CN209625818U - Conductive adhesive film and wiring board - Google Patents
Conductive adhesive film and wiring board Download PDFInfo
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- CN209625818U CN209625818U CN201821963111.2U CN201821963111U CN209625818U CN 209625818 U CN209625818 U CN 209625818U CN 201821963111 U CN201821963111 U CN 201821963111U CN 209625818 U CN209625818 U CN 209625818U
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Abstract
The utility model relates to electronic technology fields, disclose a kind of conductive adhesive film and wiring board, wherein, conductive adhesive film passes through setting conductor layer, first protrusion and the second protrusion, so that conductive adhesive film is when pressing use, it pierces through the first adhesive film and contacts conducting with a conductor in the first protrusion, it pierces through the second adhesive film and contacts conducting with another conductor in the second protrusion, to realize that conductive adhesive film is in contact conducting with conductor, it changes to avoid the state of piling up of the conducting particles of conductive adhesive film in the prior art and causes the conductive stability of conductive adhesive film poor, to effectively improve the conductive stability of conductive adhesive film；In addition, by being equipped with the through-hole through its upper and lower surface in conductor layer, so that the first adhesive film and the second adhesive film can be in close contact by the through-hole in conductor layer, so that the first adhesive film and the second adhesive film can securely link together.
Description
Technical field
The utility model relates to electronic technology fields, more particularly to a kind of conductive adhesive film and wiring board.
Background technique
Conductive adhesive film provides mechanical connection and electrical connection between element and wiring board, thus is gradually widely answered
For in the various electronic fields such as microelectronics Packaging, printed circuit board, conducting wire bonding.
Currently, existing conductive adhesive film usually only has individual conductive adhesive layer, wherein have conductive particle in conductive adhesive layer
Son；In practical applications, conductive adhesive film bonds between the conductors, to realize the conducting between conductor.But implementing this hair
In bright process, at least there are the following problems in the prior art for inventor's discovery: due to the shadow by factors such as stress, weathers
It rings, the matrix material or shape of conductive adhesive film are easy to happen gradual change or mutation, so that its internal conducting particles piles up state
It is easy to happen variation, so that the conductive path in conductive adhesive film easily changes, so that between conductive adhesive film and conductor
Turn-on effect is undesirable, therefore causes the conductive stability of conductive adhesive film poor.
Utility model content
The purpose of the utility model embodiment is to provide a kind of conductive adhesive film and wiring board, can effectively improve conduction
The conductive stability of glue film.
In order to solve the above-mentioned technical problem, the utility model provides a kind of conductive adhesive film, including the first adhesive film, conductor layer
With the second adhesive film, the conductor layer is set between first adhesive film and second adhesive film, and the conductor layer is close
The one side of first adhesive film is non-smooth surface, and the conductor layer includes close to the non-smooth surface of first adhesive film
Multiple first protrusions and multiple first recessed portions, multiple first protrusions and the setting of multiple first recessed portion intervals, it is more
First adhesive film is protruded into a first protrusion；The conductor layer is non-smooth table close to the one side of second adhesive film
Face, the conductor layer include multiple second protrusions and multiple second recessed portions close to the non-smooth surface of second adhesive film,
Multiple second protrusions and the setting of multiple second recessed portion intervals, second glue film is protruded into multiple second protrusions
Layer；The conductor layer is equipped with the through-hole through its upper and lower surface.
Preferably, the conductor layer is equipped with the first conductor close to the non-smooth surface of first adhesive film
Grain, the first conductive particles integrated distribution is on first protrusion.
Preferably, the conductor layer is equipped with the second conductor close to the non-smooth surface of second adhesive film
Grain, the second conductive particles integrated distribution is on second protrusion.
Preferably, the shape of first conductive particles is cluster-shaped or extension ice-like or stalactite or branch
Shape, and/or, the shape of second conductive particles is cluster-shaped or extension ice-like or stalactite or dendroid.
Preferably, the quantity of first conductive particles is multiple, multiple first conductive particles rules or
The conductor layer is irregularly distributed in the one side of first adhesive film；Multiple first conductive particles it is continuous or
The conductor layer is discontinuously distributed in the one side of first adhesive film；The shape of multiple first conductive particles
It is identical or different；The size of multiple first conductive particles is identical or different；And/or
The quantity of second conductive particles be it is multiple, multiple second conductive particles are regularly or irregularly distributed in
The conductor layer is in the one side of second adhesive film；Multiple second conductive particles are continuously or non-continuously distributed in
The conductor layer is in the one side of second adhesive film；The shape of multiple second conductive particles is identical or different；It is more
The size of a second conductive particles is identical or different.
Preferably, first adhesive film includes the adhesion layer containing conducting particles；Or, first adhesive film
Adhesion layer including being free of conducting particles.
Preferably, second adhesive film includes the adhesion layer containing conducting particles；Or, second adhesive film
Adhesion layer including being free of conducting particles.
Preferably, the conductor layer with a thickness of 0.01 μm -45 μm, first adhesive film with a thickness of 0.1 μ
M-45 μm, second adhesive film with a thickness of 0.1 μm -45 μm.
Preferably, the conductive adhesive film further includes the first peelable protective film layer and the second peelable protective film
Layer, the first peelable protective film layer are set in the one side of first adhesive film far from the conductor layer, and described second can
Protective film layer is removed to be set in the one side of second adhesive film far from the conductor layer.
Preferably, the area of the through-hole is 0.1 μm2-1mm2；And/or in the conductor layer every square centimeter
The number of the through-hole be 10-1000.
The utility model embodiment provides a kind of conductive adhesive film, by the way that conductor layer, the first protrusion and the second protrusion is arranged, with
So that conductive adhesive film is pressing in use, the first protrusion pierces through the first adhesive film and contacts conducting with a conductor, the second protrusion is pierced
It wears the second adhesive film and contacts conducting with another conductor, to realize that conductive adhesive film is in contact conducting with conductor, to avoid existing
The state of piling up of the conducting particles of conductive adhesive film, which changes, in technology causes the conductive stability of conductive adhesive film poor, to have
The conductive stability of conductive adhesive film is improved to effect, while avoiding and using individual conductive adhesive layer to lead to conduction in the prior art
The Duplication of particle is lower, to reduce the resistance of conductive adhesive film, and then is conducive to improve the electric conductivity of conductive adhesive film, in turn
Improve the reliability be connected between conductive adhesive film and conductor；Further, since without using conducting particles, therefore greatly reduce
The production cost of conductive adhesive film；In addition, by being equipped with the through-hole through its upper and lower surface in conductor layer, so that the first glue film
Layer and the second adhesive film can be in close contact by the through-hole in conductor layer, to increase the first adhesive film and the second adhesive film
Between peel strength so that the first adhesive film and the second adhesive film can securely link together；In addition, in conductor
Layer is equipped with the through-hole through its upper and lower surface, and the volatile matter be conducive in the first adhesive film and the second adhesive film at high temperature is logical
The through-hole for crossing conductor layer is exhausted, and is difficult to be discharged to avoid the volatile matter of the first adhesive film and the second adhesive film at high temperature,
It is peeling-off with conductor that conductive adhesive film is caused so as to avoid conductive adhesive film blistering layering, and then improves conductive adhesive film and conductor
The reliability of connection；In addition, the gelatin substance for constituting the first adhesive film is extruded on the first recessed portion in pressing, constitute
The gelatin substance of second adhesive film is extruded on the second recessed portion, so that the charging capacity of conductive adhesive film is increased, to not allow
Easily there is the phenomenon that conductive adhesive film and conductor removing, avoids existing conductive adhesive film since charging capacity deficiency leads to conductive adhesive film
The problem of being removed with conductor, and then it is effectively guaranteed the reliability that conductive adhesive film is connect with conductor.
