CN209659712U

CN209659712U - A kind of finned radiator

Info

Publication number: CN209659712U
Application number: CN201920065918.2U
Authority: CN
Inventors: 汤俊; 隋晓勇
Original assignee: Beijing Ziyu Weiye Electronic Technology Co Ltd
Current assignee: Beijing Ziyu Weiye Electronic Technology Co Ltd
Priority date: 2019-01-15
Filing date: 2019-01-15
Publication date: 2019-11-19
Anticipated expiration: 2029-01-15

Abstract

The utility model provides a kind of finned radiator, it is characterized by comprising: substrate (1) and fin (2), fin (2) setting is on the substrate, and the fin (2) is multiple, and be arranged with being spaced pre-determined distance between two adjacent fins (2), so that forming heat exchanging air duct between the adjacent fin (2).It enables to air-flow to pass through by the utility model to be flowed through in the heat exchanging air duct formed between adjacent fin to effectively improve the heat exchange efficiency of fin type heat exchanger, therefore the fin thickness of circuit board can be done in the case where heat exchange amount is equivalent relatively small, so that the weight of radiator becomes relatively light, whole cabinet weight (cabinets of especially more plates) will not excessively be increased after being installed into cabinet, carrying portable is convenient.

Description

A kind of finned radiator

Technical field

The utility model belongs to the device cooling techniques such as electronic circuit board euthermic chip field, and in particular to a kind of fin type Radiator.

Background technique

Existing CPCI and VPX heat dissipation for circuit board device is all made of unitary block of aluminum base Milling Process, and then nigrescence oxygen is done on surface Change or yellow green aoxidizes；Because Milling Process technique is limited, otherwise processing residual thickness will appear deformation, stick up it is not possible that very little Phenomena such as bent, so existing circuit board cooling fin thickness is big (1-2mm), heatsink weight is big, be installed into after cabinet increase it is whole Portion's cabinet weight (cabinets of especially more plates) carries laborious.

Since there are heat dissipation for circuit board for heat dissipation for circuit board device in the prior art especially CPCI and VPX heat dissipation for circuit board device Piece thickness is big (1-2mm), and heatsink weight weight increases whole cabinet weight (cabinets of especially more plates) after being installed into cabinet, The technical problems such as laborious are carried, therefore the utility model researching and designing goes out a kind of finned radiator.

Utility model content

The technical problem to be solved by the present invention is to overcome heat dissipation for circuit board device in the prior art, there are cooling fins Thickness is big, the defect of heatsink weight again etc., to provide a kind of finned radiator.

The utility model provides a kind of finned radiator comprising:

Substrate and fin, on the substrate, and the fin is multiple, and two adjacent fins for fin setting Pre-determined distance is spaced between piece it is arranged, so that forming heat exchanging air duct between the adjacent fin.

Preferably,

The fin connects on the substrate by welding.

Preferably,

The top of multiple fins forms fins group by crimping connection.

Preferably,

The material of the substrate is aluminium, and the material of the fin is also aluminium.

Preferably,

The material of the substrate is aluminium 1060, and the material of the fin is aluminum 1100.

Preferably,

The fin is the aluminium flake of thickness 0.4mm, and the spacing between the two adjacent aluminium flakes is 2mm.

Preferably,

It is additionally provided with heat pipe in the bottom of the substrate, the heat pipe and the fin are separately positioned on the two of the substrate On a opposite surface.

Preferably,

The outer diameter of the heat pipe is φ 4mm.

Preferably,

The finned radiator can be used in radiating to CPCI and VPX circuit board.

Preferably,

The outer surface of the substrate and the fin carries out Nickel Plating Treatment.

A kind of finned radiator provided by the utility model has the following beneficial effects:

The utility model is by way of setting finned radiator to including substrate and fin combines, and fin is Multiple and two neighboring fin separation pre-determined distance setting, so that forming heat exchanging air duct between adjacent fin, enables to air-flow By flowing through to effectively improve the heat exchange efficiency of fin type heat exchanger between adjacent fin in the heat exchanging air duct that is formed, therefore The fin thickness of circuit board can be done in the case where heat exchange amount is equivalent it is relatively small so that the weight of radiator becomes It is relatively light, it will not excessively increase whole cabinet weight (cabinets of especially more plates) after being installed into cabinet, carrying portable is convenient.

