CN209629696U - A kind of heat dissipation probing shell, ultrasonic probe and ultrasonic face battle array probe - Google Patents
A kind of heat dissipation probing shell, ultrasonic probe and ultrasonic face battle array probe Download PDFInfo
- Publication number
- CN209629696U CN209629696U CN201821616958.3U CN201821616958U CN209629696U CN 209629696 U CN209629696 U CN 209629696U CN 201821616958 U CN201821616958 U CN 201821616958U CN 209629696 U CN209629696 U CN 209629696U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- layer
- probing shell
- heat
- internal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
The utility model provides a kind of heat dissipation probing shell, and energy converter is contained in heat dissipation probing shell, and heat dissipation probing shell includes internal layer and outer layer；Internal layer and outer layer are connected as one, and are made of different materials；The thermal coefficient of internal layer is higher than the thermal coefficient of outer layer.The utility model also provides a kind of ultrasonic probe, including energy converter and heat dissipation probing shell, energy converter are contained in the heat dissipation probing shell.The utility model also provides a kind of ultrasonic face battle array probe, including energy converter and heat dissipation probing shell, energy converter are contained in the heat dissipation probing shell.Heat dissipation probing shell, ultrasonic probe and ultrasonic face battle array provided by the invention are popped one's head in, and the heat that energy converter generates is conducted to shell internal layer, can be spread rapidly and be conducted to shell outer layer, be scattered outward by shell outer layer, improve the heat dissipation performance of probe.
Description
Technical field
The present invention relates to field of medical device, and in particular to a kind of heat dissipation probing shell, ultrasonic probe and ultrasonic face battle array are visited
Head.
Background technique
Ultrasonic probe is the important component of ultrasonic diagnostic imaging equipment, needs to realize electro-acoustic signal in the work course
Conversion, a large amount of heat can be generated in the conversion process of electro-acoustic signal, if generate heat cannot shed outward in time,
It will lead to the rising of probe temperature.On the one hand probe fever may influence whether the personal safety of patient, if on the other hand popping one's head in
Long-term work can accelerate the aging of probe in higher temperature, shorten probe service life.Therefore, effective heat dissipation of probe
It is particularly important.
Current ultrasonic probe shell is adopted made of plastic, is unfavorable for the heat that generates during the work time of probe to extending out
It dissipates, the temperature that will lead to probe is excessively high.
Summary of the invention
The present invention provides a kind of heat dissipation probing shell, ultrasonic probe and ultrasonic face battle array probe, to solve existing ultrasonic probe
The problem of heat dissipation performance difference.
The present invention provides a kind of heat dissipation probing shell, and energy converter is contained in heat dissipation probing shell, and radiate probing shell packet
Include internal layer and outer layer；Internal layer and outer layer are connected as one, and are made of different materials；The thermal coefficient of internal layer is higher than outer layer
Thermal coefficient.
The present invention also provides a kind of ultrasonic probes, including energy converter and heat dissipation probing shell, energy converter to be contained in described dissipate
In thermal probe shell.
The present invention also provides a kind of ultrasonic face battle array probes, including energy converter and heat dissipation probing shell, energy converter to be contained in institute
It states in heat dissipation probing shell.
Heat dissipation probing shell, ultrasonic probe and ultrasonic face battle array probe provided by the invention, shell inner layer material thermal coefficient
Higher than shell cladding material, the heat that energy converter generates is conducted to shell internal layer, can be spread rapidly and be conducted to shell outer layer,
It is scattered outward by shell outer layer, improves the heat dissipation performance of probe.
Detailed description of the invention
Fig. 1 is a kind of embodiment schematic diagram of ultrasonic probe；
Fig. 2 is a kind of partial schematic diagram of embodiment of heat dissipation probing shell；
Fig. 3 is a kind of partial schematic diagram of embodiment of heat dissipation probing shell.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.Further, since known function and construction can be retouched so that unnecessary details is fuzzy
It states, therefore is not described in detail them.