In order to solve identical technical problem, the utility model embodiment also provides a kind of wiring board, including printed wire
Plate and the conductive adhesive film, the conductive adhesive film are set in the printed wiring board, and first protrusion pierces through described the
One adhesive film is simultaneously conducted with the stratum of the printed wiring board；The wiring board further includes steel disc, and the steel disc is set to described
In one side of second adhesive film far from first adhesive film, second protrusion pierce through second adhesive film and with the steel
Piece contact conducting.By the way that conductive adhesive film is set in printed wiring board, thus be printed wiring board shielding electromagnetic interference, it is extraneous
The interference charge buildup of generation pierces through the first adhesive film and and printed wire in the conductor layer of conductive adhesive film, through the first protrusion
The stratum of plate contacts conducting, so that the interference charge gathered in conductor layer be exported by the stratum of printed wiring board；In addition, logical
Steel disc is crossed as reinforced structure, and the second adhesive film is pierced through by the second protrusion and contacts conducting with steel disc, to pass through steel disc
The interference charge gathered in conductor layer can also be exported.
In order to solve identical technical problem, the utility model embodiment also provides a kind of wiring board, including printed wire
Plate, electromagnetic shielding film and the conductive adhesive film, the conductive adhesive film are set on the electromagnetic shielding film, the electromagnetic shielding
Film is set in the printed wiring board；The electromagnetic shielding film includes insulating layer and metal conducting layer, and the of the conductive adhesive film
It pierces through first adhesive film and the insulating layer and contacts conducting, the metal conducting layer with the metal conducting layer in one protrusion
Conducting is contacted with the stratum of the printed wiring board；The wiring board further includes steel disc, and the steel disc is set to second glue film
Layer far from the one side of first adhesive film, pierce through second adhesive film and contact with the steel disc and lead by second protrusion
It is logical.By the way that conductive adhesive film to be set on electromagnetic shielding film, electromagnetic shielding film is set in printed wiring board, so that conductive adhesive film
It can be printed wiring board shielding electromagnetic interference with electromagnetic shielding film, the interference charge buildup that the external world generates is in conductive adhesive film
On the metal conducting layer of conductor layer and electromagnetic shielding film, by the first protrusion pierce through the first adhesive film and with the ground of printed wiring board
Layer contact conducting, so that the interference charge gathered in conductor layer and metal conducting layer be exported by the stratum of printed wiring board；
In addition, by steel disc as reinforced structure, and the second adhesive film is pierced through by the second protrusion and contacts conducting with steel disc, thus logical
The interference charge gathered in conductor layer and metal conducting layer can also be exported by crossing steel disc.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the conductive adhesive film in the utility model embodiment；
Fig. 2 is the structural schematic diagram of another angle of the conductive adhesive film in the utility model embodiment；
Fig. 3 is the structural schematic diagram of the conductive adhesive film in the utility model embodiment comprising the first conductive particles；
Fig. 4 is the structure of the conductive adhesive film comprising the first conductive particles and the second conductive particles in the utility model embodiment
Schematic diagram；
Fig. 5 is that the first conductive particles in the utility model embodiment, the second conductive particles and conductor layer are one-time formed
Structural schematic diagram；
Fig. 6 is leading comprising the first peelable protective film layer and the second peelable protective film layer in the utility model embodiment
The structural schematic diagram of electric glue film；
Fig. 7 is the structural schematic diagram of the wiring board in the utility model embodiment；
Fig. 8 is the structural schematic diagram of another embodiment of the wiring board in the utility model embodiment；
Fig. 9 is the flow diagram of the preparation method of the conductive adhesive film in the utility model embodiment；
Wherein, 1, conductor layer；11, the first protrusion；12, the first recessed portion；13, the second protrusion；14, the second recessed portion；15,
Through-hole；2, the first adhesive film；3, the second adhesive film；4, the first conductive particles；5, the second conductive particles；6, the first peelable protection
Film layer；7, the second peelable protective film layer；8, printed wiring board；81, steel disc；82, stratum；83, the first ground hole；84, second
Ground hole；9, electromagnetic shielding film；91, insulating layer；92, metal conducting layer.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, fall within the protection scope of the utility model.
Referring to figs. 1 and 2, a kind of conductive adhesive film of the preferred embodiment in the utility model, including the first adhesive film 2,
Conductor layer 1 and the second adhesive film 3, the conductor layer 1 is set between first adhesive film 2 and second adhesive film 3, described
Conductor layer 1 is non-smooth surface close to the one side of first adhesive film 2, and the conductor layer 1 is close to first adhesive film 2
Non-smooth surface includes multiple first protrusions 11 and multiple first recessed portions 12, multiple first protrusions 11 and multiple described
The setting of one recessed portion 12 interval, first adhesive film 2 is protruded into multiple first protrusions 11；The conductor layer 1 is close to described
The non-smooth surface of second adhesive film 3 includes multiple second protrusions 13 and multiple second recessed portions 14, multiple second protrusions
13 and the setting of multiple second recessed portions 14 interval, second adhesive film 3 is protruded into multiple second protrusions 13；It is described
Conductor layer 1 is equipped with the through-hole 15 through its upper and lower surface.
In the utility model embodiment, by setting conductor layer 1, the first protrusion 11 and the second protrusion 13, so that leading
Electric glue film in pressing in use, the first protrusion 11 pierces through the first adhesive film 2 and contacts conducting with a conductor, pierce through by the second protrusion 13
Second adhesive film 3 simultaneously contacts conducting with another conductor, to realize that conductive adhesive film is in contact conducting with conductor, to avoid existing skill
The state of piling up of the conducting particles of conductive adhesive film, which changes, in art causes the conductive stability of conductive adhesive film poor, thus effectively
Ground improves the conductive stability of conductive adhesive film, while avoiding and using individual conductive adhesive layer to lead to conductive particle in the prior art
The Duplication of son is lower, to reduce the resistance of conductive adhesive film, and then is conducive to improve the electric conductivity of conductive adhesive film, Jin Erti
The high reliability be connected between conductive adhesive film and conductor；Further, since without using conducting particles, therefore greatly reduce and lead
The production cost of electric glue film；In addition, by being equipped with the through-hole through its upper and lower surface in conductor layer 1, so that the first glue film
Layer 2 and the second adhesive film 3 can be in close contact by the through-hole in conductor layer 1, to increase the first adhesive film 2 and the second glue
Peel strength between film layer 3, so that the first adhesive film 2 and the second adhesive film 3 can securely link together；This
Outside, it is equipped with the through-hole 15 through its upper and lower surface in conductor layer 1, is conducive to the first adhesive film 2 and the second glue film at high temperature
Volatile matter in layer 3 is exhausted by the through-hole 15 of conductor layer 1, to avoid the first adhesive film 2 and the second glue film at high temperature
The volatile matter of layer 3 is difficult to be discharged, and causes conductive adhesive film peeling-off with conductor so as to avoid conductive adhesive film blistering layering, in turn
Improve the reliability that conductive adhesive film is connect with conductor；In addition, the gelatin substance for constituting the first adhesive film 2 is squeezed in pressing
It is pressed on the first recessed portion 12, the gelatin substance for constituting the second adhesive film 3 is extruded on the second recessed portion 14, to increase
The charging capacity of conductive adhesive film avoids existing conducting resinl to be not easy to occur conductive adhesive film and the phenomenon that conductor is removed
The problem of film causes conductive adhesive film and conductor to be removed due to charging capacity deficiency, and then it is effectively guaranteed conductive adhesive film and conductor company
The reliability connect.
