CN209707543U - The connection structure of ceramic carrier and microminiature multilayer chiop and circuit board - Google Patents
The connection structure of ceramic carrier and microminiature multilayer chiop and circuit board Download PDFInfo
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- CN209707543U CN209707543U CN201920103494.4U CN201920103494U CN209707543U CN 209707543 U CN209707543 U CN 209707543U CN 201920103494 U CN201920103494 U CN 201920103494U CN 209707543 U CN209707543 U CN 209707543U
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Abstract
The utility model discloses the connection structures of ceramic carrier and microminiature multilayer chiop and circuit board.Ceramic carrier is equipped with ceramic wafer, and array distribution has several jacks on ceramic wafer, each jack is penetrated through from one end of ceramic wafer toward other end straight line.The connection structure of microminiature multilayer chiop and circuit board is equipped with ceramic substrate, further includes having several groups spacing amplification module, be electrically connected by several copper wires between each group of spacing amplification module and ceramic substrate；If each group of spacing amplification module is equipped with dry plate spacing amplification module.Method are as follows: copper wire is connected between ceramic substrate and spacing amplification module, is put into and reprints on plate, take away and finished product is electroplated by production ceramic substrate.The utility model has structure simple, at low cost, and easy production is unlikely to deform, and installation is simple, can be used on the circuit board of more layers, can be tested for wafer, and the advantages of connection can be used as between wafer and circuit board.
Description
Technical field
The present invention relates to the connections of electronic technology field more particularly to ceramic carrier and microminiature multilayer chiop and circuit board
Structure.
Background technique
Traditional technology has the following problems:
1, support plate is easily deformed, unstable；
2, welding process trouble, is difficult to weld, because more small intensive；It is not achieved more if using welding technique
The design of multilayer circuit board；
3, have in terms of the circuit board for being connected to more complicated multilayer between the test or wafer and circuit board of wafer
Wait improve；
4, all more troublesome complexity of entire method process, mass ratio is more unstable, can not accomplish the circuit board of more layers
Upper application, therefore can not meet international high-end market.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide ceramic carrier, microminiature multilayer
The connection structure of chip and circuit board, it is simple with structure, it is at low cost, it is easy production, is unlikely to deform, installation is simple, can
It for the circuit board of more layers, can be tested for wafer, the longevity can be used between wafer and circuit board as connection
Order long advantage.
The technical scheme adopted by the invention is that:
Ceramic carrier is equipped with ceramic wafer, and array distribution has several jacks on ceramic wafer, each jack is from ceramic wafer
One end toward other end straight line penetrate through.
Further, several fixation holes are distributed in the edge circumference array of ceramic wafer, and it is heavy that the upper end of each fixation hole is equipped with
Hole, the lower end in each hole are equipped with annular flange, and annular flange surrounds fixation hole.
Further, the centre of the ceramic wafer is equipped with receptacle area, and receptacle area is square, if receptacle area edge is equipped with
The slot of dry array distribution.
Ceramic wafer lower end is equipped with pcb board and the conducting resinl between pcb board and ceramic wafer；Pcb board corresponds to jack and is equipped with
Second electric conductor is equipped with the first electric conductor in jack；When ceramic wafer and pcb board are squeezed toward conducting resinl, the first electric conductor and the
Two electric conductors are electrically connected；Inside conducting resinl and it is set between the first electric conductor and the second electric conductor equipped with metallic particles.
The connection structure of microminiature multilayer chiop and circuit board is equipped with the ceramic wafer, further includes having several groups
Spacing amplification module is electrically connected by several copper wires between each group of spacing amplification module and ceramic wafer；Each group of spacing
If amplification module is equipped with dry plate spacing amplification module, each piece of spacing amplification module includes that substrate, several array distributions exist
Conductor on substrate, set on substrate one end and the input plug that is electrically connected with conductor and be set to the substrate other end and with conductor electricity
Property connection output plug；Each input plug is equipped with several first contact points to distribute alternately, each output plug
Several the second contact points to distribute alternately are equipped with, the both ends of each conductor are separately connected a first contact point and one
Two contact points；Spacing between two neighboring first contact point is less than the spacing between two neighboring second contact point；Ceramic base
One end of plate is electrically connected by copper wire and spacing amplification module, and the other end of ceramic substrate forms the contact for contacting wafer
End face, output plug set by each spacing amplification module are respectively formed amplification end.