Detailed description of the invention

Fig. 1 is the finned radiator of the utility model from the structural schematic diagram in terms of top surface；

Fig. 2 is the finned radiator of the utility model from the structural schematic diagram in terms of bottom surface；

Fig. 3 is structural schematic diagram of the finned radiator of the utility model when circuit board combines.

Appended drawing reference indicates in figure are as follows:

1, substrate；2, fin；3, heat pipe；4, circuit board.

Specific embodiment

As shown in Figure 1-3, the utility model provides a kind of finned radiator comprising:

Substrate 1 and fin 2, on the substrate, and the fin 2 is multiple, and two adjacent institutes for the fin 2 setting It states and is arranged with being spaced pre-determined distance between fin 2, so that forming heat exchanging air duct between the adjacent fin 2.

Preferably,

The fin 2 is connected to by welding on the substrate 1.This be the utility model fin and substrate it Between preferably connect mode, enable to fin to be firmly attached on substrate by welding, realize heat exchange heat transfer Effect.

Preferably,

The top of multiple fins 2 forms fins group by crimping connection.This is further between multiple fins It is preferably interconnecting mode, if being since single fin may can deform during collision, friction etc. at top Such case is avoided, fins group is formed using the technology mode crimped at the top of multiple fins, so that fins group connects It connects securely without deforming.

Preferably,

The material of the substrate 1 is aluminium, and the material of the fin 2 is also aluminium.This is the substrate and fin of the utility model Preferred material, weight can be effectively reduced by being chosen to aluminium, and also improve or keep original heat dissipation effect.

Preferably,

The material of the substrate 1 is aluminium 1060, and the material of the fin 2 is aluminum 1100.This is the substrate of the utility model With the further preferred material category of fin.1000 series belong to a most series of aluminum content in all series.Purity It can achieve 99.00% or more.Due to not containing other technologies element, so production process is relatively simple, price is relatively Cheaply；1060 aluminium sheets are formed to add a small amount of copper in fine aluminium, and aluminum content reaches 99.6% and is otherwise known as pure aluminum plate, in aluminium Belong to a common series in strip family.

Preferably,

The fin 2 is the aluminium flake of thickness 0.4mm, and the spacing between the two adjacent aluminium flakes is 2mm.It is such Size and spacing can further increase the heat transfer effect between fin and air, and save material, save space.

Preferably,

It is additionally provided with heat pipe 3 in the bottom of the substrate 1, the heat pipe 3 is separately positioned on the substrate with the fin 2 On 1 two opposite surfaces.By the setting of heat pipe, so that the heat exchange efficiency of circuit board further improves greatly, aluminium base The embedded φ 4mm heat pipe in board bottom portion, in the big chip of heating power or device top, the heat transfer coefficient of heat pipe is up to 3000- 10000W/m²K, the heat sink top of bulk substrate that heat consumption soon can be transmitted to radiator from chip or device upper surface and Heat is swapped out by fin, the flake structure large increase of fin heat dissipation area, the heat exchanging air duct between fin quickly；It should Silver color is presented in finned radiator outer surface Nickel Plating Treatment, appearance；The finned radiator is due to light-weight, so putting into cabinet Afterwards, make cabinet weight not and will increase too many, the cabinet of especially more plates, consequently facilitating carrying.

Preferably,

The outer diameter of the heat pipe 3 is φ 4mm.This is the preferred size of the heat pipe of the utility model, can be further increased Exchange heat the effect conducted heat.

Preferably,

The finned radiator can be used in radiating to CPCI and VPX circuit board.This kind of fin type substrate bottom surface Embedding heat-pipe radiator with the chip of CPCI and VPX circuit board and device heat dissipation on, can be especially for CPCI and VPX circuit board It radiates, improves heat dissipation effect.

Preferably,

The outer surface of the substrate 1 and the fin 2 carries out Nickel Plating Treatment.

The main purpose of the utility model is to provide a kind of radiator for CPCI and VPX circuit board, design principles Be: both increasing heat radiation areas improve radiating efficiency, and Weight control are obtained smaller.