Fig. 1 and Fig. 2 are please referred to, the present embodiment provides a kind of heat dissipation probing shell 1, it is outer that energy converter 5 is contained in heat dissipation probe
In shell 1, heat dissipation probing shell 1 includes internal layer 3 and outer layer 2；Internal layer 3 and outer layer 2 are connected as one, and use different materials system
At the thermal coefficient of internal layer is higher than the thermal coefficient of outer layer.During energy converter 5 works, a large amount of heat can be generated, it should
Heat is conducted to probing shell inner surface, and is dispersed outward by probing shell.The probing shell 1 that radiates in the present embodiment includes interior
Layer 3 and outer layer 2,3 thermal coefficient of internal layer are higher than outer layer 2, so that the heat of conduction is rapidly spread inside internal layer 3, it is interior
Layer 3 conducts heat to outer layer 2, and passes through outer layer 2 to external diffusion.Since the thermal coefficient of internal layer 3 is high compared with outer layer 2, compared to
The heat distribution area of the structure of single layer outer probe, internal layer 3 is larger, and the area that 3 outer layers 2 of internal layer conduct heat is larger, makes
The area for obtaining the reception heat of outer layer 2 is larger, while the area to radiate outward is larger, and radiating efficiency improves.Meanwhile outer layer 2 is led
Hot coefficient is low compared with internal layer 3 so that outer layer 2 will not heat up it is too fast, user hold probe when will not be excessively high because of 2 temperature of outer layer
And it scalds one's hand.
A kind of heat dissipation probing shell embodiment, outer layer 2 and the attaching of internal layer 3 are integrated, and attaching refers to that outer layer 2 and internal layer 3 are close
It is combined as a whole, gap is not present in centre, and attaching can be to be bonded as one, or integrated molding is integrated or other
The implementation that outer layer 2 and internal layer 3 are combined closely can be reached.Outer layer 2 and the attaching of internal layer 3 are integrated, since two interlayers are not deposited
In gap, reduce during 3 heat outer layers 2 of internal layer are transmitted since air layer obstructs the efficiency for influencing heat and transmitting.
The outer surface of a kind of heat dissipation probing shell embodiment, internal layer 3 is equipped with combined hole, and the inner surface of outer layer 2 is equipped with
Lug boss, outer layer 2 invest 3 outer surface of internal layer, and the combination on lug boss insertion 3 outer surface of internal layer on 2 inner surface of outer layer
Hole；Alternatively, the outer surface of internal layer 3 is equipped with lug boss, the inner surface of outer layer 2 is equipped with combined hole, and outer layer 2 invests outside internal layer 3
Surface, and the combined hole of lug boss insertion 2 inner surface of outer layer of 3 outer surface of internal layer.The lug boss can be that spherical shape can also
Think other shapes, which can be round or other shapes for matching with lug boss, which can be with
For through-hole or blind hole.Internal layer 3 and outer layer 2 combine even closer and not easily to fall off by combined hole and lug boss, keep away
Exempt to form gap between internal layer 3 and outer layer 2, so that heat conduction efficiency is higher.
A kind of heat dissipation probing shell embodiment, the inner wall of combined hole and the outer wall of lug boss are equipped with thermal conductive material layer, or knot
The outer wall of the inner wall and lug boss that close hole is any to be equipped with thermal conductive material layer.Since thermal conductive material layer has good heating conduction,
Thermal conductive material layer can reinforce the heat conduction efficiency between combined hole and lug boss, so that the heat that energy converter 5 generates is to extending out
In scattered process, when heat is by will not influence the efficiency of heat transfer when the bound fraction of combined hole and lug boss.
A kind of heat dissipation probing shell embodiment, thermal conductive material layer use flexible graphite layer.The thermal conductive material layer is not limited to
Flexible graphite layer, or heat-conducting layer made of other thermal coefficients material high compared with 3 material of internal layer and 2 material of outer layer.
A kind of heat dissipation probing shell embodiment, outer layer 2 are made of plastic material.Outer layer 2 or other thermal coefficients
Material lower than internal layer 3 is made.
A kind of heat dissipation probing shell embodiment is first manufactured internal layer 3, then is manufactured outer layer on the basis of internal layer 3
2, being manufactured internal layer 3 can use technologies, the outer layers 2 such as die casting, CNC (computer numerical control technology), 3D printing can be in internal layer 3
Outer surface using the technologies such as injection molding, coating, 3D printing technique production shell molds outer layer 2 so that between internal layer 3 and outer layer 2
It is not easy to form assembly gap and influence to radiate.
A kind of heat dissipation probing shell embodiment, internal layer 3 are made of metal or graphite material.Internal layer 3 may be that other are led
The material that hot coefficient is higher than outer layer 2 is made.
Fig. 1 and Fig. 3 are please referred to, a kind of heat dissipation probing shell embodiment, heat dissipation probing shell 1 further includes heat-conducting layer 4, thermally conductive
Layer 4 is connected to the inner surface of internal layer 3, and the thermal coefficient of heat-conducting layer 4 is higher than the thermal coefficient of internal layer 3.Heat-conducting layer 4 can pass through glue
The mode of stickup is connect with 3 inner surface of internal layer, can also be placed on the inner surface of internal layer 3, or install by other means
In internal layer 3 inner surface and connect with the inner surface of internal layer 3, connection here can may be thermal coupling for physical connection.