Method is used for the connection knot of the ceramic substrate production microminiature multilayer chiop and circuit board
Structure comprising following steps:
S1, several jacks are formed on ceramic wafer, ceramic carrier is made；
S2, ceramic substrate is prevented on the first mold, is connected several spacing amplification modules using copper wire, be made
The semi-finished product of the connection structure of microminiature multilayer chiop and circuit board；
S3, by the semi-finished product of the connection structure of microminiature multilayer chiop and circuit board, be placed into and reprint on plate,
S4, the reprinting plate for being equipped with semi-finished product is placed on the second mold；
S5, plating that the second mold is taken away.
Copper post can be plugged in each jack.
The reprinting plate include reprint plate, set on reprint plate wherein the groove of an end face central location, two be set to groove
Internal first fixation hole, two the second fixation holes for being set to inside grooves and several be set to reprint edges of boards edge first through hole；Two
First fixed matrix part alternate with two the second fixation holes in inside grooves, each first fixation hole and each second consolidate
The end face for determining the equal rotation support plate in hole is penetrated through toward the other end for reprinting plate；The reprinting plate is transparent turn made of plastic material
Support plate；The reprinting plate is in round pie, and the reprinting plate is that plate is reprinted made of acrylic material；The hole of first fixation hole
Aperture of the diameter less than the second fixation hole.
Further, second mold includes:
Pedestal；
Slide rail, lower end are fixedly mounted on pedestal upper surface, up extend from pedestal upper surface；
Fixed platform, lower end are fixedly mounted on the upper surface of slide rail, and end face is equipped with four rectangle permutations point thereon
The screw fixing hole of cloth；
Height-adjustable support rim, is serially connected on slide rail among it, is set between fixed platform and pedestal,
It is fixedly mounted on slide rail by the 4th screw；
Movable platform is serially connected on slide rail among it, surrounds what slide rail circumference array was distributed equipped with several
Support claw is fixedly mounted on slide rail by the second bolt.
Further, first mold includes:
Second base；
Several support rods, all support rod array distributions are fixed in second base upper surface, one end of each support rod
It is mounted on second base upper surface, and the other end of the support rod is set to second base upper end；
Platform board is fixedly connected with the upper end of all support rods, and several be equipped with cooperates the first of fixed workpiece among it
Hole, intermediate position are to be equipped with several notches around all first holes；
Upright bar is set between platform board and second base and is surrounded by all support rods, and lower end and second base are solid
Fixed connection, the upper end are set to below platform board；
Supporting table is set to below platform board, and lower end is fixedly connected with the upper end of upright bar.
The present invention has structure simple, at low cost, is easy production, is unlikely to deform, and installation is simple, can be used in more layers
On circuit board, it can be tested for wafer, it can be for wafer and circuit board between as connecting, the advantages of long service life.
Detailed description of the invention
Fig. 1 is the principle schematic diagram one of ceramic substrate in the present invention, the schematic diagram of the visual observation of vertical view；
Fig. 2 is the principle schematic diagram two of ceramic substrate in the present invention, the vision schematic diagram of cutting；
Fig. 3 is the principle schematic diagram three of ceramic substrate in the present invention, is inserted with the cutting signal of copper post；
Fig. 4 is the principle schematic diagram four of ceramic substrate in the present invention, the cutting signal of copper post protrusion；
Fig. 5 is the principle schematic diagram five of ceramic substrate in the present invention, illustrates counterbore；
Fig. 6 is the principle schematic diagram six of ceramic substrate in the present invention, is illustrated with slotted vertical view；
Fig. 7 is the principle schematic diagram seven of ceramic substrate in the present invention, is installed to circuit board, and intermediate equipped with conducting resinl
Cutting signal；
Fig. 8 is that conducting resinl receives the cut-away illustration for squeezing and being powered in the present invention；
Fig. 9 is the schematic illustration of connection structure of the present invention
Figure 10 is the tool schematic diagram successively used in method and step in the present invention.
Figure 11 is the principle schematic diagram of transfer support plate of the present invention；
Figure 12 is the principle schematic diagram of the second mold in the present invention；
Figure 13 is the principle schematic diagram of the first mold in the present invention；
Figure 14 is the principle schematic diagram of platform board in the present invention；
Figure 15 is the first principles of die structure schematic diagram disassembled after platform in the present invention；
Figure 16 is the cutting principle schematic diagram of support rod in the present invention；
Figure 17 is the cutting principle schematic diagram of supporting table in the present invention；
Figure 18 is the principle schematic diagram of second base in the present invention.
