CN110960254A - Heat dissipation probe shell, ultrasonic probe and ultrasonic area array probe - Google Patents

Heat dissipation probe shell, ultrasonic probe and ultrasonic area array probe Download PDF

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Publication number
CN110960254A
CN110960254A CN201811160675.7A CN201811160675A CN110960254A CN 110960254 A CN110960254 A CN 110960254A CN 201811160675 A CN201811160675 A CN 201811160675A CN 110960254 A CN110960254 A CN 110960254A
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China
Prior art keywords
heat
probe
layer
heat dissipation
shell
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Pending
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CN201811160675.7A
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Chinese (zh)
Inventor
王金池
吴飞
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Shenzhen Mindray Bio Medical Electronics Co Ltd
Shenzhen Mindray Scientific Co Ltd
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Shenzhen Mindray Bio Medical Electronics Co Ltd
Shenzhen Mindray Scientific Co Ltd
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Application filed by Shenzhen Mindray Bio Medical Electronics Co Ltd, Shenzhen Mindray Scientific Co Ltd filed Critical Shenzhen Mindray Bio Medical Electronics Co Ltd
Priority to CN201811160675.7A priority Critical patent/CN110960254A/en
Publication of CN110960254A publication Critical patent/CN110960254A/en
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A61B8/4455—Features of the external shape of the probe, e.g. ergonomic aspects

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  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

The invention provides a heat dissipation probe shell, wherein an energy converter is accommodated in the heat dissipation probe shell, and the heat dissipation probe shell comprises an inner layer and an outer layer; the inner layer and the outer layer are connected into a whole and are made of different materials; the thermal conductivity of the inner layer is higher than the thermal conductivity of the outer layer. The invention also provides an ultrasonic probe which comprises an energy converter and a heat dissipation probe shell, wherein the energy converter is contained in the heat dissipation probe shell. The invention also provides an ultrasonic area array probe, which comprises an energy converter and a heat dissipation probe shell, wherein the energy converter is contained in the heat dissipation probe shell. According to the heat dissipation probe shell, the ultrasonic probe and the ultrasonic area array probe, heat generated by the transducer is conducted to the inner layer of the shell, can be rapidly diffused and conducted to the outer layer of the shell, and is dispersed outwards through the outer layer of the shell, so that the heat dissipation performance of the probe is improved.