In the utility model embodiment, the conductor layer 1 is rule close to the non-smooth surface of first adhesive film 2
Non-smooth surface or irregular non-smooth surface.Specifically, when the conductor layer 1 is close to the non-of first adhesive film 2
When flat surface is the non-smooth surface of rule, the non-smooth surface is the structure of periodic undulations variation, described non-smooth
The interval of the amplitude and fluctuating that rise and fall on surface is identical；When the conductor layer 1 is close to the non-smooth table of first adhesive film 2
When face is irregular non-smooth surface, the non-smooth surface is the structure of aperiodicity fluctuations, the non-smooth table
The interval of the amplitude and/or fluctuating that rise and fall on face is different.
In the utility model embodiment, multiple first protrusions 11 can be deposited with the outer surface of first adhesive film 2
In a certain distance, it can also be in contact with the outer surface of first adhesive film 2 or extend the appearance of first adhesive film 2
Face.
In the utility model embodiment, in order to further ensure that the reliability of ground connection, while electrical efficiency, this reality are improved
The spacing applied between each first protrusion 11 and adjacent first recessed portion 12 in example is identical.By by each institute
The spacing stated between the first protrusion 11 and adjacent first recessed portion 12 is set as identical, so that first protrusion 11
First adhesive film 2 can be equably pierced through, has thereby further ensured that the conductor layer 1 is in contact with conductor, has mentioned simultaneously
High electrical efficiency.Preferably, the shape of each first protrusion 11 is all the same；The shape of each first recessed portion 12
Shape is all the same；Wherein, each first protrusion 11 is axially symmetric structure；Each first recessed portion 12 is axial symmetry
Structure；Certainly, each first protrusion 11 can also be that nonaxisymmetric structure, each first recessed portion 12 can also be
Nonaxisymmetric structure.Since the spacing between each first protrusion 11 and adjacent first recessed portion 12 is identical, and
And the shape of each first protrusion 11 is all the same, the shape of each first recessed portion 12 is all the same, so that described
The charging capacity on 1 surface of conductor layer is relatively uniform, to further avoid existing conductive adhesive film since charging capacity deficiency causes
The problem of conductive adhesive film and conductor are removed, and then it is effectively guaranteed the reliability that conductive adhesive film is connect with conductor.
In the utility model embodiment, the conductor layer 1 is rule close to the non-smooth surface of second adhesive film 3
Non-smooth surface or irregular non-smooth surface.Specifically, when the conductor layer 1 is close to the non-of second adhesive film 3
When flat surface is the non-smooth surface of rule, the non-smooth surface is the structure of periodic undulations variation, described non-smooth
The interval of the amplitude and fluctuating that rise and fall on surface is identical；When the conductor layer 1 is close to the non-smooth table of second adhesive film 3
When face, the non-smooth surface is the structure of aperiodicity fluctuations, the amplitude to rise and fall on the non-smooth surface and/or is risen
The interval of volt is different.
In the utility model embodiment, multiple second protrusions 13 can be deposited with the outer surface of second adhesive film 3
In a certain distance, it can also be in contact with the outer surface of second adhesive film 3 or extend the appearance of second adhesive film 3
Face.
In the utility model embodiment, in order to further ensure that the reliability of ground connection, while electrical efficiency, this reality are improved
The spacing applied between each second protrusion 13 and adjacent second recessed portion 14 in example is identical.By by each institute
The spacing stated between the second protrusion 13 and adjacent second recessed portion 14 is set as identical, so that second protrusion 13
Second adhesive film 3 can be equably pierced through, has thereby further ensured that the conductor layer 1 is in contact with conductor, has mentioned simultaneously
High electrical efficiency.Preferably, the shape of each second protrusion 13 is all the same；The shape of each second recessed portion 14
Shape is all the same；Wherein, each second protrusion 13 is axially symmetric structure；Each second recessed portion 14 is axial symmetry
Structure；Certainly, each second protrusion 13 can also be that nonaxisymmetric structure, each second recessed portion 14 can also be
Nonaxisymmetric structure.Since the spacing between each second protrusion 13 and adjacent second recessed portion 14 is identical, and
And the shape of each second protrusion 13 is all the same, the shape of each second recessed portion 14 is all the same, so that described
The charging capacity on 1 surface of conductor layer is relatively uniform, to further avoid existing conductive adhesive film since charging capacity deficiency causes
The problem of conductive adhesive film and conductor are removed, and then it is effectively guaranteed the reliability that conductive adhesive film is connect with conductor.
Preferably, waviness (i.e. described conductor of the conductor layer 1 close to the non-smooth surface of first adhesive film 2
The highs and lows of one side the distance between of the layer 1 close to first adhesive film 2) it is 0.1 μm -30 μm, and, institute
Stating conductor layer 1, (the i.e. described conductor layer 1 is close to second glue close to the waviness of the non-smooth surface of second adhesive film 3
The distance between the highs and lows of one side of film layer 3) it is 0.1 μm -30 μm, by the conductor layer 1 close to described first
Adhesive film 2 waviness and the conductor layer 1 close to second adhesive film 3 while waviness be set in
It states in range, the puncture function of the conductor layer 1 can be enhanced, to guarantee that the interference charge accumulated in the conductor layer 1 is suitable
Benefit export, and then avoid the accumulation of interference charge and form interference source.
In conjunction with shown in Fig. 3 to Fig. 5, in order to further ensure that the conductor layer 1 is in contact with conductor, in the present embodiment institute
The non-smooth surface that conductor layer 1 is stated close to first adhesive film 2 is equipped with the first conductive particles 4.By in the conductor layer 1
Non-smooth surface close to first adhesive film 2 is equipped with the first conductive particles 4, in order to pierce through first adhesive film 2,
Thereby further ensure that the conductor layer 1 is in contact with conductor.Preferably, 4 integrated distribution of the first conductive particles is described
On first protrusion 11, so that the conductor layer 1 is easier to pierce through first adhesive film 2 during the pressing process.
In conjunction with shown in Fig. 4 and Fig. 5, in order to further ensure that the conductor layer 1 is in contact with conductor, in the present embodiment institute
The non-smooth surface that conductor layer 1 is stated close to second adhesive film 3 is equipped with the second conductive particles 5.By in the conductor layer 1
Non-smooth surface close to second adhesive film 3 is equipped with the second conductive particles 5, in order to pierce through second adhesive film 3,
Thereby further ensure that the conductor layer 1 is in contact with conductor.Preferably, 5 integrated distribution of the second conductive particles is described
On second protrusion 13, so that the conductor layer 1 is easier to pierce through second adhesive film 3 during the pressing process.
Referring to fig. 4 and shown in Fig. 5, in specific implementation, it can be initially formed conductor layer 1, then pass through other techniques again
First conductive particles 4 and second conductive particles 5 are formed in the conductor layer 1.Certainly, the conductor layer 1, described first
Conductive particles 4 and second conductive particles 5 can also be the overall structure formed by one-shot forming technique.