Specific embodiment
As shown in Fig. 1 to Figure 18, ceramic carrier E in the present invention is equipped with ceramic wafer E1, array distribution on ceramic wafer E1
There are several jack E11, each jack E11 to penetrate through from one end of ceramic wafer E1 toward other end straight line.
The edge circumference array of ceramic wafer E1 is distributed with several, the upper end of each fixation hole E15 is equipped with counterbore E12, often
The lower end in one hole is equipped with annular flange E13, and annular flange E13 surrounds fixation hole E15.
The centre of the ceramic wafer E1 is equipped with the region jack E11, and the region jack E11 is square, jack E11 edges of regions
Slot E14 equipped with several array distributions.
The lower end ceramic wafer E1 is equipped with the pcb board E17 and conducting resinl E16 between pcb board E17 and ceramic wafer E1；Pcb board
E17 corresponds to jack E11 and is equipped with the second electric conductor E171, is equipped with metallic particles E161 in jack E11；Ceramic wafer E1 and pcb board E17
When squeezing toward conducting resinl E16, metallic particles E161 and the second electric conductor E171 are electrically connected；Inside conducting resinl E16 and it is set to
Metallic particles is equipped between metallic particles E161 and the second electric conductor E171.
The connection structure D of microminiature multilayer chiop and circuit board, be equipped with the ceramic wafer E, further include have it is several
Group spacing amplification module D6, is electrically connected by several copper wire D1 between each group of spacing amplification module D6 and ceramic wafer；Often
If one group of spacing amplification module D6 is equipped with dry plate spacing amplification module D6, each piece of spacing amplification module D6 includes substrate
The conductor D4 of D3, several array distributions on substrate D 3, the input plug set on 3 one end of substrate D and with conductor D4 electric connection
D2 and set on 3 other end of substrate D and with conductor D4 be electrically connected output plug D5；If each input plug D2 is equipped with
The dry first contact point D21 to distribute alternately, each output plug D5 are equipped with several the second contact point D51 to distribute alternately,
The both ends of each conductor D4 are separately connected a first contact point D21 and a second contact point D51；Two neighboring first connects
Spacing between the D21 of contact is less than the spacing between two neighboring second contact point D51；One end of ceramic substrate D3 passes through copper
Silk D1 and spacing amplification module D6 is electrically connected, and the other end of ceramic substrate D3 forms the contact face for contacting wafer, often
Output plug D5 set by one spacing amplification module D6 is respectively formed amplification end.
Method is used for the connection knot of the ceramic substrate D3 production microminiature multilayer chiop and circuit board
Structure comprising following steps:
S1, several jack E11 are formed on ceramic wafer E1, ceramic carrier D3 is made；
S2, ceramic substrate D3 is prevented on the first mold A, is connected several spacing amplification module D6 using copper wire D1
Come, the semi-finished product of the connection structure of microminiature multilayer chiop and circuit board are made；
S3, by the semi-finished product of the connection structure of microminiature multilayer chiop and circuit board, be placed into and reprint on plate B,
S4, the reprinting plate B for being equipped with semi-finished product is placed on the second mold C；
S5, plating that the second mold C takes away.
Copper post E2 can be plugged in each jack E11.
The reprinting plate B include reprint plate B, set on reprint plate B wherein the groove B1 of an end face central location, two set
The first fixation hole B2, two the second fixation hole B3 being set to inside groove B1 and several be set to reprint the side plate B inside groove B1
Edge first through hole；Two first fixations matrix part alternate with two the second fixation hole B3 is inside groove B1, each first
An end face of fixation hole B2 and each equal rotation support plate B of the second fixation hole B3 is penetrated through toward the other end for reprinting plate B；It is described
Reprinting plate B is transparent reprinting plate B made of plastic material；The reprinting plate B is in round pie, and the reprinting plate B is acrylic material
Plate B is reprinted made of material；Aperture of the aperture of the first fixation hole B2 less than the second fixation hole B3.
The second mold C includes:
Pedestal C1；
Slide rail C2, lower end are fixedly mounted on the upper surface pedestal C1, up extend from the upper surface pedestal C1；
Screw fixing hole C31, lower end are fixedly mounted on the upper surface of slide rail C2, and end face is equipped with four rectangles thereon
The screw fixing hole E15 of permutation distribution；
Height-adjustable support rim C4, is serially connected among it on slide rail C2, be set to screw fixing hole C31 with
Between pedestal C1, it is fixedly mounted on slide rail C2 by the 4th screw；
Movable platform C5 is serially connected among it on slide rail C2, is equipped with several around slide rail C2 circumference array
The support claw C51 of distribution is fixedly mounted on slide rail C2 by the second bolt C52.
