CN209608930U - A kind of high-frequency microwave printing high density HDI wiring board - Google Patents

Abstract

The utility model provides a kind of high-frequency microwave printing high density HDI wiring board, including substrate and support base, support base includes support ring and supporting bracket, is connected between supporting bracket and support ring by supporting beam, and the top surface of supporting beam, supporting bracket and support ring is in sustained height；Supporting bracket is equipped with accommodating chamber, is equipped with cooling piece in accommodating chamber；Substrate is located at the top surface of bottom surface abutting supporting beam, supporting bracket and the support ring of the top of support base and substrate；The top of substrate is close to be equipped with insulating layer, is close to be equipped with conductive layer above insulating layer；Wiring board erection is installed in equipment by it using support construction, changes the conventional mounting mode that wiring board ontology is directly fixedly mounted in equipment, and the bottom of wiring board is exposed in air, convenient for heat dissipation；And it radiated, cooled down using refrigeration modes, changed traditional fan cooling, substantially increase heat dissipation effect, the damage of electronic component caused by effectively preventing because of high temperature.

Description

A kind of high-frequency microwave printing high density HDI wiring board

Technical field

The utility model relates to wiring board arts, more particularly to a kind of high-frequency microwave prints high density HDI route Plate.

Background technique

HDI is high-end printed circuit board, conductive layer thickness < 0.025mm, line width/line-spacing≤0.1mm/0.1mm, insulation Thickness degree < 0.075mm, I/O number > 300, through-hole aperture≤0.15mm；Due to electronic equipment just quickly towards it is light, thin, short, The development in the directions such as small, high-precision and high reliability, electronic component also develop into wafer-level package new technology from surface encapsulation；This It is that there is higher electronics Connection Density relative to SMT due to CSP, this requires printed boards to be capable of providing higher internal layer connection With surface layer Connection Density, this, which becomes, provides huge motive force for the development and popularization of HDI printed board technique；But in multilayer In wiring board, there is also problems for heat dissipation aspect.

Utility model content

In order to overcome the drawbacks of the prior art, the technical problem to be solved by the utility model is to propose that a kind of high frequency is micro- Wave prints high density HDI wiring board, and that it changes wiring board ontologies to be directly fixedly mounted on the conventional mounting mode in equipment, line The bottom of road plate is exposed in air, radiates convenient for wiring board；And traditional fan cooling is changed, is substantially increased Heat dissipation effect, the damage of electronic component caused by effectively preventing because of high temperature, improves the service life of wiring board.

For this purpose, the following technical solution is employed for the utility model:

The utility model provides a kind of high-frequency microwave printing high density HDI wiring board, including substrate and support base, described Support base includes support ring and the supporting bracket in the support ring, passes through support between the supporting bracket and the support ring Beam is fixedly connected, and the top surface of the supporting beam, the supporting bracket and the support ring is in sustained height；The supporting bracket Top surface is recessed forms accommodating chamber downwards, is equipped with cooling piece in the accommodating chamber；The substrate be located at the support base top, And the top surface of the supporting beam, the supporting bracket and the support ring is close in the bottom surface of the substrate；The top of the substrate is tight Being sticked has insulating layer, is close to be equipped with conductive layer above the insulating layer.

In the utility model preferably technical solution, shape between the supporting beam, the supporting bracket and the support ring At grid in be fixed with cooling fin, and the top surface of the cooling fin and the top surface of the supporting bracket maintain an equal level.

In the utility model preferably technical solution, the cooling fin is S type thin slice, and the cooling fin is equipped with more A through-hole.

In the utility model preferably technical solution, the lower section of the supporting beam and the supporting bracket is equipped with a plurality of heat dissipation Column, one end of the thermal column are fixedly connected with the bottom surface of the supporting beam or the supporting bracket, the other end and the support ring Bottom surface be in same plane.

In the utility model preferably technical solution, the side wall of the support ring is equipped with multiple air holes.

