formed in the positions, corresponding to the wire passing wheels, on the wire feeding bottom plate; the stepping motor is fixed on the tin dotting bottom plate and drives the double grooved wheels; the lead frame is fixed on the tin-on bottom plate, and is provided with a lead wheel which is arranged corresponding to the double grooved wheels; the tin point head is fixed on the lower surface of the tin point bottom plate through the tin point head fixing seat. In this way, the utility model discloses can change corresponding two some tin external members on the basis of single-point tin structure, can realize once the multiple spot tin.

Description

Double-spot tin device for producing semiconductor power device

Technical Field

The utility model relates to a some tin device field especially relates to a semiconductor power device production is with two some tin devices.

Background

A chip mounting process of a power device for a semiconductor uses a special solder wire as an adhesive of a chip and a frame, such as TO-220, TO-126, TO-3P, D-pak and the like, at present, in a chip mounting process, a point tin mode is mostly in a linear conveying type structure, namely the solder wire is accurately fed through a conveying motor. This point tin structure has the following drawbacks: when the aspect ratio of the chip is larger than 2, the tin is required to be dotted for many times through additional movement, and the yield of the device is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem of main solution provides a semiconductor power device production is with two some tin devices, can change corresponding two some tin external members on the basis of single-point tin structure, can realize once many some tin.

in order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a two some tin devices for semiconductor power device production, includes: the device comprises a base, a lifting mechanism, a controller, an XY adjusting platform and a spot tin module; the lifting mechanism comprises a cylinder fixing seat, a lifting cylinder, a lifting guide rail, a lifting plate, a lifting platform and a cylinder connecting block; the lifting guide rail is fixed on the other side of the base in the vertical direction, the lifting cylinder is fixed on the cylinder fixing seat, and a piston rod of the lifting cylinder is parallel to the lifting guide rail; the lifting guide rail is provided with a sliding block, the lifting plate is fixed on the sliding block, the cylinder connecting block is fixed on one side of the lifting plate corresponding to the lifting cylinder, and a piston rod of the lifting cylinder is fixedly connected with the cylinder connecting block; the lifting platform is fixed on the lifting plate, and the controller is integrated on the lifting platform; the tin dispensing module comprises a tin dispensing bottom plate, a supporting plate, a wire feeding bottom plate, a wire feeding vertical plate, a wire feeding frame, a wire passing frame, a stepping motor, a driving wheel, a driven wheel, a synchronous belt, a rotating shaft, a double grooved wheel, a wire guide frame, a tin dispensing head fixing seat and a tin dispensing head, wherein the supporting plate, the wire feeding frame, the wire passing frame, the double grooved wheel and the wire guide frame are respectively provided with a pair; the XY adjusting platform is arranged in the horizontal direction, the upper surface of the XY adjusting platform is fixedly connected with the lifting platform, the position, close to the rear end of the point tin bottom plate, of the upper surface of the point tin bottom plate is fixedly connected with the lower surface of the XY adjusting platform, and the point tin bottom plate is arranged horizontally; the two supporting plates are fixed on the upper surface of the tin dispensing bottom plate in the vertical direction, the wire feeding bottom plate is fixed at the top of the supporting plates, the wire feeding vertical plates and the wire passing frames are fixed on the upper surface of the wire feeding bottom plate, the two wire feeding frames are fixed on the wire feeding vertical plates, each wire passing frame corresponds to one wire feeding frame, the wire passing frames are rotatably provided with wire passing wheels, wire grooves are formed in the circumferential direction of the wire passing wheels, and the wire passing holes are formed in the positions, corresponding to the lower parts of the two wire passing wheels; the stepping motor is fixed on the tin dotting bottom plate below the wire feeding bottom plate; the rotating shaft is arranged on the two supporting plates through a bearing, the axis of the rotating shaft is positioned in the horizontal direction, and one end of the rotating shaft extends out of one supporting plate; the driven wheel is fixed at one end of the rotating shaft extending out of the supporting plate, the driving wheel is fixed on a main shaft of the stepping motor, the driving wheel and the driven wheel correspond to each other, and the driving wheel and the driven wheel are driven by the synchronous belt; the two double grooved pulleys are fixed on the rotating shaft between the two supporting plates, and each double grooved pulley is arranged corresponding to one wire passing hole; the two lead frames are fixed at the position, close to the front end of the tin dotting bottom plate, of the upper surface of the tin dotting bottom plate, a lead shaft is fixed on each lead frame, a lead wheel is arranged on each lead shaft, and each lead wheel is arranged corresponding to one double grooved wheel; the tin point fixing seat is fixed at a position, corresponding to the lower part of the double grooved pulley, of the lower surface of the tin point bottom plate through a connecting rod, and the tin point is fixed on the tin point fixing seat.

further, the controller is connected with the lifting cylinder, the stepping motor, the XY adjusting platform and the point tin head respectively.