The first mold A includes:
Second base A1；
Several support rod A2, all support rod A2 array distributions in the upper surface second base A1, each support rod A2's
One end is fixedly mounted on the upper surface second base A1, and the other end of the support rod A2 is set to the upper end second base A1；
Platform board A3 is fixedly connected with the upper end of all support rod A2, and several be equipped with cooperates fixed workpiece among it
First hole A35, intermediate position are to be equipped with several notch A32 around all first hole A35；
Upright bar A4 is set between platform board A3 and second base C1 and by all support rod A2 and surrounds, lower end and the
Two pedestal A1 are fixedly connected, and the upper end is set to below platform board A3；
Supporting table A5 is set to below platform board A3, and lower end is fixedly connected with the upper end of upright bar.
The present invention has structure simple, at low cost, is easy production, is unlikely to deform, and installation is simple, can be used in more layers
On circuit board, it can be tested for wafer, it can be for wafer and circuit board between as connecting, the advantages of long service life.
Claims (5)
1. ceramic carrier, it is characterised in that: it is equipped with ceramic wafer, and array distribution has several jacks on ceramic wafer, each jack
Penetrated through from one end of ceramic wafer toward other end straight line.
2. ceramic carrier according to claim 1, it is characterised in that: if the edge circumference array of ceramic wafer be distributed with it is solid
Determine hole, the upper end of each fixation hole is equipped with counterbore, and the lower end in each hole is equipped with annular flange, and annular flange is around solid
Determine hole.
3. ceramic carrier according to claim 2, it is characterised in that: the centre of the ceramic wafer is equipped with receptacle area, inserts
Bore region is square, and receptacle area edge is equipped with the slot of several array distributions.
4. ceramic carrier according to claim 1, it is characterised in that: ceramic wafer lower end be equipped with pcb board and be set to pcb board with
Conducting resinl between ceramic wafer；Pcb board corresponds to jack and is equipped with the second electric conductor, is equipped with the first electric conductor in jack；Ceramic wafer with
When pcb board is squeezed toward conducting resinl, the first electric conductor and the second electric conductor are electrically connected；Inside conducting resinl and it is set to the first conduction
Metallic particles is equipped between body and the second electric conductor.
5. the connection structure of microminiature multilayer chiop and circuit board is equipped with the ceramics as described in claims 1 to 3 any one
Support plate, it is characterised in that: it further includes having several groups spacing amplification module, between each group of spacing amplification module and ceramic wafer
It is electrically connected by several copper wires；If each group of spacing amplification module is equipped with dry plate spacing amplification module, each piece of spacing is put
Big module include conductor on substrate of substrate, several array distributions, be electrically connected set on substrate one end and with conductor it is defeated
Enter plug and the output plug set on the substrate other end and with conductor electric connection；Each input plug is equipped with several alternate
The first contact point of distribution, each output plug are equipped with several the second contact points to distribute alternately, the both ends of each conductor
It is separately connected a first contact point and second contact point；Spacing between two neighboring first contact point is less than adjacent
Spacing between two the second contact points；One end of ceramic substrate is electrically connected by copper wire and spacing amplification module, ceramic base
The other end of plate forms the contact face for contacting wafer, and output plug set by each spacing amplification module, which is respectively formed, to be put
Big end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920103494.4U CN209707543U (en) | 2019-01-22 | 2019-01-22 | The connection structure of ceramic carrier and microminiature multilayer chiop and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920103494.4U CN209707543U (en) | 2019-01-22 | 2019-01-22 | The connection structure of ceramic carrier and microminiature multilayer chiop and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209707543U true CN209707543U (en) | 2019-11-29 |
Family
ID=68640923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920103494.4U Active CN209707543U (en) | 2019-01-22 | 2019-01-22 | The connection structure of ceramic carrier and microminiature multilayer chiop and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209707543U (en) |
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2019
- 2019-01-22 CN CN201920103494.4U patent/CN209707543U/en active Active
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| CP01 | Change in the name or title of a patent holder |
Address after: No.28, Xinqing 2nd Road, Jingan Town, Doumen District, Zhuhai City, Guangdong Province 519000 Patentee after: Zero one electronics (Zhuhai) Co.,Ltd. Address before: No.28, Xinqing 2nd Road, Jingan Town, Doumen District, Zhuhai City, Guangdong Province 519000 Patentee before: CORAD ELECTRONIC TECHNOLOGY (ZHUHAI) CO.,LTD. |