In the utility model preferably technical solution, the substrate is equipped with multiple dissipating through the substrate top and bottom Hot hole.

In the utility model preferably technical solution, the insulating layer is made of heat conductive silica gel insulating trip.

The utility model has the following beneficial effects:

A kind of high-frequency microwave provided by the utility model prints high density HDI wiring board, utilizes support base by wiring board Erection is installed in equipment, the conventional mounting mode that wiring board ontology is directly fixedly mounted in equipment is changed, by wiring board Bottom it is exposed in air, radiate convenient for wiring board；And it radiated, cooled down using the refrigeration modes of cooling piece, Traditional fan cooling is changed, heat dissipation effect is substantially increased, the damage of electronic component caused by effectively preventing because of high temperature, Improve the service life of wiring board.

Detailed description of the invention

Fig. 1 is that the structure for the high-frequency microwave printing high density HDI wiring board that specific embodiment of the present invention provides is shown It is intended to；

Fig. 2 is the schematic perspective view for the support base that specific embodiment of the present invention provides.

In figure:

100, substrate；110, heat release hole；200, support base；210, support ring；211, air hole；220, supporting bracket；221, Accommodating chamber；230, supporting beam；300, cooling piece；400, insulating layer；500, conductive layer；600, circuit element；700, cooling fin； 800, thermal column.

Specific embodiment

Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.

Figure provides a kind of high-frequency microwave printing high density HDI wiring board, including substrate 100 as indicated with 1, in the present embodiment With support base 200, the support base 200 includes support ring 210 and the supporting bracket 220 in the support ring 210, described It is fixedly connected between supporting bracket 220 and the support ring 210 by supporting beam 230, and the supporting beam 230, the supporting bracket 220 and the top surface of the support ring 210 be in sustained height；220 top surface of supporting bracket, which is recessed downwards, forms accommodating chamber 221, cooling piece 300 is installed in the accommodating chamber 221；The substrate 100 is located at the top of the support base 200 and described It is close to the top surface of the supporting beam 230, the supporting bracket 220 and the support ring 210 in the bottom surface of substrate 100；The substrate 100 top is close to be equipped with insulating layer 400, is close to be equipped with conductive layer 500 above the insulating layer 400, on the conductive layer 500 Equipped with circuit element 600.

A kind of above-mentioned high-frequency microwave prints high density HDI wiring board, utilizes the support base 200 by the substrate 100 erections are installed in equipment, change the conventional mounting mode that wiring board ontology is directly fixedly mounted in equipment, will be described The bottom of substrate 100 is exposed in air, radiates convenient for the substrate 100；And using the refrigeration of the cooling piece 300 Mode is radiated, is cooled down, and is changed traditional fan cooling, is substantially increased heat dissipation effect, effectively prevents because of high temperature The damage for causing the circuit element 600, improves the service life of the utility model.

Further, solid in the grid formed between the supporting beam 230, the supporting bracket 220 and the support ring 210 Surely it is equipped with cooling fin 700, and the top surface of the cooling fin 700 and the top surface of the supporting bracket 220 maintain an equal level, and mean during installation It is close to the bottom of the substrate 100 in the top surface of the cooling fin 700；The design of the cooling fin 700 increases the substrate 100 With the contact area of air, heat dissipation area is increased, effectively reduces the circuit element caused by the substrate 100 generates heat The probability of 600 damages, improves the service life of the utility model.

Further, the cooling fin 700 is S type thin slice, and the cooling fin 700 is equipped with multiple through-holes；It is described logical The flowing of gas is convenient in the design in hole, accelerates the exchange of hot and cold air, convenient for scattering and disappearing for heat.

Further, as shown in Fig. 2, the lower section of the supporting beam 230 and the supporting bracket 220 is equipped with a plurality of thermal column 800, one end of the thermal column 800 is connect with the fixed bottom of the supporting beam 230 or the supporting bracket 220, the other end with The bottom surface of the support ring 210 is in same plane；800 one side of thermal column may act as support column, so that entire described Support base 200 is more firm；On the other hand the thermal column 800 can increasing heat radiation area, further speed up distributing for heat.

