CN209729903U - A kind of LED filament - Google Patents
A kind of LED filament Download PDFInfo
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- CN209729903U CN209729903U CN201920923614.5U CN201920923614U CN209729903U CN 209729903 U CN209729903 U CN 209729903U CN 201920923614 U CN201920923614 U CN 201920923614U CN 209729903 U CN209729903 U CN 209729903U
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- glue
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- led filament
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Abstract
The utility model discloses a kind of LED filament, including substrate, the power supply terminal for being located at the substrate both ends, the luminescence chip for being located at the substrate front side, by the luminescence chip and the concatenated bonding wire of power supply terminal, it is characterized by: the substrate front side is coated with the inner glue layer for covering the luminescence chip, the outer glue-line for covering the inner glue layer is coated on the outside of the inner glue layer.The utility model is using the positive double-deck gluing process, one, the green light that green emitting phosphor issues largely is launched, and the excitation to red fluorescence powder is reduced, and the dosage of green emitting phosphor is reduced, luminous flux significantly improves, second, reducing double excitation, aobvious finger can be improved, the use for reducing long-wave band red fluorescence powder in this way reduces the production cost of LED filament.Compared with traditional filament, luminous flux, light efficiency and aobvious refer to of the utility model LED filament have greatly improved.
Description
Technical field
The utility model relates to LED technology field, especially a kind of LED filament.
Background technique
With the fast development of illuminating industry, LED filament is gradually exploited as the advantage of light source.It is many due to itself
Excellent characteristics makes it by favor, becomes the supreme arrogance of a person with great power for example, light efficiency is high, the service life is long, safe and reliable, environmental protection, energy conservation etc..By
In the restriction of oneself factor, the photoelectric properties of LED filament are difficult to take into account, and production cost is also higher compared to traditional light source.With
The development of lighting engineering, one side people the biological safety of light source, light quality, the comfort of light etc. are proposed
Higher requirement, it is endless, but these two aspects that another aspect people, which maximumlly pursue light-source brightness and light efficiency,
Mutually press down, improve the light quality and comfort of light source, the brightness of light source will be sacrificed, reduce the light efficiency of light source.How to solve
This problem improves performance, is the problem that illuminating industry needs to solve.
It is known that the principle of luminosity of LED filament is that the blue light that chip issues excites red green fluorescence powder respectively, feux rouges is generated
And green light, then with remaining blue light at white light.But the blue light that filament chip issues excites red green fluorescence powder mistake respectively
Cheng Zhong, the green light that red fluorescence powder can also be issued by green emitting phosphor excite, i.e., double excitation, reduce the blue light conversion of chip
Efficiency, to reduce the luminous efficiency of filament.On the other hand, the especially milky white ball bubble of the ball bubble of filament lamp, due to ball bubble
Blister can reflect a part of light, and green light meeting excitated red fluorescent powder therein reduces the luminous efficiency of filament again.
Utility model content
Technical problem to be solved by the utility model is: green light excites cause filament again in the luminescence process of LED filament
The low problem of luminous efficiency
The utility model solve the technical problem the technical solution adopted is that:
A kind of LED filament including substrate, is located at the power supply terminal at the substrate both ends, is located at the hair of the substrate front side
Optical chip, by the luminescence chip and the concatenated bonding wire of power supply terminal, it is characterised in that: the substrate front side is coated with described in covering
The inner glue layer of luminescence chip, the inner glue layer outside are coated with the outer glue-line for covering the inner glue layer.
Preferably, the inner glue layer is the red glue-line for mixing red fluorescence powder, the outer glue-line is that mixing green is glimmering
The green glue-line of light powder.
Preferably, the inner glue layer is the red glue-line for mixing red fluorescence powder, the outer glue-line is that mixing green is glimmering
The mixing glue-line one of light powder and red fluorescence powder.
Preferably, the substrate back is coated with reverse side glue-line.
Preferably, the reverse side glue-line is the green glue-line of mixed green color fluorescent powder.
Preferably, the reverse side glue-line is the mixing glue-line two of mixed green color fluorescent powder and red fluorescence powder.