The heat that heat-conducting layer 4 generates energy converter 5 is rapidly evenly distributed on heat-conducting layer 4, by heat-conducting layer 4 by heat
Inner layer 3 is conducted, and is conducted by 3 outer layers 2 of internal layer, since the thermal coefficient of heat-conducting layer 4 is higher than the thermal coefficient of internal layer 3,
The heat that energy converter 5 is generated faster is more equally distributed on heat-conducting layer, increases the area of conduction heat outward,
Improve the efficiency of heat dissipation.
A kind of heat dissipation probing shell embodiment, heat-conducting layer 4 are soft graphite film.Heat-conducting layer 4 or other thermally conductive systems
The material that number is higher than internal layer 3 is made.
A kind of heat dissipation probing shell embodiment, the wall thickness of outer layer 2 is less than or equal to 1 millimeter, in this kind of embodiment, internal layer 3
Wall thickness can be arbitrary value.Resistance to change layer and insulating layer of the outer layer 2 as heat dissipation probing shell 1, heating conduction is compared with internal layer 3
Difference, lesser wall thickness are conducive to conduction of the heat to outside probe.
A kind of heat dissipation probing shell embodiment, the wall thickness of internal layer 3 are greater than or equal to 0.5 millimeter and less than or equal to 3 millimeters,
In this kind of embodiment, the wall thickness of outer layer 2 can be arbitrary value.Internal layer 3 has biggish wall thickness to play heat dissipation probing shell 1
Structural support effect, meanwhile, biggish wall thickness make radiate probing shell 1 in the case where receiving identical heat temperature raising compared with
It is low.
Referring to FIG. 1, energy converter 5 is contained in heat dissipation probing shell 1, and heat dissipation is visited in a kind of embodiment of ultrasonic probe
Head shell 1 includes internal layer 3 and outer layer 2；Internal layer 3 and outer layer 2 are connected as one, and are made of different materials, and internal layer is led
Hot coefficient is higher than the thermal coefficient of outer layer.The ultrasonic wave for transmitting and receiving of energy converter 5, and ultrasonic signal and electric signal is mutual
Conversion, generally comprises (but being not limited to) matching layer, piezo-electric crystal and backing block.In other embodiments, heat dissipation probing shell 1 can also
Think any combination of other above-mentioned heat dissipation probing shell embodiments.
It further include thermally conductive sheet or heat-conducting block in a kind of embodiment of ultrasonic probe, thermally conductive sheet or heat-conducting block and energy converter heat
Coupling, and with heat dissipation probing shell inner surface thermal coupling.The case where thermal coupling can be physical connection not may be physically not
Connect the case where still heat can transmit between two components.Thermally conductive sheet or heat-conducting block heating conduction are good, can be rapidly
The heat that energy converter 5 generates is conducted to heat dissipation probing shell, and passes through heat dissipation probing shell to external diffusion.
In a kind of embodiment of ultrasonic probe, heat-conducting glue or phase transformation are filled between thermally conductive sheet or heat-conducting block and inner surface of outer cover
Material.Heat-conducting glue or phase-change material are filled in the gap between thermally conductive sheet or heat-conducting block and inner surface of outer cover, avoid the sky in gap
Vapour lock hinders heat to external diffusion.Heat-conducting glue has biggish thermal coefficient, will rapidly can absorb from thermally conductive sheet or heat-conducting block
Heat conduct the radiating efficiency that probe is improved to shell internal layer.It is solid-state that phase-change material, which refers under room temperature, when temperature rises to one
Become the material of liquid when definite value, and there is larger thermal capacitance.The heat of heat-conducting block or thermally conductive sheet conduction is absorbed in phase-change material
Amount, heats up and during the entire process of phase transformation, absorbs a large amount of heat, and temperature change is slow, and slowly by heat to shell
Conduction plays the role of radiating to energy converter.
As shown in Figure 1, in a kind of embodiment, ultrasonic probe includes thermally conductive sheet (not shown go out), define energy converter transmitting and
Receive ultrasonic wave is front surface on one side, and the side surface adjacent thereto for energy converter, thermally conductive sheet stretches out from inside to outside from energy converter, and
It is attached at 5 side surface of energy converter, is filled between thermally conductive sheet and heat-conducting layer 4 by heat-conducting glue 6, heat-conducting layer 4 is attached at table in internal layer 3
Face, internal layer 3 are attached at the inner surface of outer layer 2.The heat that energy converter 5 generates is exported by thermally conductive sheet, and is conducted by heat-conducting glue 6
It is conducted layer by layer to heat-conducting layer 4, and by 4 inner layer 3 of heat-conducting layer, outer layer 2, eventually by outer layer 2 to external diffusion, plays heat dissipation
Effect.