Description

Heat dissipation probe shell, ultrasonic probe and ultrasonic area array probe
Technical Field
The invention relates to the field of medical equipment, in particular to a heat dissipation probe shell, an ultrasonic probe and an ultrasonic area array probe.
Background
The ultrasonic probe is an important part of ultrasonic diagnosis imaging equipment, the conversion of an electro-acoustic signal needs to be realized in the working process of the ultrasonic probe, a large amount of heat is generated in the conversion process of the electro-acoustic signal, and if the generated heat cannot be dissipated outwards in time, the temperature of the probe is increased. On one hand, the heating of the probe may affect the personal safety of a patient, and on the other hand, if the probe works at a higher temperature for a long time, the aging of the probe is accelerated, and the service life of the probe is shortened. Therefore, efficient heat dissipation of the probe is particularly important.
The shell of the existing ultrasonic probe is made of plastics, so that the heat generated by the probe in the working process is not easy to diffuse outwards, and the temperature of the probe is overhigh.
Disclosure of Invention
The invention provides a heat dissipation probe shell, an ultrasonic probe and an ultrasonic area array probe, and aims to solve the problem that an existing ultrasonic probe is poor in heat dissipation performance.
The invention provides a heat dissipation probe shell, wherein an energy converter is accommodated in the heat dissipation probe shell, and the heat dissipation probe shell comprises an inner layer and an outer layer; the inner layer and the outer layer are connected into a whole and are made of different materials; the thermal conductivity of the inner layer is higher than the thermal conductivity of the outer layer.
The invention also provides an ultrasonic probe which comprises an energy converter and a heat dissipation probe shell, wherein the energy converter is contained in the heat dissipation probe shell.
The invention also provides an ultrasonic area array probe, which comprises an energy converter and a heat dissipation probe shell, wherein the energy converter is contained in the heat dissipation probe shell.
According to the heat dissipation probe shell, the ultrasonic probe and the ultrasonic area array probe, the heat conductivity coefficient of the material of the inner layer of the shell is higher than that of the material of the outer layer of the shell, heat generated by the transducer is conducted to the inner layer of the shell, can be rapidly diffused and conducted to the outer layer of the shell, and is dispersed outwards through the outer layer of the shell, so that the heat dissipation performance of the probe is improved.
Drawings
FIG. 1 is a schematic diagram of one embodiment of an ultrasound probe;
FIG. 2 is a partial schematic view of one embodiment of a heat dissipating probe housing;
FIG. 3 is a partial schematic view of one embodiment of a heat dissipating probe housing.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. In addition, well-known functions or constructions are not described in detail since they would obscure the description in unnecessary detail.
Referring to fig. 1 and fig. 2, the present embodiment provides a heat dissipation probe housing 1, wherein a transducer 5 is accommodated in the heat dissipation probe housing 1, and the heat dissipation probe housing 1 includes an inner layer 3 and an outer layer 2; the inner layer 3 and the outer layer 2 are connected into a whole and are made of different materials, and the heat conductivity coefficient of the inner layer is higher than that of the outer layer. During operation of the transducer 5, a significant amount of heat is generated, which is conducted to the inner surface of the probe housing and dissipated outwardly through the probe housing. Heat dissipation probe shell 1 includes inlayer 3 and skin 2 in this embodiment, and inlayer 3 coefficient of heat conductivity is higher than skin 2 for the heat that conducts and comes is fast at 3 internal diffusion of inlayer, and inlayer 3 conducts the heat to skin 2, and through skin 2 outdiffusion. Because the coefficient of heat conductivity of inlayer 3 is higher than outer 2, compare in the outer structure of individual layer probe, the heat distribution area of inlayer 3 is great, and the area that inlayer 3 conducts heat to outer 2 is great for outer 2 area of receiving the heat is great, and the outside radiating area is great simultaneously, and the radiating efficiency improves. Meanwhile, the heat conductivity coefficient of the outer layer 2 is lower than that of the inner layer 3, so that the outer layer 2 cannot be heated too fast, and hands cannot be scalded due to overhigh temperature of the outer layer 2 when a user holds the probe.
The utility model provides a heat dissipation probe shell embodiment, outer 2 and 3 attached as an organic whole of inlayer, attached indicates that outer 2 and 3 inseparable combinations of inlayer are as an organic whole, and the middle space that does not exist, and attached can be as an organic whole for bonding, also can be integrated into one piece as an organic whole or other can reach the realization mode that outer 2 and 3 inseparable combinations of inlayer. The outer layer 2 and the inner layer 3 are attached into a whole, and because no gap exists between the two layers, the efficiency of heat transfer influenced by the obstruction of an air layer in the process of transferring heat of the inner layer 3 to the outer layer 2 is reduced.