The utility model uses fin type structure, and fin material is the aluminum 1100 of thickness 0.4mm, and aluminium base plate material is aluminium 1060, aluminum substrate bottom surface corresponding position is embedded in heat pipe；Weight is 0.413Kg, size (long x wide x high): 227x133x16 (mm)； The embedded φ 4mm heat pipe of base plate bottom, is in the maximum chip of heating power or device top, and the heat transfer coefficient of heat pipe is up to 3000-10000W/m²K, the bulk substrate that heat consumption soon can be transmitted to radiator from chip or device upper surface is heat sink Top and fin, the flake structure large increase of fin heat dissipation area, the heat exchanging air duct between fin exchange heat quickly It goes out.

The radiator can realize very high radiating efficiency with lesser weight and volume.

(i), very big reduction product weight

The radiator is baseplate material with aluminium alloy 1060；Fin uses aluminum 1100, and every only 0.4mm is thick, between air duct Every 2mm, whole heatsink weight only has 0.413Kg；

(ii), manufacturing cost is low

The radiator largely uses standard model part, the integrated height of structure, and the embedding heat pipe of substrate uses standard φ 4mm heat pipe, Fin is welded on substrate using standard 0.4mm thickness aluminium flake interval 2mm；Fin top surface uses compression joint technique mode, makes fin Group is connected firmly indeformable；

(iii), large increase radiating efficiency

The embedded φ 4mm heat pipe of base plate bottom, is in the maximum chip of heating power or device top, the heat transfer system of heat pipe Number is high, the heat sink top of bulk substrate that heat consumption soon can be transmitted to radiator from chip or device upper surface and fin, fin Heat is swapped out by the structure large increase of piece heat dissipation area, the heat exchanging air duct between fin quickly.

Fin 2 is welded on substrate 1 using the aluminium flake interval 2mm of standard 0.4mm thickness；2 top surface of fin is using crimping work Skill mode makes fins group be connected firmly indeformable；2 material of fin is aluminum 1100, and 1 material of substrate is aluminium 1060,1 bottom surface phase of substrate Position is answered to be embedded in heat pipe 3；Heatsink weight is 0.413Kg, size (long x wide x high): 227x133x16 (mm)；Base plate bottom is embedding 3 heat pipes of dress, are in the maximum chip of heating power or device top, and the heat transfer coefficient of heat pipe 3 is up to 3000-10000W/ m²Heat consumption can be soon transmitted to the heat sink top of bulk substrate 1 and the fin 2 of radiator by K from chip or device upper surface, Heat is swapped out by the flake structure large increase of fin 2 heat dissipation area, the heat exchanging air duct between fin 2 quickly.The fin Silver color is presented in gilled radiator outer surface Nickel Plating Treatment, appearance.

The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model Protection scope within.The above is only the preferred embodiment of the utility model, it is noted that for the art For those of ordinary skill, without deviating from the technical principle of the utility model, several improvements and modifications can also be made, These improvements and modifications also should be regarded as the protection scope of the utility model.

Claims

1. a kind of finned radiator, it is characterised in that: include:

Substrate (1) and fin (2), on the substrate, and the fin (2) is multiple, and two phases for the fin (2) setting It is arranged with being spaced pre-determined distance between the adjacent fin (2), so that forming heat exchanging air duct between the adjacent fin (2).

2. finned radiator according to claim 1, it is characterised in that:

The fin (2) is connected to by welding on the substrate (1).

3. finned radiator according to claim 1, it is characterised in that:

The top of multiple fins (2) forms fins group by crimping connection.

4. finned radiator according to claim 1, it is characterised in that:

The material of the substrate (1) is aluminium, and the material of the fin (2) is also aluminium.

5. finned radiator according to claim 4, it is characterised in that:

The material of the substrate (1) is aluminium 1060, and the material of the fin (2) is aluminum 1100.

6. finned radiator according to claim 4, it is characterised in that:

The fin (2) is the aluminium flake of thickness 0.4mm, and the spacing between the two adjacent aluminium flakes is 2mm.

7. finned radiator according to claim 1 to 6, it is characterised in that:

It is additionally provided with heat pipe (3) in the bottom of the substrate (1), the heat pipe (3) is separately positioned on described with the fin (2) On two opposite surfaces of substrate (1).

8. finned radiator according to claim 7, it is characterised in that:

The outer diameter of the heat pipe (3) is φ 4mm.

9. finned radiator according to claim 1 to 6, it is characterised in that:

The finned radiator can be used in radiating to CPCI and VPX circuit board.

10. finned radiator according to claim 1 to 6, it is characterised in that:

The outer surface of the substrate (1) and the fin (2) carries out Nickel Plating Treatment.