In conjunction with shown in Fig. 3 and Fig. 4, the height h1 of first conductive particles 4 is preferably 0.1 μm -30 μm, and described second leads
The height h2 of body particle 5 is preferably 0.1 μm -30 μm, and the thickness of first adhesive film 2 and second adhesive film 3 is preferred
It is 0.1 μm -45 μm.Height by the way that first conductive particles 4 and second conductive particles 5 are arranged be both preferably 0.1 μm-
30 μm, the thickness of first adhesive film 2 and second adhesive film 3 is both preferably 0.1 μm -45 μm, to ensure the conduction
Glue film is being pressed in use, first conductive particles 4 can pierce through first adhesive film 2 and second conductor
Particle 5 can pierce through second adhesive film 3, ensure that the conductive adhesive film can contact conducting with conductor.In addition, institute
The thickness for stating conductor layer 1 is preferably 0.01 μm -45 μm, to ensure that the conductor layer 1 is not allowed easily rupturable and has and good scratch
Property.
In conjunction with shown in Fig. 3 and Fig. 4, it should be noted that first conductive particles 4 be both distributed in the first recessed portion 12,
Also the first protrusion 11, also, the height H1 of any first protrusion 11 and the first conductor on first protrusion 11 are distributed in
The sum of oneself height h1 of particle 4 is also 1 to 30 μm.Certainly, the first conductive particles 4 being located on the first protrusion 11 be can also be
Oneself height h1 is 1 to 30 μm, then, the height H1 of the first protrusion 11 is led with first on first protrusion 11 at this time
The sum of oneself height h1 of body particle 4 is greater than 1 to 30 μm, so as to further enhance the electrical connection performance of the conductive adhesive film；
In addition, second conductive particles 5 be both distributed in the second recessed portion 13, it is also distributed in the second protrusion 14, also, any second convex
The height H2 in portion 14 is also 1 to 30 μm with the sum of the oneself height h2 of the second conductive particles 5 being located on second protrusion 14.
Certainly, the oneself height h2 that can also be the second conductive particles 5 being located on the second protrusion 14 is 1 to 30 μm, then, at this time
The height H2 of two protrusions 14 is greater than 1 to 30 μ with the sum of the oneself height h2 of the second conductive particles 5 being located on second protrusion 14
M, so as to further enhance the electrical connection performance of the conductive adhesive film.
First conductive particles 4 can with the outer surface of first adhesive film 2 there are a certain distance, can also with it is described
The outer surface of first adhesive film 2 is in contact or extends the outer surface of first adhesive film 2；Second conductive particles 5 can
Outer surface with second adhesive film 3 there are a certain distance, can also be in contact with the outer surface of second adhesive film 3 or
Extend the outer surface of second adhesive film 3.In addition, the outer surface of first adhesive film 2 and second adhesive film 3 can
The flat surface for thinking no fluctuating is also possible to the out-of-flatness surface gently to rise and fall.
In the utility model embodiment, the quantity of first conductive particles 4 is multiple, multiple first conductors
Grain 4 is regularly or irregularly distributed in the conductor layer 1 in the one side of first adhesive film 2；Multiple described first lead
Body particle 4 is continuously or non-continuously distributed in the conductor layer 1 in the one side of first adhesive film 2；Multiple described
The shape of one conductive particles 4 is identical or different；The size of multiple first conductive particles 4 is identical or different；And/or it is described
The quantity of second conductive particles 5 be it is multiple, multiple second conductive particles 5 are regularly or irregularly distributed in the conductor layer
1 in the one side of second adhesive film 3；Multiple second conductive particles 5 are continuously or non-continuously distributed in described lead
Body layer 1 is in the one side of second adhesive film 3；The shape of multiple second conductive particles 5 is identical or different；Multiple institutes
The size for stating the second conductive particles 5 is identical or different.It should be noted that multiple first conductive particles 4 are regularly distributed
Refer to periodically dividing for multiple first conductive particles 4 in the one side of first adhesive film 2 in the conductor layer 1
Cloth is in the conductor layer 1 in the one side of first adhesive film 2；Multiple first conductive particles 4 are irregularly distributed
Refer to the disorderly distribution of multiple first conductive particles 4 in the one side of first adhesive film 2 in the conductor layer 1
In the conductor layer 1 in the one side of first adhesive film 2；Multiple second conductive particles 5 are regularly distributed over institute
It states conductor layer 1 and refers to that multiple second conductive particles 5 are periodically distributed in institute in the one side of second adhesive film 3
Conductor layer 1 is stated in the one side of second adhesive film 3；Multiple second conductive particles 5 are irregularly distributed in described
Conductor layer 1 refers to that multiple second conductive particles 5 are disorderly distributed in described lead in the one side of second adhesive film 3
Body layer 1 is in the one side of second adhesive film 3.
It should be noted that the shape of first conductive particles 4 and second conductive particles 5 of the Fig. 3 into Fig. 5
It is only exemplary, due to the difference on process means and parameter, first conductive particles 4 and second conductive particles
5 can also be the other shapes such as cluster-shaped, extension ice-like, stalactite, dendroid.In addition, the institute in the utility model embodiment
The first conductive particles 4 and second conductive particles 5 are stated not by illustrating and above-mentioned shape is limited, as long as have pierce through and
The first conductive particles 4 and the second conductive particles 5 of conducting function, both are within the protection scope of the present invention.
It should be noted that the conductor layer 1 of the present embodiment can be single layer structure, or multilayered structure；It is led when described
When body layer 1 is multilayer, each layer conductor layer 1 can be equipped with the first conductor in the one side of first adhesive film 2
Grain 4, each layer conductor layer 1 can be equipped with the second conductive particles 5 in the one side of second adhesive film 3 or not set
There are the second conductive particles 5.First adhesive film 2 and second adhesive film 3 can be single layer structure, be also possible to multilayer knot
Structure；The conductor layer 1, first adhesive film 2 and second adhesive film 3 can be set to multiple.Preferably, it is led when described
When body layer 1, first adhesive film 2 and second adhesive film 3 are respectively multiple, first adhesive film 2, the conductor layer
1 and second adhesive film 3 be successively spaced setting, for example, work as the conductor layer 1, first adhesive film 2 and described second
When adhesive film 3 is respectively 2, putting in order can be with are as follows: first adhesive film 2, one described conductor layer 1, one
Second adhesive film 3, another described first adhesive film 2, another described conductor layer 1 and another described second adhesive film
3, and so on, it does not do more repeat herein；Alternatively, 1 adhesive film can be only set between 2 conductor layers 1, than
Such as, it when the conductor layer 1 and second adhesive film 3 are respectively 2, and first adhesive film 2 is 1, arranges suitable
Sequence can be with are as follows: described 1, second adhesive film 3 of conductor layer of first adhesive film 2, one is led described in another
Body layer 1 and another described second adhesive film 3, and so on, it does not do more repeat herein.In addition, according to actual production and
The needs of application, the embodiment of the present invention conductor layer 1 may be configured as foaming shape etc., do not do more repeat herein.
Preferably, the thickness of first adhesive film 2 is with the conductor layer 1 close to the non-smooth of first adhesive film 2
The sum of the height of the waviness on surface and first conductive particles 4 meets proportionate relationship 0.5~2, to guarantee enough punctures
Intensity and charging capacity embody are as follows: on the one hand prevent the thickness of first adhesive film 2 close relative to the conductor layer 1
It is the height of the waviness of the one side of first adhesive film 2 and first conductive particles 4 and too small cause charging capacity insufficient
The phenomenon that causing conductive adhesive film and conductor to remove, on the other hand prevents the conductor layer 1 close to the one side of first adhesive film 2
Waviness and the sums of height of first conductive particles 4 too small cause to pierce through relative to the thickness of first adhesive film 2
Intensity deficiency causes conductive adhesive film that can not be connected with conductor.