In the embodiment that a kind of ultrasound face battle array is popped one's head in, energy converter 5 is contained in heat dissipation probing shell 1, and radiate probing shell 1
Including internal layer 3 and outer layer 2；Internal layer 3 and outer layer 2 are connected as one, and are made of different materials, and the thermal coefficient of internal layer is high
In the thermal coefficient of outer layer.In other embodiments, heat dissipation probing shell 1 or other above-mentioned heat dissipation probing shell embodiments
Any combination of feature.
It further include thermally conductive sheet or heat-conducting block in a kind of embodiment of ultrasound face battle array probe, thermally conductive sheet or heat-conducting block and transducing
Device thermal coupling, and with heat dissipation probing shell inner surface thermal coupling.The case where thermal coupling can be physical connection may be physics
On be not connected to but heat the case where being transmitted between two components.Thermally conductive sheet or heat-conducting block heating conduction are good, can be fast
Fastly the heat that energy converter 5 generates is conducted to heat dissipation probing shell, and passes through heat dissipation probing shell to external diffusion.
In a kind of embodiment of ultrasound face battle array probe, between thermally conductive sheet or heat-conducting block and inner surface of outer cover filled with heat-conducting glue or
Phase-change material.Heat-conducting glue or phase-change material are filled in the gap between thermally conductive sheet or heat-conducting block and inner surface of outer cover, avoid in gap
Air hinder heat to external diffusion.Heat-conducting glue has biggish thermal coefficient, can rapidly will be from thermally conductive sheet or heat-conducting block
The heat of absorption conducts the radiating efficiency that probe is improved to shell internal layer.It is solid-state that phase-change material, which refers under room temperature, when temperature rises
Become the material of liquid when to certain value, and there is larger thermal capacitance.Heat-conducting block or thermally conductive sheet conduction are absorbed in phase-change material
Heat, heat up and phase transformation during the entire process of, absorb a large amount of heat, and temperature change is slow, and slowly by heat to
Shell conduction plays the role of radiating to energy converter.
The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any
Those familiar with the art within the technical scope of the present application, can easily think of the change or the replacement, and should all contain
Lid is within the scope of protection of this application.
Claims (16)
1. a kind of heat dissipation probing shell, energy converter is contained in the heat dissipation probing shell, it is characterised in that:
The heat dissipation probing shell includes internal layer and outer layer；
The internal layer and outer layer are connected as one, and are made of different materials；
The thermal coefficient of the internal layer is higher than the thermal coefficient of the outer layer.
2. heat dissipation probing shell as described in claim 1, it is characterised in that: outer layer and internal layer attaching are integrated.
3. heat dissipation probing shell as described in claim 1, it is characterised in that:
The outer surface of the internal layer is equipped with combined hole；
The inner surface of the outer layer is equipped with lug boss；
The lug boss that the outer layer invests on the inner surface of the inner layer outer surface and the outer layer is embedded in the outer of the internal layer
Combined hole on surface；
Or
The outer surface of the internal layer is equipped with lug boss；
The inner surface of the outer layer is equipped with combined hole；
The lug boss that the outer layer invests on the outer surface of the inner layer outer surface and the internal layer is embedded in the interior of the outer layer
Combined hole on surface.
4. heat dissipation probing shell as claimed in claim 3, it is characterised in that: the inner wall of the combined hole and/or the protrusion
The outer wall in portion is equipped with thermal conductive material layer.
5. heat dissipation probing shell as claimed in claim 4, it is characterised in that: the thermal conductive material layer is flexible graphite layer.
6. the heat dissipation probing shell as described in any one of claim 1 to 5, it is characterised in that: the outer layer is by plastics material
Material is made.
7. heat dissipation probing shell as described in claim 6, it is characterised in that: the outer layer is beaten by injection molding, coating or 3D
The type of being printed as is integrated on the internal layer.
8. the heat dissipation probing shell as described in any one of claim 1 to 5, it is characterised in that: the internal layer by metal or
Graphite material is made.
9. the heat dissipation probing shell as described in any one of claim 1 to 5, it is characterised in that: it further include heat-conducting layer, it is described
Heat-conducting layer is connected to the inner surface of the internal layer；
The thermal coefficient of the heat-conducting layer is higher than the thermal coefficient of the internal layer.