Further, the side wall of the support ring 210 is equipped with multiple air holes 211；The design of the air hole 211 It is swapped convenient for the hot gas in the support ring 210 with ambient atmos, the heat that the circuit element 600 is generated is timely Outflow is extraneous.

Further, the substrate 100 is equipped with multiple heat release holes 110 through 100 top and bottom of substrate；It is described to dissipate The design of hot hole 110 can further speed up the heat dissipation of heat.

Further, the insulating layer 400 is made of heat conductive silica gel insulating trip；Heat conductive silica gel insulating trip is one kind with special Film is the high performance elastomer insulating materials of substrate, has excellent anti-cut ability and fabulous heating conduction, extensive Applied to industries such as electronic apparatus；In use, according to the size at fever interface and the thermal conductive silicon of clearance height selection different-thickness Film is cut, and is placed in the gap at fever interface and its component, is played heat-conducting medium；The insulating layer 400 is set to institute It states between substrate 100 and the conductive layer 500, the effect that can play insulation is made of heat conductive silica gel insulating trip, and can have The heat for generating the circuit element 600 of effect is transmitted in time on the substrate 100 and the support base 200, accelerates to dissipate Heat.

The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality In the case where with novel spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality It is not limited to the particular embodiment disclosed with novel, other embodiments fallen into claims hereof all belong to In the range of the utility model protection.

Claims (7)

1. a kind of high-frequency microwave prints high density HDI wiring board, it is characterised in that:

Including substrate (100) and support base (200), the support base (200) include support ring (210) and be located at the support ring (210) supporting bracket (220) in, it is fixed by supporting beam (230) between the supporting bracket (220) and the support ring (210) Connection, and the top surface of the supporting beam (230), the supporting bracket (220) and the support ring (210) is in sustained height； Supporting bracket (220) top surface, which is recessed downwards, to be formed accommodating chamber (221), is equipped with cooling piece in the accommodating chamber (221) (300)；

The substrate (100) is located at the top of the support base (200) and the bottom surface of the substrate (100) and is close to the support The top surface of beam (230), the supporting bracket (220) and the support ring (210)；It is close to be equipped with exhausted in the top of the substrate (100) Edge layer (400), insulating layer (400) top are close to be equipped with conductive layer (500).

2. a kind of high-frequency microwave according to claim 1 prints high density HDI wiring board, it is characterised in that:

It is fixed in the grid formed between the supporting beam (230), the supporting bracket (220) and the support ring (210) Cooling fin (700), the top surface of the cooling fin (700) and the top surface of the supporting bracket (220) maintain an equal level.

3. a kind of high-frequency microwave according to claim 2 prints high density HDI wiring board, it is characterised in that:

The cooling fin (700) is S type thin slice, and the cooling fin (700) is equipped with multiple through-holes.

4. a kind of high-frequency microwave according to claim 1 prints high density HDI wiring board, it is characterised in that:

The lower section of the supporting beam (230) and the supporting bracket (220) is equipped with a plurality of thermal column (800), the thermal column (800) One end be fixedly connected with the bottom surface of the supporting beam (230) or the supporting bracket (220), the other end and the support ring (210) bottom surface is in same plane.

5. a kind of high-frequency microwave according to claim 1 prints high density HDI wiring board, it is characterised in that:

The side wall of the support ring (210) is equipped with multiple air holes (211).

6. a kind of high-frequency microwave according to claim 1 prints high density HDI wiring board, it is characterised in that:

The substrate (100) is equipped with multiple heat release holes (110) through the substrate (100) top and bottom.

7. a kind of high-frequency microwave according to claim 1 prints high density HDI wiring board, it is characterised in that:

The insulating layer (400) is made of heat conductive silica gel insulating trip.