Preferably, the thickness of second adhesive film 3 is with the conductor layer 1 close to the non-smooth of second adhesive film 3
The sum of the height of the waviness on surface and second conductive particles 5 meets proportionate relationship 0.5~2, to guarantee enough punctures
Intensity and charging capacity embody are as follows: on the one hand prevent the thickness of second adhesive film 3 close relative to the conductor layer 1
It is the height of the waviness of the one side of second adhesive film 3 and second conductive particles 5 and too small cause charging capacity insufficient
The phenomenon that causing conductive adhesive film and conductor to remove, on the other hand prevents the conductor layer 1 close to the one side of second adhesive film 3
Waviness and the sums of height of second conductive particles 5 too small cause to pierce through relative to the thickness of second adhesive film 3
Intensity deficiency causes conductive adhesive film that can not be connected with conductor.
In the utility model embodiment, in order to guarantee that the conductor layer 1 has good electric conductivity, the conductor layer 1
Including one of metal conductor layer, carbon nanotube conductor layer, ferrite conductor layer and graphene conductor layer or a variety of.Wherein,
The metal conductor layer includes monometallic conductor layer and/or alloy conductor layer；Wherein, the monometallic conductor layer by aluminium, titanium,
Any one material in zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made, the alloy conductor layer by aluminium, titanium, zinc, iron, nickel,
Two or more any material in chromium, cobalt, copper, silver and gold is made.
In the utility model embodiment, first conductive particles 4 include metallic particles, carbon nanotube particulate and iron oxygen
One of body particle is a variety of, and second conductive particles 5 include in metallic particles, carbon nanotube particulate and ferrite particle
It is one or more；The metallic particles includes monometallic particle and/or alloying pellet；Wherein, the monometallic particle by aluminium,
Any one material in titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made, the alloying pellet by aluminium, titanium, zinc, iron, nickel,
Two or more any material in chromium, cobalt, copper, silver and gold is made.It should be noted that first conductive particles
4 and second conductive particles 5 can be identical as the material of the conductor layer 1, can not also be identical.
It should be noted that conductive adhesive film in the prior art uses individual conductive adhesive layer (insulating body and conduction
Particle composition) when, conductive path can be formed by tunnel-effect between conducting particles and conducting particles realize element and route
Electrical connection between plate still in use, is influenced by stress, weather etc., the volume or shape of insulating body
It is easy to happen gradual change or mutation, so that the state of piling up of the conducting particles inside conductive adhesive layer easily changes (that is, conductive
The thickness of insulating body between particle and conducting particles easily changes), and due to passing through tunnel-effect between conducting particles
Thickness of the conductive path of formation mainly by the insulating body between conducting particles is influenced, therefore, in use, existing
The conductive path of some conductive adhesive films vulnerable to the insulating body between conducting particles thickness change and fail so that existing
The electric property of some conductive adhesive films is unstable.And in the utility model embodiment, first adhesive film 2 and described second
No setting is required that conducting particles can form conductive path for adhesive film 3, solves existing conductive adhesive film because leading between conducting particles
It crosses tunnel-effect and the vulnerable problem of the conductive path that is formed, effectively improves the conductive stability of conductive adhesive film.
Certainly, first adhesive film 2 in the present embodiment is also possible to include the adhesion layer containing conducting particles, passes through
First adhesive film 2 includes the adhesion layer containing conducting particles, to improve the conductive capability of first adhesive film 2, thus
Further ensure the conduction of the conductive adhesive film；Wherein, the shape of the conducting particles can be spherical or sheet etc.；Work as institute
When to state conducting particles be spherical, the partial size of the conducting particles in first adhesive film 2 is preferably 0.1-15 μm, first glue
The volume ratio of the adhesion layer in conducting particles and first adhesive film 2 in film layer 2 is 2%-80%.Certainly, described first
Adhesive film 2 can also be the adhesion layer including being free of conducting particles, thus before the conduction for ensuring the conductive adhesive film
It puts, when the conductive adhesive film is for that can reduce the eddy-current loss of wiring board, to ensure that route when connecting with wiring board
The integrality of plate transmission, and the bending of wiring board can be improved.
Similarly, second adhesive film 3 in the present embodiment is also possible to include the adhesion layer containing conducting particles, passes through
Second adhesive film 3 includes the adhesion layer containing conducting particles, to improve the conductive capability of second adhesive film 3, thus
Further ensure the conduction of the conductive adhesive film；Wherein, the shape of the conducting particles can be spherical or sheet etc.；Work as institute
When to state conducting particles be spherical, the partial size of the conducting particles in second adhesive film 3 is preferably 0.1-15 μm, second glue
The volume ratio of the adhesion layer in conducting particles and second adhesive film 3 in film layer 3 is 2%-80%.Certainly, described second
Adhesive film 3 can also be the adhesion layer including being free of conducting particles, thus before the conduction for ensuring the conductive adhesive film
It puts, when the conductive adhesive film is for that can reduce the eddy-current loss of wiring board, to ensure that route when connecting with wiring board
The integrality of plate transmission, and the bending of wiring board can be improved.
Preferably, the adhesion layer material therefor of the adhesion layer of first adhesive film 2 and second adhesive film 3 be selected from
Under it is several: modified epoxy class, acrylic compounds, modified rubber class, modified thermoplastic polyimide, polyurethanes, poly- third
Olefin(e) acid esters, organic silicon.
Shown in Figure 6, in order to protect the conductive adhesive film, the conductive adhesive film in the present embodiment further includes first can
Protective film layer 6 and the second peelable protective film layer 7 are removed, the first peelable protective film layer 6 is set to first adhesive film 2
In one side far from the conductor layer 1, the second peelable protective film layer 7 is set to second adhesive film 3 and leads far from described
In the one side of body layer 1.By the way that the first peelable protective film layer 6 is set to first adhesive film 2 far from the conductor layer 1
One side on, to protect the outer surface of first adhesive film 2, thus avoid its by the impurity such as extraneous dust pollute, and will
The second peelable protective film layer 7 is set in one side of second adhesive film 3 far from the conductor layer 1, described in protection
The outer surface of second adhesive film 3, so that it is avoided to be polluted by impurity such as extraneous dusts, the first peelable protective film layer 6
Being preferably release film with the second peelable protective film layer 7 when in use can be by the first peelable protective film layer 6
It is removed with the second peelable protective film layer 7.
In the utility model embodiment, the area of the through-hole 15 is preferably 0.1 μm2-1mm2.By by the through-hole
15 area is preferably 0.1 μm2-1mm2, to ensure first adhesive film 2 and second adhesive film 3 volatile matter at high temperature
It can be vented by the sufficiently large through-hole 15, so as to avoid first adhesive film 2 at high temperature and second glue
Volatile matter in film layer 3 is difficult to be discharged, and then avoids conductive adhesive film blistering layering and cause to remove between conductive adhesive film and conductor,
To ensure to be connected between conductive adhesive film and conductor.In addition, if the quantity of the through-hole 15 is too many, it is easy to cause the conductor layer
1 discontinuous even rupture, so that the flowing of interference charge is influenced, it is therefore preferred that in the conductor layer 1 every square centimeter
The number of the through-hole 15 is 10-1000.It is set by the number of the through-hole 15 in the conductor layer 1 every square centimeter
10-1000 are set to, to ensure that the volatile matter in first adhesive film 2 and second adhesive film 3 at high temperature can lead to
It crosses enough through-holes 15 to be vented, to avoid waving in first adhesive film 2 and second adhesive film 3 at high temperature
Hair object is difficult to be discharged, and causes to remove between conductive adhesive film and conductor so as to avoid conductive adhesive film blistering layering, to ensure conduction
It is connected between glue film and conductor, meanwhile, it is continuous in the conductor layer 1 that the quantity of the through-hole 15 will not influence interference charge
Flowing.Certainly, the area of the through-hole 15 and number are not limited to above-mentioned preferred scope, need to only meet 2 He of the first adhesive film
The volatile matter that second adhesive film 3 generates at high temperature can be vented by the through-hole 15, and the number of the through-hole 15
Amount will not influence interference charge and continuously flow and export in the conductor layer 1, not will cause the conductor layer 1 more and ruptures
, do not do more repeat herein.