In the embodiment of the heat dissipation probe shell, the outer surface of an inner layer 3 is provided with a combination hole, the inner surface of an outer layer 2 is provided with a convex part, the outer layer 2 is attached to the outer surface of the inner layer 3, and the convex part on the inner surface of the outer layer 2 is embedded into the combination hole on the outer surface of the inner layer 3; or, the outer surface of the inner layer 3 is provided with a convex portion, the inner surface of the outer layer 2 is provided with a combination hole, the outer layer 2 is attached to the outer surface of the inner layer 3, and the convex portion of the outer surface of the inner layer 3 is embedded into the combination hole of the inner surface of the outer layer 2. The convex part can be in a spherical shape or other shapes, the combination hole can be in a circular shape or other shapes matched with the convex part, and the combination hole can be a through hole or a blind hole. Inlayer 3 and skin 2 combine closely more and be difficult for droing through combining hole and bellying, avoid forming the space between inlayer 3 and skin 2 for heat conduction efficiency is higher.
An embodiment of a heat dissipation probe shell is characterized in that a heat conduction material layer is arranged on the inner wall of a combination hole and the outer wall of a protruding portion, or a heat conduction material layer is arranged on either the inner wall of the combination hole or the outer wall of the protruding portion. Because the heat conduction material layer has good heat-conducting property, the heat conduction efficiency between the combination hole and the protruding part can be enhanced by the heat conduction material layer, so that the heat generated by the transducer 5 can not influence the heat transfer efficiency when the heat passes through the combination part of the combination hole and the protruding part in the outward diffusion process.
An embodiment of a heat dissipation probe shell adopts a flexible graphite layer as a heat conduction material layer. The heat conducting material layer is not limited to the flexible graphite layer, and can also be a heat conducting layer made of other materials with higher heat conductivity coefficient than the materials of the inner layer 3 and the outer layer 2.
In one embodiment of the heat dissipating probe housing, the outer layer 2 is made of a plastic material. The outer layer 2 may also be made of other materials having a lower thermal conductivity than the inner layer 3.
An embodiment of a heat dissipation probe shell comprises an inner layer 3, an outer layer 2 is manufactured and formed on the basis of the inner layer 3, the inner layer 3 can be manufactured and formed by die casting, CNC (computer numerical control technology), 3D printing and other technologies, the outer layer 2 can be manufactured and formed on the outer surface of the inner layer 3 by injection molding, coating, 3D printing and other technologies, and therefore assembly gaps are not prone to forming between the inner layer 3 and the outer layer 2 to affect heat dissipation.
In one embodiment of the heat dissipating probe housing, the inner layer 3 is made of a metal or graphite material. The inner layer 3 may also be made of other materials having a higher thermal conductivity than the outer layer 2.
Referring to fig. 1 and fig. 3, in an embodiment of the heat dissipation probe housing, the heat dissipation probe housing 1 further includes a heat conduction layer 4, the heat conduction layer 4 is connected to an inner surface of the inner layer 3, and a heat conductivity coefficient of the heat conduction layer 4 is higher than a heat conductivity coefficient of the inner layer 3. The heat conducting layer 4 may be attached to the inner surface of the inner layer 3 by gluing, may be placed on the inner surface of the inner layer 3, or may be attached to the inner surface of the inner layer 3 by other means and connected to the inner surface of the inner layer 3, where the connection may be physical or thermal. The heat-conducting layer 4 further makes the heat that transducer 5 produced evenly distributed at the heat-conducting layer 4 fast, through heat-conducting layer 4 with the heat to the conduction of inlayer 3 to through the conduction of inlayer 3 to outer 2, because the coefficient of heat conductivity of heat-conducting layer 4 is higher than the coefficient of heat conductivity of inlayer 3, make the heat that transducer 5 produced distribute more evenly on the heat-conducting layer sooner, increased the area of outside conduction heat, improved radiating efficiency.
In one embodiment of the heat dissipation probe housing, the heat conductive layer 4 is a flexible graphite film. The heat conducting layer 4 may also be made of other materials having a higher thermal conductivity than the inner layer 3.
In an embodiment of the heat dissipation probe shell, the wall thickness of the outer layer 2 is less than or equal to 1 mm, and in this embodiment, the wall thickness of the inner layer 3 can be any value. The outer layer 2 is used as a durable layer and an insulating layer of the heat dissipation probe shell 1, the heat conductivity of the outer layer is lower than that of the inner layer 3, and the smaller wall thickness is beneficial to the conduction of heat to the outside of the probe.
In an embodiment of the heat dissipation probe shell, the wall thickness of the inner layer 3 is greater than or equal to 0.5 mm and less than or equal to 3 mm, and in this embodiment, the wall thickness of the outer layer 2 can be any value. The inner layer 3 has a greater wall thickness to serve as a structural support for the heat sink probe housing 1, while the greater wall thickness results in a lower temperature rise of the heat sink probe housing 1 for receiving the same amount of heat.
