CN209706766U - Inverse Hartmann's optical path wafer surface roughness measuring device - Google Patents
Inverse Hartmann's optical path wafer surface roughness measuring device Download PDFInfo
- Publication number
- CN209706766U CN209706766U CN201920846630.9U CN201920846630U CN209706766U CN 209706766 U CN209706766 U CN 209706766U CN 201920846630 U CN201920846630 U CN 201920846630U CN 209706766 U CN209706766 U CN 209706766U
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- CN
- China
- Prior art keywords
- optical path
- lcd display
- hartmann
- surface roughness
- wafer surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Length Measuring Devices By Optical Means (AREA)
Abstract
The utility model relates to inverse Hartmann's optical path wafer surface roughness measuring devices.LCD display in the utility model is fixed on bottom of device, total reflection mirror and spectroscope are fixed at sustained height, and it is located at the surface of LCD display and tested wafer, LCD display shows that the stripe pattern encoded through light intensity, the Image Acquisition of preposition aperture CMOS camera are controlled by computer, and image procossing and error compensation are realized by computer.
Description
Technical field
The utility model belongs to field of measuring technique, is related to a kind of wafer surface roughness survey based on inverse Hartmann's optical path
Measure device.It is mainly used for the measurement work of wafer surface roughness.
Background technique
With the rapid development of information technology, semiconductor element demand is continuously increased, type to semiconductor element and
More stringent requirements are proposed for function.The quality of raw material of the wafer as manufacture semiconductor integrated circuit, surface roughness is straight
It connects and affects semiconductor product quality.
There is device complexity in existing wafer surface roughness measurement method, furthermore mechanical probes method easy damaged
Measured surface；Microscopic method and laser interferance method are with high costs.Therefore, lacking for these wafer surface roughness measuring devices is made up
It falls into, it appears most important.
Summary of the invention
The utility model in view of the deficiencies of the prior art, proposes that a kind of precision is high, at low cost, apparatus structure is simply surveyed
Measure device.
The utility model includes LCD display, total reflection mirror, spectroscope, microlens, preposition aperture CMOS camera and meter
Calculation machine.
The LCD display shows the light and shade striped encoded through light intensity.
It is projected after the striped light beam of the total reflection mirror reflective LCD display screen projection to spectroscope.
It is projected after the spectroscope reflection strip light beam to microlens.
The microlens is projected to tested crystal column surface after assembling striped light beam.
The preposition aperture CMOS camera receives the striped light beam after being reflected by crystal column surface.
The computer control LCD display and preposition aperture CMOS camera, pass through Image Acquisition, image procossing and mistake
Difference compensation, realizes high-acruracy survey function.
The utility model has the beneficial effects that:
1, the preposition aperture of CMOS camera can filter out veiling glare, avoid interference of the ambient to CMOS camera.
2, by error compensation system, influence of the systematic error to measurement result can be eliminated, improves measurement accuracy.
Detailed description of the invention
Fig. 1 is the device light path schematic diagram of the utility model.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawing.
As shown in Figure 1, measuring device optical routing LCD display 1 in the present embodiment, total reflection mirror 2, spectroscope 3, micro-
Mirror 4, tested wafer 5, preposition aperture CMOS camera 6 and computer 7 form.
The course of work of the utility model:
In wafer surface roughness measurement work, using inverse Hartmann's optical path.It is measured in inverse Hartmann's optical path
Point on crystal column surface is incident upon the magazine hot spot coordinate value of preposition aperture CMOS, while being obtained pair by optical path-tracing model
Answer the ideal hot spot coordinate value of position.Calculating is finally compared, wafer surface roughness is obtained.
Measuring process is as follows:
1, LCD display is controlled by computer and generates the light and shade striped encoded through light intensity, fringe light is anti-through total reflection mirror
Rear optical path is penetrated to change；
2, reflection strip light changes optical path again after spectroscope reflects, and amplifies after projecting microlens.
3, amplified fringe light deforms after tested crystal column surface reflection, and is connect by preposition aperture CMOS camera
It receives.
4, the ideal hot spot coordinate value of corresponding position is obtained according to optical ray trace model.
5, actual facula coordinate and ideal hot spot coordinate value are compared, and the surface of tested crystal column surface is calculated
Roughness.
Claims (2)
1. against Hartmann's optical path wafer surface roughness measuring device, including it is LCD display, total reflection mirror, spectroscope, micro-
Mirror, preposition aperture CMOS camera and computer, it is characterised in that:
The LCD display shows the light and shade striped encoded through light intensity,
It is projected after the striped light beam of the total reflection mirror reflective LCD display screen projection to spectroscope,
It is projected after the spectroscope reflection strip light beam to microlens,
The microlens is projected to tested crystal column surface after assembling striped light beam,
The preposition aperture CMOS camera receives the striped light beam after being reflected by crystal column surface,
The computer control LCD display and preposition aperture CMOS camera, are mended by Image Acquisition, image procossing and error
It repays, realizes high-acruracy survey function.
2. inverse Hartmann's optical path wafer surface roughness measuring device according to claim 1, it is characterised in that:
Wafer surface roughness optical path uses inverse Hartmann's optical path,
Computer uses error compensation system, realizes high-acruracy survey.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920846630.9U CN209706766U (en) | 2019-06-06 | 2019-06-06 | Inverse Hartmann's optical path wafer surface roughness measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920846630.9U CN209706766U (en) | 2019-06-06 | 2019-06-06 | Inverse Hartmann's optical path wafer surface roughness measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209706766U true CN209706766U (en) | 2019-11-29 |
Family
ID=68650409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920846630.9U Expired - Fee Related CN209706766U (en) | 2019-06-06 | 2019-06-06 | Inverse Hartmann's optical path wafer surface roughness measuring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209706766U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111273466A (en) * | 2020-01-20 | 2020-06-12 | 凌云光技术集团有限责任公司 | Display screen surface defect detecting system |
| CN115930850A (en) * | 2023-02-06 | 2023-04-07 | 宜科(天津)电子有限公司 | Data processing system for detecting surface roughness of object |
-
2019
- 2019-06-06 CN CN201920846630.9U patent/CN209706766U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111273466A (en) * | 2020-01-20 | 2020-06-12 | 凌云光技术集团有限责任公司 | Display screen surface defect detecting system |
| CN111273466B (en) * | 2020-01-20 | 2022-06-17 | 凌云光技术股份有限公司 | Display screen surface defect detecting system |
| CN115930850A (en) * | 2023-02-06 | 2023-04-07 | 宜科(天津)电子有限公司 | Data processing system for detecting surface roughness of object |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191129 Termination date: 20200606 |
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| CF01 | Termination of patent right due to non-payment of annual fee |