In the utility model embodiment, the through-hole 15 can be regularly or irregularly distributed in the conductor layer 1；
Wherein, the through-hole 15, which is regularly distributed in the conductor layer 1, refers to that each 15 shape of through-hole is identical and is evenly distributed in
In the conductor layer 1；The through-hole 15, which is irregularly distributed in the conductor layer 1, refers to the different of each through-hole 15
And it is disorderly distributed in the conductor layer 1.Preferably, the shape of each through-hole 15 is identical, and each through-hole 15 is evenly distributed on
In the conductor layer 1.In addition, the through-hole 15 can be circular through hole 15, the through-hole 15 of other arbitrary shapes can also be, this
Utility model attached drawing is only that circular through hole 15 is illustrated with the through-hole 15, but the through-hole 15 of other any shapes
It is within the protection scope of the utility model.
Shown in Figure 7, in order to solve identical technical problem, the utility model embodiment also provides a kind of wiring board,
Including printed wiring board 8 and the conductive adhesive film, the conductive adhesive film is set in the printed wiring board 8, and described first
It pierces through first adhesive film 2 and contacts conducting with the stratum 82 of the printed wiring board 8 in protrusion 11；The wiring board also wraps
Steel disc 81 is included, the steel disc 81 is set in one side of second adhesive film 3 far from first adhesive film 2, and described second is convex
It pierces through second adhesive film 3 and contacts conducting with the steel disc 81 in portion 13.By the way that conductive adhesive film is set to printed wiring board 8
On, to be 8 shielding electromagnetic interference of printed wiring board, conductor layer 1 of the interference charge buildup that the external world generates in conductive adhesive film
On, the first adhesive film 2 is pierced through by the first protrusion 11 and contacts conducting with the stratum of printed wiring board 8 82, thus by conductor layer
The interference charge gathered on 1 is exported by the stratum 82 of printed wiring board 8；In addition, being used as reinforced structure by steel disc 81, and lead to
It crosses the second protrusion 13 and pierces through and the second adhesive film 3 and contact conducting with steel disc 81, so that passing through steel disc 81 can also will be in conductor layer 1
The interference charge of accumulation exports.
It is shown in Figure 7, in order to realize that the interference charge that will be gathered in conductor layer 1 passes through the stratum 82 of printed wiring board 8
It exports, the printed wiring board 8 in the present embodiment is equipped with the first ground hole 83, and first protrusion 11 connects by described first
Ground hole 83 is connect with the stratum 82 of printed wiring board 8, so that the interference charge gathered in conductor layer 1 is passed through printed wiring board 8
Stratum 82 export.
Shown in Figure 8, in order to solve identical technical problem, the utility model embodiment also provides a kind of wiring board,
Including printed wiring board 8, electromagnetic shielding film 9 and the conductive adhesive film, the conductive adhesive film is set to the electromagnetic shielding film 9
On, the electromagnetic shielding film 9 is set in the printed wiring board 8；The electromagnetic shielding film 9 includes insulating layer 91 and metallic conduction
Layer 92, the first protrusion 11 of the conductive adhesive film is pierced through first adhesive film 2 and the insulating layer 91 and is led with the metal
The contact conducting of electric layer 92, the metal conducting layer 92 contact conducting with the stratum 82 of the printed wiring board 8；The wiring board is also
Including steel disc 81, the steel disc 81 is set in one side of second adhesive film 3 far from first adhesive film 2, and described second
It pierces through second adhesive film 3 and contacts conducting with the steel disc 81 in protrusion 13.By the way that conductive adhesive film is set to electromagnetic shielding film
On 9, electromagnetic shielding film 9 is set in printed wiring board 8, so that conductive adhesive film and electromagnetic shielding film 9 can be printed wire
8 shielding electromagnetic interference of plate, the interference charge buildup that the external world generates is in the conductor layer 1 of conductive adhesive film and the gold of electromagnetic shielding film 9
Belong on conductive layer 92, the first adhesive film 2 is pierced through by the first protrusion 11 and contacts conducting with the stratum of printed wiring board 8 82, from
And the interference charge gathered in conductor layer 1 and metal conducting layer 92 is exported by the stratum 82 of printed wiring board 8；In addition, logical
Steel disc 81 is crossed as reinforced structure, and the second adhesive film 3 is pierced through by the second protrusion 13 and contacts conducting with steel disc 81, thus logical
The interference charge gathered in conductor layer 1 and metal conducting layer 92 can also be exported by crossing steel disc 81.
It is shown in Figure 8, in order to realize that the interference charge that will be gathered in conductor layer 1 passes through the stratum 82 of printed wiring board 8
It exports, the printed wiring board 8 in the present embodiment is equipped with the second ground hole 84, and the metal conducting layer 92 connects by described second
Ground hole 84 is connect with the stratum 82 of printed wiring board 8, thus the interference that will be gathered in conductor layer 1 and the metal conducting layer 92
Charge is exported by the stratum 82 of printed wiring board 8.
Referring to figs. 7 and 8, when the wiring board is applied in electronic equipment, the steel disc 81 and electricity can be passed through
The shell of sub- equipment contacts conducting, so that the interference charge gathered in the conductor layer 1 can be led by the steel disc 81
Out, in order to export interference charge via the shell of electronic equipment, so that realizing will gather in the conductor layer 1 of the conductive adhesive film
Interference charge import ground in, avoid interference charge accumulation and forming interference source influences the normal work of the wiring board.
Preferably, the printed wiring board 8 is one of flexible single-side plate, flexibility double face plate, flexible multi-layer plate, rigid-flex combined board.
In order to solve identical technical problem, the utility model embodiment also provides a kind of wiring board, including multiple printings
Wiring board and multiple conductive adhesive films, the conductive adhesive film are set between two adjacent printed wiring board, with
Make the stratum mutual conduction of two adjacent printed wiring board.Specifically, two adjacent printed wires are being set to
In conductive adhesive film between plate, first protrusion 11 pierce through first adhesive film 2 and with printed wire described in one of them
The stratum of plate contacts conducting, second protrusion 13 pierce through second adhesive film 3 and with printed wiring board described in another
Stratum contact conducting, so that the stratum mutual conduction of two adjacent printed wiring board.Preferably, the track
Road plate 8 is one of flexible single-side plate, flexibility double face plate, flexible multi-layer plate, rigid-flex combined board.