Further, the tin point head is an air-cooled wire feeding head.

The utility model has the advantages that: the utility model discloses on the basis of single-point tin structure, change corresponding two some tin external members, can realize once multiple spot tin.

Drawings

Fig. 1 is a schematic perspective view of a preferred embodiment of a double-dot tin device for semiconductor power device production according to the present invention;

FIG. 2 is a schematic diagram of a front view of a double-point tin device for producing a semiconductor power device;

FIG. 3 is a schematic diagram of a side view of a double-point tin device for producing a semiconductor power device;

FIG. 4 is a schematic diagram of a top view of a dual-point tin device for producing a semiconductor power device;

FIG. 5 is a schematic perspective view of a solder module in a dual-point solder apparatus for manufacturing a semiconductor power device;

The parts in the drawings are numbered as follows: 1. a base; 2. a lifting cylinder; 3. a lifting platform; 4. an XY conditioning stage; 5. tin base plate is dotted; 6. a support plate; 7. a wire feeding bottom plate; 8. a vertical wire feeding plate; 9. a wire feeding frame; 10. a wire passing frame; 11. a stepping motor; 12. a lead frame; 13. a tin head is dotted; 14. a double grooved pulley; 15. a synchronous belt; 16. a rotating shaft.

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.

referring to fig. 1 to 5, an embodiment of the present invention includes:

A double-point tin device for producing a semiconductor power device comprises: the device comprises a base 1, a lifting mechanism, a controller, an XY adjusting platform 4 and a spot tin module; the lifting mechanism comprises a cylinder fixing seat, a lifting cylinder 2, a lifting guide rail, a lifting plate, a lifting platform 3 and a cylinder connecting block; the air cylinder fixing seat is arranged on one side of the base 1, the lifting guide rail is fixed on the other side of the base 1 in the vertical direction, the lifting air cylinder 2 is fixed on the air cylinder fixing seat, and a piston rod of the lifting air cylinder 2 is parallel to the lifting guide rail; the lifting guide rail is provided with a sliding block, the lifting plate is fixed on the sliding block, the cylinder connecting block is fixed on one side, corresponding to the lifting cylinder, of the lifting plate, a piston rod of the lifting cylinder is fixedly connected with the cylinder connecting block, and the lifting mechanism controls the tin dispensing module to be lifted integrally, so that the tin dispensing head can be replaced conveniently, and production, maintenance and observation can be facilitated; the lifting platform 3 is fixed on the lifting plate, and the controller is integrated on the lifting platform; the tin dispensing module comprises a tin dispensing bottom plate 5, a supporting plate 6, a wire feeding bottom plate 7, a wire feeding vertical plate 8, a wire feeding frame 9, a wire passing frame 10, a stepping motor 11, a driving wheel, a driven wheel, a synchronous belt 15, a rotating shaft, a double grooved wheel 14, a lead frame 12, a tin dispensing head fixing seat and a tin dispensing head 13, wherein the supporting plate, the wire feeding frame, the wire passing frame, the double grooved wheel and the lead frame are respectively provided with a pair; the XY adjusting platform 4 is arranged in the horizontal direction, the upper surface of the XY adjusting platform 4 is fixedly connected with the lifting platform 3, the position, close to the rear end of the point tin bottom plate, of the upper surface of the point tin bottom plate 5 is fixedly connected with the lower surface of the XY adjusting platform 4, and the point tin bottom plate 5 is arranged horizontally; the two supporting plates 6 are fixed on the upper surface of the tin dispensing bottom plate 5 in the vertical direction, the wire feeding bottom plate 7 is fixed at the top of the supporting plates 6, the wire feeding vertical plate 8 and the wire passing frames 10 are fixed on the upper surface of the wire feeding bottom plate 7, the two wire feeding frames 9 are fixed on the wire feeding vertical plate, each wire passing frame 10 corresponds to one wire feeding frame 9, wire passing wheels are rotatably arranged on the wire passing frames 10, wire grooves are formed in the circumferential direction of the wire passing wheels, and wire passing holes are formed in the positions, corresponding to the positions below the two wire passing wheels, on the wire feeding bottom; the stepping motor 11 is fixed on the tin dotting bottom plate below the wire feeding bottom plate; the rotating shaft 16 is arranged on the two supporting plates 6 through a bearing, the axis of the rotating shaft 16 is positioned in the horizontal direction, and one end of the rotating shaft 16 extends out of one supporting plate; the driven wheel is fixed at one end of the rotating shaft extending out of the supporting plate, the driving wheel is fixed on a main shaft of the stepping motor, the driving wheel and the driven wheel correspond to each other, the driving wheel and the driven wheel are driven by the synchronous belt 15, and the stepping motor 11 provides power for the whole solder wire conveying structure; the two double grooved pulleys 14 are fixed on a rotating shaft between the two supporting plates, and each double grooved pulley 14 is arranged corresponding to one wire passing hole; the two lead frames 12 are fixed on the upper surface of the tin dotting bottom plate close to the front end of the tin dotting bottom plate, each lead frame 12 is fixed with a lead shaft, each lead shaft is provided with a lead wheel, and each lead wheel is arranged corresponding to one double grooved pulley; the tin point fixing seat is fixed at a position, corresponding to the lower part of the double grooved pulley, of the lower surface of the tin point bottom plate through a connecting rod, and the tin point 13 is fixed on the tin point fixing seat. The tin point head 13 is an air-cooled wire feeding head, so that the blockage of the wire feeding head can be greatly reduced, and the disassembly is also convenient.