Referring to fig. 1, in an embodiment of an ultrasonic probe, a transducer 5 is accommodated in a heat dissipation probe housing 1, and the heat dissipation probe housing 1 includes an inner layer 3 and an outer layer 2; the inner layer 3 and the outer layer 2 are connected into a whole and are made of different materials, and the heat conductivity coefficient of the inner layer is higher than that of the outer layer. The transducer 5 is used to transmit and receive ultrasonic waves and to convert the ultrasonic signals and electrical signals to each other, and typically includes (but is not limited to) a matching layer, a piezoelectric crystal, and a backing block. In other embodiments, the heat dissipation probe housing 1 may also be any combination of the other heat dissipation probe housing embodiments described above.
An embodiment of the ultrasound probe further comprises a thermally conductive sheet or block thermally coupled to the transducer and to the inner surface of the heat dissipating probe housing. The thermal coupling may be physically connected or physically disconnected but heat may be transferred between the two components. The heat conducting fins or the heat conducting blocks have good heat conducting performance, can quickly conduct heat generated by the transducer 5 to the heat dissipation probe shell and can be diffused outwards through the heat dissipation probe shell.
In an embodiment of the ultrasonic probe, a heat conducting glue or a phase change material is filled between the heat conducting sheet or the heat conducting block and the inner surface of the shell. The heat-conducting glue or the phase-change material is filled in the gap between the heat-conducting sheet or the heat-conducting block and the inner surface of the shell, so that the air in the gap is prevented from hindering the outward diffusion of heat. The heat-conducting glue has a large heat conductivity coefficient, and can quickly conduct heat absorbed by the heat-conducting fins or the heat-conducting blocks to the inner layer of the shell, so that the heat dissipation efficiency of the probe is improved. The phase-change material is a material which is solid at normal temperature and becomes liquid when the temperature rises to a certain value, and has a large heat capacity. In the whole process that the phase-change material absorbs heat conducted by the heat-conducting block or the heat-conducting fin, the temperature rises and changes phase, a large amount of heat is absorbed, the temperature changes slowly, the heat is conducted to the shell slowly, and the effect of radiating the heat of the transducer is achieved.
As shown in fig. 1, in one embodiment, the ultrasonic probe includes a heat conducting sheet (not shown), a front surface is defined as a surface of the transducer that transmits and receives ultrasonic waves, a side surface of the transducer is adjacent to the front surface, the heat conducting sheet extends outwards from the inside of the transducer and is attached to a side surface of the transducer 5, the space between the heat conducting sheet and the heat conducting layer 4 is filled with a heat conducting glue 6, the heat conducting layer 4 is attached to the inner surface of the inner layer 3, and the inner layer 3 is attached to the inner surface of the outer layer 2. The heat that transducer 5 produced is derived through the conducting strip to conduct to heat-conducting layer 4 through heat-conducting glue 6, and conduct layer upon layer to inlayer 3, outer 2 through heat-conducting layer 4, finally through outer 2 outdiffusion, play radiating effect.
In an embodiment of the ultrasonic area array probe, a transducer 5 is accommodated in a heat dissipation probe shell 1, and the heat dissipation probe shell 1 comprises an inner layer 3 and an outer layer 2; the inner layer 3 and the outer layer 2 are connected into a whole and are made of different materials, and the heat conductivity coefficient of the inner layer is higher than that of the outer layer. In other embodiments, the heat dissipation probe housing 1 may also be any combination of the features of the other heat dissipation probe housing embodiments described above.
In one embodiment of the ultrasonic area array probe, the ultrasonic area array probe further comprises a heat conducting sheet or a heat conducting block, wherein the heat conducting sheet or the heat conducting block is thermally coupled with the transducer and is thermally coupled with the inner surface of the heat dissipation probe shell. The thermal coupling may be physically connected or physically disconnected but heat may be transferred between the two components. The heat conducting fins or the heat conducting blocks have good heat conducting performance, can quickly conduct heat generated by the transducer 5 to the heat dissipation probe shell and can be diffused outwards through the heat dissipation probe shell.
In an embodiment of the ultrasonic area array probe, heat conducting glue or phase change material is filled between the heat conducting sheet or the heat conducting block and the inner surface of the shell. The heat-conducting glue or the phase-change material is filled in the gap between the heat-conducting sheet or the heat-conducting block and the inner surface of the shell, so that the air in the gap is prevented from hindering the outward diffusion of heat. The heat-conducting glue has a large heat conductivity coefficient, and can quickly conduct heat absorbed by the heat-conducting fins or the heat-conducting blocks to the inner layer of the shell, so that the heat dissipation efficiency of the probe is improved. The phase-change material is a material which is solid at normal temperature and becomes liquid when the temperature rises to a certain value, and has a large heat capacity. In the whole process that the phase-change material absorbs heat conducted by the heat-conducting block or the heat-conducting fin, the temperature rises and changes phase, a large amount of heat is absorbed, the temperature changes slowly, the heat is conducted to the shell slowly, and the effect of radiating the heat of the transducer is achieved.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application.