Shown in Figure 9, in order to solve identical technical problem, the utility model embodiment also provides a kind of conductive adhesive film
Preparation method, comprising the following steps:
S11 forms conductor layer 1；Wherein, the conductor layer 1 is equipped with the through-hole 15 through its upper and lower surface；
S12 forms the first adhesive film 2 on the side of the conductor layer 1；
S13 forms the second adhesive film 3 on the other side of the conductor layer 1；Wherein, the conductor layer 1 is close to described
The one side of first adhesive film 2 is non-smooth surface, and the conductor layer 1 includes close to the non-smooth surface of first adhesive film 2
Multiple first protrusions 11 and multiple first recessed portions 12, between multiple first protrusions 11 and multiple first recessed portions 12
Every setting, first adhesive film 2 is protruded into multiple first protrusions 11；The conductor layer 1 is close to second adhesive film 3
Non-smooth surface includes multiple second protrusions 13 and multiple second recessed portions 14, multiple second protrusions 13 and multiple described
The setting of second recessed portion 14 interval, second adhesive film 3 is protruded into multiple second protrusions 13.
In the utility model embodiment, the area of the through-hole 15 is preferably 0.1 μm2-1mm2.By by the through-hole
15 area is preferably 0.1 μm2-1mm2, to ensure first adhesive film 2 and second adhesive film 3 volatile matter at high temperature
It can be vented by the sufficiently large through-hole 15, so as to avoid first adhesive film 2 at high temperature and second glue
Volatile matter in film layer 3 is difficult to be discharged, and then avoids conductive adhesive film blistering layering and cause to remove between conductive adhesive film and conductor,
To ensure to be connected between conductive adhesive film and conductor.In addition, if the quantity of the through-hole 15 is too many, it is easy to cause the conductor layer
1 discontinuous even rupture, so that the flowing of interference charge is influenced, it is therefore preferred that in the conductor layer 1 every square centimeter
The number of the through-hole 15 is 10-1000.It is set by the number of the through-hole 15 in the conductor layer 1 every square centimeter
10-1000 are set to, to ensure that the volatile matter in first adhesive film 2 and second adhesive film 3 at high temperature can lead to
It crosses enough through-holes 15 to be vented, to avoid waving in first adhesive film 2 and second adhesive film 3 at high temperature
Hair object is difficult to be discharged, and causes to remove between conductive adhesive film and conductor so as to avoid conductive adhesive film blistering layering, to ensure conduction
It is connected between glue film and conductor, meanwhile, it is continuous in the conductor layer 1 that the quantity of the through-hole 15 will not influence interference charge
Flowing.Certainly, the area of the through-hole 15 and number are not limited to above-mentioned preferred scope, need to only meet 2 He of the first adhesive film
The volatile matter that second adhesive film 3 generates at high temperature can be vented by the through-hole 15, and the number of the through-hole 15
Amount will not influence interference charge and continuously flow and export in the conductor layer 1, not will cause the conductor layer 1 more and ruptures
, do not do more repeat herein.
In the utility model embodiment, the through-hole 15 can be regularly or irregularly distributed in the conductor layer 1；
Wherein, the through-hole 15, which is regularly distributed in the conductor layer 1, refers to that each 15 shape of through-hole is identical and is evenly distributed in
In the conductor layer 1；The through-hole 15, which is irregularly distributed in the conductor layer 1, refers to the different of each through-hole 15
And it is disorderly distributed in the conductor layer 1.Preferably, the shape of each through-hole 15 is identical, and each through-hole 15 is evenly distributed on
In the conductor layer 1.In addition, the through-hole 15 can be circular through hole 15, the through-hole 15 of other arbitrary shapes can also be,
The utility model attached drawing is only that circular through hole 15 is illustrated with the through-hole 15, but the through-hole of other any shapes
15 are within the protection scope of the utility model.
In the utility model embodiment, the step S11 specifically: formed on release film or peelable metal carrier band
Conductor layer 1；Wherein it is possible to plated by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation plating, sputtering,
One of plating and mixing plating or kinds of processes form conductor layer 1 on release film or peelable metal carrier band.
In the utility model embodiment, the peelable metal carrier band the preparation method is as follows:
S21 is surface-treated the matrix of metal foil, makes 40-90 dynes of its surface tension；
S22 forms vacuum-coating on the side of described matrix；
S23 carries out lightization processing to the surface of the vacuum-coating, forms surface metal bright layer, peelable to obtain
From metal carrier band.
In the utility model embodiment, the step S12 is specifically included:
S121 forms the first conductive particles 4 on the side of the conductor layer 1；Wherein, first conductive particles 4 collect
In be distributed on first protrusion 11；Specifically, physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical gaseous phase can be passed through
One of deposition, evaporation plating, sputtering plating, plating and mixing plating or kinds of processes form the first conductor in the conductor layer 1
Particle 4.
S122 forms the first adhesive film 2 on the side that the conductor layer 1 is formed with first conductive particles 4.
In the utility model embodiment, the step S13 is specifically included:
S131 forms the second conductive particles 5 on the other side of the conductor layer 1；Wherein, second conductive particles 5
Integrated distribution is on second protrusion 13；Specifically, physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical gas can be passed through
Mutually one of deposition, evaporation plating, sputtering plating, plating and mixing plating or kinds of processes form second in the conductor layer 1 and lead
Body particle 5；
S132 forms the second adhesive film 3 on the side that the conductor layer 1 is formed with second conductive particles 5.
Preferably, the step S12 specifically:
S21 is coated with the first adhesive film 2 on release film；
First adhesive film 2 pressing is transferred on the side of the conductor layer 1 by S22；Or,
S31 is coated with the first adhesive film 2 on the side of the conductor layer 1.
Preferably, the step S13 specifically:
S31 is coated with the second adhesive film 3 on release film；
Second adhesive film 3 pressing is transferred on the other side of the conductor layer 1 by S32；Or,
S41 is coated with the second adhesive film 3 on the other side of the conductor layer 1.
It participates in shown in Fig. 6, in order to protect the conductive adhesive film, the conductive adhesive film in the present embodiment further includes first can
Protective film layer 6 and the second peelable protective film layer 7 are removed, the first peelable protective film layer 6 is set to first adhesive film 2
In one side far from the conductor layer 1, the second peelable protective film layer 7 is set to second adhesive film 3 and leads far from described
In the one side of body layer 1.By the way that the first peelable protective film layer 6 is set to first adhesive film 2 far from the conductor layer 1
One side on, to protect the outer surface of first adhesive film 2, thus avoid its by the impurity such as extraneous dust pollute, and will
The second peelable protective film layer 7 is set in one side of second adhesive film 3 far from the conductor layer 1, described in protection
The outer surface of second adhesive film 3, so that it is avoided to be polluted by impurity such as extraneous dusts, the first peelable protective film layer 6
Being preferably release film with the second peelable protective film layer 7 when in use can be by the first peelable protective film layer 6
It is removed with the second peelable protective film layer 7.