The utility model discloses work flow rises the some tin module for elevating system, installs the solder wire, and the frame targets in place, send a according to the settlement parameter, and the frame height is listened, sends out settlement length solder wire, withdraws unnecessary solder wire. The utility model discloses TO TO series's frame for the semiconductor, the device can realize a multiple spot tin.

The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same principle as the protection scope of the present invention.

Claims (3)

1. a double-point tin device for producing a semiconductor power device is characterized by comprising: the device comprises a base, a lifting mechanism, a controller, an XY adjusting platform and a spot tin module; the lifting mechanism comprises a cylinder fixing seat, a lifting cylinder, a lifting guide rail, a lifting plate, a lifting platform and a cylinder connecting block; the lifting guide rail is fixed on the other side of the base in the vertical direction, the lifting cylinder is fixed on the cylinder fixing seat, and a piston rod of the lifting cylinder is parallel to the lifting guide rail; the lifting guide rail is provided with a sliding block, the lifting plate is fixed on the sliding block, the cylinder connecting block is fixed on one side of the lifting plate corresponding to the lifting cylinder, and a piston rod of the lifting cylinder is fixedly connected with the cylinder connecting block; the lifting platform is fixed on the lifting plate, and the controller is integrated on the lifting platform; the tin dispensing module comprises a tin dispensing bottom plate, a supporting plate, a wire feeding bottom plate, a wire feeding vertical plate, a wire feeding frame, a wire passing frame, a stepping motor, a driving wheel, a driven wheel, a synchronous belt, a rotating shaft, a double grooved wheel, a wire guide frame, a tin dispensing head fixing seat and a tin dispensing head, wherein the supporting plate, the wire feeding frame, the wire passing frame, the double grooved wheel and the wire guide frame are respectively provided with a pair; the XY adjusting platform is arranged in the horizontal direction, the upper surface of the XY adjusting platform is fixedly connected with the lifting platform, the position, close to the rear end of the point tin bottom plate, of the upper surface of the point tin bottom plate is fixedly connected with the lower surface of the XY adjusting platform, and the point tin bottom plate is arranged horizontally; the two supporting plates are fixed on the upper surface of the tin dispensing bottom plate in the vertical direction, the wire feeding bottom plate is fixed at the top of the supporting plates, the wire feeding vertical plates and the wire passing frames are fixed on the upper surface of the wire feeding bottom plate, the two wire feeding frames are fixed on the wire feeding vertical plates, each wire passing frame corresponds to one wire feeding frame, the wire passing frames are rotatably provided with wire passing wheels, wire grooves are formed in the circumferential direction of the wire passing wheels, and the wire passing holes are formed in the positions, corresponding to the lower parts of the two wire passing wheels; the stepping motor is fixed on the tin dotting bottom plate below the wire feeding bottom plate; the rotating shaft is arranged on the two supporting plates through a bearing, the axis of the rotating shaft is positioned in the horizontal direction, and one end of the rotating shaft extends out of one supporting plate; the driven wheel is fixed at one end of the rotating shaft extending out of the supporting plate, the driving wheel is fixed on a main shaft of the stepping motor, the driving wheel and the driven wheel correspond to each other, and the driving wheel and the driven wheel are driven by the synchronous belt; the two double grooved pulleys are fixed on the rotating shaft between the two supporting plates, and each double grooved pulley is arranged corresponding to one wire passing hole; the two lead frames are fixed at the position, close to the front end of the tin dotting bottom plate, of the upper surface of the tin dotting bottom plate, a lead shaft is fixed on each lead frame, a lead wheel is arranged on each lead shaft, and each lead wheel is arranged corresponding to one double grooved wheel; the tin point fixing seat is fixed at a position, corresponding to the lower part of the double grooved pulley, of the lower surface of the tin point bottom plate through a connecting rod, and the tin point is fixed on the tin point fixing seat.

2. The double-dot tin device for producing the semiconductor power device according to claim 1, wherein: the controller is respectively connected with the lifting cylinder, the stepping motor, the XY adjusting platform and the tin point.

3. The double-dot tin device for producing the semiconductor power device according to claim 2, wherein: the tin point head is an air-cooled wire feeding head.