Claims (16)

1. The utility model provides a heat dissipation probe shell, the transducer accept in the heat dissipation probe shell, its characterized in that:
the heat dissipation probe shell comprises an inner layer and an outer layer;
the inner layer and the outer layer are connected into a whole and are made of different materials;
the thermal conductivity of the inner layer is higher than the thermal conductivity of the outer layer.
2. The heat dissipation probe housing of claim 1, wherein: the outer layer and the inner layer are attached into a whole.
3. The heat dissipation probe housing of claim 1, wherein:
the outer surface of the inner layer is provided with a combination hole;
the inner surface of the outer layer is provided with a convex part;
the outer layer is attached to the outer surface of the inner layer and the convex part is embedded into the combination hole;
or
The outer surface of the inner layer is provided with a convex part;
the inner surface of the outer layer is provided with a combination hole;
the outer layer is attached to the inner layer outer surface and the boss is fitted into the coupling hole.
4. The heat dissipation probe housing of claim 3, wherein: and the inner wall of the combination hole and/or the outer wall of the bulge part are/is provided with a heat conduction material layer.
5. The heat dissipation probe housing of claim 4, wherein: the heat conducting material layer is a flexible graphite layer.
6. The heat dissipating probe housing of any one of claims 1 to 5, wherein: the outer layer is made of a plastic material.
7. The heat dissipating probe housing of any one of claims 1 to 6, wherein: the outer layer is bonded to the inner layer by injection molding, coating, or 3D printing.
8. A heat dissipation probe cover as recited in any one of claims 1-7, wherein: the inner layer is made of a metal or graphite material.
9. A heat dissipation probe cover as recited in any one of claims 1-8, wherein: the heat conduction layer is connected to the inner surface of the inner layer;
the heat conduction layer has a higher thermal conductivity than the inner layer.
10. The heat dissipation probe housing of claim 9, wherein: the heat conducting layer is a flexible graphite film.
11. A heat dissipation probe cover as recited in any one of claims 1-10, wherein: the outer layer has a wall thickness of less than or equal to 1 mm.
12. A heat dissipation probe cover as recited in any one of claims 1-11, wherein: the inner layer has a wall thickness greater than or equal to 0.5 mm and less than or equal to 3 mm.
13. An ultrasound probe characterized by: comprising a transducer and the heat dissipating probe housing of any of claims 1 to 12;
the transducer is contained in the heat dissipation probe shell.
14. The ultrasound probe of claim 13, wherein: also comprises a heat conducting fin or a heat conducting block;
the heat conducting fin or the heat conducting block is thermally coupled with the transducer and is thermally coupled with the inner surface of the heat dissipation probe shell.
15. The ultrasound probe of claim 14, wherein: and heat-conducting glue or phase-change material is filled between the heat-conducting fin or the heat-conducting block and the inner surface of the shell.
16. An ultrasonic area array probe, characterized in that: comprising a transducer and the heat dissipating probe housing of any of claims 1 to 12;
the transducer is contained in the heat dissipation probe shell.
CN201811160675.7A 2018-09-30 2018-09-30 Heat dissipation probe shell, ultrasonic probe and ultrasonic area array probe Pending CN110960254A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811160675.7A CN110960254A (en) 2018-09-30 2018-09-30 Heat dissipation probe shell, ultrasonic probe and ultrasonic area array probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811160675.7A CN110960254A (en) 2018-09-30 2018-09-30 Heat dissipation probe shell, ultrasonic probe and ultrasonic area array probe

Publications (1)

Publication Number Publication Date
CN110960254A true CN110960254A (en) 2020-04-07

Family

ID=70029209

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811160675.7A Pending CN110960254A (en) 2018-09-30 2018-09-30 Heat dissipation probe shell, ultrasonic probe and ultrasonic area array probe

Country Status (1)

Country Link
CN (1) CN110960254A (en)

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