10. heat dissipation probing shell as claimed in claim 9, it is characterised in that: the heat-conducting layer is soft graphite film.
11. the heat dissipation probing shell as described in any one of claim 1 to 5, it is characterised in that: the wall thickness of the outer layer is small
In or equal to 1 millimeter.
12. the heat dissipation probing shell as described in any one of claim 1 to 5, it is characterised in that: the wall thickness of the internal layer is big
In or be equal to 0.5 millimeter and be less than or equal to 3 millimeters.
13. a kind of ultrasonic probe, it is characterised in that: outer including any heat dissipation probe of energy converter and claim 1 to 12
Shell；
The energy converter is contained in the heat dissipation probing shell.
14. ultrasonic probe as claimed in claim 13, it is characterised in that: further include thermally conductive sheet or heat-conducting block；
The thermally conductive sheet or heat-conducting block and energy converter thermal coupling, and with the heat dissipation probing shell inner surface thermal coupling.
15. ultrasonic probe as claimed in claim 14, it is characterised in that: between the thermally conductive sheet or heat-conducting block and inner surface of outer cover
Filled with heat-conducting glue or phase-change material.
16. a kind of ultrasound face battle array probe, it is characterised in that: including the heat dissipation any in energy converter and claim 1 to 12
Probing shell；
The energy converter is contained in the heat dissipation probing shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821616958.3U CN209629696U (en) | 2018-09-30 | 2018-09-30 | A kind of heat dissipation probing shell, ultrasonic probe and ultrasonic face battle array probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821616958.3U CN209629696U (en) | 2018-09-30 | 2018-09-30 | A kind of heat dissipation probing shell, ultrasonic probe and ultrasonic face battle array probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209629696U true CN209629696U (en) | 2019-11-15 |
Family
ID=68471194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821616958.3U Active CN209629696U (en) | 2018-09-30 | 2018-09-30 | A kind of heat dissipation probing shell, ultrasonic probe and ultrasonic face battle array probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209629696U (en) |
-
2018
- 2018-09-30 CN CN201821616958.3U patent/CN209629696U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI309461B (en) | Thermally conductive member and cooling system using the same | |
| KR101457666B1 (en) | Ultrasound Transducer with cooling function | |
| CN103429161B (en) | Ultrasound probe and diagnostic ultrasound equipment | |
| KR20100097178A (en) | Ultrasonic therapy applicator | |
| CN105873417B (en) | A kind of chip, circuit board and mobile terminal | |
| AU2020245521B2 (en) | Handheld ultrasound imager | |
| CN105744811B (en) | Shell and mobile terminal | |
| CN109362208A (en) | Quick soakage device and hand-held ultrasound detection device | |
| CN209629696U (en) | A kind of heat dissipation probing shell, ultrasonic probe and ultrasonic face battle array probe | |
| CN207623920U (en) | High efficiency and heat radiation totally enclosed type chassis component | |
| TWM612803U (en) | Flexible cold and hot compress | |
| CN206924084U (en) | Ultrasonic probe | |
| CN105632482B (en) | Deep brain stimulation and neuromodulation ultrasound face array transducer heat dissipation backing and preparation method | |
| CN109275318A (en) | Radiator, shell and mobile terminal | |
| US20220362571A1 (en) | Device comprising a heat source | |
| WO2020062271A1 (en) | Heat-dissipating probe housing, ultrasonic probe, and ultrasonic planar array probe | |
| CN202032657U (en) | Far infrared intelligent quick heater | |
| CN110960254A (en) | Heat dissipation probe shell, ultrasonic probe and ultrasonic area array probe | |
| CN207294673U (en) | A kind of heat conduction and heat radiation adhesive tape | |
| CN206658295U (en) | Loudspeaker module | |
| CN109549666A (en) | Soakage device and hand-held ultrasound detection device | |
| CN107484391A (en) | The radiator structure and electronic equipment of a kind of power inverter | |
| CN105744804A (en) | Temperature control system of high-heat consumption and high-stability single machine | |
| CN209643244U (en) | Optical module radiator structure and optical module | |
| CN106038039A (en) | Portable electronic cooling instrument |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Mindray Animal Medical Technology Co.,Ltd. Assignor: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS Co.,Ltd. Contract record no.: X2022440020009 Denomination of utility model: A heat dissipation probe shell, an ultrasonic probe and an ultrasonic area array probe Granted publication date: 20191115 License type: Common License Record date: 20220804 |
|
| EE01 | Entry into force of recordation of patent licensing contract |