The beneficial effects of the utility model are:
The utility model is using the positive double-deck gluing process, first, the green light that green emitting phosphor issues largely is sent out
It is shot out, reduces the excitation to red fluorescence powder, the dosage of green emitting phosphor is reduced, and luminous flux significantly improves, second, reducing
Double excitation can be improved aobvious finger, reduce the use of long-wave band red fluorescence powder in this way, reduces being produced into for LED filament
This.Compared with traditional filament, luminous flux, light efficiency and aobvious refer to of the utility model LED filament have greatly improved.
Detailed description of the invention
Fig. 1 is the utility model embodiment structural schematic diagram
Fig. 2 is the utility model embodiment diagrammatic cross-section
In figure: 1. substrates；2. power supply terminal；3. luminescence chip；4. bonding wire；5. inner glue layer；6. outer glue-line；7. reverse side glue
Layer.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below
Embodiment is not intended to limit the scope of the present invention for illustrating the utility model.
As shown in Figs. 1-2, a kind of LED filament including substrate 1, the power supply terminal 2 that is located at 1 both ends of substrate, is located at substrate 1
Positive multiple luminescence chips 3, by multiple luminescence chips 3 and the concatenated bonding wire 4 of power supply terminal 2,1 front of substrate is coated with covering hair
The inner glue layer 5 of optical chip 3 is coated with the outer glue-line 6 of covering inner glue layer 5 on the outside of inner glue layer 5, and 1 back side of substrate is coated with reverse side glue-line 7.
In the present embodiment, inner glue layer 5 is the red glue-line for mixing red fluorescence powder, and outer glue-line 6 is the green glue of mixed green color fluorescent powder
Layer, reverse side glue-line 7 is the green glue-line of mixed green color fluorescent powder.
In specific implementation, outer glue-line 6 is also possible to the mixing glue-line of mixed green color fluorescent powder and a small amount of red fluorescence powder
One, reverse side glue-line 7 is also possible to the mixing glue-line two of mixed green color fluorescent powder and red fluorescence powder.
The utility model can be changed for various ways it is apparent to one skilled in the art, it is such change not
Think to be detached from the scope of the utility model.All such obviously modify the field technical staff are included within this
Within the scope of the claims.
Claims (6)
1. a kind of LED filament, including substrate, the power supply terminal that is located at the substrate both ends, it is located at shining for the substrate front side
Chip, by the luminescence chip and the concatenated bonding wire of power supply terminal, it is characterised in that: the substrate front side is coated with the covering hair
The inner glue layer of optical chip, the inner glue layer outside are coated with the outer glue-line for covering the inner glue layer.
2. LED filament as described in claim 1, it is characterised in that: the inner glue layer is the red glue for mixing red fluorescence powder
Layer, the outer glue-line is the green glue-line of mixed green color fluorescent powder.
3. LED filament as described in claim 1, it is characterised in that: the inner glue layer is the red glue for mixing red fluorescence powder
Layer, the outer glue-line is the mixing glue-line one of mixed green color fluorescent powder and red fluorescence powder.
4. LED filament as described in claim 1, it is characterised in that: the substrate back is coated with reverse side glue-line.
5. LED filament as claimed in claim 4, it is characterised in that: the reverse side glue-line is the green of mixed green color fluorescent powder
Glue-line.
6. LED filament as claimed in claim 4, it is characterised in that: the reverse side glue-line is mixed green color fluorescent powder and red
The mixing glue-line two of fluorescent powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920923614.5U CN209729903U (en) | 2019-06-19 | 2019-06-19 | A kind of LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920923614.5U CN209729903U (en) | 2019-06-19 | 2019-06-19 | A kind of LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209729903U true CN209729903U (en) | 2019-12-03 |
Family
ID=68675456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920923614.5U Active CN209729903U (en) | 2019-06-19 | 2019-06-19 | A kind of LED filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209729903U (en) |
-
2019
- 2019-06-19 CN CN201920923614.5U patent/CN209729903U/en active Active
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