To sum up, the utility model embodiment provides the preparation method of a kind of conductive adhesive film, wiring board and conductive adhesive film,
In, conductive adhesive film is by setting conductor layer 1, the first protrusion 11 and the second protrusion 13, so that it is in pressing in use, first is convex
Portion 11 pierces through the first adhesive film 2 and contacts conducting with a conductor, and the second protrusion 13 is pierced through the second adhesive film 3 and connect with another conductor
Touching conducting, to realize that conductive adhesive film is in contact conducting with conductor, to avoid the conducting particles of conductive adhesive film in the prior art
The state of piling up, which changes, causes the conductive stability of conductive adhesive film poor, so that the conduction for effectively improving conductive adhesive film is steady
It is qualitative, while avoid causes the Duplication of conducting particles lower using individual conductive adhesive layer in the prior art, to reduce
The resistance of conductive adhesive film, and then be conducive to improve the electric conductivity of conductive adhesive film, and then improve between conductive adhesive film and conductor
The reliability of conducting；In addition, in one embodiment provided by the utility model, due to the first adhesive film 2 and the second adhesive film
3 no setting is required that conducting particles can form conductive path, solves existing conductive adhesive film because passing through tunnel between conducting particles
Effect and the vulnerable problem of the conductive path that is formed, effectively improve the conductive stability of conductive adhesive film, also, due to nothing
A large amount of conducting particles need to be used, therefore greatly reduce the production cost of conductive adhesive film；In addition, by being equipped in conductor layer 1
Through the through-hole 15 of its upper and lower surface, so that the first adhesive film 2 and the second adhesive film 3 can pass through the through-hole in conductor layer 1
15 are in close contact, so that the peel strength between the first adhesive film 2 and the second adhesive film 3 is increased, so that the first glue film
Layer 2 and the second adhesive film 3 can securely link together；In addition, being equipped with the through-hole through its upper and lower surface in conductor layer 1
15, the volatile matter be conducive in the first adhesive film 2 and the second adhesive film 3 at high temperature is arranged by the through-hole 15 of conductor layer 1
Gas is difficult to be discharged, so as to avoid conductive adhesive film to avoid the volatile matter of the first adhesive film 2 and the second adhesive film 3 at high temperature
Blistering layering causes conductive adhesive film peeling-off with conductor, and then improves the reliability that conductive adhesive film is connect with conductor；In addition,
In pressing, the gelatin substance for constituting the first adhesive film 2 is extruded on the first recessed portion 12 conductive adhesive film, constitutes the second glue film
The gelatin substance of layer 3 is extruded on the second recessed portion 14, so that the charging capacity of conductive adhesive film is increased, to be not easy
The phenomenon that existing conductive adhesive film and conductor are removed, avoids existing conductive adhesive film since charging capacity deficiency leads to conductive adhesive film and leads
The problem of body is removed, and then it is effectively guaranteed the reliability that conductive adhesive film is connect with conductor.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, without deviating from the technical principle of the utility model, several improvement and replacement can also be made, these change
It also should be regarded as the protection scope of the utility model into replacement.
Claims (12)
1. a kind of conductive adhesive film, which is characterized in that including the first adhesive film, conductor layer and the second adhesive film, the conductor layer is set
Between first adhesive film and second adhesive film, the conductor layer is non-flat close to the one side of first adhesive film
Whole surface, the conductor layer include multiple first protrusions and multiple first recess close to the non-smooth surface of first adhesive film
Portion, multiple first protrusions and the setting of multiple first recessed portion intervals, multiple first protrusions protrude into described first
Adhesive film；The conductor layer is non-smooth surface close to the one side of second adhesive film, and the conductor layer is close to described second
The non-smooth surface of adhesive film includes multiple second protrusions and multiple second recessed portions, multiple second protrusions and multiple described
The setting of second recessed portion interval, second adhesive film is protruded into multiple second protrusions；The conductor layer, which is equipped with, runs through it
The through-hole of upper and lower surface.
2. conductive adhesive film as described in claim 1, which is characterized in that the conductor layer is non-flat close to first adhesive film
Whole surface is equipped with the first conductive particles, and the first conductive particles integrated distribution is on first protrusion.
3. conductive adhesive film as claimed in claim 2, which is characterized in that the conductor layer is non-flat close to second adhesive film
Whole surface is equipped with the second conductive particles, and the second conductive particles integrated distribution is on second protrusion.
4. conductive adhesive film as claimed in claim 3, which is characterized in that the shape of first conductive particles is cluster-shaped or extension
Ice-like or stalactite or dendroid, and/or, the shape of second conductive particles is cluster-shaped or extension ice-like or stalactite
Or dendroid.
5. conductive adhesive film as claimed in claim 3, which is characterized in that the quantity of first conductive particles be it is multiple, it is multiple
First conductive particles are regularly or irregularly distributed in the conductor layer in the one side of first adhesive film；It is multiple
First conductive particles are continuously or non-continuously distributed in the conductor layer in the one side of first adhesive film；It is multiple
The shape of first conductive particles is identical or different；The size of multiple first conductive particles is identical or different；And/or
The quantity of second conductive particles be it is multiple, multiple second conductive particles are regularly or irregularly distributed in described
Conductor layer is in the one side of second adhesive film；Multiple second conductive particles are continuously or non-continuously distributed in described
Conductor layer is in the one side of second adhesive film；The shape of multiple second conductive particles is identical or different；Multiple institutes
The size for stating the second conductive particles is identical or different.
6. conductive adhesive film as described in any one in claim 1-5, which is characterized in that first adhesive film includes containing conduction
The adhesion layer of particle；Or, first adhesive film includes the adhesion layer without conducting particles.
7. conductive adhesive film as described in any one in claim 1-5, which is characterized in that second adhesive film includes containing conduction
The adhesion layer of particle；Or, second adhesive film includes the adhesion layer without conducting particles.
8. conductive adhesive film as described in any one in claim 1-5, which is characterized in that the conductor layer with a thickness of 0.01 μm-
45 μm, first adhesive film with a thickness of 0.1 μm -45 μm, second adhesive film with a thickness of 0.1 μm -45 μm.
9. conductive adhesive film as described in any one in claim 1-5, which is characterized in that the conductive adhesive film further includes first peelable
From protective film layer and the second peelable protective film layer, the first peelable protective film layer is set to first adhesive film far from institute
It states in the one side of conductor layer, the second peelable protective film layer is set to the one side of second adhesive film far from the conductor layer
On.
10. conductive adhesive film as described in any one in claim 1-5, which is characterized in that the area of the through-hole is 0.1 μm2-
1mm2；And/or the number of the through-hole in the conductor layer every square centimeter is 10-1000.
11. a kind of wiring board, which is characterized in that including printed wiring board and such as the described in any item conductions of claim 1-10
Glue film, the conductive adhesive film are set in the printed wiring board, first protrusion pierce through first adhesive film and with it is described
The stratum of printed wiring board conducts；The wiring board further includes steel disc, and the steel disc is set to second adhesive film far from institute
In the one side for stating the first adhesive film, second protrusion pierces through second adhesive film and contacts conducting with the steel disc.
12. a kind of wiring board, which is characterized in that including printed wiring board, electromagnetic shielding film and as claim 1-10 is any
Conductive adhesive film described in, the conductive adhesive film are set on the electromagnetic shielding film, and the electromagnetic shielding film is set to the printing
On wiring board；The electromagnetic shielding film includes insulating layer and metal conducting layer, described in the first protrusion of the conductive adhesive film is pierced through
First adhesive film and the insulating layer simultaneously contact conducting with the metal conducting layer, the metal conducting layer and the printed wire
The stratum of plate contacts conducting；The wiring board further includes steel disc, and the steel disc is set to second adhesive film far from described first
In the one side of adhesive film, second protrusion pierces through second adhesive film and contacts conducting with the steel disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821963111.2U CN209625818U (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film and wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821963111.2U CN209625818U (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film and wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209625818U true CN209625818U (en) | 2019-11-12 |
Family
ID=68444464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821963111.2U Active CN209625818U (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film and wiring board |
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| Country | Link |
|---|---|
| CN (1) | CN209625818U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110783020A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
-
2018
- 2018-11-26 CN CN201821963111.2U patent/CN209625818U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110783020A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
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